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NASA NTRS2000

Polyimides Containing Fluorine and Phosphorus for Potential Space Applications

As part of an effort to develop low color, ultraviolet (UV) radiation and atomic oxygen resistant polyimides for potential space applications, a novel diamine containing fluorine and phosphorus was synthesized and used to prepare polyimides. The approach was to combine attributes from colorless, UV resistant polyimides and atomic oxygen (AO) resistant polymers into a single material. Preparation of colorless polyimides has focused on minimization of charge transfer complex formation by incorporation of bulky substituents and disrupting conjugation by using meta-catenated monomers. AO resistant polymer technology development has focused on placing phenylphosphine oxide groups into the backbone of aromatic polymers. However, polyimides prepared utilizing this approach thus far have all exhibited significant color. Thus in an attempt to combine these features in a polyimide a new diamine, bis(3-aminophenyl)-3,5-di(trifluoromethyl)phenylphosphine oxide (TFMDA) was synthesized and used to prepare polyimides. The polyimides were cast into films and characterized for physical and mechanical properties, optical transmission and AO and UV resistance.

Connell, John W.↗

NASA NTRS2010

Polyimide Aerogels with Three-Dimensional Cross-Linked Structure

Polyimide aerogels with three-dimensional cross-linked structure are made using linear oligomeric segments of polyimide, and linked with one of the following into a 3D structure: trifunctional aliphatic or aromatic amines, latent reactive end caps such as nadic anhydride or phenylethynylphenyl amine, and silica or silsesquioxane cage structures decorated with amine. Drying the gels supercritically maintains the solid structure of the gel, creating a polyimide aerogel with improved mechanical properties over linear polyimide aerogels. Lightweight, low-density structures are desired for acoustic and thermal insulation for aerospace structures, habitats, astronaut equipment, and aeronautic applications. Aerogels are a unique material for providing such properties because of their extremely low density and small pore sizes. However, plain silica aerogels are brittle. Reinforcing the aerogel structure with a polymer (X-Aerogel) provides vast improvements in strength while maintaining low density and pore structure. However, degradation of polymers used in cross-linking tends to limit use temperatures to below 150 C. Organic aerogels made from linear polyimide have been demonstrated, but gels shrink substantially during supercritical fluid extraction and may have lower use temperature due to lower glass transition temperatures. The purpose of this innovation is to raise the glass transition temperature of all organic polyimide aerogel by use of tri-, tetra-, or poly-functional units in the structure to create a 3D covalently bonded network. Such cross-linked polyimides typically have higher glass transition temperatures in excess of 300 400 C. In addition, the reinforcement provided by a 3D network should improve mechanical stability, and prevent shrinkage on supercritical fluid extraction. The use of tri-functional aromatic or aliphatic amine groups in the polyimide backbone will provide such a 3D structure.

Panek, John↗

NASA NTRS1983

Laminating Polyimide Films

Thermoplastic polyimide adhesive is used to bond polyimide sheets into flexible laminates. Films are first primed with polyimide adhesive, then bonded together under heat and pressure. Adhesive is cast on separate surface, then sandwiched between polyimide and/or metal films for final assembly. Objectives of process are to improve bonding of high-temperature polyimide film, prepare flexible, large-area, void-free laminates from polyimide film, and laminate polyimide film not only to itself but to metal surfaces.

St. Clair, A. K.↗

NASA NTRS1982

Tribological properties at 25 C of seven polyimide films bonded to 440 C high-temperature stainless steel

The tribological properties of seven polyimide films applied to 440 C high temperature stainless steel substrates were studied at 25 C with a pin-on-disk type of friction and were apparatus. The polyimides fell into two groups according to friction and wear properties. Group I polyimides had slightly lower friction but much higher wear than group II polyimides. The wear mechanism was predominately adhesion, but the wear particles were larger for group I polyimides. For most of the polyimides the transfer films consisted of clumps of compacted wear particles. One polyimide composition produced a very thin transfer film that sheared plastically in the contact area.

Fusaro, R. L.↗

NASA NTRS1983

Polyimides formulated from a partially fluorinated diamine for aerospace tribological applications

Preliminary tribological studies on polyimides formulated from the diamine 2,2-bis 4-(4-aminophenoxy)phenyl hexafluorapane (4-BDAF) indicate that polyimides formulated from this diamine have excellent potential for high temperature tribological applications. The dianhydrides used to make the polyimides were pyromellitic (PMDA) and benzophenonetetracarboxylic acid (BTDA). Friction and wear studies at 25 and 200 C indicate that polyimides formulated using 50 mole percent of the PMDA dianhydride and 50 mole percent of the BTDA dianhydride perform better than polyimides formulated solely with the BTDA dianhydride. Graphite fiber reinforced polyimide composites were formulated with the polyimide made from the BTDA dianhydride, both graphitic and non-graphitic fibers were evaluated. Graphitic fibers produced better tribological results, since thin, flowing, "layer-like' transfer films were produced which did not build-up with long sliding durations. Non-graphitic fibers did not produce this type of transfer.

Fusaro, R. L.↗

NASA NTRS1984

Polyimides formulated from a partially fluorinated diamine for aerospace tribological applications

Preliminary pribological studies on polyimides formulated from the diamine 2,2-bis 4-(4-aminophenoxy)phenyl hexafluoropane (4-BDAF) indicate that polyimides formulated from this diamine have excellent potential for high temperature tribological applications. The dianhydrides used to make the polyimides were pyromellitic (PMDA) and benzophenonetetracarboxylic acid (BTDA). Friction and wear studies at 25 and 200 C indicate that polyimides formulated using 50 mole percent of the PMDA dianhydride and 50 mole percent of the BTDA dianhydride perform better than polyimides formulated solely with the BTDA dianhydride. Graphite fiber reinforced polyimide composites were formulated with the polyimide made from the BTDA dianhydride and both graphitic and non-graphitic fibers were evaluated. Graphitic fibers produced better tribological results, since thin, flowing, 'layer-like' transfer films were produced which did not build up with long sliding durations. Non-graphitic fibers did not produce this type of transfer. Previously announced in STAR as N83-22423

Fusaro, R. L.↗

NASA NTRS1984

PMR polyimide composites for aerospace applications

A novel class of addition-type polyimides has been developed in response to the need for high temperature polymers with improved processability. The new plastic materials are known as PMR (for in situ polymerization of monomer reactants) polyimides. The highly processable PMR polyimides have made it possible to realize much of the potential of high temperature resistant polymers. Monomer reactant combinations for several PMR polyimides have been identified. The present investigation is concerned with a review of the current status of PMR polyimides. Attention is given to details of PMR polyimide chemistry, the processing of composites and their properties, and aerospace applications of PMR-15 polyimide composites.

Serafini, T. T.↗

NASA NTRS1985

Structure-to-glass transition temperature relationships in high temperature stable condensation polyimides

The presence of a hexafluoroisopropylidene (6F) connecting group in aryl dianhydrides used to prepare aromatic condensation polyimides provides high glass transition temperature (T sub g) polyimides with excellent thermo-oxidative stability. The purpose of this study was to determine if a trifluorophenyl-ethylidene (3F) connecting group would have a similar effect on the T sub g of aromatic condensation polyimides. A new dianhydride containing the 3F connecting group was synthesized. This dianhydride and an aromatic diamine also containing the 3F connecting group were used together and in various combinations with known diamines or known dianhydrides, respectively, to prepare new 3F containing condensation polyimides. Known polyimides, including some with the 6F connecting linkage, were also prepared for comparison purposes. The new 3F containing polymers and the comparison polymers were prepared by condensation polymerization via the traditional amic-acid polymerization method in N,N-dimethylacetamide solvent. The solutions were characterized by determining their inherent viscosities and then were thermally converted into polyimide films under nitrogen atmosphere at 300 to 500 C, usually 350 C. The T sub g's of the films and resin discs were then determined by thermomechanical analysis and were correlated as a function of the final processing temperatures of the films and resin discs. The results showed that similarities existed in the T sub g's depending on the nature of the connecting linkage in the monomers used to prepare the condensation polyimides.

Alston, W. B.↗

NASA NTRS1989

The 3F condensation polyimides: Review and update

Nine new condensation polyimides containing the phenyltrifluoroethylidene (3F) linkage were synthesized by the amic-acid route. Several other polyimides, including some with hexafluoroisopropylidene (6F) linkage, were also prepared as controls. Amic-acid solutions were characterized by determining their inherent viscosities prior to thermal conversion into polyimide films. Glass transition temperatures (T sub g), thermogravimetric analysis (TGA), and isothermal weight loss data (at 316, 371, and 371 C under 0.5 MPa air pressure) were obtained for the films. The films were pulverized into molding powders which, in turn, were thermally processed under pressure into neat resin disks. The disks were also characterized by T sub g's and 316 and 371 C isothermal weight losses. The film study identified two new polyimides with T sub g's greater than 371 C and two new polyimides with low rates of weight loss. The resin disks exhibited the same overall trends in T sub g and weight loss as the respective films, however the weight loss per unit surface area was always greater, presumably due to molecular degradation induced during preparation of the molding powders. The overall results indicate that polyimides containing the 3F linkage have T sub g's and thermo-oxidative stability comparable to polyimides containing the 6F group. Alternate technology was also shown by the synthesis of two new polyalkyl substituted 3F diamines and five more new 3F polymers. Their potential as photoresists was demonstrated by T sub g advancement after ultraviolet exposure. Last, four U.S. patents on 3F monomers and polymers were issued and up to eight more are pending.

Alston, William B.↗

NASA NTRS1991

Vinyl capped addition polyimides

Polyimide resins (PMR) are generally useful where high strength and temperature capabilities are required (at temperatures up to about 700 F). Polyimide resins are particularly useful in applications such as jet engine compressor components, for example, blades, vanes, air seals, air splitters, and engine casing parts. Aromatic vinyl capped addition polyimides are obtained by reacting a diamine, an ester of tetracarboxylic acid, and an aromatic vinyl compound. Low void materials with improved oxidative stability when exposed to 700 F air may be fabricated as fiber reinforced high molecular weight capped polyimide composites. The aromatic vinyl capped polyimides are provided with a more aromatic nature and are more thermally stable than highly aliphatic, norbornenyl-type end-capped polyimides employed in PMR resins. The substitution of aromatic vinyl end-caps for norbornenyl end-caps in addition polyimides results in polymers with improved oxidative stability.

Vannucci, Raymond D.↗

NASA NTRS1985

Siloxane containing polyimides with improved processability

Siloxane containing polyimides were prepared in an effort to improve processability of linear aromatic polyimides and toughness of addition curing imide oligomers. Linear aromatic polyimides were endcapped with varying proportions of a silane; a diaminosiloxane was copolymerized with an aromatic diamine; polyimide oligomers were endcapped with reactive groups; and acetylene terminated siloxane-containing oligomers were blended with linear siloxane-containing polyimides. The resins were used to prepare moldings, titanium to titanium adhesive bonds, and graphite reinforced composites. In each case, physical properties and other characteristics were compared to those of chemically similar polyimides with no siloxane incorporation. The resins, in most cases, performed better at room temperature than the corresponding polyimide. At elevated temperatures, for high siloxane content, the performance deteriorated.

Maudgal, Shubha↗

NASA NTRS1997

P-V-T Properties of Polyimides and Model Imide Compounds

Aromatic polyimides are used as matrix resins in advanced composites, as high strength films, and as high-temperature adhesives, owing in part to their unusual thermal and chemical stability. The polyimides' desirable qualities of very high softening temperatures and negligibly small solubilities in and low permeabilities by most solvents have limited the kinds of fundamental studies that can be performed on these systems. Consequently, relationships between the molecular structure of polyimides and their bulk properties are not as well understood as might be expected given their widespread applications. In particular, the intermolecular forces in polyimides that play a critical role determining their densities, solubilities, viscosities, moduli, glass transitions, etc. are less well characterized for polyimides than for other widely used polymeric materials. The purpose of the present study is to obtain experimental data for establishing parameters that characterize the intermolecular forces in polyimides. We report here our studies on tractable low molecular-weight imides that contain the same structural features that are present in polyimide materials. We have measured equation-of-state properties and dipole moments for a variety of such systems in the liquid state. Both pure compounds and binary mixtures have been studied.

Orwoll, Robert A.↗

NASA NTRS2007

Review of Polyimides Used in the Manufacturing of Micro Systems

Since their invention, polyimides have found numerous uses in MicroElectroMechanical Systems (MEMS) technology. Polyimides can act as photoresist, sacrificial layers, structural layers, and even as a replacement for silicon as the substrate during MEMS fabrication. They enable fabrication of both low and high aspect ratio devices. Polyimides have been used to fabricate expendable molds and reusable flexible molds. Development of a variety of devices that employ polyimides for sensor applications has occurred. Micro-robotic actuator applications include hinges, thermal actuators and residual stress actuators. Currently, polyimides are being used to create new sensors and devices for aerospace applications. This paper presents a review of some of the many uses of polyimides in the development of MEMS devices, including a new polyimide based MEMS fabrication process.

Wilson, William C.↗

NASA NTRS2008

New Materials for the Repair of Polyimide Electrical Wire Insulation

Two viable polyimide backbone materials have been identified that will allow the repair of polyimide electrical wire insulation found on the Space Shuttle and other aging aircraft. This identification is the outcome of ongoing efforts to assess the viability of using such polyimides and polyimide precursors (polyamic acids [PAAs]) as repair materials for aging polyimide electrical wire insulation. These repair materials were selected because they match the chemical makeup of the underlying wire insulation as closely as possible. This similarity allows for maximum compatibility, coupled with the outstanding physical properties of polyimides. The two polyimide backbone materials allow the polymer to be extremely flexible and to melt at low temperatures. A polymer chain end capping group that allows the polymer to crosslink into a nonflowable repair upon curing at around 200 C was also identified.

Source record↗

NASA NTRS2011

Commercialization of LARC (TradeMark) -SI Polyimide Technology

LARC(TradeMark)-SI, Langley Research Center- Soluble Imide, was developed in 1992, with the first patent issuing in 1997, and then subsequent patents issued in 1998 and 2000. Currently, this polymer has been successfully licensed by NASA, and has generated revenues, at the time of this reporting, in excess of $1.4 million. The success of this particular polymer has been due to many factors and many lessons learned to the point that the invention, while important, is the least significant part in the commercialization of this material. Commercial LARC(TradeMark)-SI is a polyimide composed of two molar equivalents of dianhydrides: 4,4 -oxydiphthalic anhydride (ODPA), and 3,3 ,4,4 -biphenyltetracarboxylic dianhydride (BPDA) and 3,4 -oxydianiline (3,4 -ODA) as the diamine. The unique feature of this aromatic polyimide is that it remains soluble after solution imidization in high-boiling, polar aprotic solvents, even at solids contents of 50-percent by weight. However, once isolated and heated above its T(sub g) of 240 C, it becomes insoluble and exhibits high-temperature thermoplastic melt-flow behavior. With these unique structure property characteristics, it was thought this would be an advantage to have an aromatic polyimide that is both solution and melt processable in the imide form. This could potentially lead to lower cost production as it was not as equipment- or labor-intensive as other high-performance polyimide materials that either precipitate or are intractable. This unique combination of properties allowed patents with broad claim coverage and potential commercialization. After the U.S. Patent applications were filed, a Small Business Innovation Research (SBIR) contract was awarded to Imtec, Inc. to develop and supply the polyimide to NASA and the general public. Some examples of demonstration parts made with LARC(TradeMark)-SI ranged from aircraft wire and multilayer printed-circuit boards, to gears, composite panels, supported adhesive tape, composite coatings, cookware, and polyimide foam. Even with its unique processing characteristics, the thermal and mechanical properties were not drastically different from other solution or meltprocessable polyimides developed by NASA. LARC(TradeMark)-SI risked becoming another interesting, but costly, high-performance material.

Bryant, Robert G.↗

NASA NTRS1980

Incorporation of metal ions into polyimides

The effects of the incorporation of metal ions into various polyimides on polyimide properties are investigated. Polyimide films derived from 3,3',4,4'-benzophenone tetracarboxylic acid dianhydride (BDTA) 3,3'-diaminobenzophenone (m,m'-DABP), 4,4'-diaminobenzophenone (p,p'-DABP) or 4,4'-oxydianiline were prepared with the concurrent addition of approximately 20 metals in a variety of forms. In general, it is found that the films derived from BDTA + p,p'-DABP were brittle and of poor quality, with brittle films also produced in most of the BDTA + m, m'-DABP polyimides regardless of whether the added metal was hydrate or anhydrous. Thermomechanical analysis, torsional braid analysis, thermal gravimetric analysis, infrared spectral analysis and isothermal studies on many of the polyimide films produced indicate that the softening temperature is generally increased upon the addition of metal ions, at the expense of thermal stability, while no changes in chemical functionality are observed. The best system studied in regard to polymer property enhancement appears to be tri(acetylacetonato)aluminum(III) added to the m, m'-DABP polyamide, which has been found to exhibit four times the lap shear strength of the polyimide alone.

Taylor, L. T.↗

NASA NTRS1984

Low wear partially fluorinated polyimides

Tribological studies were conducted on five different polyimide solid bodies formulated from the diamine 2,2-bis 4-(4-aminophenoxy)phenyl hexafluoropropane (4-BDAF) and the dianhydrides pyromellitic acid (PMDS) and benzophenonetetracarboxylic acid (BTDA). The following polyimides were evaluated 4-BDAF/PMDA, 4-BDAF/BTDA, 4-BDAF/80 mole percent PMDA, 20 mole percent BTDA, 4-BDAF/60 mole percent BTDA. Friction coefficients, polyimide wear rates, polyimide surface morphology and transfer films were evaluated at sliding speeds of 0.31 to 11.6 m/s and at temperatures of 25 C to 300 C. The results indicate that the tribological properties are highly dependent on the composition of the polyimide and on the experimental conditions. Two polyimides were found which produced very low wear rates but very high friction coefficients (greater than 0.85) under ambient conditions. They offer considerable potential for high traction types of application such as brakes.

Fusaro, R. L.↗

NASA NTRS1985

Low-wear partially fluorinated polyimides

Tribological studies were conducted on five different polyimide solid bodies formulated from the diamine 2,2-bis 4-(4-aminophenoxy)pgenyl hexafluoropropane (4-BDAF) and the dianhydrides pyromellitic acid (PMDS) and benzophenonetetracarboxylic acid (BTDA). The following polyimides were evaluated 4-BDAF/PMDA, 4-BDAF/BTDA, 4-BDAF/80 mole percent PMDA, 20 mole percent BTDA, 4-BDAF/60 mole percent BTDA. Friction coefficients, polyimide wear rates, polyimide surface morphology and transfer films were evaluated at sliding speeds of 0.31 to 11.6 m/s and at temperatures of 25 C to 300 C. The results indicate that the tribological properties are highly dependent on the composition of the polyimide and on the experimental conditions. Two polyimides were found which produced very low wear rates but very high friction coefficients (greater than 0.85) under ambient conditions. They offer considerable potential for high traction types of application such as brakes.

Fusaro, R. L.↗