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At least 379 records · Page 21

All sources NASA NTRS DOE OSTI

NASA NTRSDate not supplied

Bond Line Thickness Estimation in Composite Structures Using Multiple Inspection Techniques

Imaging and other nondestructive evaluation techniques are commonly used for material characterization and defect recognition in safety critical aerospace applications, with data fusion providing the framework for uncertainty quantification in these contexts. Most commonly, forward physics-based modeling predicts the response conditioned on material properties and defect assumptions, and probabilistic methods are used to infer the hidden state of the subject of the inspection from a combination of prior information, likelihoods, and inspection data. In this paper Bayesian methods are used to estimate bond thickness in lap joints comprised of aluminum adherends using a combination of infrared thermography and ultrasound. The concept of the conflation of probability distributions is applied to combine the posterior distributions derived from thermography and ultrasound and the quality of the fused estimates are compared against the individual estimates against synthetic data that was created to mimic the inspection of a lap joint comprised of aluminum adherends.

thermal nondestructive evaluation↗

NASA NTRSDate not supplied

Bond Line Thickness Estimation in Composite Structures Using Multiple Inspection Techniques

Imaging and other nondestructive evaluation techniques are commonly used for material characterization and defect recognition in safety critical aerospace applications, with data fusion providing the framework for uncertainty quantification in these contexts. Most commonly, forward physics-based modeling predicts the response conditioned on material properties and defect assumptions, and probabilistic methods are used to infer the hidden state of subject of the inspection from a combination of prior information, likelihoods, and inspection data. In this paper Bayesian methods are used to estimate bond thickness in lap joints comprised of aluminum adherends using a combination of infrared thermography, digital radiography, and ultrasound. The accuracy of the fused estimates are validated against data generated from synthetic specimens, and by comparison against high resolution X-ray computed tomography inspections of built specimens.

thermal nondestructive evaluation↗

NASA NTRS2014

Buckling of a Longitudinally Jointed Curved Composite Panel Arc Segment for Next Generation of Composite Heavy Lift Launch Vehicles: Verification Testing Analysis

In this work, an all-bonded out-of-autoclave (OoA) curved longitudinal composite joint concept, intended for use in the next generation of composite heavy lift launch vehicles, was evaluated and verified through finite element (FE) analysis, fabrication, testing, and post-test inspection. The joint was used to connect two curved, segmented, honeycomb sandwich panels representative of a Space Launch System (SLS) fairing design. The overall size of the resultant panel was 1.37 m by 0.74 m (54 in by 29 in), of which the joint comprised a 10.2 cm (4 in) wide longitudinal strip at the center. NASTRAN and ABAQUS were used to perform linear and non-linear analyses of the buckling and strength performance of the jointed panel. Geometric non-uniformities (i.e., surface contour imperfections) were measured and incorporated into the FE model and analysis. In addition, a sensitivity study of the specimens end condition showed that bonding face-sheet doublers to the panel's end, coupled with some stress relief features at corner-edges, can significantly reduce the stress concentrations near the load application points. Ultimately, the jointed panel was subjected to a compressive load. Load application was interrupted at the onset of buckling (at 356 kN 80 kips). A post-test non-destructive evaluation (NDE) showed that, as designed, buckling occurred without introducing any damage into the panel or the joint. The jointed panel was further capable of tolerating an impact damage to the same buckling load with no evidence of damage propagation. The OoA cured all-composite joint shows promise as a low mass factory joint for segmented barrels.

mechanical/sub-structural testing↗

NASA NTRS1990

Epoxies Bond Waveguides To Flanges

Each waveguide/flange joint made with conductive adhesive and structural adhesive. New two-adhesive joints overcome many of disadvantages of dip-brazed joints, including damage caused by heat of brazing process, corrosion of joints by brazing salts retained in them, cracks in joints, weakening of waveguide material and limitation to use of aluminum alloys, which are only ones dip-brazed. Flange machined slightly oversize and beveled to accommodate structural and conductive adhesives.

Bloom, Jay D.↗

NASA NTRS1990

Space shuttle development Motor No. 9 (DM-9), volume 1

The results obtained during the December 23, 1987 static firing of the DM-9 test article are presented. The DM-9 full-scale static test article employed redesigned solid rocket motor (RSRM) field joint capture feature hardware with J-seal insulation configuration, and nozzle-to-case joint radial bolt design with bonded insulation configuration. The nozzle incorporated RSRM components, including a thicker cowl with involuted outer boot ring. The nozzle employed redundant and verifiable seals in all five joints, and room temperature vulcanization backfill in three joints. With very few exceptions, the DM-9 test article was flight configuration. The test was conducted under extreme weather conditions: temperature of 25 F and wind at 15 to 20 mph. Ballistics performance values were within specification requirements. The RSRM field joint (J-seal) insulation configuration functioned as predicted with no indication of hot gases reaching the capture feature O-rings. There was a blowhole in the polysulfide adhesive in the nozzle-to-case joint, but no evidence of hot gases past the wiper O-ring. Nozzle design changes appeared to perform nominally, with the exception of the outer boot ring, which suffered partial structural breakup late in the test. Field joint heaters maintained the controlling resistance temperature device temperature within the specified requirements during heater operation. The thrust vector control system operated properly. The redesigned water deluge system, temperature conditioning equipment, and other test support equipment performed as planned.

Garecht, Diane M.↗

NASA NTRS2010

Microstructural and Mechanical Evaluation of a Cu-Based Active Braze Alloy to Join Silicon Nitride Ceramics

Self-joining of St. Gobain Si3N4 (NT-154) using a ductile Cu-Al-Si-Ti active braze (Cu-ABA) was demonstrated. A reaction zone approx.2.5-3.5 microns thick) developed at the interface after 30 min brazing at 1317 K. The interface was enriched in Ti and Si. The room temperature compressive shear strengths of Si3N4/Si3N4 and Inconel/Inconel joints (the latter created to access baseline data for use with the proposed Si3N4/Inconel joints) were 140+/-49MPa and 207+/-12MPa, respectively. High-temperature shear tests were performed at 1023K and 1073 K, and the strength of the Si3N4/Si3N4 and Inconel/Inconel joints were determined. The joints were metallurgically well-bonded for temperatures above 2/3 of the braze solidus. Scanning and transmission electron microscopy studies revealed a fine grain microstructure in the reaction layer, and large grains in the inner part of the joint with interfaces being crack-free. The observed formation of Ti5Si3 and AlN at the joint interface during brazing is discussed.

Singh, M.↗

DOE OSTI2021

Adhesive Bonding of Copper Prepared by Laser-Interference near the Interference Structuring Limits

Adhesive bonding requires adequate surface preparation for ensuring an appropriate joint quality. The interest in adhesive joining has recently expanded to thermal systems having a large number of joints employed for manufacturing and assembly. This study presents surface topology of copper 110 produced by a laser-interference setup that would theoretically yield a periodicity of 1.7 μm, which is near the 1.6–2 μm structuring limit that was estimated based on thermal diffusion length scale for an 8 ns laser pulse. The results show that although the expected periodic interference structuring was not attained, the melt-induced texturing was affected by the laser-interference profile. Single-lap shear tests were performed with specimen surfaces prepared by traditional abrasion and laser-interference structuring methods. Several laser processing parameters, such as the laser spot size, density, number of pulses, and raster speed, were studied. Scanning electron microscope and profilometry measurements were used to characterize the processed surface microstructures. Web-like structures, which indicate widespread melting, were shown to be formed at different processing conditions. Based on the surface topologies investigated, two laser raster speeds were selected to make single-lap-joint specimens. Baseline joints were prepared by abrading joining specimens. The shear-lap strength and displacement at maximum load were shown to be higher by 16.8% and 43.8% for the laser-structured specimens than those of the baseline specimens, respectively. Moreover, the load-displacement curves indicated that the laser-structured joints were more ductile than those without laser-structuring. The increased ductility for the laser-structured joints was found to yield an increase in the energy absorbed during shear-lap testing of approximately of 80–90% over those measured for baseline joints. It is another indicator that laser-interference structuring enhanced the bonding performance of single-lap shear joints.

36 MATERIALS SCIENCE↗

NASA NTRS1972

Energy pulse bonding

To eliminate many of the present termination problems a technique called energy pulse bonding (EPB) was developed. The process demonstrated the capability of: (1) joining conductors without prior removal of insulations, (2) joining conductors without danger of brittle intermetallics, (3) increased joint temperature capability, (4) simultaneous formation of several bonds, (5) capability of higher joint density, and (6) a production oriented process. The following metals were successfully bonded in the solid state: copper, beryllium copper, phosphor bronze, aluminum, brass, and Kovar.

Smith, G. C.↗

NASA NTRS1974

Nondestructive evaluation of electroformed outer shells for regeneratively cooled thrust chambers

Electroforming is presently a prime technique for producing the outer jackets of regeneratively cooled thrust chambers for rocket engines. Good bond integrity of the electroformed joints adjacent to the coolant passages is important to the useful service life of these aerospace systems. This investigation demonstrated that nondestructive evaluation techniques such as ultrasonic 'C' scan, holography, and acoustic emission are capable of detecting low integrity bonds which could lead to premature failures in the subject hardware.

Malone, G. A.↗

NASA NTRS1980

Design, fabrication and test of graphite/polyimide composite joints and attachments for advanced aerospace vehicles

Bonded and bolted designs are presented for each of four major attachment types. Prepreg processing problems are discussed and quality control data are given for lots 2W4604, 2W4632 and 2W4643. Preliminary design allowables test results for tension tests and compression tests of laminates are included. The final small specimen test matrix is defined and the configuration of symmetric step-lap joint specimens are shown. Finite element modeling studies of a double lap joint were performed to evaluate the number of elements required through the adhesive thickness to assess effects of various joint parameters on stress distributions. Results of finite element analyses assessing the effect of an adhesive fillet on the stress distribution in a double lap joint are examined.

Skoumal, D. E.↗

NASA NTRS2016

Evaluation of a Conductive Elastomer Seal for Spacecraft

An electrically conductive elastomer was evaluated as a material candidate for a spacecraft seal. The elastomer used electrically conductive constituents as a means to reduce the resistance between mating interfaces of a sealed joint to meet spacecraft electrical bonding requirements. The compound's outgassing levels were compared against published NASA requirements. The compound was formed into a hollow O-ring seal and its compression set was measured. The O-ring seal was placed into an interface and the electrical resistance and leak rate were quantified. The amount of force required to fully compress the test article in the sealing interface and the force needed to separate the joint were also measured. The outgassing and resistance measurements were below the maximum allowable levels. The room temperature compression set and leak rates were fairly high when compared against other typical spacecraft seal materials, but were not excessive. The compression and adhesion forces were desirably low. Overall, the performance of the elastomer compound was sufficient to be considered for future spacecraft seal applications.

elastomer↗

NASA NTRS2016

Evaluation of a Conductive Elastomer Seal for Spacecraft

Daniels, Christopher C.↗

DOE OSTI2024

Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures

This paper studied the evolution of air voids at the substrate-adhesive interface during the curing and bonding process of an epoxy-based adhesive between two glass substrates due to the sequence of adhesive placement, external pressure, and plasma treatment on substrates for bonding. The experimental results showed that a higher quantity of interfacial voids were generated during adhesive curing when the substrate was attached to the adhesive compared to when the adhesive was applied and distributed on the substrate. Such interfacial voids can be efficiently removed or reduced by applying slight pressure on the bonded structure during adhesive curing, or by leveraging plasma-treated substrates, as less reported in the literature. This work provided practical suggestions for preparing adhesive joints with minimized interfacial air voids to enhance bonding performance, particularly for dissimilar joints such as metal-CFRTP (carbon-fiber-reinforced thermoplastic polymer), as well as combinations with different types of polymer composites.

Qiao, Yao [BATTELLE (PACIFIC NW LAB)] (ORCID:00000↗

NASA NTRS2021

Molecular Dynamics Investigation of the Structural and Mechanical Properties of Off-Stoichiometric Epoxy Resins

Molecular dynamic (MD) simulations were performed to compute the mechanical properties of off-stoichiometric epoxy resins as a function of hardener/epoxy mixture ratio (r). Properties were characterized in relation to their microscopic structures. Such resins have been used recently for adhesive-free bonding of large-scale composite structures using the co-curing-ply method. In this process, two partially precured composite panels with hardener-poor (HP) off-stoichiometric resins are coupled with ply(ies) of complementary hardener-rich (HR) formulations and then cured simultaneously. This bonding process has the potential to produce reliable and certifiable composite joints without the need for additional fasteners, which are often required for many conventional bonding methods because even small amounts of contamination can cause a weak bond. The reflow and mixing of the HP/HR resin in this bonding process result in a joint with no discernable interface that should not be susceptible to surface contamination. However, incomplete mixing of the two offset resins may result in chemical heterogeneity of the cured polymeric joint. Thus, different r values may be obtained across the joint. Classical MD simulations were performed to compute the Young’s modulus of polymers with different r values and correlate their properties to network structures. High stiffness was associated with molecular packing due to chemical crosslinking, leading to a single network structure. Moreover, the networks became denser as the ratio approached the stoichiometric value r = 1. Thus, the r = 1 systems were single clusters, with high stiffness, high molecular weight, and a high degree of crosslinking. Structural properties such as radius of gyration and mean square displacement were determined to investigate the variation in the stiffness with respect to r. This MD simulation study was validated with experimental measurements.

Chang Woon Jang↗

NASA NTRS2019

Reliable Bonding of Composite Laminates Using Reflowable Epoxy Resins

Epoxy matrix composites assembled with adhesives maximize the performance of aerospace structures, but the possibility of forming weak bonds requires the installation of redundant fasteners, which add weight and manufacturing cost. Co-cured joints (e.g. unitized composite structures) are immune to weak bonds because the uncured resin undergoes diffusion and mixing through the joint. A means of co-curing complex structures may reduce the need for redundant fasteners in bondlines. To this end, NASA started the AERoBOND project to develop novel joining materials to enable a “secondary-co-cure” assembly process. Aerospace epoxy resin systems reformulated with offset stoichiometry prevented the resin from advancing beyond the gel point during a conventional autoclave cure cycle up to 180 °C. The offset resins were applied to the joining surfaces of laminate preforms as prepreg. Two surfaces with complimentary offset resins were joined using conventional secondary bonding techniques. Preliminary efforts have indicated that the resulting joint has no discernable interface and appears as a conventional co-cured laminate under optical magnification. This report will discuss the initial work performed regarding formulation of the epoxy resin system using calorimetry, rheology, and mechanical testing.

Palmieri, Frank L.↗

DOE OSTI2025

Functional group activation and coupling agent migration induced by plasma treatment in adhesive for enhanced toughness of metal-composite joints

Commercial adhesive paste was additionally activated using low-power oxygen plasma with different plasma exposure durations to investigate its interfacial bonding contribution in adhesively-bonded Aural-5/CFRP-PA6 double cantilever beam (DCB) joints with plasma-treated adherends. The plasma-treated adhesive showed enhanced functional peak intensities in Fourier transfer infrared spectroscopy (FTIR) as plasma exposure time was increased, and some degree of oxidation was also detected via X-ray photoelectron spectroscopy (XPS). A small molecule, dicyandiamde (coupling agent) in adhesive was migrated to adhesive layer, where double concentration of coupling agent was detected after 10 minutes of plasma treatment. As a result, characterization of the adhesive/CFRP-PA6 interface after DCB fracture showed additional chemical bonds formed through amine-initiated epoxy ring opening polymerization, as well as amide bonds and ester bonds. In conclusion, these additional bonds at the adhesive/CFRP-PA6 interfaces led to significantly increased failure extensions and fracture energies of the joints as the plasma exposure time on the adhesive increased, compared to the joints with plasma-treated adherends but non-plasma-treated adhesive as commonly seen in the literature.

36 MATERIALS SCIENCE↗

NASA NTRS1972

Development of the weldbond process for joining titanium

High quality resistance spot welds were produced by welding through epoxy adhesive on titanium alloys. Weldbond joints were consistently stronger than those of either mechanical fasteners, structural adhesive bonds, or mechanical fasteners with adhesive at the joint interface. Weldbond joints and/or spot weld joints showed superior strength at all temperature ranges as compared to other joints tested.

Fields, D.↗

NASA NTRS2001

Affordable, Robust Ceramic Joining Technology (ARCJoint) Developed

Affordable, Robust Ceramic Joining Technology (ARCJoint) is a method for joining high temperature- resistant ceramic pieces together, establishing joints that are strong, and allowing joining to be done in the field. This new way of joining allows complex shapes to be formed by joining together geometrically simple shapes. The joining technology at NASA is one of the enabling technologies for the application of silicon-carbide-based ceramic and composite components in demanding and high-temperature applications. The technology is being developed and tested for high-temperature propulsion parts for aerospace use. Commercially, it can be used for joining ceramic pieces used for high temperature applications in the power-generating and chemical industries, as well as in the microelectronics industry. This innovation could yield big payoffs for not only the power-generating industry but also the Silicon Valley chipmakers. This technology, which was developed at the NASA Glenn Research Center by Dr. Mrityunjay Singh, is a two-step process involving first using a paste to join together ceramic pieces and bonding them by heating the joint to 110 to 120 C for between 10 and 20 min. This makes the joint strong enough to be handled for the final joining. Then, a silicon-based substance is applied to the joint and heated to 1400 C for 10 to 15 min. The resulting joint is as strong as the original ceramic material and can withstand the same high temperatures.

Steele, Gynelle C.↗