Search NASA⌕ Search

SEARCH · Search NASA

Results for “multilayer packaging”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 37 records · Page 2

Response time for multilayered platinum resistance thermometers

Response time constants for several multilayered temperature transducers were determined numerically by using Martin Marietta's MITAS software package which is available at NASA Langley Research Center. Present results were found in close agreement with the solutions reported in the literature, thus, the capability of MITAS was justified. On the basis of experiences gained, the MITAS is recommended for use in predicting the response time constants of sensors by an in-situ technique.

Pandey, D. K.↗

Guidelines for Selection, Screening and Qualification of Low-Voltage Commercial Multilayer Ceramic Capacitors for Space Programs

This document has been developed in the course of NASA Electronic Parts and Packaging (NEPP) program and is not an official endorsement of the insertion of commercial capacitors in space programs or an established set of requirements for their testing. The purpose of this document is to suggest possible ways for selection, screening, and qualification of commercial capacitors for NASA projects and open discussions in the parts engineering community related to the use of COTS ceramic capacitors. This guideline is applicable to commercial surface mount chip, simple parallel plate design, multi-layer ceramic capacitors (MLCCs) rated to voltages of 100V and less. Parts with different design, e.g. low inductance ceramic capacitors (LICA), land grid array (LGA) etc., might need additional testing and tailoring of the requirements described in this document. Although the focus of this document is on commercial MLCCs, many procedures discussed below would be beneficial for military-grade capacitors

Teverovsky, Alexander A.↗

A Hard-X-Ray Telescope Science Enhancement Package for the Constellation-X Mission

We present a science enhancement package (SEP) for NASA's planned Constellation-X mission submitted in response to a call for white papers. The call solicited proposals for either extending the bandwidth of Con-X to higher energies or enhancing the low-energy spectral resolution. The ground rules were that enhancement package should cost no more than $100M and weigh no more than 100 kg. The nickel-replicated-optics team responded with a stand-alone hard-x-ray telescope SEP concept. This consisted of two mirror modules, each with approximately 70 multilayer and iridium-coated shells, and two corresponding cadmium-zinc-telluride-based focal plane detectors. Addition of this package permits measurement of the hard-x-ray continuum up to 30-40 keV, which is essential for a quantitative measurement of the spectrum of gravitationally broadened iron lines that appear in the spectra of many black hole candidates. Full details of the instrument will be presented showing trades in energy bandwidth and effective area together with the full science justification for the enhancement package.

Ramsey, Brian↗

Reliability evaluation of hermetic dual in-line flat microcircuit packages

The relative strengths and weaknesses of 35 commonly used hermetic flat and dual in-line packages were determined and used to rank each of the packages according to a numerical weighting scheme for package attributes. The list of attributes included desirable features in five major areas: lead and lead seal, body construction, body materials, lid and lid seal, and marking. The metal flat pack and multilayer integral ceramic flat pack and DIP received the highest rankings, and the soft glass Cerdip and Cerpak types received the lowest rankings. Loss of package hermeticity due to lead and lid seal problems was found to be the predominant failure mode from the literature/data search. However, environmental test results showed that lead and lid seal failures due to thermal stressing was only a problem with the hard glass (Ceramic) body DIP utilizing a metal lid and/or bottom. Insufficient failure data were generated for the other package types tested to correlate test results with the package ranking.

Johnson, G. M.↗

Design of a Thermal and Micrometeorite Protection System for an Unmanned Lunar Cargo Lander

The first vehicles to land on the lunar surface during the establishment phase of a lunar base will be unmanned lunar cargo landers. These landers will need to be protected against the hostile lunar environment for six to twelve months until the next manned mission arrives. The lunar environment is characterized by large temperature changes and periodic micrometeorite impacts. An automatically deployable and reconfigurable thermal and micrometeorite protection system was designed for an unmanned lunar cargo lander. The protection system is a lightweight multilayered material consisting of alternating layers of thermal and micrometeorite protection material. The protection system is packaged and stored above the lander common module. After landing, the system is deployed to cover the lander using a system of inflatable struts that are inflated using residual fuel (liquid oxygen) from the fuel tanks. Once the lander is unloaded and the protection system is no longer needed, the protection system is reconfigured as a regolith support blanket for the purpose of burying and protecting the common module, or as a lunar surface garage that can be used to sort and store lunar surface vehicles and equipment. A model showing deployment and reconfiguration of the protection system was also constructed.

Hernandez, Carlos A.↗

A basic design fault in ceramic flat packs

Recent moisture resistance tests of various multilayer top brazed ceramic flat packs and leaded and unleaded chip carriers has revealed a serious design defect. These packages, which utilize a tungsten interconnect system, in the presence of high humidity, suffer a galvanic corrosion which anodically consumes the tungsten. This process can continue until the package suffers an open circuit. The test results indicate that the lead plating system does not adequately seal off the interface area where the tungsten strips egresses from the inside of the package.

Drotman, B.↗

A basic design fault in ceramic flat packs

Recent moisture resistance tests of various multilayer top brazed ceramic flat packs and leaded and unleaded chip carriers has revealed a serious design defect. These packages, which utilize a tungsten interconnect system, in the presence of high humidity, suffer a galvanic corrosion which anodically consumes the tungsten. This process can continue until the package suffers an open circuit. The test results indicate that the lead plating system does not adequately seal off the interface area where the tungsten stripe egresses from the inside of the package. Leaded and leadless chip carrier packages were also subjected to the moisture resistance test. The familiar red and green corrosion products were visible after the test was completed. Careful sectioning of the chip carriers has revealed that the tungsten interconnect stripe instead of exiting under the castellations, exits at the top of the castellation and is thus vulnerable to the attack of moisture. These basic design faults severely impact the reliability of these packages.

Drotman, B.↗

LK39F1 S/N U-1 infrared detector

A multilayered (Hg,Cd)Te detector is described with three infrared bands. Nominal cut-off wavelengths for each band are as follows: (1) Channel 1 - 3 microns, (2) Channel 2 - 6 microns, and (3) Channel 3 - 11 microns. The multilayered detector is mounted in a Honeywell LK39 glass dewar. Accompanying the detector/dewar assembly is a three-channel preamplifier package capable of switching each detector to the single channel input of the HRB Singer Reconfax 4 Mark 4 Infrared Scanner.

Source record↗

Optical Design of the MOSES Sounding Rocket Experiment

The Multi-Order Solar EUV Spectrograph (MOSES) is a sounding rocket payload now being developed by Montana State University in collaboration with the Goddard Space Flight Center, Lockheed Martin Advanced Technology Center, and Mullard Space Science Laboratory. The instrument utilizes a unique optical design to provide solar EUV measurements with true 2-pixel resolutions of 1.0 arcsec and 60 mA over a full two-dimensional field of view of 1056 x 528 arcsec, all at a time cadence of 10 s. This unprecedented capability is achieved by means of an objective spherical grating 100 mm in diameter, ruled at 833 gr/mm. The concave grating focuses spectrally dispersed solar radiation onto three separate detectors, simultaneously recording the zero-order as well as the plus and minus first-spectral-order images. Data analysis procedures, similar to those used in X-ray tomography reconstructions, can then disentangle the mixed spatial and spectral information recorded by the multiple detectors. A flat folding mirror permits an imaging focal length of 4.74 m to be packaged within the payload's physical length of 2.82 m. Both the objective grating and folding flat have specialized, closely matched, multilayer coatings that strongly enhance their EUV reflectance while also suppressing off-band radiation that would otherwise complicate data inversion. Although the spectral bandpass is rather narrow, several candidate wavelength intervals are available to carry out truly unique scientific studies of the outer solar atmosphere. Initial flights of MOSES, scheduled to begin in 2004, will observe a 10 Angstrom band that covers very strong emission lines characteristic of both the sun's corona (Si XI 303 Angstroms) and transition-region (He II 304 Angstroms). The MOSES program is supported by a grant from NASA's Office of Space Science.

Thomas, Roger J.↗

Aerogel-Based Multilayer Insulation with Micrometeoroid Protection

Ultra-low-density, highly hydrophobic, fiber-reinforced aerogel material integrated with MLI (aluminized Mylar reflectors and B4A Dacron separators) offers a highly effective insulation package by providing unsurpassed thermal performance and significant robustness, delivering substantial MMOD protection via the addition of a novel, durable, external aerogel layer. The hydrophobic nature of the aerogel is an important property for maintaining thermal performance if the material is exposed to the environment (i.e. rain, snow, etc.) during ground installations. The hybrid aerogel/MLI/MMOD solution affords an attractive alternative because it will perform thermally in the same range as MLI at all vacuum levels (including high vacuum), and offers significant protection from micrometeoroid damage. During this effort, the required low-density and resilient aerogel materials have been developed that are needed to optimize the thermal performance for space (high vacuum) cryotank applications. The proposed insulation/MMOD package is composed of two sections: a stack of interleaved aerogel layers and MLI intended for cryotank thermal insulation, and a 1.5- to 1-in. (.2.5- to 3.8- cm) thick aerogel layer (on top of the insulation portion) for MMOD protection. Learning that low-density aerogel cannot withstand the hypervelocity impact test conditions, the innovators decided during the course of the program to fabricate a high-density and strong material based on a cross-linked aerogel (X-aerogel; developed elsewhere by the innovators) for MMOD protection. This system has shown a very high compressive strength that is capable of withstanding high-impact tests if a proper configuration of the MMOD aerogel layer is used. It was learned that by stacking two X-aerogel layers [1.5-in. (.3.8-cm) thick] separated by an air gap, the system would be able to hold the threat at a speed of 5 km/s and gpass h the test. The first aerogel panel stopped the projectile from damaging the second aerogel panel. The impacted X-aerogel (the back specimen from the successful test) was further tested in comparison to another similar sample (not impacted) at Kennedy Space Center for thermal conductivity evaluation at cryogenic conditions. The specimens were tested under high vacuum and cryogenic temperatures, using Cryostat 500. The results show that the specimen did not lose a significant amount of thermal performance due to the impact test, especially at high vacuum.

Begag, Redouane↗

Evaluation of propellant tank insulation concepts for low-thrust chemical propulsion systems

An analytical evaluation of cryogenic propellant tank insulations for liquid oxygen/liquid hydrogen low-thrust 2224N (500 lbf) propulsion systems (LTPS) was conducted. The insulation studied consisted of combinations of N2-purged foam and multilayer insulation (MLI) as well as He-purged MLI-only. Heat leak and payload performance predictions were made for three Shuttle-launched LTPS designed for Shuttle bay packaged payload densities of 56 kg/cu m, 40 kg/cu m and 24 kg/cu m. Foam/MLI insulations were found to increase LTPS payload delivery capability when compared with He-purged MLI-only. An additional benefit of foam/MLI was reduced operational complexity because Orbiter cargo bay N2 purge gas could be used for MLI purging. Maximum payload mass benefit occurred when an enhanced convection, rather than natural convection, heat transfer was specified for the insulation purge enclosure. The enhanced convection environment allowed minimum insulation thickness to be used for the foam/MLI interface temperature selected to correspond to the moisture dew point in the N2 purge gas. Experimental verification of foam/MLI benefits was recommended. A conservative program cost estimate for testing a MLI-foam insulated tank was 2.1 million dollars. It was noted this cost could be reduced significantly without increasing program risk.

Kramer, T.↗

Evaluation of propellent tank insulation concepts for low-thrust chemical propulsion systems: Executive summary

Cryogenic propellant tank insulations or liquid oxygen/liquid hydrogen low-thrust 2224N (500 lbf) propulsion systems (LTPS) were assessed. The insulation studied consisted of combinations of N2-purged foam and multilayer insulation (MLI) as well as He-purged MLI-only. Heat leak and payload performance predictions were made for three shuttle-launched LTPS designed for shuttle bay packaged payload densities of 56 kg cu/m (3.5 lbm/cu ft), 40 kg/cu m (2.5 lbm/cu ft) and 24 kg/cu m (1.5 lbm/cu ft). Foam/MLI insulations were found to increase LTPS payload delivery capability when compared with He-purged MLI-only. An additional benefit of foam/MLI was reduced operational complexity because orbiter cargo bay N2 purge gas could be used for MLI purging. Maximum payload mass benefit occurred when an enhanced convection, rather than natural convection, heat transfer was specified for the insulation purge enclosure. The enhanced convection environment allowed minimum insulation thickness to be used for the foam/MLI interface temperature selected to correspond to the moisture dew point in the N2 purge gas. Experimental verification of foam/MLI benefits was recommended. A conservative program cost estimate for testing a MLI-foam insulated tank was 2.1 million dollars. This cost could be reduced significantly without increasing program risk.

Kramer, T.↗

4H-SiC JFET Multilayer Integrated Circuit Technologies Tested Up to 1000 K

Testing of semiconductor electronics at temperatures above their designed operating envelope is recognized as vital to qualification and lifetime prediction of circuits. This work describes the high temperature electrical testing of prototype 4H silicon carbide (SiC) junction field effect transistor (JFET) integrated circuits (ICs) technology implemented with multilayer interconnects; these ICs are intended for prolonged operation at temperatures up to 773K (500 C). A 50 mm diameter sapphire wafer was used in place of the standard NASA packaging for this experiment. Testing was carried out between 300K (27 C) and 1150K (877 C) with successful electrical operation of all devices observed up to 1000K (727 C).

JFET↗

Method for Fabricating and Packaging an M.Times.N Phased-Array Antenna

A method for fabricating an M.times.N, P-bit phased-array antenna on a flexible substrate is disclosed. The method comprising ink jet printing and hardening alignment marks, antenna elements, transmission lines, switches, an RF coupler, and multilayer interconnections onto the flexible substrate. The substrate of the M.times.N, P-bit phased-array antenna may comprise an integrated control circuit of printed electronic components such as, photovoltaic cells, batteries, resistors, capacitors, etc. Other embodiments are described and claimed.

Subbaraman, Harish↗

NASA Tech Briefs, May 2013

Topics include: Test Waveform Applications for JPL STRS Operating Environment; Pneumatic Proboscis Heat-Flow Probe; Method to Measure Total Noise Temperature of a Wireless Receiver During Operation; Cursor Control Device Test Battery; Functional Near-Infrared Spectroscopy Signals Measure Neuronal Activity in the Cortex; ESD Test Apparatus for Soldering Irons; FPGA-Based X-Ray Detection and Measurement for an X-Ray Polarimeter; Sequential Probability Ratio Test for Spacecraft Collision Avoidance Maneuver Decisions; Silicon/Carbon Nanotube Photocathode for Splitting Water; Advanced Materials and Fabrication Techniques for the Orion Attitude Control Motor; Flight Hardware Packaging Design for Stringent EMC Radiated Emission Requirements; RF Reference Switch for Spaceflight Radiometer Calibration; An Offload NIC for NASA, NLR, and Grid Computing; Multi-Scale CNT-Based Reinforcing Polymer Matrix Composites for Lightweight Structures; Ceramic Adhesive and Methods for On-Orbit Repair of Re-Entry Vehicles; Self-Healing Nanocomposites for Reusable Composite Cryotanks; Pt-Ni and Pt-Co Catalyst Synthesis Route for Fuel Cell Applications; Aerogel-Based Multilayer Insulation with Micrometeoroid Protection; Manufacturing of Nanocomposite Carbon Fibers and Composite Cylinders; Optimized Radiator Geometries for Hot Lunar Thermal Environments; A Mission Concept: Re-Entry Hopper-Aero-Space-Craft System on-Mars (REARM-Mars); New Class of Flow Batteries for Terrestrial and Aerospace Energy Storage Applications; Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments; Using a Blender to Assess the Microbial Density of Encapsulated Organisms; Mixed Integer Programming and Heuristic Scheduling for Space Communication; Video Altimeter and Obstruction Detector for an Aircraft; Control Software for Piezo Stepping Actuators; Galactic Cosmic Ray Event-Based Risk Model (GERM) Code; Sasquatch Footprint Tool; and Multi-User Space Link Extension (SLE) System.

Source record↗

Packaging Of Control Circuits In A Robot Arm

Packaging system houses and connects control circuitry mounted on circuit boards within shoulder, upper section, and lower section of seven-degree-of-freedom robot arm. Has modular design that incorporates surface-mount technology, multilayer circuit boards, large-scale integrated circuits, and multi-layer flat cables between sections for compactness. Three sections of robot arm contain circuit modules in form of stardardized circuit boards. Each module contains two printed-circuit cards, one of each face.

Kast, William↗

Thin Film Physical Sensor Instrumentation Research and Development at NASA Glenn Research Center

A range of thin film sensor technology has been demonstrated enabling measurement of multiple parameters either individually or in sensor arrays including temperature, strain, heat flux, and flow. Multiple techniques exist for refractory thin film fabrication, fabrication and integration on complex surfaces and multilayered thin film insulation. Leveraging expertise in thin films and high temperature materials, investigations for the applications of thin film ceramic sensors has begun. The current challenges of instrumentation technology are to further develop systems packaging and component testing of specialized sensors, further develop instrumentation techniques on complex surfaces, improve sensor durability, and to address needs for extreme temperature applications. The technology research and development ongoing at NASA Glenn for applications to future launch vehicles, space vehicles, and ground systems is outlined.

Wrbanek, John D.↗

Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary report

Electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnection technique called discrete multilayer (DML). Development and qualification of high density cabling techniques, using small gage wire and microminiature connectors, are also reported.

Dawe, R. H.↗