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At least 37 records · Page 2

The 3D Printing of Polyimide Aerogels

Polyimide aerogels are a nanoporous material made by extracting the liquid portion of a wet gel and replacing it with air, while still maintaining the porous solid internal architecture. This results in a material with extremely low densities, low thermal conductivities, high internal surfaces areas, and low dielectric constants. Currently, complex aerogel forms are not possible, since they require molds in order to be shaped. To overcome this challenge, we are attempting to use various additive manufacturing techniques to produce complex architectures. Three different approaches are being studied to accomplish this. One is to print using a viscous wet gel and have the structure solidify at the end of the print, another is to use a mixing tip, where a less viscous gel and the final chemical that causes gelation will be mixed as it is printing, allowing it to gel layer by layer, and the third is to use a UV curable aerogel with a UV light following behind to solidify the gel as it prints. To have these approaches be successful, the printing parameters and the aerogel's chemical formulation need to be optimized. The more harmonious these two factors can be made, the more defined and complex the resulting structure can be. Preliminary results show that 3D printing polyimide aerogels are a viable option, but further optimization must occur for reliable printing.

Nosel, Theresa↗

Process Development for Printing Copper Conductible Ink on Flexible Substrates Using Aerosol Jet Technology

Rise in demand for wearable consumer electronics products has given an impetus to the development of flexible electronics technology encompassing flexible substrates and compatible circuitry. Also, additive manufacturing of flexible electronics is emerging rapidly via several techniques such as Inkjet and Aerosol Jet Printing (AJP). The basic component of all flexible circuits to be printed by these technologies is conductible ink, which is generally silver ink. Few studies exist on the printing of copper conductible ink and not many copper ink formulations are available in the market as that of silver inks. This study aims to develop a process development study for deposition of copper conductible lines on flexible substrates using the aerosol jet printing technology. The process development study includes investigation of photosintering parameters for obtaining desirable electrical resistance and shear load to failure values for the printed line. Different pre-drying techniques such as oven pre-drying and platen pre-drying have been used for improving the electrical and mechanical properties of the conductive traces. Techniques such as optical microscopy and white light interferometry have been used for the characterization of print quality of the conductible lines.

printed electronics↗

Process Recipes for Additively Printed Copper Ink Flexible Circuits using Direct Write Methods

In this paper, the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods have been studied. The process has been implemented on the direct write platform. Interest in the use of additive printing methods for the manufacture of micro-circuits has grown immensely in recent times. Direct write methods have been shown to have the ability to create circuits in a limited manner. However, the process recipes and the effect of process parameters on the manufactured properties are not well understood. Copper ink is a good and cost-effective alternative to silver ink but its use has lagged owing to an increased propensity for oxidation. In this paper, photonic curing has been used to sinter copper ink to make the traces conductive. The method flashes high energy light that sinter metal particles instantaneously and the temperature of the substrate remains low. The effect of the different photonic sintering profiles on the mechanical and electrical properties of the printed traces has been studied in this paper.The print process parameters also play an important role in the line width and height that has been studied to print with the desired line profile for the end application. An LC filter circuit is been printed with SMD components been attached using an electrically conductive adhesive (ECA). The manufactured flexible LC filter is been tested for its frequency sweep to compare with the commercially available LC filer with the help of the Bode plot.

Process control↗

RF Characterization of a Photocurable PEDOT:PSS:PEGDA Conductive Biomaterial for 3D-Printing Implantable Antennas

In this work, we demonstrate photocurable PEDOT:PSS:PEGDA biomaterial as a promising candidate for intracorporeal 3D printing. Intracorporeal 3D printing offers a less invasive method which offer flexibility to tailor the form factor of printed structures. Previous work has demonstrated the feasibility of a robotic probe to 3D-print biological tissues intracorporeally via a minor incision. This same probe could also 3D-print implantable antennas as long as a suitable conductive material is identified in terms of conductivity, biocompatibility, and ability to cure at room/body temperature for safety purposes. We assess the frequency-dependent conductivity of this biomaterial and explore the Radio-Frequency (RF) performance of resulting antennas operating in free-space and inside tissue-emulating phantoms. Results show that PEDOT:PSS biomaterial with 21% and 30% PEGDA content exhibit a conductivity of ~10 4 S/m up to 5 GHz, suitable for wireless implants. Comparing the two, 21% PEGDA content exhibits poorer curing abilities, while 30% PEGDA exhibits slightly lower conductivity. Measurements for 2.4 GHz free-space dipoles conducted in an anechoic chamber reveal only ~0.8 dB and ~1 dB lower gain for PEDOT:PSS:21%PEGDA and PEDOT:PSS:30%PEGDA biomaterial, respectively, as compared to their copper counterpart. For a 5 mm-deep implanted patch antenna, these two biomaterials exhibit 3.05 dB and 3.84 dB higher transmission loss than copper, respectively. If deemed necessary, this performance degradation can be overcome by increasing the overall antenna size since the printing process is now minimally invasive and miniaturization requirements can be relaxed.

3D-printing↗

3D Printing Multi-Functionality: Embedded RF Antennas and Components

Significant research and press has recently focused on the fabrication freedom of Additive Manufacturing (AM) to create both conceptual models and final end-use products. This flexibility allows design modifications to be immediately reflected in 3D printed structures, creating new paradigms within the manufacturing process. 3D printed products will inevitably be fabricated locally, with unit-level customization, optimized to unique mission requirements. However, for the technology to be universally adopted, the processes must be enhanced to incorporate additional technologies; such as electronics, actuation, and electromagnetics. Recently, a novel 3D printing platform, Multi3D manufacturing, was funded by the presidential initiative for revitalizing manufacturing in the USA using 3D printing (America Makes - also known as the National Additive Manufacturing Innovation Institute). The Multi3D system specifically targets 3D printed electronics in arbitrary form; and building upon the potential of this system, this paper describes RF antennas and components fabricated through the integration of material extrusion 3D printing with embedded wire, mesh, and RF elements.

antennas↗

3-D Printed Ultem 9085 Testing and Analysis

The purpose of this document is to analyze the mechanical properties of 3-D printed Ultem 9085. This document will focus on the capabilities, limitations, and complexities of 3D printing in general, and explain the methods by which this material is tested. Because 3-D printing is a relatively new process that offers an innovative means to produce hardware, it is important that the aerospace community understands its current advantages and limitations, so that future endeavors involving 3-D printing may be completely safe. This document encompasses three main sections: a Slosh damage assessment, a destructive test of 3-D printed Ultem 9085 samples, and a test to verify simulation for the 3-D printed SDP (SPHERES Docking Port). Described below, 'Slosh' and 'SDP' refer to two experiments that are built using Ultem 9085 for use with the SPHERES (Synchronized Position Hold, Engage, Reorient, Experimental Satellites) program onboard the International Space Station (ISS) [16]. The SPHERES Facility is managed out of the National Aeronautics and Space Administration (NASA) Ames Research Center in California.

Aguilar, Daniel↗

NASA's Centennial Challenge for 3D-Printed Habitat: Phase II Outcomes and Phase III Competition Overview

The 3D-Printed Habitat Challenge is part of NASA's Centennial Challenges Program. NASA's Centennial Challenges seek to accelerate innovation in aerospace technology development through public competitions. The 3D-Printed Habitat Challenge, launched in 2015, is part of the Centennial Challenges portfolio and focuses on habitat design and development of large-scale additive construction systems capable of fabricating structures from in situ materials and/or mission recyclables. The challenge is a partnership between NASA, Caterpillar (primary sponsor), Bechtel, Brick and Mortar Ventures, and Bradley University. Phase I of the challenge was an architectural concept competition in which participants generated conceptual renderings of habitats on Mars which could be constructed using locally available resources. Phase II asked teams to develop the printing systems and material formulations needed to translate these designs into reality. Work under the phase II competition, which concluded in August 2017 with a head to head competition at Caterpillar's Edward Demonstration Facility in Peoria, Illinois, is discussed, including the key technology development outcomes resulting from this portion of the competition. The phase III competition consists of both virtual and construction subcompetitions. Virtual construction asks teams to render high fidelity architectural models of a habitat and all the accompanying information required for construction of the pressure retaining and load bearing portions of the structure. In construction phase III, teams are asked to scale up their printing systems to produce a 1/3 scale habitat on-site at Caterpillar. The levels of the phase III construction competition (which include printing of a foundation and printing and hydrostatic testing of a habitat element) are discussed. Phase III construction also has an increased focus on autonomy, as these systems are envisioned for robotic precursor missions which would buildup infrastructure prior to the arrival of crew. Results of the phase III competition through July 2017 (which includes virtual construction level 1) are discussed. This Centennial Challenge enables an assessment of the scaleability and efficacy of various processes, material systems, and designs for planetary construction. There are also near-term terrestrial applications, from disaster response to affordable housing and infrastructure refurbishment, for these technologies.

Prater, T. J.↗

From 3D Printing Lunar and Mars Habitats to Affordable Sustainable Housing on Earth

In 2015, the NASA Centennial Challenges program launched the 3D-Printed Habitat (3DPH) competition to develop housing solutions for extended-duration missions on planetary surfaces using advanced additive construction technology. The challenge was executed in three phases with increasing complexities and requirements. The main goal of the competition was to use of planetary indigenous materials and mission recyclables as feedstock for large-scale, autonomous 3D printers to construct a habitat on the Moon or Mars. Phase 1 challenged teams to develop state-of-the-art architecture concepts that took advantage of unique capabilities offered by 3D-printing. In Phase 2, teams autonomously 3D-printed structural components using terrestrial/space-based materials and recyclables. Phase 3 tasked competitors to fabricate sub-scale habitats using indigenous materials with or without mission-generated recyclables and ended in a head-to-head competition. The developments from this challenge are applicable both to the fulfillment of NASA’s Moon to Mars mission and to the creation of affordable and sustainable housing solutions on Earth. This paper will summarize the results of the four-year challenge and provide an overview of team achievements as a result of the competition. Results from the competition include humanitarian and business opportunities created/negotiated and the development of 3D-printed housing solutions for people such those in need of shelter in Austin, Texas and 3D-printing houses at the United Nations habitat headquarters in Nairobi, Keyna. The Phase 3: Level 5 winner, AI. SpaceFactory, is currently 3D-printing an ecofriendly house in New York called Terra, a full-size habitat design for Mars and available on Earth.

M C Roman↗

3D Printed Ceramic Reinforced Polymer Composites Microstructure and Mechanical Properties

In Fused Filament Fabrication (FFF) 3D printing a part is made by extruding material layer by layer. Benefits of FFF are the ability to print complex shapes quickly and at a lower cost compared to other manufacturing methods. In this work, filaments composed of either silicon carbide (SiC) or zirconium silicate ceramic particulates in a polylactic-acid (PLA) matrix were used to print specimens for microstructural analysis and mechanical testing. Pure PLA samples were also printed and tested as a baseline for comparison. A Design of Experiments approach was used to test the interactions between three different parameters and their effect on ultimate strength, Young’s modulus, and yield strength. For compression test specimens, these parameters were infill percentage, number of shells, and print orientation angle. For tensile test specimens, the parameters were layer height, number of shells, and infill orientation angle. Pre- and post-compression test samples were evaluated by scanning electron microscopy for microstructural analysis. Infill percentage had the greatest effect on mechanical properties while number of shells and print orientation angle had minor effects. When changing the layer lines from perpendicular to parallel, relative to the loading direction, SiC-PLA had higher mechanical properties while pure PLA properties had decreased, and zirconium silicate-PLA had mix results.

Fused filament fabrication↗

Printed Electrochemical Sensor for Quantifying Bone Density Loss in Microgravity

Printed electrochemical biosensors have been developed for astronaut point-of-care testing. Our fabrication approach is complimentary with in-space manufacturing for an on-demand and hands-free fabrication process. These sensors are developed using a combination of thin film materials printing and 3D printing and are comprised of carbon nanotube, gold nanoparticle, silver nanoparticle and dielectric inks to make traditional electrochemical sensor devices. Initial prototyped printed electrochemical sensors demonstrate good electrochemical performance while also displaying low batch to batch variability. Here we report the development of a printed sensor to monitor bone turnover. The absence of load bearing forces experienced in microgravity causes a reduction of overall bone mass and results in the development of space osteopenia/osteoporosis.(1,2) Our approach to identify space osteopenia/osteoporosis is to monitor the change in bone mass indirectly through an excreted biomarker of bone remodeling, amino-terminal collagen crosslinks (NTX). Antibodies specific to NTX are added to the sensor’s electrode ink and applied during the manufacturing process. NTX is measured from a urine sample by changes in voltammetry and electrochemical impedance as it binds to the antibody modified electrode surface. The measurement is rapid, quantitative and requires only small handheld electronics to perform the measurement. By this process, ground and flight physicians will receive frequent and real-time insight into the development of space osteopenia/osteoporosis to guide appropriate countermeasures. REFERENCES [1] Nabavi, N. et al (2011) Bone 49, 965-974. [2] Tamma, R. et al (2009) FASEB J 23, 2549-2554.

in-space manufacturing↗

Toward Fully 3D-Printed Two Degree of Freedom Acoustic Liners

An acoustic liner optimization tool is developed for designing two degree of freedom (2DOF) liners with high absorption over a wide range of frequencies and sound pressure levels (SPLs). Two additively manufactured 2DOF liners (one constant and one variable chamber depth) are designed and printed with an embedded perforate layer as the septum. A normal incidence impedance tube study is performed to directly compare impedance and absorption spectra to a more traditionally manufactured 2DOF liner with embedded mesh caps in phenolic honeycomb. Comparisons of test data to predictions are shown as well as SPL sensitivities for each acoustic liner. Broadband absorption is achieved with the 3D printed 2DOF liner containing constant chamber depths, although due to current limitations in printed embedded perforate hole size, not as broad as the traditional mesh cap liner. However, results also show that the 3D printed variable chamber depth sample is more comparable to the mesh cap liner absorption, demonstrating the viability of printed embedded perforates in novel concepts.

acoustic liner 2DOF two degree of freedom 3D print↗

Screen printed Y and Bi-based superconductors

High T(sub c) superconducting thick film was prepared by screen printing process. Y-based (YBa2Cu3O(7 - x)) superconducting thick films were printed on 211/Al2O3, SNT/Al2O3, and YSZ substrates. Because of poor adhesion of the superconducting thick films to 211/Al2O3 and SNT/Al2O3 substrates, relatively low T(sub c) and J(sub c) values were obtained from the films printed on these substrates. Critical temperatures of YBa2Cu3O(7 - x) thick films deposited on 211/Al2O3 and SNT/Al2O3 substrates were about 80 K. The critical current densities of these films were less than 2 A/cm(exp 2). Higher T(sub c) and J(sub c) films were printed on the YSZ substrates; T(sub c) = 86.4 K and J(sub c) = 50.4 A/cm(exp 2). Multiple lead samples were also prepared on the YSZ substrates. These showed lower T(sub c) and J(sub c) values than plain samples. The heat treatment conditions of the multiple lead samples are still under investigation. Bi-based superconductor thick films have been obtained so far. Improving the superconducting properties of the BSCCO screen printed thick films will be emphasized in future work.

Haertling, Gene H.↗

Fully Printed, Flexible, Phased Array Antenna for Lunar Surface Communication

NASAs future exploration missions focus on the manned exploration of the Moon, Mars, and beyond, which will rely heavily on the development of a reliable communications infrastructure from planetary surface-to-surface, surface-to-orbit, and back to Earth. Flexible antennas are highly desired in many scenarios. Active phased array antennas (active PAAs) with distributed control and processing electronics at the surface of an antenna aperture offer numerous advantages for radar communications. Large-area active PAAs on flexible substrates are of particular interest in NASA s space radars due to their efficient inflatable package that can be rolled up during transportation and deployed in space. Such an inflatable package significantly reduces stowage volume and mass. Because of these performance and packaging advantages, large-area inflatable active PAAs are highly desired in NASA s surface-to-orbit and surface-to-relay communications. To address the issues of flexible electronics, a room-temperature printing process of active phased-array antennas on a flexible Kapton substrate was developed. Field effect transistors (FETs) based on carbon nanotubes (CNTs), with many unique physical properties, were successfully proved feasible for the PAA system. This innovation is a new type of fully inkjet-printable, two-dimensional, high-frequency PAA on a flexible substrate at room temperature. The designed electronic circuit components, such as the FET switches in the phase shifter, metal interconnection lines, microstrip transmission lines, etc., are all printed using a special inkjet printer. Using the developed technology, entire 1x4, 2x2, and 4x4 PAA systems were developed, packaged, and demonstrated at 5.3 GHz. Several key solutions are addressed in this work to solve the fabrication issues. The source/drain contact is developed using droplets of silver ink printed on the source/drain areas prior to applying CNT thin-film. The wet silver ink droplets allow the silver to wet the CNT thin-film area and enable good contact with the source and drain contact after annealing. A passivation layer to protect the device channel is developed by bonding a thin Kapton film on top of the device channel. This film is also used as the media for transferring the aligned CNT thin-film on the device substrate. A simple and cost-effective technique to form multilayer metal interconnections on flexible substrate is developed and demonstrated. Contact vias are formed on the second substrate prior to bonding on the first substrate. Inkjet printing is used to fill the silver ink into the via structure. The printed silver ink penetrates through the vias to contact with the contact pads on the bottom layer. It is then annealed to form a good connection. One-dimensional and two-dimensional PAAs were fabricated and characterized. In these circuits, multilayer metal interconnects were used to make a complete PAA system.

Subbaraman, Harish↗

BOK-Printed Electronics

The use of printed electronics technologies (PETs), 2D or 3D printing approaches either by conventional electronic fabrication or by rapid graphic printing of organic or nonorganic electronic devices on various small or large rigid or flexible substrates, is projected to grow exponentially in commercial industry. This has provided an opportunity to determine whether or not PETs could be applicable for low volume and high-reliability applications. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the current status of organic and printed electronics technologies. It reviews three key industry roadmaps- on this subject-OE-A, ITRS, and iNEMI-each with a different name identification for this emerging technology. This followed by a brief review of the status of the industry on standard development for this technology, including IEEE and IPC specifications. The report concludes with key technologies and applications and provides a technology hierarchy similar to those of conventional microelectronics for electronics packaging. Understanding key technology roadmaps, parameters, and applications is important when judicially selecting and narrowing the follow-up of new and emerging applicable technologies for evaluation, as well as the low risk insertion of organic, large area, and printed electronics.

Ghaffarian, Reza↗

Design of 3D-Printed Titanium Compliant Mechanisms

This paper describes 3D-printed titanium compliant mechanisms for aerospace applications. It is meant as a primer to help engineers design compliant, multi-axis, printed parts that exhibit high performance. Topics covered include brief introductions to both compliant mechanism design and 3D printing in titanium, material and geometry considerations for 3D printing, modeling techniques, and case studies of both successful and unsuccessful part geometries. Key findings include recommended flexure geometries, minimum thicknesses, and general design guidelines for compliant printed parts that may not be obvious to the first time designer.

Merriam, Ezekiel G.↗

3D Printing the Complete CubeSat

The 3D Printing the Complete CubeSat project is designed to advance the state-of-the-art in 3D printing for CubeSat applications. Printing in 3D has the potential to increase reliability, reduce design iteration time and provide greater design flexibility in the areas of radiation mitigation, communications, propulsion, and wiring, among others. This project is investigating the possibility of including propulsion systems into the design of printed CubeSat components. One such concept, an embedded micro pulsed plasma thruster (mPPT), could provide auxiliary reaction control propulsion for a spacecraft as a means to desaturate momentum wheels.

Printing CubeSat subsystems↗

Direct-Write Printing on Three-Dimensional Geometries for Miniaturized Detector and Electronic Assemblies

Direct-write printing techniques will enable new detector assemblies that were not previously possible with traditional assembly processes. Detector concepts were manufactured using this technology to validate repeatability. Additional detector applications and printed wires on a 3-dimensional magnetometer bobbin will be designed for print. This effort focuses on evaluating performance for direct-write manufacturing techniques on 3-dimensional surfaces. Direct-write manufacturing has the potential to reduce mass and volume for fabrication and assembly of advanced detector concepts by reducing trace widths down to 10 microns, printing on complex geometries, allowing new electronic concept production, and reduced production times of complex those electronics.

Direct-write printing↗

Direct-Write Printing on Three-Dimensional Geometries for Miniaturized Detector and Electronic Assemblies

Direct-write printing techniques will enable new detector assemblies that were not previously possible with traditional assembly processes. Detector concepts were manufactured using this technology to validate repeatability. Additional detector applications and printed wires on a 3-dimensional magnetometer bobbin will be designed for print. This effort focuses on evaluating performance for direct-write manufacturing techniques on 3-dimensional surfaces. Direct-write manufacturing has the potential to reduce mass and volume for fabrication and assembly of advanced detector concepts by reducing trace widths down to 10 microns, printing on complex geometries, allowing new electronic concept production, and reduced production times of complex those electronics.

Additive Manufacturing↗