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1-(Diorganooxyphosphonyl)methyl2,4- and-2,6diamino benzenes are reacted with polyacylhalides and optionally comonomers to produce polyamides which have desirable heat and fire resistance properties. These polymers are used to form fibers and fabrics where fire resistance properties are important, e.g., aircraft equipment and structures.
Flammability and weight loss reduced. Fire-resistant polymers obtained from 1-{(dialkoxyphosphonyl) methyl}-2, 4- and -2, 6-diaminobenzenes by reaction with acyl or diacyl halides of higher functionality. Incorporation of compounds containing phosphorus into certain polymers shown previously to increase fire retardance. Discovery adds new class of polyamides to group of such polymers.
Continued interest by the research community in thermally stable, tough, high temperature adhesives has resulted in the investigation by Langley Research Center of two linear aromatic polyamide-imide (PAI) homopolymers and two linear aromatic PAI copolymers. The homopolymers were made with either 3,3'=DABA or 4,4'-DABA and BTDA. The two polymers were prepared with a monomer ratio of 0.75 DABP:0.25 DABA:1.00 BTDA. These aromatic PAIs possess high thermal stability because of intermolecular hydrogen bonding and chain stiffness. Lap shear strength (LSS) was the main criteria used to evaluate the polymers as adhesives. LSS of bonded Ti-6Al-4V was determined at room temperature (RT), 177, 204 and 232 C. The glass transition temperature and the type of bond failure were also determined. The best LSS values of the four adhesive systems investigated were obtained with the PAI copolymer identified in the report as LARC-TPI (25 percent 3,3'-DABA); however, it did not produce LSSs nearly as high as LARC-TPI. The poor flow properties observed appear to be due to a combination of high molecular weight and the increased interchain electronic interactions associated with the amide group.
An account is given of tough, thermally stable linear polyimides containing amide linkages that recommend themselves for use in high temperature-resistant films and coatings as well as matrix resins for graphite-reinforced structures. Four such polymers were synthesized from unsubstituted amide diamines, and two others from N-substituted amide diamines. High inherent viscosities and glass transition temperatures were obtained. The films exhibit good resistance to organic solvents. Films of the 4,4-prime-isomer polyamide-imide yielded exceptionally high modulus and toughness during impact evaluation.
Several thermally stable tough linear polyimides containing amide linkages were synthesized which have application as matrix resins in graphite reinforced structures. Isomers of diaminobenzanilide were reacted with 3,3-prime,4,4-prime-benzophenonetetracarboxylic dianhydride, and then thermally converted to the polyamide-imide. Polymers prepared from unsubstituted amide diamines and from N-substituted amide diamines exhibited high inherent viscosities and glass transition temperatures. The mechanical properties of these polymers were found to be superior to those of LARC-TPI.
Continued interest by the research community in thermally stable, tough, high temperature adhesives has resulted in the investigation by Langley Research Center of two linear aromatic polyamide-imide (PAI) homopolymers and two linear aromatic PAI copolymers. The homopolymers were made with either 3,3'=DABA or 4,4'-DABA and BTDA. The two polymers were prepared with a monomer ratio of 0.75 DABP:0.25 DABA:1.00 BTDA. These aromatic PAIs possess high thermal stability because of intermolecular hydrogen bonding and chain stiffness. Lap shear strength (LSS) was the main criteria used to evaluate the polymers as adhesives. LSS of bonded Ti-6Al-4V was determined at room temperature (RT), 177, 204 and 232 C. The glass transition temperature and the type of bond failure were also determined. The best LSS values of the four adhesive systems investigated were obtained with the PAI copolymer identified in the report as LARC-TPI (25 percent 3,3'-DABA); however, it did not produce LSSs nearly as high as LARC-TPI. The poor flow properties observed appear to be due to a combination of high molecular weight and the increased interchain electronic interactions associated with the amide group.
The synthesis and characterization of polyamide-imides (PAI) derived from four different dianhydrides and three isomers of diaminobenzanilide are discussed with emphasis on the effect of combining an amide linkage in the diamine portion with other bridging groups in the dianhydride portion of the polymer backbone. It is noted that all of the amide-imide polymers exhibit high-glass transition temperatures, high thermooxidative stability, and a relatively good solvent resistance. These aromatic PAIs are characterized by high thermal stability due to chain stiffness, crystallinity, and intermolecular hydrogen bonding, and are considered to be good candidates as high-temperature films, coatings, and fibers for aerospace applications.
An aerogel and process of making the aerogel is provided. The aerogel is a polyimide aerogel having polyamide cross-links formed using a triacid chloride cross-linker.
Graphene oxide (GO) was incorporated into polyamide-11 (PA11) via in-situ polymerization. The GO-PA11 nano-composite had elevated resistance to hydrolytic degradation. At a loading of 1 mg/g, GO to PA11, the accelerated aging equilibrium molecular weight of GO-PA11 was higher (33 and 34 kg/mol at 100 and 120 °C, respectively) compared to neat PA11 (23 and 24 kg/mol at 100 and 120 °C, respectively). Neat PA11 had hydrolysis rate constants (kH) of 2.8 and 12 ( × 10(exp -2) day(exp -1)) when aged at 100 and 120 °C, respectively, and re-polymerization rate constants (kP) of 5.0 and 23 ( × 10(exp -5) day(exp -1)), respectively. The higher equilibrium molecular weight for GO-PA11 loaded at 1 mg/g was the result of a decreased kH, 1.8 and 4.5 ( × 10(exp -2) day(exp -1)), and an increased kP, 10 and 17 ( × 10(exp -5) day(exp -1)) compared with neat PA11 at 100 and 120 °C, respectively. The decreased rate of degradation and resulting 40% increased equilibrium molecular weight of GO-PA11 was attributed to the highly asymmetric planar GO nano-sheets that inhibited the molecular mobility of water and the polymer chain. The crystallinity of the polymer matrix was similarly affected by a reduction in chain mobility during annealing due to the GO nanoparticles' chemistry and highly asymmetric nano-planar sheet structure.
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Organic fabric is reacted first with vapors of a phosphorus oxychloride, phosphorus oxybromide solution and then with bromine vapor, after neutralization it is flameproof in pure oxygen atmosphere. Soaking the fabric with mixture of ammonium polyphosphates increases flame resistance, but the polyphosphates are leached out during laundering.
The investigation reported is concerned with the development of a filament-wound, ultralightweight composite vessel for the containment of cryogenic propellants and pressurant gases. The vessels are to be used within an operational temperature range from -253 C to ambient temperature. The fiber used for the process is Kevlar 49. The design and the fabrication of specimens and vessels are discussed along with the results obtained in a testing program.
New synthesis results in improved class of tough, thermally stable polyimides containing amide linkages. Linear, aromatic, polyimide/amides synthesized from isomers of DABA with 3, 3', 4, 4'- BTDA. Mechanical properties better than those of LARC-TPI polyimide. Potentially useful as matrix resins in graphite-reinforced structures, and as fibers or coating films withstanding high temperatures.
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Economical process improves flame resistance and resistance to acids of polyamide fibers, without modifying colors of mechanical properties. Process improves general safety of garments and other items made from polyamide fibers and makes them suitable for applications requiring exposure to oxygen-rich atmosphere or corrosive acids. Halo-olefins are added to surface of fibers by photoadditon in sealed chamber. Process could be used with films and other forms of polyamide.
A series of N-methyl substituted aromatic polyamides derived from the secondary aromatic diamines, 4,4'-bis(methylamino)diphenylmethane, 3,3'-bis(methylamino) diphenylmethane, 4,4'-bis(methylamino)benzophenone or 3,3'-bis(methylamino)benzophenone and isophthaloyl dichloride, terphthaloyl dichloride or 3,3'diphenylmethane dicarboxylic acid dichloride was prepared by high temperature solution polymerization in s-tetrachloroethane. Compared to analogous unsubstituted and partially N-methylated aromatic polyamides, the full N-methylated polyamides exhibited significantly lower glass transition temperatures, reduced crystallinity, improved thermal stability and good solubility in chlorinated solvents.
The heat resistant, protective glove is made up of first and second shell sections which define a palm side and a backside, respectively. The first shell section is made of a twill wave fabric of a temperature-resistant aromatic polyamide fiber. The second shell section is made of a knitted fabric of a temperature-resistant aromatic polyamide fiber. The first and second shell sections are secured to one another, e.g., by sewing, to provide the desired glove configuration and an opening for insertion of the wearer's hand. The protective glove also includes a first liner section which is secured to and overlies the inner surface of the first shell section and is made of a felt fabric of a temperature-resistant aromatic polyamide fiber and has a flame resistant, elastomenic coating on the surface facing and overlying the inner surface of the first shell section.
Polyimide-metal oxide (Co3O4 or CuO) composite films have been prepared via in situ thermal decomposition of cobalt (II) chloride or bis(trifluoroacetylacetonato)copper(II). A soluble polyimide (XU-218) and its corresponding prepolymer (polyamide acid) were individually employed as the reaction matrix. The resulting composites exhibited a greater metal oxide concentration at the air interface with polyamide acid as the reaction matrix. The water of imidization that is released during the concurrent polyamide acid cure and additive decomposition is believed to promote metal migration and oxide formation. In contrast, XU-218 doped with either HAuCl4.3H2O or AgNO3 yields surface gold or silver when thermolyzed (300 C).