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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 379 records · Page 21

Computer circuit will fit on single silicon chip

A simplified computer logic circuit of two NAND/NOR gates and three additional inputs to accomplish the count and shift function is described. The circuit has capacity for parallel read-in, counting, serial shiftout, complement input and set and reset.

Smith, C.↗

Magnetic and Moessbauer studies of Apollo 16 rock chips 60315,51 and 62295,27

Analysis of the Moessbauer spectra of two Apollo 16 rocks showed that 60315,51 is much richer in iron metal and troilite, but poorer in olivine, than 62295,27. The values of magnetic parameters, derived from hysteresis loops at 175 and 300 K, indicate the high metal contents and the predominance of coarse multidomain grains in both rocks. These coexist with a superparamagnetic grain fraction in 60315 and with a small single-domain grain fraction in 62295. The high Fe(0)/Fe(2+) ratios, the nonlinear acquisition of laboratory thermoremanence, and the drastic changes in magnetic parameters upon heating support the proposed formation of both rocks from the lunar regolith, with incorporation of shocked meteoritic metal grains during high-temperature impact events and simultaneous acquisition of magnetic remanence. Values estimated for ancient lunar magnetic fields by comparing the natural remanence with laboratory thermoremanence acquired in fields of 0.05 and 0.5 Oe, range from 0.01 to more than 1 Oe.

Brecher, A.↗

Investigation of discrete component chip mounting technology for hybrid microelectronic circuits

The use of polymer adhesives for high reliability microcircuit applications is a radical deviation from past practices in electronic packaging. Bonding studies were performed using two gold-filled conductive adhesives, 10/90 tin/lead solder and Indalloy no. 7 solder. Various types of discrete components were mounted on ceramic substrates using both thick-film and thin-film metallization. Electrical and mechanical testing were performed on the samples before and after environmental exposure to MIL-STD-883 screening tests.

Caruso, S. V.↗

Ultrasonic scanning of multilayer ceramic chip capacitors

Ultrasonic scanning is compared to neutron radiography and scanning laser acoustic microscopy (SLAM). Data show that SLAM and ultrasonic scanning evaluations are in good agreement. There is poor agreement between N-ray and both ultrasonic techniques because N-ray is insensitive to all but the grossest delaminations. Statistical analysis show a good correlation between ultrasonic scanning and destructive physical analysis.

Bradley, F. N.↗

Low-Contamination Vibrating Feeder for Silicon Chips

Vibratory feeding is method of controlling flow of small oddly shaped particles. Technique applied to other materials that require contamination control by feeding material through vibrating troughs topped by particular material.

Mackintosh, B. H.↗

Single-Chip VLSI Reed-Solomon Encoder

Reed-Solomon (RS) encoder based on Berlekamp bit-serial multiplier algorithm. RS code standard, based on code words of 255 8-bit symbols, of which 223 symbols convey information and remaining 32 are check symbols. This code enables correction of up to 16 erroneous information symbols per word. Berlekamp algorithm based on code-generating polynomial with 32 roots that occur in reciprocal pairs. Choice of algorithm permits compact design.

Truong, T. K.↗

Detection of Machining Chips by Pressure Reversal

Inaccessible interior spaces inspected acoustically. In acoustic inspection, inlet and outlet ports of component connected to pneumatic hoses of apparatus that rapidly reverses induced pressure differential. If loose particles inside this component, they will generate noise detected by series of contact microphones attached to component. Noise indicates general location of contaminants, and its characteristic helps in identifying particles from their acoustic signatures.

Wyett, L. M.↗

A VLSI single chip 8-bit finite field multiplier

A Very Large Scale Integration (VLSI) architecture and layout for an 8-bit finite field multiplier is described. The algorithm used in this design was developed by Massey and Omura. A normal basis representation of finite field elements is used to reduce the multiplication complexity. It is shown that a drastic improvement was achieved in this design. This multiplier will be used intensively in the implementation of an 8-bit Reed-Solomon decoder and in many other related projects.

Deutsch, L. J.↗

Single-Chip VLSI Reed-Solomon Decoder

Efficient utilization of computing elements reduces size while preserving throughput. VLSI architecture is pipeline Reed-Solomon decoder for correction of errors and erasures. Uses transform circuit to compute syndrome polynomial. Erasure information enters decoder as binary sequence. Applied to variety of digital communications involving error-correcting RS codes.

Shao, Howard M.↗

Narrow bandgap semiconducting silicides: Intrinsic infrared detectors on a silicon chip

Polycrystalline thin films of CrSi2, LaSi2, and ReSi2 were grown on silicon substrates. Normal incidence optical transmittance and reflectance measurements were made as a function of wavelength. It was demonstrated that LaSi2 is a metallic conductor, but that CrSi2 and ReSi2 are, in fact, narrow bandgap semiconductors. For CrSi2, the complex index of refraction was determined by computer analysis of the optical data. From the imaginary part, the optical absorption coefficient was determined as a function of photon energy. It was shown that CrSi2 possesses an indirect forbidden energy gap of slightly less than 0.31 eV, and yet it is a very strong absorber of light above the absorption edge. On the other hand, the ReSi2 films exhibit an absorption edge in the vicinity of 0.2 eV. Measurements of the thermal activation energy of resistivity for ReSi2 indicate a bandgap of 0.18 eV. It is concluded that the semiconducting silicides merit further investigation for development as new silicon-compatible infrared detector materials.

Mahan, John E.↗

Lateral charge transport from heavy-ion tracks in integrated circuit chips

A 256K DRAM has been used to study the lateral transport of charge (electron-hole pairs) induced by direct ionization from heavy-ion tracks in an IC. The qualitative charge transport has been simulated using a two-dimensional numerical code in cylindrical coordinates. The experimental bit-map data clearly show the manifestation of lateral charge transport in the creation of adjacent multiple-bit errors from a single heavy-ion track. The heavy-ion data further demonstrate the occurrence of multiple-bit errors from single ion tracks with sufficient stopping power. The qualitative numerical simulation results suggest that electric-field-funnel-aided (drift) collection accounts for single error generated by an ion passing through a charge-collecting junction, while multiple errors from a single ion track are due to lateral diffusion of ion-generated charge.

Zoutendyk, J. A.↗

VLSI single-chip (255,223) Reed-Solomon encoder with interleaver

The invention relates to a concatenated Reed-Solomon/convolutional encoding system consisting of a Reed-Solomon outer code and a convolutional inner code for downlink telemetry in space missions, and more particularly to a Reed-Solomon encoder with programmable interleaving of the information symbols and code correction symbols to combat error bursts in the Viterbi decoder.

Hsu, In-Shek↗

Proof of principal for staircase auger chip removal theory

A proof of principal design of the staircase auger theory is provided for lunar drilling. The drill is designed to drill holes 30 meters deep and 0.1 meters in diameter. The action of the auger is 0.01 meter strokes at a varying number of strokes per second. A detailed analysis of the interaction of the auger and particle was done to optimize the parameters of the auger. This optimum design will allow for proper heat removal and reasonable drilling time. The drill bit is designed to scoop the particles into the auger while efficiently cutting through the moon's surface.

Barron, Jeffrey B.↗