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The paper is an overview of the status and science for the LODESTARS (Levitation Observation of Dendrite Evolution in Steel Ternary Alloy Rapid Solidification) research project. The program is aimed at understanding how melt convection influences phase selection and the evolution of rapid solidification microstructures.
The reduction in the use of Cr in Ni base superalloys by the combined approaches of both elemental substitution and rapid solidification processing is studied. The elements Si, Zr, Y and Hf were chosen as potential partial substitutes for Cr in Waspaloy and IN 713LC sine their separate addition to other alloys has previously resulted in enhanced oxidation resistance. The roles of Cr and these replacement elements in determining the microstructure and properties are evaluated. The elements Si, Zr, and Y and Hf are used as partial replacements for Cr in the base superalloys and these resultant alloys are processed using rapid solidification techniques. The mechanical properties and oxidation resistance of the processed materials are evaluated. The microstructure is characterized using state of the art techniques (e.g. analytical transmission electron microscopy), and the mechanism by which these structures are produced is determined.
This paper describes the research program initiated at the NASA Lewis Research Center for the study of rapid solidification of high temperature materials, with the major purpose for the development of advanced high-temperature and heat-flux materials for aircraft and aerosphace applications. Particular attention is given to the development of three alloys: Ni-aluminides, Nb-alloys, and Cu-alloys. Rapid solidification processing yielded alloys with novel microstructures, very fine grain sizes, reduced chemical segregation, and metastable extended solid solutions.
Thermoelectric TiNiSn-based half Heusler compound reveals high Seebeck coefficient and electrical conductivity, leading to high power factor. As a consequence of the solidification path, TiNiSn single phase cannot be obtained directly from the liquid phase. Thus, a long annealing step is needed to homogenize the alloy. In this work, we present a new processing route for half Heusler compound formation, combining arc melting of pure elements, rapid solidification of the molten alloy and sintering. Rapid solidification of the molten alloy allows to obtain almost single TiNiSn phase, limiting the formation of the primary TiNi{sub 2}Sn phase as a consequence of the deep undercooling of the liquid. The rapidly solidified alloy was ground to powder and sintered by open die pressing. As-sintered samples show a density around 95% of the theoretical value. Thermal cycling of the sintered samples shows evolution of the phases, suggesting that after sintering the sample is not in equilibrium yet. After the second thermal cycle thermoelectric properties become reproducible, indicating the attainment of the equilibrium. In conclusion, the proposed processing route allows to obtain dense TiNiSn in bulk form avoiding the time-consuming annealing step, typically used to homogenize this alloy after solidification.
The fundamental mechanisms responsible for both micro scale and macro scale compositional variations during cellular and dendritic solidification are discussed. It is shown that presently available models for cellular and dendritic growth in alloys predict only the elimination of macrosegregation during rapid solidification but that microsegregation still persists even in this regime. A simple model is proposed here to describe the complete elimination of microsegregation in the rapid solidification regime. A solid of ideally uniform composition can be produced with no micro or macro segregation at both very low large solidifation rates.
Highlights: • The nanoscale AuCu super-structure formed in Au80Sn20/Cu soldering joint. • The phase-transformation diffusion mechanism of Au80Sn20/Cu soldering process was studied. • The orientation relationship of Au80Sn20/Cu intermetallic compounds was investigated. • The interfacial strengthening mechanism of nanoscale AuCu layer was discussed. - Abstract: Phase composition and orientation of intermetallic compounds layers determine the functional and mechanical properties of solder joints. In this paper, interfacial reaction and strengthening mechanism of Au80Sn20/Cu joint by rapid solidification reflow soldering were studied. The Au80Sn20/Cu solder joint by rapid solidification reflow soldering exhibit a superior shear property, and the shear strength reaches up to 90 MPa. It is found that a new nanoscale AuCu super-structure formed in the interfacial intermetallic compounds layer, which is coherent with the [001] Cu substrate. The orientation relationship of Cu matrix/interfacial intermetallic compounds is determined to be [001]{sub Cu}∥[001]{sub AuCu}∥[ 2-bar 4 2-bar 3]{sub (AuCu){sub 5Sn}} and (200){sub Cu}∥(200){sub AuCu}∥(10 1-bar 0){sub (AuCu){sub 5Sn}}. Nanoscale AuCu super-structure influences the interface slip direction and provides interface misfit dislocation, hinder the dislocation movement, lead to the interface strengthening effect. Our finding on nanoscale AuCu super-structure formed during Au80Sn20/Cu soldering process not only sheds light on future research direction but also provides practical guidance to the engineers in solder industry.
Within the past few years, additive manufacturing (AM) has emerged as a promising manufacturing technique to enable the production of complex engineering structures with high efficiency and accuracy. Among the important factors establishing AM as a sustainable manufacturing process is the ability to control the microstructures and properties of AM products. In most AM processes, such as laser sintering (LS), laser melting (LM), and laser metal deposition (LMD), rapid solidification and high-temperature phase transformations play primary roles in determining nano- and microstructures, and consequently the mechanical and other properties of AM products. This topic of JOM is dedicated to summarizing the current research efforts in the area of rapid solidification and phase transformations in additively manufactured materials. Finally, a brief summary follows below of 10 journal articles in this topic.
Laser annealing studies provide much information on various consequences of rapid solidification, including the trapping of impurities in the crystal, the generation of vacancies and twins, and on the fundamental limits to the speed of the crystal-melt interface. Some results obtained by molecular dynamics methods of the solidification of a Lennard-Jones liquid are reviewed. An indication of the relationship of interface speed to undercooling for certain materials can be derived from this model. Ising model simulations of impurity trapping in silicon are compared with some of the laser annealing results. The consequences of interface segregation and atomic strain are discussed.
The effect of the electroslag remelting-continuous rapid solidification (ESR-CRS) process on element segregation and carbide precipitation in GCr15 bearing steel was investigated. The results showed that a microstructure with fewer primary carbides and less segregation can be achieved via the ESR-CRS process. In the specimen subjected to ESR, the morphology of primary carbide changed from angular to lumplike. After the ESR-CRS process, the dimension of primary carbide and the mass fraction of Cr in primary carbide decreased. With the increase of cooling intensity during the ESR-CRS process, the microstructure of ESR ingot became more refined and uniform and the size of large primary carbides in ESR ingot gradually decreased. Suppressing the formation of grain boundary cementite and primary carbide during ESR of GCr15 steel is beneficial to inhibiting the presence of large secondary carbide formation after annealing. With the increase of cooling intensity, the mass fraction of carbides in ESR ingot decreased and the mass fraction of Cr in carbides increased, whereas the types of carbides did not change; all the M{sub 3}C, M{sub 3}C{sub 2}, and M{sub 7}C{sub 3} exist before and after ESR-CRS. Al{sub 2}O{sub 3} inclusions promoted the formation of Ti(N,C) by serving as preferred heterogeneous nucleation sites, whereas the formation of Ti(N,C) was suppressed through the refinement of Al{sub 2}O{sub 3} inclusions by increasing the cooling intensity.
The enhanced control over microstructural evolution inherent in rapid solidification processing techniques are exploited to create novel ceramic magnetic materials. The great sensitivity of magnetic properties to local structure provides a powerful probe both for the study of structure and of microscopic solidification mechanisms. The first system studied is the SrO-Fe2O3 binary, which contains the commercially important hard magnetic compound strontium hexaferrite. The products were analyzed by transmission electron microscopy, Mossbauer spectroscopy, magnetic measurements, and differential thermal analysis. As-quenched ribbons contain high concentrations of super-paramagnetic particles, 80 to 250 Angstroms in diameter, in a glassy matrix. This suggests the possibility of crystallizing monodomain strontium hexaferrite during subsequent heat treatment, with a resulting increase in coercivity over conventionally processed ferrite magnets. That magnetic properties can be controlled in solidification processing by varying the quench rate is demonstrated.
Using molecular dynamics simulations and the capillary fluctuation method, we have calculated the anisotropic crystal-melt interfacial free energy and stiffness of aluminum in a rapid solidification system where a temperature gradient is applied to enforce thermal non-equilibrium. To calculate these material properties, the standard capillary fluctuation method typically used for systems in equilibrium has been modified to incorporate a second-order Taylor expansion of the interfacial free energy term. The result is a robust method for calculating interfacial energy, stiffness and anisotropy as a function of temperature gradient using the fluctuations in the defined interface height. This work includes the calculation of interface characteristics for temperature gradients ranging from 11 to 34 K/nm. The captured results are compared to a thermal equilibrium case using the same model and simulation technique with a zero gradient definition. We define the temperature gradient as the change in temperature over height perpendicular to the crystal-melt interface. The gradients are applied in MD simulations using defined thermostat regions on a stable solid-liquid interface initially in thermal equilibrium. The results of this work show that the interfacial stiffness and free energy for aluminum are dependent on the magnitude of the temperature gradient, however the anisotropic parameters remain independent of the non-equilibrium conditions applied in this analysis. As a result, the relationships of the interfacial free energy/stiffness are determined to be linearly related to the thermal gradient, and can be interpolated to find material characteristics at additional temperature gradients.
A combination of dynamic transmission electron microscopy (DTEM) experiments and CALPHAD-informed phase-field simulations was used to study rapid solidification in Cu–Ni thin-film alloys. Experiments—conducted in the DTEM—consisted of in situ laser melting and determination of the solidification kinetics by monitoring the solid–liquid interface and the overall microstructure evolution (time-resolved measurements) during the solidification process. Modelling of the Cu–Ni alloy microstructure evolution was based on a phase-field model that included realistic Gibbs energies and diffusion coefficients from the CALPHAD framework (thermodynamic and mobility databases). DTEM and post mortem experiments highlighted the formation of microsegregation-free columnar grains with interface velocities varying from ~0.1 to ~0.6 m s –1 . After an 'incubation' time, the velocity of the planar solid–liquid interface accelerated until solidification was complete. In addition, a decrease of the temperature gradient induced a decrease in the interface velocity. The modelling strategy permitted the simulation (in 1D and 2D) of the solidification process from the initially diffusion-controlled to the nearly partitionless regimes. Lastly, results of DTEM experiments and phase-field simulations (grain morphology, solute distribution, and solid–liquid interface velocity) were consistent at similar time (μs) and spatial scales (μm).
One of the simpler methods available to accomplish rapid solidification processing is free jet melt spinning. With only a modest expenditure of time, effort, and capital, an apparatus suitable for preliminary experimentation can be assembled. Wheel and crucible materials, process atmospheres, crucible design, heating methods, and process parameters and their relationship to melt composition are described. Practical solutions to processing problems, based on 'hands-on' experience, are offered. Alloys with melting points up to 3000 F have been rapidly solidified using the techniques described.
Collection of reports describes experimental metallurgical studies of nickel aluminide alloys made by rapid-solidification powder-metallurgy process. Process incorporates ultrafine dispersions of hard, stable refractory compounds and rare-earth oxides into alloys. Effects of dispersoids on high-temperature mechanical properties (flow stress, and compressive and tensile creep) of alloys investigated. Results indicate specific additives result in improved strength and ductility.
A study of reduced chromium content in a nickel base superalloy via element substitution and rapid solidification processing was performed. The two elements used as partial substitutes for chromium were Si and Zr. The microstructure of conventionally solidified materials was characterized using microscopy techniques. These alloys were rapidly solidified using the chill block melt spinning technique and the rapidly solidified microstructures were characterized using electron microscopy. The spinning technique and the rapidly solidified microstructures was assessed following heat treatments at 1033 and 1272 K. Rapidly solidified material of three alloys was reduced to particulate form and consolidated using hot isostatic pressing (HIP). The consolidated materials were also characterized using microscopy techniques. In order to evaluate the relative strengths of the consolidated alloys, compression tests were performed at room temperature and 1033 K on samples of as-HIPed and HIPed plus solution treated material. Yield strength, porosity, and oxidation resistance characteristics are given and compared.
Containerless processing and rapid solidification techniques were used to process Nb-Si alloys in the Nb-rich eutectic range. Electromagnetically levitated drops were melted and subsequently splat-quenched from different temperatures. A variety of eutectic morphologies was obtained as a function of the degree of superheating or undercooling of the drops prior to splatting. Metallic glass was observed only in drops quenched from above the melting temperature. Microstructures of splats deeply undercooled prior to quenching were very fine and uniform. These results are discussed in terms of classic nucleation theory concepts and the expected heat evolution at different regions of the splat during the rapid quenching process. The locations of the coupled-zone boundaries for the alpha-Nb + Nb3Si eutectic are also suggested.
A rapid solidification strategy was developed for simultaneously avoiding the Marangoni effect and suppressing molecular aggregation. The resultant 15.64 cm 2 large-area OSC module exhibited a record power conversion efficiency of 16.03%.
In order to maximize the heat transfer coefficient the most important variable in rapid solidification is the powder particle size. The finer the particle size, the higher the solidification rate. Efforts to decrease the particle size diameter offer the greatest payoff in attained quench rate. The velocity of the liquid droplet in the atmosphere is the second most important variable. Unfortunately the choices of gas atmospheres are sharply limited both because of conductivity and cost. Nitrogen and argon stand out as the preferred gases, nitrogen where reactions are unimportant and argon where reaction with nitrogen may be important. In gas atomization, helium offers up to an order of magnitude increase in solidification rate over argon and nitrogen. By contrast, atomization in vacuum drops the quench rate several orders of magnitude.