Search NASA⌕ Search

SEARCH · Search NASA

Results for “bonding processes”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 361 records · Page 20
All sourcesNASA NTRSDOE OSTI
NASA NTRS1979

Design, processing and testing of LSI arrays: Hybrid microelectronics task

Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.

Himmel, R. P.↗
NASA NTRS1984

Effect of preforming adherends on static and fatigue strength of bonded composite single-lap joints

An analytical and experimental investigation was conducted on bonded composite single-lap joints with the adherends performed to reduce the angle between the line of action of the applied in-plane force and the bondline. A classical closed-form solution was used to analyze the composite joints with various preform angles and overlap lengths. The adherends of the test specimens were preformed before bonding, during the layup and curing process. Static tests were conducted for preform angles of 0, 5, 10, and 15 deg and overlap lengths of 0.75, 1.75, 2.75, and 3.75 in. A limited fatigue study was conducted for specimens with a 2.75-in. overlap and a preform angle of 5 deg. Results of the analysis showed that preforming the adherends of bonded composite single-lap joints significantly reduced the shear and peel stress concentrations in the adhesive. Experimental results showed that preforming the adherends significantly increased their static and fatigue strength and thus increased the load level for which bonded composite single-lap joints can be designed.

Sawyer, J. W.↗
NASA NTRS1977

Early stages in the evolution of the atmosphere and climate on the Earth-group planets

The early evolution of the atmospheres and climate of the Earth, Mars and Venus is discussed, based on a concept of common initial conditions and main processes (besides known differences in chemical composition and outgassing rate). It is concluded that: (1) liquid water appeared on the surface of the earth in the first few hundred million years; the average surface temperature was near the melting point for about the first two eons; CO2 was the main component of the atmosphere in the first 100-500 million years; (2) much more temperate outgassing and low solar heating led to the much later appearance of liquid water on the Martian surface, only one to two billion years ago; the Martian era of rivers, relatively dense atmosphere and warm climate ended as a result of irreversible chemical bonding of CO2 by Urey equilibrium processes; (3) a great lack of water in the primordial material of Venus is proposed; liquid water never was present on the surface of the planet, and there was practically no chemical bonding of CO2; the surface temperature was over 600 K four billion years ago.

Moroz, V. I.↗
NASA NTRS2017

Synchronous Separation, Seaming, Sealing and Sterilization (S4) using Brazing for Sample Containerization and Planetary Protection

The potential return of samples back to Earth from other planetary bodies would be based on planetary protection requirements that vary depending on the type of body [1]. Potential Mars Sample Return would require the protection of our planet from backward contamination. To fulfill this requirement, it would be necessary to implement “break the chain of contact (BTC)” process, where any material reaching Earth would have to be inside a container that is sealed with an extremely high level of confidence. In order to accomplish this, it would be necessary to contain the acquired samples and destroy any potential biological materials that may have contaminated the external surface of the container, while protecting the samples for further analysis. Using brazing, a novel synchronous separation, seaming, sealing and sterilization (S4) process for sample containerization and planetary protection has been conceived and demonstrated. A prototype double-wall container with inner and outer shells and Earth clean interstitial space was used for this demonstration. For potential Mars sample return, the double wall container would be consist of two halves and prepared on Earth. The on-orbit execution would consist of inserting the sample into one of the halves and then mating to the other half and melt the braze material to perform the S4 process. The use of brazing material that melts at temperatures higher than 500OC would assure sterilization of the exposed areas due to pyrolysis since carbon bonds are broken at this temperature. The process consists of two-steps, Step-1: the double wall container halves are fabricated and brazed on Earth; and Step-2: Assembly and brazing the samples on orbit. To prevent potential jamming during the process of mating the two halves of the double-wall container and the extraction of the brazed inner container, a double cone-within-cone approach has been conceived. The results of this study are described and discussed in this manuscript.

Bar-Cohen, Yoseph↗
NASA NTRS2012

Modified Process Reduces Porosity when Soldering in Reduced Gravity Environments

A modified process yields lower levels of internal porosity for solder joints produced in reduced-gravity environments. The process incorporates both alternative materials and a modified procedure. The process provides the necessary cleaning action to enable effective bonding of the applied solder alloy with the materials to be joined. The modified process incorporates a commercially available liquid flux that is applied to the solder joint before heating with the soldering iron. It is subsequently heated with the soldering iron to activate the cleaning action of the flux and to evaporate most of the flux, followed by application of solder alloy in the form of commercially available solid solder wire (containing no flux). Continued heating ensures adequate flow of the solder alloy around and onto the materials to be joined. The final step is withdrawal of the soldering iron to allow alloy solidification and cooling of the solder joint.

Watson, Kevin↗
NASA NTRS2003

Wafer-Level Membrane-Transfer Process for Fabricating MEMS

A process for transferring an entire wafer-level micromachined silicon structure for mating with and bonding to another such structure has been devised. This process is intended especially for use in wafer-level integration of microelectromechanical systems (MEMS) that have been fabricated on dissimilar substrates. Unlike in some older membrane-transfer processes, there is no use of wax or epoxy during transfer. In this process, the substrate of a wafer-level structure to be transferred serves as a carrier, and is etched away once the transfer has been completed. Another important feature of this process is that two electrodes constitutes an electrostatic actuator array. An SOI wafer and a silicon wafer (see Figure 1) are used as the carrier and electrode wafers, respectively. After oxidation, both wafers are patterned and etched to define a corrugation profile and electrode array, respectively. The polysilicon layer is deposited on the SOI wafer. The carrier wafer is bonded to the electrode wafer by using evaporated indium bumps. The piston pressure of 4 kPa is applied at 156 C in a vacuum chamber to provide hermetic sealing. The substrate of the SOI wafer is etched in a 25 weight percent TMAH bath at 80 C. The exposed buried oxide is then removed by using 49 percent HF droplets after an oxygen plasma ashing. The SOI top silicon layer is etched away by using an SF6 plasma to define the corrugation profile, followed by the HF droplet etching of the remaining oxide. The SF6 plasma with a shadow mask selectively etches the polysilicon membrane, if the transferred membrane structure needs to be patterned. Electrostatic actuators with various electrode gaps have been fabricated by this transfer technique. The gap between the transferred membrane and electrode substrate is very uniform ( 0.1 m across a wafer diameter of 100 mm, provided by optimizing the bonding control). Figure 2 depicts the finished product.

Yang, Eui-Hyeok↗
NASA NTRS1989

A noncontacting scanning photoelectron emission technique for bonding surface cleanliness inspection

Molecular contamination of bonding surfaces can drastically affect the bond strength that can be achieved and therefore the structural integrity and reliability of the bonded part. The presence of thin contaminant films on bonding surfaces can result from inadequate or incomplete cleaning methods, from oxide growth during the time between cleaning (such as grit blasting) and bonding, or from failure to properly protect cleaned surfaces from oils, greases, fingerprints, release agents, or deposition of facility airborne molecules generated by adjacent manufacturing or processing operations. Required cleanliness levels for desired bond performance can be determined by testing to correlate bond strength with contaminant type and quantity, thereby establishing the degree of contamination that can be tolerated based on the strength that is needed. Once the maximum acceptable contaminant level is defined, a method is needed to quantitatively measure the contaminant level on the bonding surface prior to bonding to verify that the surface meets the established cleanliness requirement. A photoelectron emission technique for the nondestructive inspection of various bonding surfaces, both metallic and nonmetallic, to provide quantitative data on residual contaminant levels is described. The technique can be used to scan surfaces at speeds of at least 30 ft/min using a servo system to maintain required sensor to surface spacing. The fundamental operation of the photoelectron emission sensor system is explained and the automated scanning system and computer data acquisition hardware and software are described.

Gause, Raymond L.↗
NASA NTRS1989

Tool Distributes Clamping Load

Tool distributes clamping load stably and fairly evenly among five clamping feet. Designed to stabilize and even out pressure applied to foam pads during bonding and also used in other situations where necessary to maintain fairly even clamping loads during fabrication processes. Five clamping feet, four of which adjustable, distribute clamping load and maintain clamping configuration during adhesive bonding or similar fabrication process. Used to clamp nonflat as well as flat surfaces.

Spencer, Barry Wayne↗
NASA NTRS1985

Characterization of a thermoplastic polyimidesulfone

The detailed characterization of an experimental thermoplastic polyimidesulfone adhesive based on 3,3 prime-diaminodiphenylsulfone and 3,3 prime,4,4 prime-benzophenone tetracarboxylic dianhydride was studied. Model compounds were also examined. Thermal cyclization of the amide-acid to the imide was studied by a variety of techniques including DSC, TGA, MS, in situ diffuse reflectance-FTIR, and flow mearsurement. Characterizations were continued during the processing of adhesive tapes and the fabrication, bonding, and testing of lap shear specimens. Results provide fundamental insights into the role of cure chemistry, and the effects of residual solvent and volatile produces on processing and performance. These insights and the resulting chemical models should lead to more efficient processing cycles for these and other related thermoplastic adhesive systems.

Dezern, J. F.↗
NASA NTRS1985

Process optimization of a thermoplastic polyimidesulphone

The detailed characterization of an experimental thermoplastic polyimidesulfane adhesive based on 3,3 prime-diaminodiphenylsulfone and 3,3 prime,4,4 prime-benzophenone tetracarboxylic dianhydride was studied. Model compounds were also examined. Thermal cyclization of the amide-acid to the imide was studied by a variety of techniques including DSC, TGA, MS, in situ diffuse reflectance-FTIR, and flow measurement. Characterizations were continued during the processing of adhesive tapes and the fabrication, bonding, and testing of lap shear specimens. Results provide fundamental insights into the role of cure chemistry, and the effects of residual solvent and volatile produces on processing and performance. These insights and the resulting chemical models should lead to more efficient processing cycles for these and other related thermoplastic adhesive systems.

Dezern, J. F.↗
NASA NTRS1970

Transistor bonding pad configuration for uniform injection and low inductance

Modification of process for fabricating transistors, which comprises a metallization-pattern design for emitter and base areas together with a double bonding configuration for each emitter and base-bonding lead, improves uniformity of carrier injection in transistors and of reducing lead inductances at base-emitter terminals.

Jacobson, D. S.↗
NASA NTRS1994

Assessment of impact damage of composite rocket motor cases

This contract reviewed the available literature on mechanisms of low velocity impact damage in filament wound rocket motor cases, MDE methods to quantify damage, critical coupon level test methods, manufacturing and material process variables and empirical and analytical modeling off impact damage. The critical design properties for rocket motor cases are biaxial hoop and axial tensile strength. Low velocity impact damage is insidious because it can create serious nonvisible damage at very low impact velocities. In thick rocket motor cases the prevalent low velocity impact damage is fiber fracture and matrix cracking adjacent to the front face. In contrast, low velocity loading of thin wall cylinders induces flexure, depending on span length and the flexure induces delamination and tensile cracking on the back face wall opposed to impact occurs due to flexural stresses imposed by impact loading. Important NDE methods for rocket motor cases are non-contacting methods that allow inspection from one side. Among these are vibrothermography, and pulse-echo methods based on acoustic-ultrasonic methods. High resolution techniques such as x-ray computed tomography appear to have merit for accurate geometrical characterization of local damage to support development of analytical models of micromechanics. The challenge of coupon level testing is to reproduce the biaxial stress state that the full scale article experiences, and to determine how to scale the composite structure to model full sized behavior. Biaxial tensile testing has been performed by uniaxially tensile loading internally pressurized cylinders. This is experimentally difficult due to gripping problems and pressure containment. Much prior work focused on uniaxial tensile testing of model filament wound cylinders. Interpretation of the results of some studies is complicated by the fact that the fabrication process did not duplicate full scale manufacturing. It is difficult to scale results from testing subscale cylinders since there are significant differences in out time of the resins relative to full scale cylinder fabrication, differences in hoop fiber tensioning and unsatisfactory coupon configurations. It appears that development of a new test method for subscale cylinders is merited. Damage tolerance may be improved by material optimization that uses fiber treatments and matrix modifications to control the fiber matrix interface bonding. It is difficult to develop process optimization in subscale cylinders without also modeling the longer out times resins experience in full scale testing. A major breakthrough in characterizing the effect of impact damage on residual strength, and understanding how to scale results of subscale evaluations, will be a sound micromechanical model that described progressive failure of the composite. Such models will utilize a three dimensional stress analysis due to the complex nature of low velocity impact stresses in thick composites. When these models are coupled with non-contact NDE methods that geometrically characterize the damage and acoustic methods that characterize the effective local elastic properties, accurate assessment of residual strength from impact damage may be possible. Directions for further development are suggested.

Paris, Henry G.↗
NASA NTRS1977

Low-pressure low-temperature molding process

Use of expanding rubber mandrel allows for bonding of graphite/epoxy laminated parts in oven instead of expensive autoclave. Heavy-duty two-piece aluminum mold limits deflection. Manipulation of resin contact by precise control of mandrel-generated pressure eliminates complex bleeder system.

Bowman, E. L.↗
NASA NTRS2001

Microstructure, Mechanical Properties, Hot-Die Forming, and Joining of 47XD Gamma TiAl Rolled Sheets

The microstructure and mechanical properties, along with the hot-die forming and joining of Ti-47Al-2Nb-2Mn-0.8 vol% TiB, sheets (known as 47XD), produced by a low-cost rolling process, were evaluated. A near-gamma microstructure was obtained in the as-rolled condition. The microstructures of heat-treated sheets ranged from a recrystallized equiaxed near-gamma microstructure at 1,200 to 1,310 C, to a duplex microstructure at 1,350 C, to a fully lamellar microstructure at 1,376 C. Tensile behavior was determined for unidirectionally rolled and cross-rolled sheets for room temperature (RT) to 816 C. Yield stress decreased gradually with increasing deformation temperature up to 704 C; above 704 C, it declined rapidly. Ultimate tensile strength exhibited a gradual decrease up to 537 C before peaking at 704 C, followed by a rapid decline at 816 C. The modulus showed a gradual decrease with temperature, reaching approximately 72% of the RT value at 816 C. Strain to failure increased slowly from RT to 537 C; between 537 C and 704 C it exhibited a phenomenal increase, suggesting that the ductile-brittle transition temperature was below 704 C. Fracture mode changed from transgranular fracture at low temperature, to a mixture of transgranular and intergranular fracture at intermediate temperature, to ductile fracture at 816 C, coupled with dynamic recrystallization at large strains. Creep rupture response was evaluated between 649 and 816 C over the stress range of 69 to 276 MPa. Deformation parameters for steady-state creep rate and time-to-rupture were similar: activation energies of approximately 350 kJ/mol and stress exponents of approximately 4.5. Hot-die forming of sheets into corrugations was done at elevated temperatures in vacuum. The process parameters to join sheets by diffusion bonding and brazing with TiCuNi 70 filler alloy were optimized for test coupons and successfully used to fabricate large truss-core and honeycomb structures. Nondestructive evaluation methods, e.g., ultrasonic C-scans and thermography along with metallography, were used to characterize bond quality. Microstructural evaluation during heat treatment, identification of phases at the braze/matrix interface, determination of shear strengths of brazed joints, and deformation mechanisms during tensile and creep processes will be discussed.

Das, G.↗
NASA NTRS1976

New advancements in titanium technology and their cost and weight benefits

A process that combines both the superplastic and diffusion bonding properties of metal into one concurrent operation is being developed. Estimates using this technology have indicated that this combined process will result in cost savings up to 70 percent when compared to conventional construction methods, while also saving weight. Many structural forms are possible including sandwich structures made by expanding face sheets and core against die forms. The classic difficulties normally associated with fabricating sandwich structures, such as parts fit-up, close tolerances, adhesive or braze alloy strength, do not exist with this technique. The total potential of Rockwell's patented new processes is limited only by the ingenuity of the designer and is expected to affect significantly future airplane concepts and criteria.

Ascani, L. A.↗
NASA NTRS1982

Evaluation of high temperature structural adhesives for extended service

The evaluation, selection, and demonstration of structural adhesive systems for supersonic cruise research applications, and establishment of environmental durability of selected systems for up to 20,000 hours is described. Ten candidate adhesives were initially evaluated. During screening and evaluation, these candidates were narrowed to three of the most promising for environmental durability testing. The three adhesives were LARC-13, PPQ, and NR056X. The LARC-13 was eliminated because of a lack of stability at 505 K. The NRO56X was removed from the market. The LARC-TPI was added after preliminary evaluation and an abbreviated screening test. Only PPQ and LARC-TPI remained as the reasonable candidates late into the durability testing. Large area bond panels were fabricated to demonstrate the processibility of the selected systems. Specifications were prepared to assure control over critical material and process parameters. Surface characterization concentrated primarily upon titanium surface treatments of 10 volt chronic acid anodize, 5 volt chromic acid anodize and PASA-JELL. Failure analysis was conducted on lap shear adhesive bond failures which occurred in PPQ and LARC-13 test specimens after 10,000 hours at 505 K.

Hill, S. G.↗
NASA NTRS2026

Beyond Melting: Amorphous Bonding for Joining and Consolidation

Crystallization may be the hidden constraint in thermoplastic composite manufacturing. It requires tightly controlled cooling, induces residual stresses through shrinkage, and introduces path-dependent behavior that complicates predictive modeling yet remains essential for structural performance. This work asks: can bonding be achieved without relying on melt-driven crystallization? To address this, thin (5–20 μm) polyetherimide (PEI) interlayers are pre-healed to slow-cooled polyaryletherketone (PAEK) in two contexts. The first, Thermabond®, is sub-melt joining of low melt-PAEK laminates. Results show that bond quality is governed primarily by processing (i.e., adequate healing and film handling) rather than modest changes in interlayer thickness. This concept is then extended to laminate-scale manufacturing through an architecture known as OATMEAL (Out-of-autoclave Amorphous/semicrystalline Thermoplastic Material for Energy-efficient Aerospace-grade Laminates). PEI is healed to carbon fiber reinforced polyetheretherketone (PEEK) at the prepreg and excess PEI is then ablated from the surface. Crystallinity is developed off-line during prepreg fabrication, while subsequent consolidation occurs below the melt temperature to preserve it. Cross-ply warpage experiments show that, contrary to intuition, repeated amorphous interfaces reduce global curvature by lowering the effective stress lock-in temperature and eliminating crystallization shrinkage from the lamina response. Correspondingly, laminate behavior is accurately predicted using classical laminate theory (CLT) with a single effective stress-free temperature, whereas conventional CF/PEEK requires accounting for crystallization-driven effects. By decoupling interfacial healing from crystallization, OATMEAL enables sub-melt consolidation, reduces energy consumption by up to 75%, and increases manufacturing throughput by fivefold. These results demonstrate that amorphous bonding is not only a joining strategy, but a pathway to more predictable and scalable thermoplastic composite manufacturing.

solidification↗
NASA NTRS1999

A Single-Lap Joint Adhesive Bonding Optimization Method Using Gradient and Genetic Algorithms

A natural process for any engineer, scientist, educator, etc. is to seek the most efficient method for accomplishing a given task. In the case of structural design, an area that has a significant impact on the structural efficiency is joint design. Unless the structure is machined from a solid block of material, the individual components which compose the overall structure must be joined together. The method for joining a structure varies depending on the applied loads, material, assembly and disassembly requirements, service life, environment, etc. Using both metallic and fiber reinforced plastic materials limits the user to two methods or a combination of these methods for joining the components into one structure. The first is mechanical fastening and the second is adhesive bonding. Mechanical fastening is by far the most popular joining technique; however, in terms of structural efficiency, adhesive bonding provides a superior joint since the load is distributed uniformly across the joint. The purpose of this paper is to develop a method for optimizing single-lap joint adhesive bonded structures using both gradient and genetic algorithms and comparing the solution process for each method. The goal of the single-lap joint optimization is to find the most efficient structure that meets the imposed requirements while still remaining as lightweight, economical, and reliable as possible. For the single-lap joint, an optimum joint is determined by minimizing the weight of the overall joint based on constraints from adhesive strengths as well as empirically derived rules. The analytical solution of the sin-le-lap joint is determined using the classical Goland-Reissner technique for case 2 type adhesive joints. Joint weight minimization is achieved using a commercially available routine, Design Optimization Tool (DOT), for the gradient solution while an author developed method is used for the genetic algorithm solution. Results illustrate the critical design variables as a function of adhesive properties and convergences of different joints based on the two optimization methods.

Smeltzer, Stanley S., III↗