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NASA NTRS2011

Reliability of Solder Materials (Sn-Pb and Pb-Free) for Deep Space Missions

The purpose of this study is to assess the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead (Sn-Pb) and lead-free (Pb-Free) solder alloys under extreme temperature deep space environments.

extreme temperatures↗