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At least 37 records · Page 2

Case study of active array feed compensation with sidelobe control for reflector surface distortion

The feasibility of electromagnetically compensating for reflector surface distortions has been investigated. The performance characteristics (gain, sidelobe levels, etc.) of large communication antenna systems degrade as the reflector surface distorts mainly due to thermal effects from a varying solar flux. The techniques described in this report can be used to maintain the design performance characteristics independently of thermal effects on the reflector surface. With the advent of monolithic microwave integrated circuits (MMIC), a greater flexibility in array-fed reflector system design can be achieved. MMIC arrays provide independent control of amplitude and phase for each of many radiating elements of the feed array. It is assumed that the surface characteristics (x,y,z, its first and second derivatives) under distorted conditions are known.

Acosta, R. J.↗

Active feed array compensation for reflector antenna surface distortions

The feasibility of electromagnetic compensation for reflector antenna surface distortions is investigated. The performance characteristics of large satellite communication reflector antenna systems degrade as the reflector surface distorts, mainly due to thermal effects from solar radiation. The technique developed can be used to maintain the antenna boresight directivity and sidelobe level independent of thermal effects on the reflector surface. With the advent of monolithic microwave integrated circuits (MMIC), a greater flexibility in array fed reflector antenna systems can be achieved. MMIC arrays provide independent control of amplitude and phase for each of the many radiating elements in the feed array. By assuming a known surface distortion profile, a simulation study is carried out to examine the antenna performance as a function of feed array size and number of elements. Results indicate that the compensation technique can effectively control boresight directivity and sidelobe level under peak surface distortion in the order of tenth of a wavelength.

Acosta, Roberto J.↗

Modular electronics packaging system

A modular electronics packaging system includes multiple packaging slices that are mounted horizontally to a base structure. The slices interlock to provide added structural support. Each packaging slice includes a rigid and thermally conductive housing having four side walls that together form a cavity to house an electronic circuit. The chamber is enclosed on one end by an end wall, or web, that isolates the electronic circuit from a circuit in an adjacent packaging slice. The web also provides a thermal path between the electronic circuit and the base structure. Each slice also includes a mounting bracket that connects the packaging slice to the base structure. Four guide pins protrude from the slice into four corresponding receptacles in an adjacent slice. A locking element, such as a set screw, protrudes into each receptacle and interlocks with the corresponding guide pin. A conduit is formed in the slice to allow electrical connection to the electronic circuit.

Hunter, Don J.↗

Materials Combustion Testing and Combustion Product Sensor Evaluations in FY12

NASA Centers continue to collaborate to characterize the chemical species and smoke particles generated by the combustion of current space-rated non-metallic materials including fluoropolymers. This paper describes the results of tests conducted February through September 2012 to identify optimal chemical markers both for augmenting particle-based fire detection methods and for monitoring the post-fire cleanup phase in human spacecraft. These studies follow up on testing conducted in August 2010 and reported at ICES 2011. The tests were conducted at the NASA White Sands Test Facility in a custom glove box designed for burning fractional gram quantities of materials under varying heating profiles. The 623 L chamber was heavily instrumented to quantify organics (gas chromatography/mass spectrometry), inorganics by water extraction followed by ion chromatography, and select species by various individual commercially-available sensors. Evaluating new technologies for measuring carbon monoxide, hydrogen cyanide, hydrogen fluoride, hydrogen chloride and other species of interest was a key objective of the test. Some of these sensors were located inside the glovebox near the fire source to avoid losses through the sampling lines; the rest were located just outside the glovebox. Instruments for smoke particle characterization included a Tapered Element Oscillating Microbalance Personal Dust Monitor (TEOM PDM) and a TSI Dust Trak DRX to measure particle mass concentration, a TSI PTrak for number concentration and a thermal precipitator for collection of particles for microscopic analysis. Materials studied included Nomex®, M22759 wire insulation, granulated circuit board, polyvinyl chloride (PVC), Polytetrafluoroethylene (PTFE), Kapton®, and mixtures of PTFE and Kapton®. Furnace temperatures ranged from 340o to 640o C, focusing on the smoldering regime. Of particular interest in these tests was confirming burn repeatability and production of acid gases with different fuel mixture compositions, as well as the dependence of aerosol concentrations on temperature.

Smoke↗

Materials Combustion Testing and Combustion Product Sensor Evaluations in FY12

NASA Centers continue to collaborate to characterize the chemical species and smoke particles generated by the combustion of current space-rated non-metallic materials including fluoropolymers. This paper describes the results of tests conducted February through September 2012 to identify optimal chemical markers both for augmenting particle-based fire detection methods and for monitoring the post-fire cleanup phase in human spacecraft. These studies follow up on testing conducted in August 2010 and reported at ICES 2011. The tests were conducted at the NASA White Sands Test Facility in a custom glove box designed for burning fractional gram quantities of materials under varying heating profiles. The 623 L chamber was heavily instrumented to quantify organics (gas chromatography/mass spectrometry), inorganics by water extraction followed by ion chromatography, and select species by various individual commercially-available sensors. Evaluating new technologies for measuring carbon monoxide, hydrogen cyanide, hydrogen fluoride, hydrogen chloride and other species of interest was a key objective of the test. Some of these sensors were located inside the glovebox near the fire source to avoid losses through the sampling lines; the rest were located just outside the glovebox. Instruments for smoke particle characterization included a Tapered Element Oscillating Microbalance Personal Dust Monitor (TEOM PDM) and a TSI Dust Trak DRX to measure particle mass concentration, a TSI PTrak for number concentration and a thermal precipitator for collection of particles for microscopic analysis. Materials studied included Nomex(R), M22759 wire insulation, granulated circuit board, polyvinyl chloride (PVC), Polytetrafluoroethylene (PTFE), Kapton(R), and mixtures of PTFE and Kapton(R). Furnace temperatures ranged from 340 to 640 C, focusing on the smoldering regime. Of particular interest in these tests was confirming burn repeatability and production of acid gases with different fuel mixture compositions, as well as the dependence of aerosol concentrations on temperature.

Combustion↗

High-Temperature Strain-And-Temperature Gauge

Two-element gauge used alternately in two different bridge circuits to measure both temperature and strain. Three-lead strain-and-temperature gauge developed for use at temperatures up to 750 degree F (390 degree C) on fiber-reinforced carbon/carbon composite material having coefficient of thermal expansion of 0.8 ppm/degree F. Unlike most temperature-compensated gauges, gauge gives accurate results even during rapid heating and cooling cycles. Similar gauges produced for materials with different coefficients of thermal expansion.

Wnuk, S. P.↗

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗

The dual element method of strain gauge temperature compensation

The use of a known temperature compensation technique is suggested to reduce the overall temperature sensitivity of a PdCr strain gauge system being developed for turbine engine research. The temperature compensation technique proposed for this application uses a resistance thermometer in an adjacent leg of the strain gauge bridge circuit to cancel the thermally generated resistance change of the strain gauge. Equations for calculating the required compensation resistor values and the sensitivity of the resulting strain gauge bridge to both temperature and strain are presented.

Englund, David R.↗

Optical Mounts for Cryogenic Beam Splitters

Spring-loaded optical mounts maintain flatness and alinement of rigid, framed, or pellicle beam splitters over wide temperature range, despite differences in thermal expansion amoung materials. Mounts permit optical adjustments at ambient temperature even though optical system operated subsequently within few degrees of absolute zero. Mounts useful as holders for integrated-circuit master patterns, survey targets, vibrating membranes, noise- or pressure-sensing membranes, osmosis filters, and fuel-cell elements.

Rudman, A. A.↗

Nano-engineered Multiwall Carbon Nanotube-copper Composite Thermal Interface Material for Efficient Heat Conduction

Efforts in integrated circuit (IC) packaging technologies have recently been focused on management of increasing heat density associated with high frequency and high density circuit designs. While current flip-chip package designs can accommodate relatively high amounts of heat density, new materials need to be developed to manage thermal effects of next-generation integrated circuits. Multiwall carbon nanotubes (MWNT) have been shown to significantly enhance thermal conduction in the axial direction and thus can be considered to be a candidate for future thermal interface materials by facilitating efficient thermal transport. This work focuses on fabrication and characterization of a robust MWNT-copper composite material as an element in IC package designs. We show that using vertically aligned MWNT arrays reduces interfacial thermal resistance by increasing conduction surface area, and furthermore, the embedded copper acts as a lateral heat spreader to efficiently disperse heat, a necessary function for packaging materials. In addition, we demonstrate reusability of the material, and the absence of residue on the contacting material, both novel features of the MWNT-copper composite that are not found in most state-of-the-art thermal interface materials. Electrochemical methods such as metal deposition and etch are discussed for the creation of the MWNT-Cu composite, detailing issues and observations with using such methods. We show that precise engineering of the composite surface affects the ability of this material to act as an efficient thermal interface material. A thermal contact resistance measurement has been designed to obtain a value of thermal contact resistance for a variety of different thermal contact materials.

Ngo, Quoc↗

A Hot-wire Circuit with Very Small Time Lag

A circuit for a hot-wire anemometer for the measurement of fluctuating flow is presented in the present report. The principal elements of the circuit are a Wheatstone bridge, one branch of which is the hot wire; and an electronic amplifier and a current regulator for the brief current which in combination maintain the bridge balance constant. Hence the hot wire is kept at practically constant resistance and temperature, and the time lag caused by thermal inertia of the wire is thereby reduced. Through the addition of a nonlinear amplifying stage the reading of the instrument has been rendered proportional to the velocity. A discussion of certain characteristics of the circuit and the results of related calibrating tests are given.

Weske, John R↗

Rotary Motors Actuated by Traveling Ultrasonic Flexural Waves

Efficient miniature actuators that are compact and consume low power are needed to drive space and planetary mechanisms in future NASA missions. Ultrasonic rotary motors have the potential to meet this NASA need and they are developed as actuators for miniature telerobotic applications. These motors have emerged in commercial products but they need to be adapted for operation at the harsh space environments that include cryogenic temperatures and vacuum and also require effective analytical tools for the design of efficient motors. A finite element analytical model was developed to examine the excitation of flexural plate wave traveling in a piezoelectrically actuated rotary motor. The model uses 3D finite element and equivalent circuit models that are applied to predict the excitation frequency and modal response of the stator. This model incorporates the details of the stator including the teeth, piezoelectric ceramic, geometry, bonding layer, etc. The theoretical predictions were corroborated experimentally for the stator. In parallel, efforts have been made to determine the thermal and vacuum performance of these motors. Experiments have shown that the motor can sustain at least 230 temperature cycles from 0 C to -90 C at 7 Torr pressure significant performance change. Also, in an earlier study the motor lasted over 334 hours at -150 C and vacuum. To explore telerobotic applications for USMs a robotic arm was constructed with such motors.

Bar-Cohen, Yoseph↗

Solar cell array design handbook - The principles and technology of photovoltaic energy conversion

Photovoltaic solar cell array design and technology for ground-based and space applications are discussed from the user's point of view. Solar array systems are described, with attention given to array concepts, historical development, applications and performance, and the analysis of array characteristics, circuits, components, performance and reliability is examined. Aspects of solar cell array design considered include the design process, photovoltaic system and detailed array design, and the design of array thermal, radiation shielding and electromagnetic components. Attention is then given to the characteristics and design of the separate components of solar arrays, including the solar cells, optical elements and mechanical elements, and the fabrication, testing, environmental conditions and effects and material properties of arrays and their components are discussed.

Rauschenbach, H. S.↗

Quartz/fused silica chip carriers

The primary objective of this research and development effort was to develop monolithic microwave integrated circuit (MMIC) packaging which will operate efficiently at millimeter-wave frequencies. The packages incorporated fused silica as the substrate material which was selected due to its favorable electrical properties and potential performance improvement over more conventional materials for Ka-band operation. The first step towards meeting this objective is to develop a package that meets standard mechanical and thermal requirements using fused silica and to be compatible with semiconductor devices operating up to at least 44 GHz. The second step is to modify the package design and add multilayer and multicavity capacity to allow for application specific integrated circuits (ASIC's) to control multiple phase shifters. The final step is to adapt the package design to a phased array module with integral radiating elements. The first task was a continuation of the SBIR Phase 1 work. Phase 1 identified fused silica as a viable substrate material by demonstrating various plating, machining, and adhesion properties. In Phase 2 Task 1, a package was designed and fabricated to validate these findings. Task 2 was to take the next step in packaging and fabricate a multilayer, multichip module (MCM). This package is the predecessor to the phased array module and demonstrates the ability to via fill, circuit print, laminate, and to form vertical interconnects. The final task was to build a phased array module. The radiating elements were to be incorporated into the package instead of connecting to it with wire or ribbon bonds.

Source record↗

Overview of space power electronic's technology under the CSTI High Capacity Power Program

The Civilian Space Technology Initiative (CSTI) is a NASA Program targeted at the development of specific technologies in the areas of transportation, operations and science. Each of these three areas consists of major elements and one of the operation's elements is the High Capacity Power element. The goal of this element is to develop the technology base needed to meet the long duration, high capacity power requirements for future NASA initiatives. The High Capacity Power element is broken down into several subelements that includes energy conversion in the areas of the free piston Stirling power converter and thermoelectrics, thermal management, power management, system diagnostics, and environmental compatibility and system's lifetime. A recent overview of the CSTI High capacity Power element and a description of each of the program's subelements is given by Winter (1989). The goals of the Power Management subelement are twofold. The first is to develop, test, and demonstrate high temperature, radiation-resistant power and control components and circuits that will be needed in the Power Conditioning, Control and Transmission (PCCT) subsystem of a space nuclear power system. The results obtained under this goal will also be applicable to the instrumentation and control subsystem of a space nuclear reactor. These components and circuits must perform reliably for lifetimes of 7-10 years. The second goal is to develop analytical models for use in computer simulations of candidate PCCT subsystems. Circuits which will be required for a specific PCCT subsystem will be designed and built to demonstrate their performance and, also, to validate the analytical models and simulations. The tasks under the Power Management subelement will now be described in terms of objectives, approach and present status of work.

Schwarze, Gene E.↗

Study program to improve the open-circuit voltage of low resistivity single crystal silicon solar cells

The results of a 14 month program to improve the open circuit voltage of low resistivity silicon solar cells are described. The approach was based on ion implantation in 0.1- to 10.0-ohm-cm float-zone silicon. As a result of the contract effort, open circuit voltages as high as 645 mV (AMO 25 C) were attained by high dose phosphorus implantation followed by furnace annealing and simultaneous SiO2 growth. One key element was to investigate the effects of bandgap narrowing caused by high doping concentrations in the junction layer. Considerable effort was applied to optimization of implant parameters, selection of furnace annealing techniques, and utilization of pulsed electron beam annealing to minimize thermal process-induced defects in the completed solar cells.

Minnucci, J. A.↗

Calibration, Data Acquisition, and Post Analysis of Turbulent Fluid Flow in a Calibration Jet Using Hot-wire Anemometry

The Turbine Branch concentrates on the following areas: Computational Fluid Dynamics (CFD), and implementing experimental procedures to obtain physical modeling data. Hot-wire Anemometry is a valuable tool for obtaining physical modeling data. Hot-wire Anemometry is likely to remain the principal research tool for most turbulent air/gas flow studies. The Hot-wire anemometer consists of a fine wire heated by electric current. When placed in a fluid stream, the hot-wire loses heat to the fluid by forced convection. In forced convection, energy transfer is due to molecular motion imposed by an extraneous force moving fluid parcels. When the hot-wire is in "equilibrium", the rate of heat input to the wire is equal to the rate of heat loss at the wire ends. The equality between heat input and heat loss is the basis for King s equation, which relates the electrical parameters of the hot-wire to the flow parameters of the fluid. Hot-wire anemometry is based on convective heat transfer from a heated wire element placed in a fluid flow. Any change in the fluid flow condition that affects the heat transfer from the heated element will be detected virtually instantaneously by a constant-temperature Hot-wire anemometry system. The system implemented for this research is the IFA 300. The system is a fully-integrated, thermal anemometer-based system that measures mean and fluctuating velocity components in air, water, and other fluids. It also measures turbulence and makes localized temperature measurements. A constant-temperature anemometer is a bridge and amplifier circuit that controls a tiny wire at constant temperature. As a fluid flow passes over the heated sensor, the amplifier senses the bridge off-balance and adjusts the voltage to the top of the bridge, keeping the bridge in balance. The voltage on top of the bridge can then be related to the velocity of the flow. The bridge voltage is sensitive to temperature as well as velocity and so the built-in thermocouple circuit can be attached to a thermocouple that can measure the fluid temperature. Additional information is included in the original extended abstract.

Moreno, Michelle↗

Self-Validating Thermocouple

Self-Validating Thermocouple (SVT) Systems capable of detecting sensor probe open circuits, short circuits, and unnoticeable faults such as a probe debonding and probe degradation are useful in the measurement of temperatures. SVT Systems provide such capabilities by incorporating a heating or excitation element into the measuring junction of the thermocouple. By heating the measuring junction and observing the decay time for the detected DC voltage signal, it is possible to indicate whether the thermocouple is bonded or debonded. A change in the thermal transfer function of the thermocouple system causes a change in the rise and decay times of the thermocouple output. Incorporation of the excitation element does not interfere with normal thermocouple operation, thus further allowing traditional validation procedures as well.

Perotti, Jose M.↗