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High temperature thruster technology for spacecraft propulsion

A technology program intended to develop high-temperature oxidation-resistant thrusters for spacecraft applications is considered. The program will provide the requisite material characterizations and fabrication to incorporate iridium coated rhenium material into small rockets for spacecraft propulsion. This material increases the operating temperature of thrusters to 2200 C, a significant increase over the 1400 C of the silicide-coated niobium chambers currently used. Stationkeeping class 22 N engines fabricated from iridium-coated rhenium have demonstrated steady state specific impulses 20-25 seconds higher than niobium chambers. These improved performances are obtained by reducing or eliminating the fuel film cooling requirements in the combustion chamber while operating at the same overall mixture ratio as conventional engines.

Schneider, Steven J.

Silicon carbide semiconductor technology for high temperature and radiation environments

Viewgraphs on silicon carbide semiconductor technology and its potential for enabling electronic devices to function in high temperature and high radiation environments are presented. Topics covered include silicon carbide; sublimation growth of 6H-SiC boules; SiC chemical vapor deposition reaction system; 6H silicon carbide p-n junction diode; silicon carbide MOSFET; and silicon carbide JFET radiation response.

Matus, Lawrence G.

A Brief Status Update on Venus Long Lived Lander Technologies

The extreme surface conditions of Venus, including high temperature/pressure and reactive chemistry, have previously limited the lifetime of surface missions to ~2 hours. However, recent advances in high temperature technologies suggest the possibility of extended duration missions on the Venus surface. This presentation gives a brief overview on a range of high temperature technologies to enable a possible extended duration Venus surface mission. This presentation highlights the technology development under the Long-Lived In Situ Solar System Explorer (LLISSE) project and related technologies. The LLISSE project aimed towards developing a full lander system operational for 60 days on the Venus surface and included a power source, electronics, communications, sensors, and the structure, each at a different level of maturity. This presentation briefly describes these and other lander system technologies, their relative level of maturity, and planned future development for Venus surface exploration.

Venus surface exploration high temperature technol

An Overview of Long-Lived Venus Lander Technologies

The extreme surface conditions of Venus, including high temperature/pressure and reactive chemistry, have previously limited the lifetime of surface missions to ~2 hours. However, recent advances in high temperature technologies suggest the possibility of extended duration missions on the Venus surface. This presentation gives a brief overview on a range of high temperature technologies to enable a possible extended duration Venus surface mission, as well as an overview of the motivation and challenges of Venus surface exploration. The technology development under the Long-Lived In Situ Solar System Explorer (LLISSE) project and related technologies will be emphasized. The LLISSE project aimed towards developing a full lander system operational for 60 days on the Venus surface and included a power source, electronics, communications, sensors, and the structure, each at a different level of maturity. This presentation briefly describes these and other lander system technologies, their relative level of maturity, and planned future development for Venus surface exploration.

Venus surface exploration high temperature technol

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu

Venus Sample Return Using In-situ Propellant

This project will pioneer a new approach to return a sample from the surface of Venus. At 450°C and 92 bar pressure, the Venus surface is the most hostile environment in the solar system. This project merges an innovative carbon monoxide rocket concept using propellant made from the Venus atmosphere with innovations in high-temperature technology and solar aircraft. We turn an ambitious mission into a reality. The mission will return a sample from the scorching surface of Venus, using a novel multi-step approach incorporating new technology. The high-temperature solar aircraft collects the sample from the surface and carries it above the main cloud deck to a balloon platform with a launch vehicle & propellant manufacturing plant. The carbon monoxide/oxygen monopropellant is manufactured from the Venus atmosphere.

Venus

High temperature superconductivity technology for advanced space power systems

In 1987, the Lewis Research center of the NASA and the Argonne National Laboratory of the Department of Energy joined in a cooperative program to identify and assess high payoff space and aeronautical applications of high temperature superconductivity (HTSC). The initial emphasis of this effort was limited, and those space power related applications which were considered included microwave power transmission and magnetic energy storage. The results of these initial studies were encouraging and indicated the need of further studies. A continuing collaborative program with Argonne National Laboratory has been formulated and the Lewis Research Center is presently structuring a program to further evaluate HTSC, identify applications and define the requisite technology development programs for space power systems. This paper discusses some preliminary results of the previous evaluations in the area of space power applications of HTSC which were carried out under the joint NASA-DOE program, the future NASA-Lewis proposed program, its thrusts, and its intended outputs and give general insights on the anticipated impact of HTSC for space power applications of the future.

Faymon, Karl A.

Advanced High-Temperature Engine Materials Technology Progresses

The objective of the Advanced High Temperature Engine Materials Technology Program (HITEMP) is to generate technology for advanced materials and structural analysis that will increase fuel economy, improve reliability, extend life, and reduce operating costs for 21st century civil propulsion systems. The primary focus is on fan and compressor materials (polymer-matrix composites--PMC's), compressor and turbine materials (superalloys, and metal-matrix and intermetallic-matrix composites--MMC's and IMC's) and turbine materials (ceramic-matrix composites--CMC's). These advanced materials are being developed by in-house researchers and on grants and contracts. NASA considers this program to be a focused materials and structures research effort that builds on our base research programs and supports component-development projects. HITEMP is coordinated with the Advanced Subsonic Technology (AST) Program and the Department of Defense/NASA Integrated High-Performance Turbine Engine Technology (IHPTET) Program. Advanced materials and structures technologies from HITEMP may be used in these future applications. Recent technical accomplishments have not only improved the state-of-the-art but have wideranging applications to industry. A high-temperature thin-film strain gage was developed to measure both dynamic and static strain up to 1100 C (2000 F). The gage's unique feature is that it is minimally intrusive. This technology, which received a 1995 R&D 100 Award, has been transferred to AlliedSignal Engines, General Electric Company, and Ford Motor Company. Analytical models developed at the NASA Lewis Research Center were used to study Textron Specialty Materials' manufacturing process for titanium-matrix composite rings. Implementation of our recommendations on tooling and processing conditions resulted in the production of defect free rings. In the Lincoln Composites/AlliedSignal/Lewis cooperative program, a composite compressor case is being manufactured with a Lewis-developed matrix, VCAP. The compressor case, which will reduce weight by 30 percent and costs by 50 percent, is scheduled to be engine tested in the near future.

Source record

Progress in advanced high temperature materials technology

Materials for intermediate temperature applications are considered, taking into account possibilities regarding the use of prealloyed powder processing to obtain superalloys with increased strength for turbine disk applications. Materials for high temperature application are also discussed. Attention is given to oxide dispersion strengthened alloys (ODS), ceramics, directionally solidified eutectics, ODS + gamma prime alloys, and composites. A description is presented of various approaches for providing environmental protection.

Freche, J. C.

Advanced High-Temperature Engine Materials Technology Progresses

The objective of the Advanced High Temperature Engine Materials Technology Program (HITEMP) at the NASA Lewis Research Center is to generate technology for advanced materials and structural analysis that will increase fuel economy, improve reliability, extend life, and reduce operating costs for 21st century civil propulsion systems. The primary focus is on fan and compressor materials (polymer-matrix composites - PMC's), compressor and turbine materials (superalloys, and metal-matrix and intermetallic-matrix composites - MMC's and IMC's), and turbine materials (ceramic-matrix composites - CMC's). These advanced materials are being developed in-house by Lewis researchers and on grants and contracts.

Source record

Computational technology for high-temperature aerospace structures

The status and some recent developments of computational technology for high-temperature aerospace structures are summarized. Discussion focuses on a number of aspects including: goals of computational technology for high-temperature structures; computational material modeling; life prediction methodology; computational modeling of high-temperature composites; error estimation and adaptive improvement strategies; strategies for solution of fluid flow/thermal/structural problems; and probabilistic methods and stochastic modeling approaches, integrated analysis and design. Recent trends in high-performance computing environment are described and the research areas which have high potential for meeting future technological needs are identified.

Noor, A. K.

Roadmap to Advance Heliostat Technologies for High Temperature Solar-Thermal Systems

Since its establishment, the Heliostat Consortium (HelioCon) has made substantial progress toward closing many of the gaps in concentrating solar power (CSP) research. Numerous techno-economic studies have been performed, investigating topics ranging from the trade-off between size and temperature for industrial process heat applications to optimization of the heliostat design itself for various applications. Significant improvements have been made in optical metrology techniques, with first steps toward in situ measurement of heliostat fields. Several standards have been, and continue to be, developed with the coordination of an international group of CSP industry participants. Training programs have been developed, with universities including CSP in their engineering curricula, and many public webinars have been held to provide broad access to the latest CSP research. Improved CSP components such as mirror facets and wireless communication systems have been developed, and the solar tower at Sandia National Laboratories has been upgraded with a testbed for closed-loop controls research and development. Field deployment challenges involving heliostat foundations and sensitive wildlife habitats have been explored, with progress made toward methods for streamlining project development and permitting. Additional knowledge has been added to the body of work on wind behavior of heliostats and arrays of heliostats, with progress made toward a holistic understanding of wind design methods. Finally, techniques have been developed and demonstrated for assessing soiling conditions at a proposed project site, with predictive models for the soiling rate showing good results. Taking these results together, HelioCon has contributed greatly to the global CSP research and development effort over the past several years.

14 SOLAR ENERGY

The Use of Microelectrodes in Molten Salt Electrochemistry

Molten salts have attracted considerable interest as essential media for advanced high-temperature technologies, including molten salt reactors, thermal energy storage, high-temperature electrolysis, and pyrochemical processing. Their ability to remain stable in liquid form at elevated temperatures, combined with favorable thermophysical properties and wide electrochemical windows, makes them highly suitable for applications involving heat transfer, energy storage, and hightemperature electrochemical processing. However, despite these advantages, molten salts present challenges due to their chemically reactive nature at high-temperatures, especially in the presence of oxidizing impurities. Salt chemistry can fluctuate through interactions with impurities over time, or fuel burnup in the case of molten salt reactors, often leading to the dissolution of metal species. This dynamic environment not only results in complex redox behavior but also promotes corrosion, which is rarely uniform and frequently manifests as localized degradation driven by structural materials’ compositional differences, electrochemical imbalances, and microstructural susceptibilities.

Kim, Changkyu [University of Wisconsin-Madison, WI

Strain-Sensing Technology For High-Temperature Applications

Paper reviews status of strain-sensing technology for high-temperature applications. Techniques discussed supported by NASA, such as those needed for applications in hypersonic vehicles and engines, advanced subsonic engines, and development of materials and structures for high temperatures. Applications involve temperatures from 540 degrees C (1,000 degrees F) to more than 1,400 degrees C (2,600 degrees F). Commercial resistance strain gauges do not give repeatable readings at temperatures above 400 degrees C (750 degrees F).

Williams, W. Dan

Technology trends in high temperature pressure transducers: The impact of micromachining

This paper discusses the implications of micromachining technology on the development of high temperature pressure transducers. The introduction puts forth the thesis that micromachining will be the technology of choice for the next generation of extended temperature range pressure transducers. The term micromachining is defined, the technology is discussed and examples are presented. Several technologies for high temperature pressure transducers are discussed, including silicon on insulator, capacitive, optical, and vibrating element. Specific conclusions are presented along with recommendations for development of the technology.

Mallon, Joseph R., Jr.