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At least 37 records · Page 2

Pixel detectors in double beta decay experiments, a new approach for background reduction

Double beta decay (ββ) experiments are challenging frontiers in contemporary physics. These experiments have the potential to investigate more about neutrinos (eg. nature and mass). The main challenge for these experiments is the reduction of background. The group at IEAP, CTU in Prague is investigating a new approach using pixel detectors Timepix. Pixel detector offer background reduction capabilities with its ability to identify the particle interaction (from the 2D signature it generates). However, use of pixel detectors has some challenges such as the presence of readout electronics near the sensing medium and heat dissipation. Different aspects of pixel setup (identification of radio-impurities, selection of radio-pure materials) and proposed experimental setup are presented. Also, results of preliminary background measurements (performed on the surface and in the underground laboratories) using the prototype setups are presented.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

A review of advances in pixel detectors for experiments with high rate and radiation

The large Hadron collider (LHC) experiments ATLAS and CMS have established hybrid pixel detectors as the instrument of choice for particle tracking and vertexing in high rate and radiation environments, as they operate close to the LHC interaction points. With the high luminosity-LHC upgrade now in sight, for which the tracking detectors will be completely replaced, new generations of pixel detectors are being devised. They have to address enormous challenges in terms of data throughput and radiation levels, ionizing and non-ionizing, that harm the sensing and readout parts of pixel detectors alike. Advances in microelectronics and microprocessing technologies now enable large scale detector designs with unprecedented performance in measurement precision (space and time), radiation hard sensors and readout chips, hybridization techniques, lightweight supports, and fully monolithic approaches to meet these challenges. In conclusion, this paper reviews the world-wide effort on these developments.

47 OTHER INSTRUMENTATION↗

Si pixel detectors in the detection of EC/EC decay

The SPT collaboration has been investigating the applicability of pixel detectors in the detection of two neutrino double electron capture (2νEC/EC) in{sup 106}Cd. The collaboration has proposed a Silicon Pixel Telescope (SPT) where a pair of Si pixel detectors with enriched Cd foil in the middle forms the detection unit. The Pixel detector gives spatial information along with energy of the particle, thus helps to identify and remove the background signals. Four units of SPT prototype (using 0.5 and 1 mm Si sensors) were fabricated and installed in the LSM underground laboratory, France. Recent progress in the SPT experiment and preliminary results from background measurements are presented.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Use of high-granularity CdZnTe pixelated detectors to correct response non-uniformities caused by defects in crystals

Following our successful demonstration of the position-sensitive virtual Frisch-grid detectors, we investigated the feasibility of using high-granularity position sensing to correct response non-uniformities caused by the crystal defects in CdZnTe (CZT) pixelated detectors. The development of high-granularity detectors able to correct response non-uniformities on a scale comparable to the size of electron clouds opens the opportunity of using unselected off-the-shelf CZT material, whilst still assuring high spectral resolution for the majority of the detectors fabricated from an ingot. Here, we present the results from testing 3D position-sensitive 15×15×10 mm 3 pixelated detectors, fabricated with conventional pixel patterns with progressively smaller pixel sizes: 1.4, 0.8, and 0.5 mm. We employed the readout system based on the H3D front-end multi-channel ASIC developed by BNL's Instrumentation Division in collaboration with the University of Michigan. We use the sharing of electron clouds among several adjacent pixels to measure locations of interaction points with sub-pixel resolution. By using the detectors with small-pixel sizes and a high probability of the charge-sharing events, we were able to improve their spectral resolutions in comparison to the baseline levels, measured for the 1.4-mm pixel size detectors with small fractions of charge-sharing events. These results demonstrate that further enhancement of the performance of CZT pixelated detectors and reduction of costs are possible by using high spatial-resolution position information of interaction points to correct the small-scale response non-uniformities caused by crystal defects present in most devices.

36 MATERIALS SCIENCE↗

Ultrafast processing of pixel detector data with machine learning frameworks

Modern photon science performed at high repetition rate free-electron laser (FEL) facilities and beyond relies on 2D pixel detectors operating at increasing frequencies (towards 100 kHz at LCLS-II) and producing rapidly increasing amounts of data (towards TB/s). This data must be rapidly stored for offline analysis and summarized in real time for online feedback to the scientists. While at LCLS all raw data has been stored, at LCLS-II this would lead to a prohibitive cost; instead, enabling real time processing of pixel detector data (dark, gain, common mode, background, charge summing, subpixel position, photon counting, data summarization) allows reducing the size and cost of online processing, offline processing and storage by orders of magnitude while preserving full photon information. This could be achieved by taking advantage of the compressibility of sparse data typical for LCLS-II applications. Faced with a similar big data challenge a decade ago, computer vision stimulated revolutionary advances in machine learning hardware and software. We investigated if these developments are useful in the field of data processing for high speed pixel detectors and found that typical deep learning models and autoencoder architectures failed to yield useful noise reduction while preserving full photon information, presumably because of the very different statistics and feature sets in computer vision and radiation imaging. However, the raw performance of modern frameworks like Tensorflow inspired us to redesign in Tensorflow mathematically equivalent versions of the state-of-the-art, “classical” algorithms used at LCLS. The novel Tensorflow models resulted in elegant, compact and hardware agnostic code, gaining 1 to 2 orders of magnitude faster processing on an inexpensive consumer GPU, reducing by 3 orders of magnitude the projected cost of online analysis and compression without photon loss at LCLS-II. The novel Tensorflow models also enabled ongoing development of a pipelined hardware system expected to yield an additional 3 to 4 orders of magnitude speedup, necessary for meeting the data acquisition and storage requirements at LCLS-II, potentially enabling acquiring every single FEL pulse at full speed. Computer vision a decade ago was dominated by hand-crafted filters; their structure inspired the deep learning revolution resulting in modern deep convolutional networks; similarly, our novel Tensorflow filters provide inspiration for designing future deep learning models for ultrafast and efficient processing and classification of pixel detector images at FEL facilities.

47 OTHER INSTRUMENTATION↗

Modeling and Analysis of Hybrid Pixel Detector Deficiencies for Scientific Applications

Semiconductor hybrid pixel detectors often consist of a pixellated sensor layer bump bonded to a matching pixelated readout integrated circuit (ROIC). The sensor can range from high resistivity Si to III-V materials, whereas a Si CMOS process is typically used to manufacture the ROIC. Independent, device physics and electronic design automation (EDA) tools are used to determine sensor characteristics and verify functional performance of ROICs respectively with significantly different solvers. Some physics solvers provide the capability of transferring data to the EDA tool. However, single pixel transient simulations are either not feasible due to convergence difficulties or are prohibitively long. A simplified sensor model, which includes a current pulse in parallel with detector equivalent capacitor, is often used; even then, spice type top-level (entire array) simulations range from days to weeks. In order to analyze detector deficiencies for a particular scientific application, accurately defined transient behavioral models of all the functional blocks are required. Furthermore, various simulations, such as transient, noise, Monte Carlo, inter-pixel effects, etc. of the entire array need to be performed within a reasonable time frame without trading off accuracy. The sensor and the analog front-end can be modeling using a real number modeling language, as complex mathematical functions or detailed data can be saved to text files, for further top-level digital simulations. Parasitically aware digital timing is extracted in a standard delay format (sdf) from the pixel digital back-end layout as well as the periphery of the ROIC. For any given input, detector level worst-case and best-case simulations are performed using a Verilog simulation environment to determine the output. Each top-level transient simulation takes no more than 10-15 minutes. The impact of changing key parameters such as sensor Poissonian shot noise, analog front-end bandwidth, jitter due to clock distribution etc. can be accurately analyzed to determine ROIC architectural viability and bottlenecks. Hence the impact of the detector parameters on the scientific application can be studied.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Tracking performance of a single-crystal and a polycrystalline diamond pixel-detector

We present a comparative characterization of the performance of a single-crystal and a polycrystalline diamond pixel-detector employing the standard CMS pixel readout chips. Measurements were carried out at the Fermilab Test Beam Facility, FTBF, using protons of momentum 120 GeV/c tracked by a high-resolution pixel telescope. Particular attention was directed to the study of the charge-collection, the charge-sharing among adjacent pixels and the achievable position resolution. The performance of the single-crystal detector was excellent and comparable to the best available silicon pixel-detectors. The measured average detection-efficiency was near unity, ε = 0.99860±0.00006, and the position-resolution for shared hits was about 6 μm. On the other hand, the performance of the polycrystalline detector was hampered by its lower charge collection distance and the readout chip threshold. A new readout chip, capable of operating at much lower threshold (around 1 ke $-$ ), would be required to fully exploit the potential performance of the polycrystalline diamond pixel-detector.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Progress in the use of pixel detectors in double beta decay experiment TGV

The TGV collaboration has been investigating two neutrino double electron capture (2νEC/EC) in {sup 106}Cd since 2000. The double beta experiments would answer some of the puzzling problems about neutrinos (e.g. nature and mass) but one of the main challenges is the background events. The collaboration is investigating the use of pixel detectors in such rare decay experiments. Pixel detector gives spatial information along with energy of the particle, thus provides useful information to reduce the background. The collaboration has proposed a Silicon Pixel Telescope (SPT) for the next generation experiment; where a pair of Si pixel detectors with enriched Cd foil in the middle forms the detection unit. A prototype unit of SPT has been constructed and results of preliminary background measurements performed on the surface and in the underground laboratories are presented.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗

The Timepix4 analog front-end design: Lessons learnt on fundamental limits to noise and time resolution in highly segmented hybrid pixel detectors

This manuscript describes the optimization of the front-end readout electronics for high granularity hybrid pixel detectors. The theoretical study aims at minimizing the noise and jitter. The model presented here is validated with both circuit post layout simulations and measurements on the Timepix4 Application Specific Integrated Circuit (ASIC). The analog front-end circuit and the procedure to optimize the dimensions of the main transistors are described with detail. The Timepix4 is the most recent ASIC designed in the framework of the Medipix4 Collaboration. It was manufactured in 65nm CMOS process, and consists of a four side buttable matrix of 448 × 512 pixels with 55µm pitch. The analog front-end has a gain of ~36mV/ke - when configured in High Gain Mode, and ~20mV/ke - when configured in Low Gain Mode. The Equivalent Noise Charge (ENC) is ~68e - rms and ~80e - rms in High Gain Mode and in Low Gain Mode respectively. In event driven mode the incoming hits can be time stamped within a ~ 200ps time bin and the chip can deal with a maximum flux of ~ 3.6MHzmm –2 s –1 . In photon counting mode, the chip can deal with up to ~ 5GHzmm –2 s –1 . The routine designed to optimize the Timepix4 front-end is then used to analyze the performance limits in terms of jitter and noise for Charge Sensitive Amplifiers in pixel detectors.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Particle showers detected on ISS in Timepix pixel detectors

We detect regular particle showers in several compact pixel detectors, distributed over the International Space Station. These showers are caused by high energy galactic cosmic rays, with energies often in the 10 s of TeV or higher. We survey the frequency of these events, their dependence on location on ISS, and their independence of the location of ISS, on its orbit. The Timepix detectors used allow individual particle tracks to be resolved, providing a possibility to perform physical analysis of shower events, which we demonstrate. In terms of radiation dosimetry, these showers indicate certain possible limitations of traditional dosimetric measures, in that (a) the dose measured in small sensor may be less than that received in a larger distribution of matter, such as a human and (b) the spatial and temporal extent of these events represents a regime of poorly documented biological response.

79 ASTRONOMY AND ASTROPHYSICS↗

Pixelated transmission-mode diamond X-ray detector

Fabrication and testing of a prototype transmission-mode pixelated diamond X-ray detector (pitch size 60–100 µm), designed to simultaneously measure the flux, position and morphology of an X-ray beam in real time, are described. The pixel density is achieved by lithographically patterning vertical stripes on the front and horizontal stripes on the back of an electronic-grade chemical vapor deposition single-crystal diamond. The bias is rotated through the back horizontal stripes and the current is read out on the front vertical stripes at a rate of ~1 kHz, which leads to an image sampling rate of ~30 Hz. This novel signal readout scheme was tested at beamline X28C at the National Synchrotron Light Source (white beam, 5–15 keV) and at beamline G3 at the Cornell High Energy Synchrotron Source (monochromatic beam, 11.3 keV) with incident beam flux ranges from 1.8 × 10 -2 to 90 W mm -2 . Test results show that the novel detector provides precise beam position (positional noise within 1%) and morphology information (error within 2%), with an additional software-controlled single channel mode providing accurate flux measurement (fluctuation within 1%).

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Design methodology: edgeless 3D ASICs with complex in-pixel processing for pixel detectors

The design methodology for the development of 3D integrated edgeless pixel detectors with in-pixel processing using Electronic Design Automation (EDA) tools is presented. A large area 3 tier 3D detector with one sensor layer and two ASIC layers containing one analog and one digital tier, is built for x-ray photon time of arrival measurement and imaging. A full custom analog pixel is 65μm x 65μm. It is connected to a sensor pixel of the same size on one side, and on the other side it has approximately 40 connections to the digital pixel. A 32 x 32 edgeless array without any peripheral functional blocks constitutes a sub-chip. The sub-chip is an indivisible unit, which is further arranged in a 6 x 6 array to create the entire 1.248cm x 1.248cm ASIC. Each chip has 720 bump-bond I/O connections, on the back of the digital tier to the ceramic PCB. All the analog tier power and biasing is conveyed through the digital tier from the PCB. The assembly has no peripheral functional blocks, and hence the active area extends to the edge of the detector. This was achieved by using a few flavors of almost identical analog pixels (minimal variation in layout) to allow for peripheral biasing blocks to be placed within pixels. The 1024 pixels within a digital sub-chip array have a variety of full custom, semi-custom and automated timing driven functional blocks placed together. The methodology uses a modified mixed-mode on-top digital implementation flow to not only harness the tool efficiency for timing and floor-planning but also to maintain designer control over compact parasitically aware layout. The methodology uses the Cadence design platform, however it is not limited to this tool.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Monolithic pixel detectors in silicon on insulator technology

Silicon On Insulator (SOI) is becoming an attractive technology to fabricate monolithic pixel detectors. The possibility of using the depleted resistive substrate as a drift collection volume and to connect it by means of vias through the buried oxide to the pixel electronic makes this kind of approach interesting both for particle and photon detection. In this paper I report the results obtained in the development of monolithic pixel detectors in an SOI technology by a collaboration between groups from the University and INFN of Padova (Italy) and the LBNL and the SCIPP at UCSC (USA).

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

RD53A: A large-scale prototype chip for the phase II upgrade in the serially powered HL-LHC pixel detectors

The phase II upgrade of the HL-LHC experiments within the LHC intends to deepen the studies of the Higgs boson and to allow the discovery of further particles by adding an integrated luminosity of about 4000 fb -1 over 10 years of operation. This upgrade would overwhelm the installed pixel detector readout chips with higher hit rates and radiation levels than ever before. To match these extreme requirements the RD53 collaboration, a joint effort between ATLAS and CMS, developed RD53A, a new generation pixel detector readout chip prototype manufactured in a 65 nm CMOS technology. It is half the size of the final pixel chips and designed to meet requirements in the face of 3 GHz/cm 2 hit rate after irradiation to 500 Mrad. The detector is able to use 50×50 μm 2 or 25×100 μm 2 pixels with high readout speed of up to 4 links per chip with 1.28 Gbit/s each. Shunt–LDO regulators integrated on the bottom of the chip provide the required voltages to the two power domains, analog and digital. These regulators enable serial powering of the pixel modules, which is the only feasible, radiation hard scheme to ensure acceptable power cable losses and to stay within the material budget for the future pixel detectors. Finally, an overview of the status and challenges of serial powering and the Shunt–LDO regulator development will be given.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Pixel Detector Developments for Tracker Upgrades of the High Luminosity LHC

This paper reports on the INFN (Istituto Nazionale di Fisica Nucleare, Italy) research activity in collaboration with FBK foundry, which is aiming at the development of new pixel detectors for the LHC Phase-2 upgrades. The R&D covers both planar pixel devices and 3D detectors built using columnar technology. All sensors are low thickness n-in-p type, as this is the general direction envisaged for the High Luminosity LHC pixel detector upgrades. Hybrid modules with 100 $\upmu $ m and 130 $\upmu $ m active thickness, connected to the PSI46dig readout chip, have been tested on beam test experiments. Selected preliminary results from test beams are described for both planar and 3D devices. The results on the 3D pixel sensors before irradiation are very satisfactory and support the conclusion that columnar devices are very good candidates for the inner layers of the upgrade pixel detectors.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Design Methodology: ASICs with complex in-pixel processing for Pixel Detectors

The development of Application Specific Integrated Circuits (ASIC) for pixel detectors with complex in-pixel processing using Computer Aided Design (CAD) tools that are, themselves, mainly developed for the design of conventional digital circuits requires a specialized approach. Mixed signal pixels often require parasitically aware detailed analog front-ends and extremely compact digital back-ends with more than 1000 transistors in small areas below 100μm x 100μm. These pixels are tiled to create large arrays, which have the same clock distribution and data readout speed constraints as in, for example, micro-processors. The methodology uses a modified mixed-mode on-top digital implementation flow to not only harness the tool efficiency for timing and floor-planning but also to maintain designer control over compact parasitically aware layout.

43 PARTICLE ACCELERATORS↗

Cadmium zinc telluride pixel detectors for high-intensity x-ray imaging at free electron lasers

Here, this paper reports the first demonstration of high-intensity x-ray imaging using cadmium zinc telluride (CdZnTe) pixel detectors at a free electron laser (FEL). Prototype detectors were produced using the STFC large pixel detector (LPD) ASIC and sensors fabricated from a novel high-intensity-capable CdZnTe material produced by Redlen Technologies. Characterisation of the performance of this sensor material was completed at the Linac Coherent Light Source (LCLS) FEL. The detectors were operated at a frame rate of 1 MHz with 9.5 keV x-ray pulses delivered at a rate of 120 Hz. Measurements successfully demonstrated the linear response of the CdZnTe material to increasing numbers of x-rays up to a fluence of 8 GeV mm –2 per pulse, the limit of the dynamic range of the LPD ASIC.

47 OTHER INSTRUMENTATION↗

Intelligent Pixel Detectors: Towards a Radiation Hard ASIC with On-Chip Machine Learning in 28 nm CMOS

Detectors at future high energy colliders will face enormous technical challenges. Disentangling the unprecedented numbers of particles expected in each event will require highly granular silicon pixel detectors with billions of readout channels. With event rates as high as 40 MHz, these detectors will generate petabytes of data per second. To enable discovery within strict bandwidth and latency constraints, future trackers must be capable of fast, power efficient, and radiation hard data-reduction at the source. We are developing a radiation hard readout integrated circuit (ROIC) in 28nm CMOS with on-chip machine learning (ML) for future intelligent pixel detectors. We will show track parameter predictions using a neural network within a single layer of silicon and hardware tests on the first tape-outs produced with TSMC. Preliminary results indicate that reading out featurized clusters from particles above a modest momentum threshold could enable using pixel information at 40 MHz.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗