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At least 379 records · Page 21

System for the installation and replacement of components in hostile environments

Service equipment for use in hostile environments is presented. The equipment includes a detachable service unit secured to a stationary service unit. The detachable service unit includes a housing with an exterior plate, a power control interface for connection to an exterior power source, locating pins located in said exterior plate, an electrical connector in the exterior plate electrically coupled to said power control interface, and a pair of clamping receptacles formed in the exterior plate and located on adjacent opposite edges of the exterior plate. The stationary unit includes an electrical connector for connection to the electrical connector of the detachable service unit, a clamping apparatus for clamping and unclamping the detachable service unit from the stationary unit, a base clamp assembly for mounting the clamping apparatus onto the stationary unit, and locating pin holes for receiving the locating pins and aligning the detachable service unit onto the stationary unit. The detachable service unit have mating scalloped faces which aid in alignment and provide a mechanism for heat dissipation.

Gordan, Andrew L.↗

Service equipment for use in hostile environments

Service equipment for use in hostile environments includes a detachable service unit secured to a stationary service unit. The detachable service unit includes a housing with an exterior plate, a power control interface for connection to an exterior power source, locating pins located in said exterior plate, an electrical connector in the exterior plate electrically coupled to said power control interface, and a pair of clamping receptacles formed in the exterior plate and located on adjacent opposite edges of the exterior plate. The stationary unit includes an electrical connector for connection to the electrical connector of the detachable service unit, a clamping apparatus for clamping and unclamping the detachable service unit from the stationary unit, a base clamp assembly for mounting the clamping apparatus onto the stationary unit, and locating pin holes for receiving the locating pins and aligning the detachable service unit onto the stationary unit. The detachable service unit and stationary unit have mating scalloped faces which aid in alignment and provide a mechanism for heat dissipation.

Dolce, James L.↗

Preload-Release Mechanism For Mounting Electronics Boxes

Proposed mechanism applies spring preload to electrical connector only while needed during insertion of electronics box into supporting frame. Once connector fully mated, mechanism relieves preload. As result, supporting structure sized to handle only individual load applied briefly by each connector on box during insertion.

Generoli, Robert M.↗

Method and Apparatus for Obtaining a Precision Thickness in Semiconductor and Other Wafers

A method and apparatus for processing a wafer comprising a material selected from an electrical semiconducting material and an electrical insulating material is presented. The wafer has opposed generally planar front and rear sides and a peripheral edge, wherein said wafer is pressed against a pad in the presence of a slurry to reduce its thickness. The thickness of the wafer is controlled by first forming a recess such as a dimple on the rear side of the wafer. A first electrical conducting strip extends from a first electrical connection means to the base surface of the recess to the second electrical connector. The first electrical conducting strip overlies the base surface of the recess. There is also a second electrical conductor with an electrical potential source between the first electrical connector and the second electrical connector to form. In combination with the first electrical conducting strip, the second electrical conductor forms a closed electrical circuit, and an electrical current flows through the closed electrical circuit. From the front side of the wafer the initial thickness of the wafer is reduced by lapping until the base surface of the recess is reached. The conductive strip is at least partially removed from the base surface to automatically stop the lapping procedure and thereby achieve the desired thickness.

Okojie, Robert S.↗

"Fly-by-Wireless": A Revolution in Aerospace Vehicle Architecture for Instrumentation and Control

Aerospace vehicle programs have always counted on the cables and connectors to provide power, grounding, data and time synchronization throughout a vehicle's life-cycle. Even with numerous improvements, wiring and connector problems and sensors continue to be key failure points, causing many hours of troubleshooting and replacement. Costly flight delays have been precipitated by the need to troubleshoot cables/connections, and/or repair a sensor. Wiring continues to be too expensive to remove once it is installed, even with the weight penalties. Miles of test instrumentation and low flight sensor wires still plague the aerospace industry. New technology options for data connectivity, processing and micro/nano manufacturing are making it possible to retrofit existing vehicles, like the Space Shuttle. New vehicles can now develop architectures that provide for and take advantage of alternatives to wired connectivity. This project motivates the aerospace industry and technology providers to establish: (1) A new emphasis for system engineering approaches to reduce cables and connectors. (2) Provisions for modularity and accessibility in the vehicle architecture. (3) A set of technologies that support alternatives to wired connectivity.

Studor, George↗

Three-dimensional modular electronic interconnection system

A three-dimensional connection system uses a plurality of printed wiring boards with connectors completely around the printed wiring boards, and connected by an elastomeric interface connector. The device includes internal space to allow room for circuitry. The device is formed by stacking an electronics module, an elastomeric interface board on the electronics module such that the interface board's exterior makes electrical connection with the connectors around the perimeter of the interface board, but the internal portion is open to allow room for the electrical devices on the printed wiring board. A plurality of these devices are stacked between a top stiffener and a bottom device, and held into place by alignment elements.

Bolotin, Gary S.↗

High-Speed Isolation Board for Flight Hardware Testing

There is a need to provide a portable and cost-effective galvanic isolation between ground support equipment and flight hardware such that any unforeseen voltage differential between ground and power supplies is eliminated. An interface board was designed for use between the ground support equipment and the flight hardware that electrically isolates all input and output signals and faithfully reproduces them on each side of the interface. It utilizes highly integrated multi-channel isolating devices to minimize size and reduce assembly time. This single-board solution provides appropriate connector hardware and breakout of required flight signals to individual connectors as needed for various ground support equipment. The board utilizes multi-channel integrated circuits that contain transformer coupling, thereby allowing input and output signals to be isolated from one another while still providing high-fidelity reproduction of the signal up to 90 MHz. The board also takes in a single-voltage power supply input from the ground support equipment and in turn provides a transformer-derived isolated voltage supply to power the portion of the circuitry that is electrically connected to the flight hardware. Prior designs used expensive opto-isolated couplers that were required for each signal to isolate and were time-consuming to assemble. In addition, these earlier designs were bulky and required a 2U rack-mount enclosure. The new design is smaller than a piece of 8.5 ~11-in. (.22 ~28-mm) paper and can be easily hand-carried where needed. The flight hardware in question is based on a lineage of existing software-defined radios (SDRs) that utilize a common interface connector with many similar input-output signals present. There are currently four to five variations of this SDR, and more upcoming versions are planned based on the more recent design.

Yamamoto, Clifford K.↗

Ultra-Compact Motor Controller

This invention is an electronically commutated brushless motor controller that incorporates Hall-array sensing in a small, 42-gram package that provides 4096 absolute counts per motor revolution position sensing. The unit is the size of a miniature hockey puck, and is a 44-pin male connector that provides many I/O channels, including CANbus, RS-232 communications, general-purpose analog and digital I/O (GPIO), analog and digital Hall inputs, DC power input (18-90 VDC, 0-l0 A), three-phase motor outputs, and a strain gauge amplifier. This controller replaces air cooling with conduction cooling via a high-thermal-conductivity epoxy casting. A secondary advantage of the relatively good heat conductivity that comes with ultra-small size is that temperature differences within the controller become smaller, so that it is easier to measure the hottest temperature in the controller with fewer temperature sensors, or even one temperature sensor. Another size-sensitive design feature is in the approach to electrical noise immunity. At a very small size, where conduction paths are much shorter than in conventional designs, the ground becomes essentially isopotential, and so certain (space-consuming) electrical noise control components become unnecessary, which helps make small size possible. One winding-current sensor, applied to all of the windings in fast sequence, is smaller and wastes less power than the two or more sensors conventionally used to sense and control winding currents. An unexpected benefit of using only one current sensor is that it actually improves the precision of current control by using the "same" sensors to read each of the three phases. Folding the encoder directly into the controller electronics eliminates a great deal of redundant electronics, packaging, connectors, and hook-up wiring. The reduction of wires and connectors subtracts substantial bulk and eliminates their role in behaving as EMI (electro-magnetic interference) antennas. A shared knowledge by each motor controller of the state of all the motors in the system at 500 Hz also allows parallel processing of higher-level kinematic matrix calculations.

Townsend, William T.↗

Hyperspectral Microwave Atmospheric Sounder (HyMAS) Architecture and Design Accommodations

The Hyperspectral Microwave Atmospheric Sounder (HyMAS) is being developed at Lincoln Laboratories and accommodated by the Goddard Space Flight Center for a flight opportunity on a NASA research aircraft. The term "hyperspectral microwave" is used to indicate an all-weather sounding that performs equivalent to hyperspectral infrared sounders in clear air with vertical resolution of approximately 1 km. Deploying the HyMAS equipped scanhead with the existing Conical Scanning Microwave Imaging Radiometer (CoSMIR) shortens the path to a flight demonstration. Hyperspectral microwave is achieved through the use of independent RF antennas that sample the volume of the Earth s atmosphere through various levels of frequencies, thereby producing a set of dense, spaced vertical weighting functions. The simulations proposed for HyMAS 118/183-GHz system should yield surface precipitation rate and water path retrievals for small hail, soft hail, or snow pellets, snow, rainwater, etc. with accuracies comparable to those of the Advanced Technology Microwave Sounder. Further improvements in retrieval methodology (for example, polarization exploitation) are expected. The CoSMIR instrument is a packaging concept re-used on HyMAS to ease the integration features of the scanhead. The HyMAS scanhead will include an ultra-compact Intermediate Frequency Processor (IFP) module that is mounted inside the door to improve thermal management. The IFP is fabricated with materials made of Low-Temperature Co-fired Ceramic (LTCC) technology integrated with detectors, amplifiers, A/D conversion and data aggregation. The IFP will put out 52 channels of 16 bit data comprised of 4-9 channel data streams for temperature profiles and 2-8 channel streams for water vapor. With the limited volume of the existing CoSMIR scanhead and new HyMAS front end components, the HyMAS team at Goddard began preliminary layout work inside the new drum. Importing and re-using models of the shell, the scan head computer, and the slip rings developed for CoSMIR was the starting point. The next step was to modify the antenna faceplate to accommodate the dimensions of the three dual polarization Gaussian Optics Antenna (GOA) assemblies. Two mechanical concepts for the core technology, the hyperspectral IFP, were captured in a design tradeoff. Connector models considered minimum bend radii for the IFP analog connectors. Hyperspectral imaging is accomplished by strategically using a short wavelength intermediate frequency of 18-29 GHz, and thus reducing the size of components in the connection of the front end to the IFP. The SMK (2.92mm) Series connector will lay near the hinge line to minimize its flexing. The digital output of the IFP will use a Serial Peripheral Interface (SPI) that must be accommodated by the scan head computer. To make that computer more reliable, maintainable, and forward compatible with the 52 HyMAS channels, a testbed of the scan head, calibration, and archive computers and the PIC24 microprocessor that resides on the IFP is in development. The computers will be programmed using a new framework application called Interoperable Remote Component (IRC). This software allows flexibility to program computers that communicate with each other and can adapt easily to the emerging HyMAS requirements for data format, algorithms, and graphical user interface (GUI). It is expected that the CoSMIR instrument will cut over to the IRC after it is adapted on an updated CoSMIR testbed.

Hilliard, Lawrence↗

An Automated Safe-to-Mate (ASTM) Tester

Safe-to-mate testing is a common hardware safety practice where impedance measurements are made on unpowered hardware to verify isolation, continuity, or impedance between pins of an interface connector. A computer-based instrumentation solution has been developed to resolve issues. The ASTM is connected to the circuit under test, and can then quickly, safely, and reliably safe-to-mate the entire connector, or even multiple connectors, at the same time.

Nguyen, Phuc↗

Flight Hardware Packaging Design for Stringent EMC Radiated Emission Requirements

This packaging design approach can help heritage hardware meet a flight project's stringent EMC radiated emissions requirement. The approach requires only minor modifications to a hardware's chassis and mainly concentrates on its connector interfaces. The solution is to raise the surface area where the connector is mounted by a few millimeters using a pedestal, and then wrapping with conductive tape from the cable backshell down to the surface-mounted connector. This design approach has been applied to JPL flight project subsystems. The EMC radiated emissions requirements for flight projects can vary from benign to mission critical. If the project's EMC requirements are stringent, the best approach to meet EMC requirements would be to design an EMC control program for the project early on and implement EMC design techniques starting with the circuit board layout. This is the ideal scenario for hardware that is built from scratch. Implementation of EMC radiated emissions mitigation techniques can mature as the design progresses, with minimal impact to the design cycle. The real challenge exists for hardware that is planned to be flown following a built-to-print approach, in which heritage hardware from a past project with a different set of requirements is expected to perform satisfactorily for a new project. With acceptance of heritage, the design would already be established (circuit board layout and components have already been pre-determined), and hence any radiated emissions mitigation techniques would only be applicable at the packaging level. The key is to take a heritage design with its known radiated emissions spectrum and repackage, or modify its chassis design so that it would have a better chance of meeting the new project s radiated emissions requirements.

Lortz, Charlene L.↗

Adhesively-Bonded Structural Composite Joint Utilizing Shoulder-Centered Sleeves

A composite joint includes a first member having a groove therein, a second member adjacent to the first member, and a connector member disposed between the second member and the first member. The connector member is received in the groove so as to bias a load path between the first member and the second member from a peripheral portion to a central portion of the connector member.

Lukowski, Florian P., Jr.↗

Reconfigurable Wideband Circularly Polarized Stacked Square Patch Antenna for Cognitive Radios

An almost square patch, a square patch and a stacked square patch with corner truncation for circular polarization (CP) are researched and developed at X-band for cognitive radios. Experimental results indicate, first, that the impedance bandwidth of a CP almost square patch fed from the edge by a 50 ohm line is 1.70% and second, that of a CP square patch fed from the ground plane side by a surface launch connector is 1.87%. Third, the impedance bandwidth of a CP stacked square patch fed by a surface launch connector is 2.22%. The measured center frequency for the CP square patch fed by a surface launch connector without and with an identical stacked patch is 8.45 and 8.1017 GHz, respectively. By stacking a patch, separated by a fixed air gap of 0.254 mm, the center frequency is observed to shift by as much as 348.3 MHz. The shift in center frequency, brought about by the reconfiguring of the physical layer antenna, can be exploited in a cognitive system since it expands the usable frequency spectrum for software reconfiguration in the presence of interference. In addition, varying the fixed air gap in the stacked antenna geometry by increments of 0.254 mm further expands the usable frequency spectrum.

Cognitive↗

Reconfigurable Wideband Circularly Polarized Stacked Square Patch Antenna for Cognitive Radios

An almost square patch, a square patch and a stacked square patch with corner truncation for circular polarization (CP) are researched and developed at X-band for cognitive radios. Experimental results indicate, first, that the impedance bandwidth of a CP almost square patch fed from the edge by a 50 ohm line is 1.70 percent and second, that of a CP square patch fed from the ground plane side by a surface launch connector is 1.87 percent. Third, the impedance bandwidth of a CP stacked square patch fed by a surface launch connector is 2.22 percent. The measured center frequency for the CP square patch fed by a surface launch connector without and with an identical stacked patch is 8.45 and 8.1017 GHz, respectively. By stacking a patch, separated by a fixed air gap of 0.254 mm, the center frequency is observed to shift by as much as 348.3 MHz. The shift in the center frequency can be exploited to reconfigure the operating frequency by mechanically increasing the air gap. The results indicate that a tuning bandwidth of about 100 MHz can be achieved when the distance of separation between the driven patch and the stacked patch is increased from its initial setting of 0.254 to 1.016 mm.

Cognitive↗

Lunar Glovebox Balance with Wireless Technology

The most important equipment required for processing lunar samples is a high-quality mass balance for maintaining accurate weight inventory, security, and scientific study. After careful review, a Curation Office memo by Michael Duke in 1978 chose the Mettler PL200 to be used for sample weight measurements inside the gloveboxes (Fig. 3). These commercial off-the-shelf (COTS) balances did not meet the strict accepted material requirements in the Lunar lab. As a result, each balance housing, weighing pan, and wiring was custom retrofitted to meet Lunar Operating Procedure (LOP) 54 requirements [for material construction restrictions]. The original design drawings for the custom housings, readout support stands, and wiring were done by the JSC engineering directorate. The 1977- 1978 schematics, drawings, and files are now housed in the curation Data Center. Per the design specifications, the housing was fabricated from aluminum grade 6061 T6, seamless welds, and anodized per MIL-A-8625 type I, class I. The balance feet were TFE Teflon and any required joints were sealed with Viton A gaskets. The readout display and support stands outside the glovebox were fabricated from 300 series stainless steel with #4 finish and mounted to the glovebox with welded bolts. Wire harnesses that linked the balance with the outside display and power were encapsulated with TFE Teflon and transported through custom Deutsch wire bulk head pass-through systems from inside to outside the glovebox. These Deutsch connectors were custom fabricated with 316L stainless steel bodies, Viton A O-rings, aluminum 6061 with electroless nickel plating, Teflon (replacing the silicone), and gold crimp connectors (no soldering). Many of the Deutsch connectors may have been used in the Apollo program high vacuum complex in building 37 and date to about 1968 to 1970.

Zeigler, Ryan A.↗

EVA Planning: Using Neutral Buoyancy Laboratory (NBL) Training to Predict in-Flight Energy Expenditure

Metabolic rate (“met rate”) is the amount of energy expended over a period of time and is influenced by many factors including body composition, level of physical activity, resting metabolic rate, sex, age, and food intake. Met rate is measured during Extravehicular Activity (EVA) training at the Neutral Buoyancy Laboratory (NBL) and during in-flight EVAs through indirect calorimetry, calculating energy expenditure from respiratory measurements of O 2 consumption and/or CO 2 production. During Extravehicular Activity (EVA) planning, metabolic cost is important to consider and is used to inform EVA duration based on spacesuit consumables associated with life support systems. Currently, NBL and previous ISS EVA met rate data for specified crewmembers are utilized to predict in-flight EVA metabolic costs based on a proposed EVA timeline. Timeline data collected during training is used to relate met rates to specific EVA activities, which are in turn assigned to more generalized EVA task categories, categorizing by both task type and restraint type. EVA task categories include EVA Setup/Cleanup, Worksite Setup/Cleanup, Cable Routing, Bolts, Fluid Connectors, Electrical Connectors, R&R Work, Miscellaneous Work, Incapacitated Crew Rescue (being rescued or performing), Assisted Crew Rescue (being assisted or performing), and Translation. Restraint types consist of Free-Float, Body Restraint Tether (BRT), Articulating Portable Foot Restraint (APFR), and Space Station Remote Manipulator System (SSRMS). From a crewmember’s historical data, individualized 10th, 50th and 90th percentile met rate estimates are generated for each task category and used to estimate the proposed EVA timeline metabolic cost. In-flight metabolic data (“As-Executed”) from recent ISS US EVAs 85-88 (totaling eight EVA crewmember met rates) was compared with their predicted metabolic cost (“As-Planned”) to evaluate the accuracy of the current met rate estimation method. Across the four EVAs, As-Executed Cumulative EVA Total Metabolic Cost (M = 5893.78 BTU, SD = 816.60) was not significantly different compared to As-Planned Cumulative EVA Total Metabolic Cost (M = 6106.60 BTU, SD = 826.62; t(7) = 0.751 , p = .477). Though not a significant difference, generally, As-Planned total estimates were slightly higher than As-Executed total metabolic cost. Relative Error for Cumulative EVA Total Metabolic Cost ranged from -33% to 14.7%, depending on the crewmember and EVA. When comparing As-Planned to A-Executed EVA task categories for Bolts, Electrical Connectors, EVA Cleanup, EVA Setup, Miscellaneous Work, Translation, Worksite Cleanup, and Worksite Setup during these EVAs, no significant differences were observed, however, there was a significant difference in As-Planned (M = 783.71 BTU, SD = 408.88) compared to As-Executed (M = 608.87 BTU, SD = 425.29) metabolic cost for the task category of Repair-and-Replace (R&R) Work (t(17) = 3.21 , p = .005). Looking closer within the R&R Work task category, As-Executed R&R Work with Free-Float restraint type (M = 706.17 BTU, SD = 352.18) was significantly less than As-Planned R&R Work with Free-Float restraint type (M= 887.96 BTU, SD = 381.42; t(12) = 2.59, p < .024). As-Executed R&R Work with SSRMS Restraint type (M = 355.89 BTU, SD = 534.65) was not significantly different from As-Planned values (M = 512.69 BTU, SD = 383.34; t(4) = 1.88, p = 0.132). These findings suggest that the energy expended performing R&R Work (Free-Float) is lower in flight than predicted. Accurate predictions of the metabolic cost of EVA are essential for planning and executing successful ISS EVAs. Overall, the current met rate prediction method is similar to actual in-flight values, slightly erring on the side of overestimation. Future work includes analysis of more historical in-flight EVA data to increase the power of the analysis, evaluating the NBL-ISS met rate conversion factor between NBL and ISS tasks, as well as exploring methods of substitution when crewmembers are missing prior task category data.

Lauren Cox↗

Thermal Evaluation of CCS and NACS Reference Devices and Adapters

A review of NLR's work in charging system reliability for charging inlets, connectors, and adapters. The review includes a detailed discussion on (a) the development of a reference device for the thermal performance of charging connectors and adapters, (b) evaluation of charging adapters and their thermal warning and shutdown response, (c) implications of side-load from real-world implementations, and (d) strengthening the conformance evaluation for end caps based on field data.

33 ADVANCED PROPULSION SYSTEMS↗

Testing

Testing is conducted to verify that the connectors will properly perform over time (reliability) per the application requirements. Testing by the manufacturer usually involves performance testing per the datasheet requirements. However, the customer may have applications that require performance under unique operational and environmental conditions. In general, electrical tests for connectors include dielectric withstanding voltage, low-signal-level contact resistance, insulation resistance, contact resistance, and standing wave ratio. Environmental tests include humidity, temperature, and contaminating conditions, as well as mechanical stress environments including vibration, mechanical shock, and durability cycling exposures.

Connectors, testing, Dielectric Withstanding Volta↗