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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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NASA NTRS2008

Electronic Components for use in Extreme Temperature Aerospace Applications

Electrical power management and control systems designed for use in planetary exploration missions and deep space probes require electronics that are capable of efficient and reliable operation under extreme temperature conditions. Space-based infra-red satellites, all-electric ships, jet engines, electromagnetic launchers, magnetic levitation transport systems, and power facilities are also typical examples where the electronics are expected to be exposed to harsh temperatures and to operate under severe thermal swings. Most commercial-off-the-shelf (COTS) devices are not designed to function under such extreme conditions and, therefore, new parts must be developed or the conventional devices need to be modified. For example, spacecraft operating in the cold environment of deep space carry a large number of radioisotope heating units in order to maintain the surrounding temperature of the on-board electronics at approximately 20 C. At the other end, built-in radiators and coolers render the operation of electronics possible under hot conditions. These thermal measures lead to design complexity, affect development costs, and increase size and weight. Electronics capable of operation at extreme temperatures, thus, will not only tolerate the hostile operational environment, but also make the overall system efficient, more reliable, and less expensive. The Extreme Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electronics suitable for applications in the aerospace environment and deep space exploration missions. Research is being conducted on devices, including COTS parts, for potential use under extreme temperatures. These components include semiconductor switching devices, passive devices, DC/DC converters, operational amplifiers, and oscillators. An overview of the program will be presented along with some experimental findings.

Patterson, Richard L.↗
NASA NTRS2005

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

thermal cycling↗
NASA NTRS2005

Re-configurable electronics behavoir under extreme thermal environment

This paper focuses on analog/digital electronics at low-temperatures. The experiments cover separate tests of the whole Evolvable Hardware system: the Evolutionary Processor (the DSP in the SABLE system), Xilinx Virtes II Pro FPGA evaluation board, and the Reconfigurable analog array components tested at low and high temperatures.

Field Programmable Transistor Arrays (FPTA)↗
NASA NTRS2020

Select Electronic Parts Operation at Extreme Low Temperature

The purpose of the study presented in this paper is to extend the test period of a selected set of electronics parts at cryogenic condition to dwell period of about 24 hours to demonstrate extreme cold operational capability of these components. The parts tested are tantalum polymer, BX and P90 type ceramic capacitors, thick film resistors, analog multiplexers, a digital inverter, and a D-flip-flop. These parts were tested to assist identifying candidate components that can be used for development of a cold capable telemetry board. There are several past investigations that have shown that COTS (commercial-off-the-shelf) capacitors and resistors tested at cryogenic temperatures and frequencies up to 10MHz did not exhibit significant changes in capacitance and resistance values. Also, there are several test results for active parts. These past tests collected measurements during a temperature sweep from room temperature down to cryogenic temperature with very short dwell time at cryogenic temperature, and back to room temperature. This study extends the operational dwell time to at least 24 hours and returning to room temperature operation without significant degradation in performance, thus, demonstrating the potential for longer dwell time in actual operation in these extreme cold temperatures and a method for identifying the cold operability.

Ashtijou, Mohammad↗
NASA NTRS2014

Flight Avionics Hardware Roadmap

The Avionics Technology Roadmap takes an 80% approach to technology investment in spacecraft avionics. It delineates a suite of technologies covering foundational, component, and subsystem-levels, which directly support 80% of future NASA space mission needs. The roadmap eschews high cost, limited utility technologies in favor of lower cost, and broadly applicable technologies with high return on investment. The roadmap is also phased to support future NASA mission needs and desires, with a view towards creating an optimized investment portfolio that matures specific, high impact technologies on a schedule that matches optimum insertion points of these technologies into NASA missions. The roadmap looks out over 15+ years and covers some 114 technologies, 58 of which are targeted for TRL6 within 5 years, with 23 additional technologies to be at TRL6 by 2020. Of that number, only a few are recommended for near term investment: 1. Rad Hard High Performance Computing 2. Extreme temperature capable electronics and packaging 3. RFID/SAW-based spacecraft sensors and instruments 4. Lightweight, low power 2D displays suitable for crewed missions 5. Radiation tolerant Graphics Processing Unit to drive crew displays 6. Distributed/reconfigurable, extreme temperature and radiation tolerant, spacecraft sensor controller and sensor modules 7. Spacecraft to spacecraft, long link data communication protocols 8. High performance and extreme temperature capable C&DH subsystem In addition, the roadmap team recommends several other activities that it believes are necessary to advance avionics technology across NASA: center dot Engage the OCT roadmap teams to coordinate avionics technology advances and infusion into these roadmaps and their mission set center dot Charter a team to develop a set of use cases for future avionics capabilities in order to decouple this roadmap from specific missions center dot Partner with the Software Steering Committee to coordinate computing hardware and software technology roadmaps and investment recommendations center dot Continue monitoring foundational technologies upon which future avionics technologies will be dependent, e.g., RHBD and COTS semiconductor technologies

Some, Raphael↗
NASA NTRS2008

Evaluation of Silicon-on-Insulator HTOP-01 Operational Amplifier for Wide Temperature Operation

Electronics capable of operation under extreme temperatures are required in many of NASA space exploration missions. Aerospace and military applications, as well as some terrestrial industries constitute environments where electronic systems are anticipated to be exposed to extreme temperatures and wide-range thermal swings. Electronics that are able to withstand and operate efficiently in such harsh environments would simplify, if not eliminate, traditional thermal control elements and their associated structures for proper ambient operation. As a result, overall system mass would be reduced, design would be simplified, and reliability would be improved. Electronic parts that are built utilizing silicon-on-insulator (SOI) technology are known to offer better radiation-tolerance compared to their conventional silicon counterparts, provide faster switching, and consume less power. They also exhibit reduced leakage current and, thus, they are often tailored for high temperature operation. These attributes make SOI-based devices suitable for use in harsh environments where extreme temperatures and wide thermal swings are anticipated. A new operational amplifier, based on silicon-on-insulator technology and geared for high temperature well-logging applications, was recently introduced by Honeywell Corporation. This HTOP-01 dual precision operational amplifier is a low power device, operates on a single supply, and has an internal oscillator and an external clocking option [1]. It is rated for operation from -55 C to +225 C with a maximum output current capability of 50 mA. The amplifier chip is designed as a 14-pin, hermetically-sealed device in a ceramic package. Table I shows some of the device manufacturer s specifications.

Patterson, Richard↗
NASA NTRS2003

Electronic Components and Circuits for Extreme Temperature Environments

Planetary exploration missions and deep space probes require electrical power management and control systems that are capable of efficient and reliable operation in very low temperature environments. Presently, spacecraft operating in the cold environment of deep space carry a large number of radioisotope heating units in order to maintain the surrounding temperature of the on-board electronics at approximately 20 C. Electronics capable of operation at cryogenic temperatures will not only tolerate the hostile environment of deep space but also reduce system size and weight by eliminating or reducing the radioisotope heating units and their associate structures; thereby reducing system development as well as launch costs. In addition, power electronic circuits designed for operation at low temperatures are expected to result in more efficient systems than those at room temperature. This improvement results from better behavior and tolerance in the electrical and thermal properties of semiconductor and dielectric materials at low temperatures. The Low Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electrical components, circuits, and systems suitable for applications in the aerospace environment and deep space exploration missions. Research is being conducted on devices and systems for reliable use down to cryogenic temperatures. Some of the commercial-off-the-shelf as well as developed components that are being characterized include switching devices, resistors, magnetics, and capacitors. Semiconductor devices and integrated circuits including digital-to-analog and analog-to-digital converters, DC/DC converters, operational amplifiers, and oscillators are also being investigated for potential use in low temperature applications. An overview of the NASA Glenn Research Center Low Temperature Electronic Program will be presented in this paper. A description of the low temperature test facilities along with selected data obtained through in-house component and circuit testing will also be discussed. Ongoing research activities that are being performed in collaboration with various organizations will also be presented.

Patterson, Richard L.↗
NASA NTRS2006

Data Converters Performance at Extreme Temperatures

Space missions often require radiation and extreme-temperature hardened electronics to survive the harsh environments beyond earth's atmosphere. Traditional approaches to preserve electronics incorporate shielding, insulation and redundancy at the expense of power and weight. However, a novel way of bypassing these problems is the concept of evolutionary hardware. A reconfgurable device, consisting of several switches interconnected with analog/digital parts, is controlled by an evolutionary processor (EP). When the EP detects degradation in the circuit it sends signals to reconfgure the switches, thus forming a new circuit with the desired output. This concept has been developed since the mid-90s, but one problem remains - the EP cannot degrade substantially. For this reason, extensive testing at extreme temperatures (-180' to 120(deg)C) has been done on devices found on FPGA boards (taking the role of the EP) such as the Analog to Digital and the Digital to Analog Converter. Analysis of the results has shown that FPGA boards implementing EP with some compensation may be a practical solution to evolving circuits. This paper describes results on the tests of data converters at extreme temperatures.

evolvable hardware↗
NASA NTRS2005

Temperature Tolerant Evolvable Systems Utilizing FPGA Boards and Bias-Controlled Amplifiers

Space missions often require radiation and extreme-temperature hardened electronics to survive the harsh environments beyond Earth's atmosphere. Traditional approaches to preserve electronics incorporate shielding, insulation and redundancy at the expense of power and weight. However, a novel way of bypassing these problems is the concept of evolutionary hardware. A reconfigurable device, consisting of several switches interconnected with analog/digital parts, is controlled by an evolutionary processor (EP). When the EP detects degradation in the circuit it sends signals to reconfigure the switches, thus forming a new circuit with the desired output. This concept has been developed since the mid-l990s, but one problem remains-the EP cannot degrade substantially. For this reason, extensive testing at extreme temperatures (-180 to 120 C) has been done on devices found on FPGA boards (taking the role of the EP), such as the Analog to Digital and the Digital to Analog Converter. The EP is used in conjunction with a bias-controlled amplifier and a new prototype relay board, which is interconnected with 6 G4-FETs, a tri-input transistor-like element developed at JPL. The greatest improvements to be made lie in the reconfigurable device, so future design and testing of the G4-FET chip is required.

Kumar, Nikhil R.↗
NASA NTRS2006

Temperature-adaptive Circuits on Reconfigurable Analog Arrays

This paper describes a new reconfigurable analog array (MA) architecture and integrated circuit (IC) used to map analog circuits that can adapt to extreme temperatures under programmable control. Algorithm-driven adaptation takes place on the RAA IC. The algorithms are implemented in a separate Field Programmable Gate Array (FPGA) IC, co-located with the RAA in the extreme temperature environment. The experiments demonstrate circuit adaptation over a wide temperature range, from extremely low temperature of -180 C to high 120 C.

self recovery↗
NASA NTRS2013

Behavior Prediction Tools Strengthen Nanoelectronics

Several years ago, NASA started making plans to send robots to explore the deep, dark craters on the Moon. As part of these plans, NASA needed modeling tools to help engineer unique electronics to withstand extremely cold temperatures. According to Jonathan Pellish, a flight systems test engineer at Goddard Space Flight Center, "An instrument sitting in a shadowed crater on one of the Moon s poles would hover around 43 K", that is, 43 kelvin, equivalent to -382 F. Such frigid temperatures are one of the main factors that make the extreme space environments encountered on the Moon and elsewhere so extreme. Radiation is another main concern. "Radiation is always present in the space environment," says Pellish. "Small to moderate solar energetic particle events happen regularly and extreme events happen less than a handful of times throughout the 7 active years of the 11-year solar cycle." Radiation can corrupt data, propagate to other systems, require component power cycling, and cause a host of other harmful effects. In order to explore places like the Moon, Jupiter, Saturn, Venus, and Mars, NASA must use electronic communication devices like transmitters and receivers and data collection devices like infrared cameras that can resist the effects of extreme temperature and radiation; otherwise, the electronics would not be reliable for the duration of the mission.

Source record↗
NASA NTRS2018

Extreme Temperature Performance of Automotive-Grade Small Signal Bipolar Junction Transistors

Electronics designed for space exploration missions must display efficient and reliable operation under extreme temperature conditions. For example, lunar outposts, Mars rovers and landers, James Webb Space Telescope, Europa orbiter, and deep space probes represent examples of missions where extreme temperatures and thermal cycling are encountered. Switching transistors, small signal as well as power level devices, are widely used in electronic controllers, data instrumentation, and power management and distribution systems. Little is known, however, about their performance in extreme temperature environments beyond their specified operating range; in particular under cryogenic conditions. This report summarizes preliminary results obtained on the evaluation of commercial-off-the-shelf (COTS) automotive-grade NPN small signal transistors over a wide temperature range and thermal cycling. The investigations were carried out to establish a baseline on functionality of these transistors and to determine suitability for use outside their recommended temperature limits.

Thermal Cycling↗