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At least 361 records · Page 20
All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

A Dual Linear/Circular Polarized Wideband Flat Panel Phased Array Antenna for K/Ka-band 6U CubeSat Communications Applications

Circular polarized (CP) electromagnetic waves are preferred for space-to-space and space-to-ground satellite communications (SATCOM). CubeSats with 6U sizes (1U represents a 10 cm x 10 cm x 10 cm), that will rotate together with the Moon as it orbits Earth require high gain CP antenna systems to maintain reliable communication links. Here, we have designed an 8x8 dual linear and dual circularly polarized phased array antenna (PAA) aperture that offers 22-28 GHz bandwidth, with maximum gain of 23 dBic, and beam scanning capability of ±50o with acceptable axial ratio over all scan angles. A stacked patch topology is selected to achieve wide impedance bandwidth. Each driven patch has two via feed point locations that are connected to grounded coplanar waveguide (CPW) feed structures. By utilizing phase shifters from the Anokiwave RFICs (AWMF-0165) employed for the beamforming network (BFN), we have generated both dual linear polarization and dual circular polarization in each patch. Each driven and parasitic patch is innovatively shaped to achieve excellent isolation between two feed points which, in turn, leads to low cross polarization, high efficiency and good axial ratio over the entire bandwidth. Each chip has eight outputs which feed one 2x2 sub-array consisting of four dual linear or dual circularly polarized driven patches, simultaneously. Each 2x2 sub-array of the 8x8 array are sequentially rotated which improves axial ratio performance when the antenna operates in the dual circularly polarized mode. By utilizing a mirror effect, cross-polarized fields are also improved when operated in a dual linear polarized mode. The 8x8 array aperture is simulated taking into account the effect of the multilayer printed circuit board (PCB) stack-up of the BFN and co-simulated with the power splitter outputs and chip outputs and results are compared with only passive array performance. The performance of the antenna is still excellent when non-ideal chip performances are included in the simulation analysis. The fabricated array will be tested for radiation patterns in the Antenna and Microwave Laboratory (AML) of the San Diego State University and the NASA Glenn Research Center (GRC) spherical near field chambers. The design of the 8x8 antenna array with BFN layout is shown in Fig. 1.

5G↗
NASA NTRS2022

Design of Rigid-Flex PCB Robotics Leveraging Validated Finite Element Simulations

The use of rigid-flex printed circuit board (PCB) as primary structure has the potential to reduce the weight and volume of robotic systems. In the case of robotics for interplanetary exploration, these systems can leverage origami-inspired folding for increased mobility options and reduced storage volume. Folding rigid-flex PCB robotics can be constructed with rigid PCB connected by short Nomex fabric hinges coupled with flex PCB ribbon cables that permits enhanced system flexibility and energy dissipation to promote impact survivability. This paper presents a design methodology of rigid-flex PCB systems with an emphasis on impact resistance. The design process considers solder joint adequacy, panel bending, and fracture using a finite element (FE) model. The proposed design methodology is developed using a case study with NASA JPL's Pop-Up Folding Flat Explorer Robot (PUFFER). First, the finite-element (FE) modeling methodology is presented with consideration to both frequency and time-domain modeling applications, which include operational self-contact analysis and high impact scenarios. The time-domain impact modeling methodology utilizes hyperelastic material properties for the Nomex hinges. This modeling method is validated using image correlation of PUFFER drop tests. A flowchart is presented to guide users through a validated Abaqus modeling procedure for highly flexible rigid-flex systems. Next, a case study is presented in which PUFFER is subject to drop heights representative of falls into Lunar pits and then the design is refined for a more optimum impact performance. Finally, the results of the case study are used to inform a generalized design methodology for rigid-flex PCB robotics subject to high-impact loads with the considerations presented.

John Bell↗
NASA NTRS2022

Design of Rigid-Flex PCB Robotics Leveraging Validated Finite Element Simulations

The use of rigid-flex printed circuit board (PCB) as primary structure has the potential to reduce the weight and volume of robotic systems. In the case of robotics for interplanetary exploration, these systems can leverage origamiinspired folding for increased mobility options and reduced storage volume. Folding rigid-flex PCB robotics can be constructed with rigid PCB connected by short Nomex fabric hinges coupled with flex PCB ribbon cables that permits enhanced system flexibility and energy dissipation to promote impact survivability. This paper presents a design methodology of rigidflex PCB systems with an emphasis on impact resistance. The design process considers solder joint adequacy, panel bending, and fracture using a finite element (FE) model. The proposed design methodology is developed using a case study with NASA JPL’s Pop-Up Folding Flat Explorer Robot (PUFFER). First, the finite-element (FE) modeling methodology is presented with consideration to both frequency and time-domain modeling applications, which include operational self-contact analysis and high impact scenarios. The time-domain impact modeling methodology utilizes hyperelastic material properties for the Nomex hinges. This modeling method is validated using image correlation of PUFFER drop tests. A flowchart is presented to guide users through a validated Abaqus modeling procedure for highly flexible rigid-flex systems. Next, a case study is presented in which PUFFER is subject to drop heights representative of falls into Lunar pits and then the design is refined for a more optimum impact performance. Finally, the results of the case study are used to inform a generalized design methodology for rigid-flex PCB robotics subject to high-impact loads with the considerations presented.

de la Croix, Jean-Pierre↗
NASA NTRSDate not supplied

Passive PCB Mounted Thermal Switch

A printed circuit board (PCB) generates heat during operation. In a vacuum this heat can only be rejected by conduction and radiation. In order to reject heat effectively the PCB needs to be thermally conductive to the electronics enclosure. However, when the enclosure temperature gets too low, too much heat is rejected from the PCB and it can fail. This thermal switch has been designed to allow for heat rejection when the PCB is sufficiently warm but then greatly reduce heat rejection when the temperature gets low enough.

Jarret Bone↗
NASA NTRS2023

Flex-Capsules for the Roman Space Telescope High Gain Antenna Gimbal

The Cable Wrap mechanism has been traditionally used for feeding power and telemetry through each gimbal actuator exiting at the gimbal output flange. Such a mechanism had often utilized round wire bundles or a multitude of single insulated conductors woven together flatwise to handle the angular rotation. Though flexible printed circuit board (PCB) is not a new technology, it was decided to implement it for the Roman Space Telescope (RST) High Gain Antenna Gimbal in an effort to improve reliability with consistency of manufacture and to save mass and minimize required volume. This paper provides a description of what we term Flex-Capsule (a similar vendor flight development is termed Twist Capsule), discusses the reasoning behind choosing a new engineering development over maintaining heritage, and includes commentary pertaining to life cycle analysis, electrical performance, and flexible PCB lubrication. Lessons learned from the design, analysis, and test campaign are also included. The conclusion is that benefits of pursuing the Flex-Capsule over heritage Cable Wrap have been realized.

twist capsule↗
NASA NTRSDate not supplied

Topics in Reliability

This talk will wind through the details of history of reliability in the agency, where things are today, and where we need to go tomorrow. It will provide many examples of reliability that are often discounted because they are not tied to some mantra from the past. Furthermore, it will separate us from the red herrings that are ever present based on the misuse of terms and practices in reliability. It will delve into several key subject matter areas that have long been considered the key reliability drivers, such as parts, printed circuit boards, radiation, and workmanship. Finally, it will highlight how the Center and Agency need to change our approach at learning lessons from past experiences to maintain a basis for reliability long into the future.

COTS↗
NASA NTRS2023

Flex-Capsule for the Roman Space Telescope High Gain Antenna Gimbal

The Cable Wrap mechanism has been traditionally used for feeding power and telemetry through each gimbal actuator exiting at the Gimbal output flange. Such a mechanism had often utilized round wire bundles, or a multitude of single insulated conductors woven together flatwise to handle the angular rotation. Though flexible printed circuit board (PCB) is not a new technology, it was decided to implement it for the Roman Space Telescope (RST) High Gain Antenna Gimbal in an effort to improve reliability with consistency of manufacture and to save mass and minimize required volume. This paper provides a description of what we term Flex-Capsule (a similar vendor flight development is termed Twist Capsule), discusses the reasoning behind choosing a new engineering development over maintaining heritage, and includes commentary pertaining to life cycle analysis, electrical performance, and flexible PCB lubrication. Lessons learned from the design, analysis, and test campaign are also included. The conclusion is that benefits of pursuing the Flex-Capsule over heritage Cable Wrap have been realized.

twist capsule↗
NASA NTRSDate not supplied

Passive PCB Mounted Thermal Switch

A printed circuit board (PCB) generates heat during operation. In a vacuum this heat can only be rejected by conduction and radiation. To reject heat effectively and avoid overheating, the PCB needs to be thermally conductive to the electronics enclosure. However, if the system rejects too much heat, or not enough heat, either can result in system failure. The thermal switch will be able to regulate the amount of heat the system rejects to stay within the operational temperature range.

Jarret Bone↗
NASA NTRSDate not supplied

Process Recipes for Additively Printed Copper Ink Flexible Circuits using Direct Write Methods

In this paper, the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods have been studied. The process has been implemented on the direct write platform. Interest in the use of additive printing methods for the manufacture of micro-circuits has grown immensely in recent times. Direct write methods have been shown to have the ability to create circuits in a limited manner. However, the process recipes and the effect of process parameters on the manufactured properties are not well understood. Copper ink is a good and cost-effective alternative to silver ink but its use has lagged owing to an increased propensity for oxidation. In this paper, photonic curing has been used to sinter copper ink to make the traces conductive. The method flashes high energy light that sinter metal particles instantaneously and the temperature of the substrate remains low. The effect of the different photonic sintering profiles on the mechanical and electrical properties of the printed traces has been studied in this paper.The print process parameters also play an important role in the line width and height that has been studied to print with the desired line profile for the end application. An LC filter circuit is been printed with SMD components been attached using an electrically conductive adhesive (ECA). The manufactured flexible LC filter is been tested for its frequency sweep to compare with the commercially available LC filer with the help of the Bode plot.

Process control↗
NASA NTRS1987

General technique for the integration of MIC/MMIC'S with waveguides

A technique for packaging and integrating of a microwave integrated circuit (MIC) or monolithic microwave integrated circuit (MMIC) with a waveguide uses a printed conductive circuit pattern on a dielectric substrate to transform impedance and mode of propagation between the MIC/MMIC and the waveguide. The virtually coplanar circuit pattern lies on an equipotential surface within the waveguide and therefore makes possible single or dual polarized mode structures.

Geller, Bernard D.↗
NASA NTRS2007

Arrays of Miniature Microphones for Aeroacoustic Testing

A phased-array system comprised of custom-made and commercially available microelectromechanical system (MEMS) silicon microphones and custom ancillary hardware has been developed for use in aeroacoustic testing in hard-walled and acoustically treated wind tunnels. Recent advances in the areas of multi-channel signal processing and beam forming have driven the construction of phased arrays containing ever-greater numbers of microphones. Traditional obstacles to this trend have been posed by (1) the high costs of conventional condenser microphones, associated cabling, and support electronics and (2) the difficulty of mounting conventional microphones in the precise locations required for high-density arrays. The present development overcomes these obstacles. One of the hallmarks of the new system is a series of fabricated platforms on which multiple microphones can be mounted. These mounting platforms, consisting of flexible polyimide circuit-board material (see left side of figure), include all the necessary microphone power and signal interconnects. A single bus line connects all microphones to a common power supply, while the signal lines terminate in one or more data buses on the sides of the circuit board. To minimize cross talk between array channels, ground lines are interposed as shields between all the data bus signal lines. The MEMS microphones are electrically connected to the boards via solder pads that are built into the printed wiring. These flexible circuit boards share many characteristics with their traditional rigid counterparts, but can be manufactured much thinner, as small as 0.1 millimeter, and much lighter with boards weighing as much as 75 percent less than traditional rigid ones. For a typical hard-walled wind-tunnel installation, the flexible printed-circuit board is bonded to the tunnel wall and covered with a face sheet that contains precise cutouts for the microphones. Once the face sheet is mounted, a smooth surface is established over the entire array due to the flush mounting of all microphones (see right side of figure). The face sheet is made from a continuous glass-woven-fabric base impregnated with an epoxy resin binder. This material offers a combination of high mechanical strength and low dielectric loss, making it suitable for withstanding the harsh test section environment present in many wind tunnels, while at the same time protecting the underlying polyimide board. Customized signal-conditioning hardware consisting of line drivers and antialiasing filters are coupled with the array. The line drivers are constructed using low-supply-current, high-gain-bandwidth operational amplifiers designed to transmit the microphone signals several dozen feet from the array to external acquisition hardware. The anti-alias filters consist of individual Chebyshev low-pass filters (one for each microphone channel) housed on small printed-circuit boards mounted on one or more motherboards. The mother/daughter board design results in a modular system, which is easy to debug and service and which enables the filter characteristics to be changed by swapping daughter boards with ones containing different filter parameters. The filter outputs are passed to commercially- available acquisition hardware to digitize and store the conditioned microphone signals. Wind-tunnel testing of the new MEMS microphone polyimide mounting system shows that the array performance is comparable to that of traditional arrays, but with significantly less cost of construction.

Shams, Qamar A.↗
NASA NTRS1981

Learning high-quality soldering

Soldering techniques for high-reliability electronic equipment are taught in 5 day course at NASA's Jet Propulsion Laboratory. Topic covered include new circuit assembly, printed-wiring board reworking, circuit changes, wire routing, and component installation.

Read, W. S.↗
NASA NTRS2017

Method for Fabricating and Packaging an M.Times.N Phased-Array Antenna

A method for fabricating an M.times.N, P-bit phased-array antenna on a flexible substrate is disclosed. The method comprising ink jet printing and hardening alignment marks, antenna elements, transmission lines, switches, an RF coupler, and multilayer interconnections onto the flexible substrate. The substrate of the M.times.N, P-bit phased-array antenna may comprise an integrated control circuit of printed electronic components such as, photovoltaic cells, batteries, resistors, capacitors, etc. Other embodiments are described and claimed.

Subbaraman, Harish↗
NASA NTRSDate not supplied

Analysis of a Dynamic Flexed Flat Cable Harness

A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the test was to demonstrate the capability of the harness to survive the number of expected flex cycles during the planned mission with appropriate margin. However, during testing, increased trace resistances and open circuits were observed beginning at approximately 10% of the total number of planned flex cycles. This paper discusses the various proximate causes that contributed to increased and open resistance in the flex cables and the subsequent redesign, manufacturing, reliability, and quality-related changes that were instituted. An analysis process, including failure analysis, non-destructive evaluation, digital imaging correlation, and parametric modeling, will also be discussed. The paper will cover the development of a robust dynamic flex harness design and include recommendations to extend flex harness life; make changes to the flex harness life test; and improve flex cable manufacturing, quality, and reliability.

Flexible PCB↗
NASA NTRSDate not supplied

Analysis of a Dynamic Flexed Flat Cable Harness

A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the test was to demonstrate the capability of the harness to survive the number of expected flex cycles during the planned mission with appropriate margin. However, during testing, increased trace resistances and open circuits were observed beginning at approximately 10% of the total number of planned flex cycles. This paper discusses the various proximate causes that contributed to increased and open resistance in the flex cables and the subsequent redesign, manufacturing, reliability, and quality-related changes that were instituted. An analysis process, including failure analysis, non-destructive evaluation, digital imaging correlation, and parametric modeling, will also be discussed. The paper will cover the development of a robust dynamic flex harness design and include recommendations to extend flex harness life; make changes to the flex harness life test; and improve flex cable manufacturing, quality, and reliability.

Flexible PCB↗