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Restoration and Reexamination of Data from the Apollo 11, 12, 14, and 15 Dust, Thermal and Radiation Engineering Measurements Experiments

As part of an effort by the Lunar Data Node (LDN) we are restoring data returned by the Apollo Dust, Thermal, and Radiation Engineering Measurements (DTREM) packages emplaced on the lunar surface by the crews of Apollo 11, 12, 14, and 15. Also commonly known as the Dust Detector experiments, the DTREM packages measured the outputs of exposed solar cells and thermistors over time. They operated on the surface for up to nearly 8 years, returning data every 54 seconds. The Apollo 11 DTREM was part of the Early Apollo Surface Experiments Package (EASEP), and operated for a few months as planned following emplacement in July 1969. The Apollo 12, 14, and 15 DTREMs were mounted on the central station as part of the Apollo Lunar Surface Experiments Package (ALSEP) and operated from deployment until ALSEP shutdown in September 1977. The objective of the DTREM experiments was to determine the effects of lunar and meteoric dust, thermal stresses, and radiation exposure on solar cells. The LDN, part of the Geosciences Node of the Planetary Data System (PDS), operates out of the National Space Science Data Center (NSSDC) at Goddard Space Flight Center. The goal of the LDN is to extract lunar data stored on older media and/or in obsolete formats, restore the data into a usable digital format, and archive the data with PDS and NSSDC. For the DTREM data we plan to recover the raw telemetry, translate the raw counts into appropriate output units, and then apply calibrations. The final archived data will include the raw, translated, and calibrated data and the associated conversion tables produced from the microfilm, as well as ancillary supporting data (metadata) packaged in PDS format.

McBride, Marie J.

Restoration and Reexamination of Apollo Lunar Dust Detector Data from Original Telemetry Files

We are recovering the original telemetry (Figure I) from the Apollo Dust, Thermal, Radiation Environment Monitor (DTREM) experiment, more commonly known as the Dust Detector, and producing full time resolution (54 second) data sets for release through the Planetary Data System (PDS). The primary objective of the experiment was to evaluate the effect of dust deposition, temperature, and radiation damage on solar cells on the lunar surface. The monitor was a small box consisting of three solar cells and thermistors mounted on the ALSEP (Apollo Lunar Surface Experiments Package) central station. The Dust Detector was carried on Apollo's 11, 12, 14 and 15. The Apollo 11 DTREM was powered by solar cells and only operated for a few months as planned. The Apollo 12, 14, and 15 detectors operated for 5 to 7 years, returning data every 54 seconds, consisting of voltage outputs from the three solar cells and temperatures measured by the three thermistors. The telemetry was received at ground stations and held on the Apollo Housekeeping (known as "Word 33") tapes. made available to the National Space Science Data Center (NSSDC) by Yosio Nakamura (University of Texas Institute for Geophysics). We have converted selected parts of the telemetry into uncalibrated and calibrated output voltages and temperatures.

McBride, M. J.

Test Cases for Modeling and Validation of Structures with Piezoelectric Actuators

A set of benchmark test articles were developed to validate techniques for modeling structures containing piezoelectric actuators using commercially available finite element analysis packages. The paper presents the development, modeling, and testing of two structures: an aluminum plate with surface mounted patch actuators and a composite box beam with surface mounted actuators. Three approaches for modeling structures containing piezoelectric actuators using the commercially available packages: MSC/NASTRAN and ANSYS are presented. The approaches, applications, and limitations are discussed. Data for both test articles are compared in terms of frequency response functions from deflection and strain data to input voltage to the actuator. Frequency response function results using the three different analysis approaches provided comparable test/analysis results. It is shown that global versus local behavior of the analytical model and test article must be considered when comparing different approaches. Also, improper bonding of actuators greatly reduces the electrical to mechanical effectiveness of the actuators producing anti-resonance errors.

Reaves, Mercedes C.

Microstrip Antenna Arrays on Multilayer LCP Substrates

A research and development effort now underway is directed toward satisfying requirements for a new type of relatively inexpensive, lightweight, microwave antenna array and associated circuitry packaged in a thin, flexible sheet that can readily be mounted on a curved or flat rigid or semi-rigid surface. A representative package of this type consists of microwave antenna circuitry embedded in and/or on a multilayer liquid- crystal polymer (LCP) substrate. The circuitry typically includes an array of printed metal microstrip patch antenna elements and their feedlines on one or more of the LCP layer(s). The circuitry can also include such components as electrostatically actuated microelectromechanical systems (MEMS) switches for connecting and disconnecting antenna elements and feedlines. In addition, the circuitry can include switchable phase shifters described below. LCPs were chosen over other flexible substrate materials because they have properties that are especially attractive for high-performance microwave applications. These properties include low permittivity, low loss tangent, low water-absorption coefficient, and low cost. By means of heat treatments, their coefficients of thermal expansion can be tailored to make them more amenable to integration into packages that include other materials. The nature of the flexibility of LCPs is such that large LCP sheets containing antenna arrays can be rolled up, then later easily unrolled and deployed. Figure 1 depicts a prototype three- LCP-layer package containing two four-element, dual-polarization microstrip-patch arrays: one for a frequency of 14 GHz, the other for a frequency of 35 GHz. The 35-GHz patches are embedded on top surface of the middle [15-mil (approx.0.13-mm)-thick] LCP layer; the 14- GHz patches are placed on the top surface of the upper [9-mil (approx. 0.23-mm)-thick] LCP layer. The particular choice of LCP layer thicknesses was made on the basis of extensive analysis of the effects of the thicknesses on cross-polarization levels, bandwidth, and efficiency at each frequency.

Thompson, Dane

Micro-focus X-ray imaging

The acceptance of surface mounting in the electronics industry has been slowed by problems with component availability, electrical testing, and inspection. Industry suppliers and users have been working to solve these problems, and they are easing. Component manufacturers are offering substantially more devices in surface mountable packages. Automated test equipment vendors are offering test fixtures for surface mount circuit boards. And just recently, solder connection inspection has been automated through a partership effort with a major electronics manufacturer. The results achieved in this effort are presented.

Juha, Michael

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Aquirre, Fernando

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Schatzel, Donald

First-Time Analysis of Completely Restored DTREM Instrument Data from Apollo 14 and 15

The Dust, Thermal and Radiation Engineering Measurement (DTREM) packages (figure 1) mounted on the central stations of the Apollo 11, 12, 14, and 15 ALSEPs (Apollo Lunar Surface Experiments Packages) measured the outputs of exposed solar cells and thermistors over time. The goal of the experiment, also commonly known as the dust detector, was to study the long-term effects of dust, radiation, and temperature at the lunar surface on solar cells. The monitors returned data for up to almost 8 years from the lunar surface.

McBride, Marie J.

Salinity Measurements During the Gulf Stream Experiment

The salinity of the open ocean is important for understanding ocean circulation, for understanding energy exchange with the atmosphere and for improving models to predict weather and climate. Passive microwave sensors at L-band (1.4 GHz) operating from aircraft have demonstrated that salinity can be measured with sufficient accuracy (1 psu) to be scientifically meaningful in coastal waters. However, measuring salinity in the open ocean presents unresolved issues largely because of the much greater accuracy (approx. 0.1 psu) required to be scientifically viable. In the summer of 1999 a series of measurements called, The Gulf Stream Experiment, were conducted as part of research at the Goddard Space Flight Center to test the potential for passive microwave remote sensing of salinity in the open ocean. The measurements consisted of a compliment of airborne microwave instruments (radiometers and scatterometer) and ships and drifters for surface truth. The study area was a 200 km by 100 km rectangle about 250 km east of Delaware Bay between the continental shelf waters and north wall of the Gulf Stream. The primary passive instruments were the ESTAR radiometer (L-band, H-pol) and the SLFMR radiometer (L-band, V-pol). In addition, the compliment of instruments on the aircraft included a C-band radiometer (ACMR), an ocean wave scatterometer (ROWS) and an infrared radiometer. A GPS backscatter experiment was also part of the package. These instruments were mounted on the NASA P-3 Orion aircraft. Surface salinity measurements were provided by the RN Cape Henlopen and MN Oleander (thermosalinographs) plus salinity and temperature sensors on three surface drifters deployed from the RN Cape Henopen. The primary experiment period was August 26-September 2, 1999. During this period the salinity field within the study area consisted of a gradient on the order of 2-3 psu in the vicinity of the shelf break and a warm core ring with a gradient of 1-2 psu. Detailed maps were made with the airborne sensors on August 28 and 29 and on September 2 flights were made over the surface drifters to look for effects due to a change in surface roughness resulting from the passage of Hurricane Dennis. Preliminary results show a good agreement between the microwave measurements and ship measurements of salinity. The features of the brightness temperature maps correspond well with the features of the salinity field measured by the ship and drifters and a preliminary retrieval of salinity compares well with the ship data.

LeVine, D. M.

Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies

This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies. Acceleration induced failure mechanisms varied from conventional surface mount (SM) failures for CSPs. Examples of unrealistic life projections for other CSPs are also presented. The cumulative cycles to failure for ceramic BGA assemblies performed under different conditions, including plots of their two Weibull parameters, are presented. The results are for cycles in the range of -30 C to 100 C, -55 C to 100 C, and -55 C to 125 C. Failure mechanisms as well as cycles to failure for thermal shock and thermal cycling conditions in the range of -55 C to 125 C were compared. Projection to other temperature cycling ranges using a modified Coffin-Manson relationship is also presented.

Ghaffarian, Reza

(abstract) Electronic Packaging for Microspacecraft Applications

The intent of this presentation is to give a brief look into the future of electronic packaging for microspacecraft applications. Advancements in electronic packaging technology areas have developed to the point where a system engineer's visions, concepts, and requirements for a microspacecraft can now be a reality. These new developments are ideal candidates for microspacecraft applications. These technologies are capable of bringing about major changes in how we design future spacecraft while taking advantage of the benefits due to size, weight, power, performance, reliability , and cost. This presentation will also cover some advantages and limitations of surface mount technology (SMT), multichip modules (MCM), and wafer scale integration (WSI), and what is needed to implement these technologies into microspacecraft.

technology multichip modules wafer scale integrati

A miniature, infrared pressure telemetry system

A miniature, single-channel, infrared telemetry system designed for making base pressure measurements on a wind tunnel model has been developed for the 13-inch magnetic suspension and balance system (MSBS) at Langley Research Center. The system consists of a transmitter installed in the wind tunnel model and a receiver station located outside of the test section. The onboard transmitter package includes a miniature pressure transducer, a signal conditioning circuit, and IR LED and a hearing-aid battery package. The IR LED, which is mounted flush with the model's surface, serves as the transmitter. The system is automatically activated in a magnetic field and has low power requirements. The system has been successfully employed to make low speed base pressure measurements at the 13-inch MSBS. The battery powered telemetry transmitter has a demonstrated one-hour operating life and an overall precision of better than 1/2 percent full scale.

Tcheng, Ping

Cryogenic Behavior of the High Temperature Crystal Oscillator PX-570

Microprocessors, data-acquisition systems, and electronic controllers usually require timing signals for proper and accurate operation. These signals are, in most cases, provided by circuits that utilize crystal oscillators due to availability, cost, ease of operation, and accuracy. Stability of these oscillators, i.e. crystal characteristics, is usually governed, amongst other things, by the ambient temperature. Operation of these devices under extreme temperatures requires, therefore, the implementation of some temperature-compensation mechanism either through the manufacturing process of the oscillator part or in the design of the circuit to maintain stability as well as accuracy. NASA future missions into deep space and planetary exploration necessitate operation of electronic instruments and systems in environments where extreme temperatures along with wide-range thermal swings are countered. Most of the commercial devices are very limited in terms of their specified operational temperature while very few custom-made and military-grade parts have the ability to operate in a slightly wider range of temperature. Thus, it is becomes mandatory to design and develop circuits that are capable of operation efficiently and reliably under the space harsh conditions. This report presents the results obtained on the evaluation of a new (COTS) commercial-off-the-shelf crystal oscillator under extreme temperatures. The device selected for evaluation comprised of a 10 MHz, PX-570-series crystal oscillator. This type of device was recently introduced by Vectron International and is designed as high temperature oscillator [1]. These parts are fabricated using proprietary manufacturing processes designed specifically for high temperature and harsh environment applications [1]. The oscillators have a wide continuous operating temperature range; making them ideal for use in military and aerospace industry, industrial process control, geophysical fields, avionics, and engine control. They exhibit low jitter and phase noise, consume little power, and are suited for high shock and vibration applications. The unique package design of these crystal oscillators offers a small ceramic package footprint, as well as providing both through-hole mounting and surface mount options.

Patterson, Richard

IR DirectFET Extreme Environments Evaluation Final Report

In 2007, International Rectifier (IR) introduced a new version of its DirectFET metal oxide semiconductor field effect transistor (MOSFET) packaging. The new version (referred to as 'Version 2') enhances device moisture resistance, makes surface mount (SMT) assembly of these devices to printed wiring boards (PWBs) more repeatable, and subsequent assembly inspection simpler. In the present study, the National Aeronautics Space Administration (NASA) Jet Propulsion Laboratory (JPL), in collaboration with Stellar Microelectronics (Stellar), continued an evaluation of the DirectFET that they started together in 2006. The present study focused on comparing the two versions of the DirectFET and examining the suitability of the DirectFET devices for space applications. This study evaluated both versions of two DirectFET packaged devices that had both been shown in the 2006 study to have the best electrical and thermal properties: the IRF6635 and IRF6644. The present study evaluated (1) the relative electrical and thermal performance of both versions of each device, (2) the performance through high reliability testing, and (3) the performance of these devices in combination with a range of alternate solder alloys in the extreme thermal environments of deep space....

electronic parts packaging

High Reliability, High Mix, Ultralow Volume Surface Mount Technology for Space Applications

For the past two years, JPL has been working to introduce surface mount technology (SMT) for high reliability space applications. The thrust has centered around four research and development projects, the aim of which is to facilitate the use of SMT for designing, producing, inspecting, and quantifying surface mount printed wiring assemblies for ultralow volume, long life space applications. This paper explores the current approach being pursued at JPL and some of the problems peculiar to applying SMT to spacecraft applications.

volume long life

A feasibility study of developing toroidal tanks for a spinning spacecraft

The use of toroidal tanks in an advanced Pioneer, spin-stabilized Jupiter orbiter was investigated. Fluid behavior in spinning toroids was evaluated and the need for a propellant acquisition system was established. A common surface tension acquisition system design was selected from four candidates for gas-free liquid feed to a single outlet in both MMH and N2O4 tanks. Fabrication of toroidal tanks using either titanium or aluminum alloys is feasible. Integration of two toroidal tanks with surface tension systems in place of four spherical tanks provides spacecraft weight, packaging, structural mounting, thermal control and stability advantages.

Anderson, J. E.

Oxygen Production System for Refueling Human Landing System Elements

Current NASA plans for lunar exploration include a human lunar landing system, comprised of separate descent andascent modules, with the eventual goal of reusability. Different oxygen production processes were studied to evaluatethe feasibility of producing 10 tons of oxygen per year assuming a high latitude landing location. The study includesconsideration of packaging the ISRU components on the descent module, methods to transfer the regolith from theexcavators to the processing plant which may be mounted well above the lunar surface, and general concept ofoperations for excavation, oxygen production, and liquefaction and storage. A solar-based power system was alsodesigned and packaged on the lander, including the use of direct solar thermal energy where appropriate.

Linne, Diane