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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 361 records · Page 20
All sourcesNASA NTRSDOE OSTI
NASA NTRS1999

EEE Links

The EEE Links Newsletter is a quarterly publication produced by Code 562 in support of the NASA HQ funded NASA Electronic Parts and Packaging (NEPP) Program. The newsletter is produced as an electronic format deliverable made available via the referenced www site administered by Code 562, The newsletter publishes brief articles on topics of interest to NASA programs and projects in the area of electronic parts and packaging. The newsletter does not provide information pertaining to patented or proprietary information. The information provided is at the level of that produced by industry and university researchers and is published at national and international conferences.

Humphrey, Robert↗
NASA NTRS2001

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗
NASA NTRS2020

Cold Survivable Current Sense Multi-Chip Module

This paper will present the design of a Current Sense Module (CSM) used to measure motor phase currents that is capable of surviving the harsh ambient environment of ocean worlds, such as Europa and Enceladus. The CSM module is fabricated by i3 Electronics using their Multi-Chip Module (MCM) technology with techniques developed by JPL to allow this module to survive temperatures down to -184°C. This module greatly improves the ability to measure phase and bridge current which can be problematic in extreme environments. In addition, by packaging these electronics at the die level, we achieve significant weight and size savings. This module is one of several modules that employ similar techniques that are integrated into a distributed or centralized motor controller. This paper will discuss the module’s design along with a summary of our test results.

Cheng, Ben↗
NASA NTRS2015

NASA EEE Parts 2014 Year in Review

The NASA Electronic Parts and Packaging Program continue to support Electrical, Electronic and Electromagnetic Parts for the agency with an eventful year of workshops, innovations, testing and challenges.

electronic↗
NASA NTRS1973

Application of diffusion bonding to electronic interconnection of flatpack leads

Diffusion-bonded joints between gold-plated Kovar leads and indium-plated copper circuit pads offer some advantages for electronic circuit packaging. Test results show that consistent high strength bonds stronger than the copper circuit foil are achieved by parallel-gap bonding at relatively low power settings. The bonds are basically formed by the alloying of the gold, indium and copper at the bond interface. Other low melting metals such as tin can also be used; however, tin does not offer the ease of bonding that results in consistent separation of the copper foil during pull testing. The investigation was conducted in three parts consisting of: (1) an evaluation of the physical strength of resulting bonds at ambient and elevated temperature, (2) a metallurgical analysis of bonds using scanning electron microscopy and nondispersive X-ray analysis, and (3) evaluation and development of various schemes for multiple lead flatpack bonding.

Korb, R. W.↗
NASA NTRS2006

Universal Controller for Spacecraft Mechanisms

An electronic control unit has been fabricated and tested that can be replicated as a universal interface between the electronic infrastructure of a spacecraft and a brushless-motor (or other electromechanical actuator) driven mechanism that performs a specific mechanical function within the overall spacecraft system. The unit includes interfaces to a variety of spacecraft sensors, power outputs, and has selectable actuator control parameters making the assembly a mechanism controller. Several control topologies are selectable and reconfigurable at any time. This allows the same actuator to perform different functions during the mission life of the spacecraft. The unit includes complementary metal oxide/semiconductor electronic components on a circuit board of a type called rigid flex (signifying flexible printed wiring along with a rigid substrate). The rigid flex board is folded to make the unit fit into a housing on the back of a motor. The assembly has redundant critical interfaces, allowing the controller to perform time-critical operations when no human interface with the hardware is possible. The controller is designed to function over a wide temperature range without the need for thermal control, including withstanding significant thermal cycling, making it usable in nearly all environments that spacecraft or landers will endure. A prototype has withstood 1,500 thermal cycles between 120 and +85 C without significant deterioration of its packaging or electronic function. Because there is no need for thermal control and the unit is addressed through a serial bus interface, the cabling and other system hardware are substantially reduced in quantity and complexity, with corresponding reductions in overall spacecraft mass and cost.

Levanas, Greg↗
NASA NTRS2017

Thermal cycling testing to failure of a ceramic column grid array package for space applications

Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.

Ramesham, Rajeshuni↗
NASA NTRS1993

The Pluto fast flyby mission: Completing the reconnaissance of the solar system

The concept of a fast flyby mission to Pluto has been advanced as a means to complete the reconnaissance of the known solar system. In order to acquire data on the Pluto system at the earliest possible time, and within the professional lifetime of investigators now active in the field, concepts are being developed for relatively small spacecraft in the mass range of 70 Kg to 350 Kg with flight times to Pluto of 7 to 13 years. Necessarily, the science complement on such a mission will be very mass and power limited. The challenge will be to define a spacecraft and an instrument package that will maximize the scientific return within these limitations. Cost, of course, will be a major consideration, and funds for new technology development specific to this mission will not be extensive. Consequently, innovative ways to incorporate elegant simplicity into the designs must be found. In order to facilitate exploration of the Pluto-Charon system, fully integrated science payloads must be developed. Two proposed mission designs involving limited mass and power science payloads have been presented to the Outer Planets Science Working Group (OPSWG). These payload mass allocations range from 5 to 30 kilograms with power allocations as low as 5 watts. The drivers behind these low mass and power allocations are that they enable developing missions to fit within the moderate mission cost profile and allow fast flight times to Pluto (7 to 13 years). The OPSWG has prioritized science goals for this class of reconnaissance mission. Three specific science objectives were identified as the highest priority required for the first Pluto mission. These goals were: (1) study of the neutral atmosphere, (2) geology and morphology, and (3) surface compositional mapping. In order to achieve these science goals within the constraints of low mass, power and cost, it may be necessary to combine the functions of 3 conventional instruments (CCD camera, Ultra-Violet Spectrometer, and Infrared Spectrometer) into one fully integrated payload. Where possible, this payload would share optics, mechanisms, electronics and packaging.

Henry, Paul K.↗
DOE OSTI2025

Atomate2: modular workflows for materials science

High-throughput density functional theory (DFT) calculations have become a vital element of computational materials science, enabling materials screening, property database generation, and training of “universal” machine learning models. While several software frameworks have emerged to support these computational efforts, new developments such as machine learned force fields have increased demands for more flexible and programmable workflow solutions. This manuscript introduces atomate2, a comprehensive evolution of our original atomate framework, designed to address existing limitations in computational materials research infrastructure. Key features include the support for multiple electronic structure packages and interoperability between them, along with generalizable workflows that can be written in an abstract form irrespective of the DFT package or machine learning force field used within them. Our hope is that atomate2's improved usability and extensibility can reduce technical barriers for high-throughput research workflows and facilitate the rapid adoption of emerging methods in computational material science.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2024

Additive Manufacturing with Cellulose-Based Composites: Materials, Modeling, and Applications

Recent advances in large-scale additive manufacturing (AM) with polymer-based composites have enabled efficient production of high-performance materials. Cellulose nanomaterials (CNMs) have emerged as bio-based feedstocks due to their exceptional strength and sustainability. However, challenges such as hornification and poor dispersion in polymer matrices still limit large-scale CNM–polymer composite manufacturing, requiring novel strategies. Here, this review outlines an approach starting with atomic-level simulations to link molecular composition to key parameters like bulk density, viscosity, and modulus. These simulations provide data for finite element analysis (FEA), which informs large-scale experiments and reduces the need for extensive trials. The strategy explores how atomic interactions impact the morphology, adhesion, and mechanical properties of CNM-based composites in AM processes. The review also discusses current developments in AM, along with predictions of mechanical and thermal properties for structural applications, packaging, flexible electronics, and hydrogel scaffolds. By integrating experimental findings with molecular dynamics (MD) simulations and finite element modeling (FEM), valuable insights for material design, process optimization, and performance enhancement in CNM-based AM are provided to address ongoing challenges.

36 MATERIALS SCIENCE↗
NASA NTRS1966

Thermal system design of the Nimbus spacecraft.

Thermal control of Nimbus spacecraft by utilizing semipassive and passive thermal control elements to maintain temperature of overall spacecraft, subsystems and components

ELECTRONIC PACKAGING↗