Study on the interfacial thermal resistance between CNTs and Al with a TTM-MD model
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Under the DOE EERE Geothermal Technology Office (GTO)-funded project in FY 2019-2022, Brookhaven National Laboratory (BNL) aimed to develop hydrophobic thermal-shock resistant lightweight well cement composites suitable for temporarily storing a curtailed hot working fluid incurred from excess geothermal-, solar-, and wind-generated energies in underground reservoirs thermal energy storage sites. This storage energy systems are designed to provide energy during the periods between energy-harvesting and -requiring periods. One key factor to the success of this project was hydrophobicity of cement composites. The hydrophobic composites not only upgrade thermal insulating properties of water-saturated composites for minimizing heat loss in upper well surface regions, but also provide improved mechanical properties related to thermal-shock resistance and the protection of carbon steel (CS) casing against corrosion.
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In this report the data is reviewed on thermal contact conductance (TCC) and/or thermal contact resistance (TCR) at material interfaces which employs flexible graphite (FG) materials as thermal interface materials (TIM). FG materials are often used as TIM due to their conforming nature. While the overall TCR can be estimated straightforward from measured data, the interface TCR is much more difficult to obtain. The report also discusses the interfacial thermal contact conductance between FG-tungsten and FG-Glidcop-Al15, which are envisioned for high-heat flux applications.
Under the DOE EERE Geothermal Technology Office (GTO)-funded project in FY 2019-2022, Brookhaven National Laboratory (BNL) aimed to develop hydrophobic thermal-shock resistant lightweight well cement composites suitable for temporarily storing a curtailed hot working fluid incurred from excess geothermal-, solar-, and wind-generated energies in underground reservoirs thermal energy storage sites. This storage energy systems are designed to provide energy during the periods between energy-harvesting and -requiring periods.
We report on experimental investigation of thermal contact resistance, RC, of the noncuring graphene thermal interface materials with the surfaces characterized by different degree of roughness, Sq. It is found that the thermal contact resistance depends on the graphene loading, ξ, non-monotonically, achieving its minimum at the loading fraction of ξ ~15 wt%. Decreasing the surface roughness by Sq~1 μm results in approximately the factor of ×2 decrease in the thermal contact resistance for this graphene loading. The obtained dependences of the thermal conductivity, KTIM, thermal contact resistance, RC, and the total thermal resistance of the thermal interface material layer on ξ and Sq can be utilized for optimization of the loading fraction of graphene for specific materials and roughness of the connecting surfaces. Our results are important for the thermal management of high-power-density electronics implemented with diamond and other wide-band-gap semiconductors.
This paper presents the use of hydrophobic silica aerogel (HSA) and hydrophilic fly ash cenosphere (FCS) aggregates for improvements in the thermal insulating and mechanical properties of 100- and 250 °C-autoclaved calcium aluminate phosphate (CaP) cement composites reinforced with micro-glass (MGF) and micro-carbon (MCF) fibers for deployment in medium- (100 °C) and high-temperature (250 °C) reservoir thermal energy storage systems. The following six factors were assessed: (1) Hydrothermal stability of HSA; (2) Pozzolanic activity of the two aggregates and MGF in an alkali cement environment; (3) CaP cement slurry heat release during hydration and chemical reactions; (4) Composite phase compositions and phase transitions; (5) Mechanical behavior; (6) Thermal shock (TS) resistance at temperature gradients of 150 and 225 °C. The results showed that hydrophobic trimethylsilyl groups in trimethylsiloxy-linked silica aerogel structure were susceptible to hydrothermal degradation at 250 °C. This degradation was followed by pozzolanic reactions (PR) of HSA, its dissolution, and the formation of a porous microstructure that caused a major loss in the compressive strength of the composites at 250 °C. The pozzolanic activities of FCS and MGF were moderate, and they offered improved interfacial bonding at cement-FCS and cement-MGF joints through a bridging effect by PR products. Despite the PR of MGF, both MGF and MCF played an essential role in minimizing the considerable losses in compressive strength, particularly in toughness, engendered by incorporating weak HSA. As a result, a FCS/HSA ratio of 90/10 in the CaP composite system was identified as the most effective hybrid insulating aggregate composition, with a persistent compressive strength of more than 7 MPa after three TS tests at a 150 °C temperature gradient. This composite displayed thermal conductivity of 0.28 and 0.35 W/mK after TS with 225 and 150 °C thermal gradients, respectively. These values, below the TC of water (TC water = 0.6 W/mK), were measured under water-saturated conditions for applications in underground reservoirs. However, considering the hydrothermal disintegration of HSA at 250 °C, these CaP composites have potential applications for use in thermally insulating, thermal shock-resistant well cement in a mid-temperature range (100 to 175 °C) reservoir thermal energy storage system.
Traditional understanding of the thermal boundary resistance (TBR) across solid-solid interfaces posits that the vibrational densities of states overlap between materials dictates interfacial energy transport, with phonon scattering occurring at the interface. Using atomistic simulations, we show a mechanism for control of TBR; point defects near an interface can lead to both short- and midrange disorder, accelerating the conversion of vibrational energy between bulk and interfacial modes, ultimately reducing the TBR. In conclusion, we experimentally demonstrate this reduction through ion irradiation of gallium nitride and subsequently measuring the TBR across Al/GaN interfaces.
High purity niobium (Nb) is a technologically important material for large-scale accelerator and nano-scale quantum computing applications in microwave frequency range. The high thermal conductivity and low resistivity of Nb are critical to the high performance at temperature range of 0.01–4.0 K. The presence of interstitials such as O, N, H, and C act as scattering centers and alter the mean free path, reducing resistivity and thermal conductivity, and contributing significantly to Nb's thermal performance for temperatures of 2.0 K and above. The residual resistivity ratio (RRR), defined as the ratio of the normal state resistivity at 300 K to that at 4.2 K (Nb, T c = 9.2 K), is an accepted direct estimate of the impurity content of fully recrystallized Nb. Complete re-crystallization of Nb is challenging unless very high temperatures are employed, which is often impractical, hence, in practice, dislocation and dislocation structures impact the thermal performance of Nb due to strong phonon scattering contributions. Furthermore, this paper reports on the degradation of thermal conductivity and RRR of high purity Nb large grain, single crystal with fixed impurity, varying strain, and dislocation content levels. Experimental thermal conductivity data fits the Boltzmann transport equation incorporating dislocation density.
Abstract In concentrated solar power (CSP) applications, fluidized bed is a promising approach for high heat transfer coefficient (HTC) solar receivers and heat exchangers. However, the complexity of multiphase mixing has made it difficult to characterize and analyze the heat transfer mechanism. This paper presents an experimental study on simultaneously characterizing heat transfer in both the near-wall and the bulk regions of a fluidized bed using modulated photothermal radiometry (MPR). The MPR is a non-contact frequency-domain technique using an intensity-modulated laser as the heat source and surface infrared emission as thermometry. The thermal penetration depth of the laser heating is varied by controlling its modulation frequency, and thus the measurement can resolve the near-wall and the bulk thermal resistances. With the MPR technique, we measured fluidized silica sands with a mean size of 164 μm in a vertical channel of 6 mm depth. Our results show that the near-wall thermal resistance is substantially increased with increasing gas velocity, which partially offsets the benefit of higher HTC brought by stronger particle mixing during the fluidization. We also used the MPR to quantify the improvement in particle-wall heat transfer in an inclined channel. We found that an 8° inclination towards the heat exchanging side led to a lower near-wall thermal resistance and a higher HTC at high gas velocities. This work demonstrates that the MPR technique is a useful tool to quantify the important near-wall thermal resistance from a bulk particle bed, which not only advances our understanding of heat transfer in fluidized beds, but may also contribute to the design of fluidized bed heat exchangers with higher HTC.
The project aimed to develop modulated photothermal radiometry (MPR) for conducting in-operando measurements of thermal transport in moving particle bed heat exchangers (MPBE) located at Sandia National Laboratory (SNL). The plan was to initially conduct lab-scale measurements on a 1-meter-long particle channel at UCSD, followed by in- operando measurements at SNL on a 20 kWth MPBE prototype built for this project, and if time permitting, potential final deployment on SNL’s 1 MWth G3P3 MPBE. The first two goals were successfully achieved but due to changes with commissioning timeline of the G3P3 MPBE, in-operando measurements on the G3P3 MPBE could not be conducted. The measurement campaigns have resulted in some promising results and the MPR tool has been handed over to trained SNL personnel for future use. MPR measurements on UCSD’s 1-meter-long particle channel showed a peculiar length dependence of the particle bed thermal conductivity and near-wall thermal resistance. The bed thermal conductivity increased, and the near-wall thermal resistance decreased, with increasing distance from the channel inlet, both eventually reaching a plateau. This was found to be due to hydrostatic pressure screening by the channel walls, known as the “Janssen effect”, and is the first experimental study on its role in granular heat transfer. A 20 kWth small-scale MPBE prototype, the first of its kind with 3 mm particle channels and 2 mm sCO2 plates, was designed and manufactured by Vacuum Process Engineering (VPE) for this project. This MPBE prototype was installed in SNL’s HEX test stand and the MPR tool was integrated into the test stand for in-operando measurements. Several modifications have been made to the MPR setup for facile installation and easy operation at SNL. Measurements with Carbo HSP40/70 particles were conducted with various particle and sCO2 temperatures and flow rates. Further, apart from regular MPBE operation, fault scenarios such as plate warping, particle stagnation, and choking were also detected and MPR showed excellent sensitivity to the detection of such conditions. Through the course of this project, MPR has evolved from a sensitive laboratory technique to a rugged industrial tool with various applications in high temperature measurements and diagnostics.
The thermal resistivity (h·ft 2 ·°F/Btu/in.) of closed-cell rigid foam insulation materials significantly decreases over time. Diffusion-tight facers are designed to significantly enhance initial thermal resistivity and long-term thermal performance by preventing gas diffusion into the foam cells and inhibiting the escape of low thermal conductivity blowing agents. In addition to the gas diffusion property of the facer film, adhesion between the foam and the facer is crucial for achieving diffusion-tight bonding. Here, this study addresses the challenge of thermal aging by investigating how facer film properties and foam formulation influence the durability of thermal performance. A systematic evaluation was conducted to understand the effects of polymeric barrier films, surface treatments, facer coverage, and foam matrix rigidity on thermal resistivity over time. Key findings reveal that diffusion-tight facers, particularly those with metallized layers and compatible heat seal layers, significantly reduce gas exchange and improve foam-facer adhesion. The optimized system, incorporating barrier facers and a tailored polyisocyanurate foam formulation, achieved initial and aged thermal resistivity values after 200 days of approximately 8.3 and 7.4 h ft 2 ·°F/Btu/in., respectively representing only a 10 % reduction compared to a 17 % reduction observed in control samples without facers. Notably, polyurethane spray foams with facers exhibited only a 4 % reduction in thermal resistivity, compared to a 23 % decrease in control samples, demonstrating nearly six times better retention of thermal performance. This innovative facer technology presents a promising solution for reducing energy costs and represents a significant advancement in optimizing energy management for building envelopes in future technologies. This technology can also be adapted for other applications that necessitate the preservation of long-term thermal performance.
The implementation of 5G-and-beyond networks requires faster, high-performance, and power-efficient semiconductor devices, which are only possible with materials that can support higher frequencies. Gallium nitride (GaN) power amplifiers are essential for 5G-and-beyond technologies since they provide the desired combination of high frequency and high power. These applications along with terrestrial hub and backhaul communications at high power output can present severe heat removal challenges. The cooling of GaN devices with diamond as the heat spreader has gained significant momentum since device self-heating limits GaN’s performance. However, one of the significant challenges in integrating polycrystalline diamond on GaN devices is maintaining the device performance while achieving a low diamond/GaN channel thermal boundary resistance. In this study, we achieved a record-low thermal boundary resistance of around 3.1 ± 0.7 m 2 K/GW at the diamond/Si 3 N 4 /GaN interface, which is the closest to theoretical prediction to date. The diamond was integrated within ~1 nm of the GaN channel layer without degrading the channel’s electrical behavior. Furthermore, we successfully minimized the residual stress in the diamond layer, enabling more isotropic polycrystalline diamond growth on GaN with thicknesses >2 μm and a ~1.9 μm lateral grain size. More isotropic grains can spread the heat in both vertical and lateral directions efficiently. Using transient thermoreflectance, the thermal conductivity of the grains was measured to be 638 ± 48 W/m K, which when combined with the record-low thermal boundary resistance makes it a leading-edge achievement.
Rapid growth in artificial intelligence and data center workloads demands high-performance liquid cooling to manage increasing chip power. This study presents two metal-additive-manufactured cold plates with sinusoidal fins, constant-amplitude wavy fins and linearly variable-amplitude wavy fins and compares them against metal-additive-manufactured straight fins using experiments conducted at 1 kW heat dissipation as well as high-fidelity 3D conjugate computational fluid dynamic simulations. The cold plates were printed in AlSi10Mg material and underwent design using a Python-automated workflow prior to manufacture and testing. The experiments show that wavy fins reduce the normalized thermal resistance by 35 to 45 % at water flow rates from 1 to 4 LPM. At a fixed 20 kPa pressure drop, the variable-waviness design lowered peak surface temperature by 9 °C and thermal resistance by 51 %, while edge-channel maldistribution in the constant wavy fin design limited gains. A thermal resistance breakdown revealed that 55–63 % of the total thermal resistance in wavy designs comes from base heat conduction, 27–33 % from fin heat conduction, and 9–13 % from fin heat convection, indicating the need to address conduction bottlenecks. Parametric sweeps identify a 3 mm fin pitch as optimal, and that horizontal inlet/outlet manifolds further reduce pressure drop by 30–60 % and thermal resistance by 9–16 % relative to vertical inlet-outlet manifolds. The results yield comprehensive guidelines for fin geometry, manifold alignment, material selection and additive-manufacturing constraints to realize high-performance liquid-cooled cold plates for power-dense electronics.
We present a systematic study of thermal oxidation resistance of transition metal borides and carbides up to 1300 °C in a dry air environment. A High-Entropy Metal Boride (HEMB), of composition (Hf 0.2 , Mo 0.2 , Nb 0.2 , Ta 0.2 , Zr 0.2 )B 2 , and a similar High-Entropy Metal Carbide (HEMC) (Hf, Mo, Nb, Ta, Zr)C 5 were synthesized from precursor mixtures, under 30 MPa of pressure at a temperature of 1800 °C using a Spark Plasma Sintering Device. The synthesized phases were confirmed via X-ray Diffraction analysis, which showed a pure hexagonal AlB 2 -type structure for HEMB and a face-centered cubic (FCC) structure for HEMC, with lattice parameters, a = 3.10 Å and c = 3.37 Å for HEMB and a = 4.524 Å for HEMC. Oxidation resistance was evaluated using a simultaneous thermogravimetric analysis and differential scanning calorimetry (TGA/DSC) stage in which HEMB and HEMC were heated up to 1300 °C at a rate of 2 °C/min in a dry air environment. Scanning electron microscopy (SEM) was used to analyze the resulting oxidized material. Our study demonstrates that HEMB shows better thermal oxidation resistance as compared to a similar metal composition HEMC at high temperatures.