Alternate Shock Pulse Width Study PIND Test Results NASA MSFC Preliminary Data Review
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particle detection in electronic packages↗
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Princeton experiment package for OAO-C.
OAO-C spacecraft optical and electronics Princeton Experiment Package including telescope, spectrometer, guidance sensor and power supply
Gundersen, N. A.↗
NASA Parts Selection List (NPSL) WWW Site http://nepp.nasa.gov/npsl
The NASA Parts Selection List (NPSL) is an on-line resource for electronic parts selection tailored for use by spaceflight projects. The NPSL provides a list of commonly used electronic parts that have a history of satisfactory use in spaceflight applications. The objective of this www site is to provide NASA projects, contractors, university experimenters, et al with an easy to use resource that provides a baseline of electronic parts from which designers are encouraged to select. The NPSL is an ongoing resource produced by Code 562 in support of the NASA HQ funded NASA Electronic Parts and Packaging (NEPP) Program. The NPSL is produced as an electronic format deliverable made available via the referenced www site administered by Code 562. The NPSL does not provide information pertaining to patented or proprietary information. All of the information contained in the NPSL is available through various other public domain resources such as US Military procurement specifications for electronic parts, NASA GSFC's Preferred Parts List (PPL-21), and NASA's Standard Parts List (MIL-STD975).
Brusse, Jay↗
Television observations of artificial aurora and analyses of flight data from NASA payload 12.18 NE
An accelerator nominally capable of ejecting pulses of electrons up to 6 sec in length, current to 500 ma and energy to 20 keV was flown on a rocket at 1500 October 15, 1972. The Strypi rocket was launched from the Pacific Missile Range Facility at Kauai, Hawaii. The intent was to eject electron pulses of various characteristics upwards along the magnetic field so as to produce artificial auroras in the conjugate (Southern Hemisphere) atmosphere and possibly to produce weaker auroras in the nearby atmosphere as a consequence of backscattered electrons. The accelerator package included a gas jet actuated attitude control system controlled by gyros. Attitude sensing also was accomplished by a two-axis fluxgate magnetometer, and a large foil was deployed to collect ambient electrons to neutralize the accelerator when it ejected high-energy electrons. Scientific instrumentation contained on the flight package included retarding potential analyzers, energetic electron detectors, and detectors to sense very low frequency radio noise. Image orthicon television systems and other optical sensors were operated in the conjugate region aboard two NC-135 jet aircrafts based in Samoa. Similar devices were operated at Haleakala, Hawaii, to attempt detection of auroras caused by backscattered electrons.
Davis, T. N.↗
Theoretical and Experimental Beam Plasma Physics (TEBPP)
The theoretical and experimental beam plasma physics (TEBPP) consists of a package of five instruments to measure electric and magnetic fields, plasma density and temperature, neutral density, photometric emissions, and energetic particle spectra during firings of the particle injector (SEPAC) electron beam. The package is developed on a maneuverable boom (or RMS) and is used to measure beam characteristics and induced perturbations field ( 10 m) and mid field ( 10 m to 100 m) along the electron beam. The TEBPP package will be designed to investigate induced oscillations and induced electromagnetic mode waves, neutral and ion density and temperature effects, and beam characteristics as a function of axial distance.
Roberts, B.↗
Theoretical and Experimental Beam Plasma Physics (TEBPP)
The theoretical and experimental beam plasma physics (TEBPP) consists of a package of five instruments to measure electric and magnetic fields, plasma density and temperature, neutral density, photometric emissions, and energetic particle spectra during firings of the particle injector (SEPAC) electron beam. The package is deployed on a maneuverable boom (or RMS) and is used to measure beam characteristics and induced perturbations in the near field ( 10 m) and mid field (10 m to 100 m) along the electron beam. The TEBPP package will be designed to investigate induced oscillations and induced electromagnetic mode waves, neutral and ion density and temperature effects, and beam characteristics as a function of axial distance.
Roberts, W. T.↗
Standardizing Microprocessor and GPU Radiation Test Approaches
Microprocessor, Graphics Processing Units (GPUs) and DDRx memory devices have emerged as promising next-generation technologies that enables both high performance processing and acceleration of complex algorithms for the latest challenges in human spaceflight, autonomous vehicles and artificial intelligence (AI). The feature sets of these devices offer exponential increases to throughput, calculation capability and system autonomy when compared to legacy flight systems. NASA's Electronic Part and Packaging (NEPP) Program has conducted an investigation into the radiation susceptibility of leading edge devices and process technologies by establishing standardized test approaches. Unlike most discrete devices, these require state of the art test systems to induce specific hardware activity similar to application software, thus allowing the characterization of failure modes within the system. To best characterize the tested part, NEPP eliminates variables that may impact device performance under radiation. Simplification of remaining system-level variables leads to an improved understanding of complex computational devices and their intended applications. The failure modes and error signatures that are recorded during testing are used to determine radiation sensitivity of the semiconductor process and the microcode architecture of the design. This presentation will discuss the test methodology that NASA Electronic Parts and Packaging (NEPP) is working to establish for its microprocessor, GPU and DDRx memory test programs to provide guidance on these devices and their underlying technology, in regards to their potential usage in future space flight systems.
GPU↗
Thematic mapper flight model preshipment review data package. Volume 4: Appendix. Part E: Electronics module data
Tests to verify the as-designed performance of all circuits within the thematic mapper electronics module unit are described. Specifically, the tests involved the evaluation of the scan line corrector driver, shutter drivers function, cal lamp controller function, post amplifier function, command decoder verification unit, and the temperature and actuator controllers function.
Source record↗
Evaluation methodology guidance for stack packages
This report provides evaluation methodology guidance based on previous National Aeronautics and Space Administration (NASA) reports and literature surveys for 3D stack packages and assemblies. Two aspects of technology are covered: the package itself (guidance for functional packages) and package assembly manufacturing and reliability. This work was funded by the NASA Electronic Parts and Packaging (NEPP) Program. The objectives of this NEPP project are to: Perform a literature survey of 3D stack technology; perform a literature survey on the evaluation methodology for 3D package and assembly; combine the two aspects to provide evaluation methodology for both aspects with consideration of interactions between package and assembly; generate guidance on the evaluation methodology for 3D stack package integrity prior to and after assembly; provide recommendations on future experimental activities. The qualification and evaluation methodology guidelines will facilitate NASA projects in effectively evaluating the reliability of very dense and newly available high-density 3D stack packages, allowing more processing power in a smaller board footprint and lower system weight.
Gerke, David↗
Low Temperature Reliability of Electronic Packages/Assemblies for Space Missions
A NASA-wide team, funded under the NASA Electronic Parts and Packaging Program (NEPP), was formed to collaborate and to establish reliability of various electronic parts/packaging and assemblies for operation under extreme cold temperatures. One of the primary objectives of the NEPP is to expedite the infusion of cutting edge technologies into the present and future NASA missions. Commercial-off-the-shelf (COTS) emerging electronic parts/packages due to their lower weight, increased functionality, and lower cost are excellent candidates for space missions if they are characterized to show that they will meet the stringent reliability and quality requirements. Characterizations, especially for the extreme cold temperatures, are required since very limited data are available by manufacturers or users. For severe military environments, the temperature conditions to -65 C are the lowest temperature for which these parts/packages and assemblies are qualified. New data beyond this relatively benign cold temperature are required for numerous NASA missions. Several parts/packages, based on the project recommendation for their immediate and future needs, were selected for detailed characterization to cold temperature regimes down to liquid nitrogen (-196 C), covering both Mars cold temperature (-125 C) and asteroid (- 180 C) lander environmental requirements. Numerous parts/packages and assemblies were characterized during extreme temperature environmental tests. Several electrical parameters were characterized at discrete temperatures to -185 C to determine if they remain within their specification ranges. Both packages and circuit boards were subjected to nondestructive testing including optical, X-ray, and acoustic microscopy to document their integrity prior to environment exposure. Package/board assemblies were also subjected to X-ray to characterize solder joint integrity including void levels. Both parts and assemblies were subjected to thermal cycling with a large temperature swing enveloping numerous NASA missions. Details of the performed tests and the results obtained are presented.
Patterson, Richard L.↗
Packaging Technology for Dielectric-Coating-Less Heavy Ion Radiation Testing of High-Voltage (HV) Electronic Parts
Testing high voltage (HV) electronic parts (greater than 300 V) for sudden event effects (SEE) caused by cosmic rays in the space environment, consisting of energetic heavy-ions, and neutron radiation in the upper atmosphere is a crucial step towards using these parts in spacecraft and aircraft. Due to the nature of cosmic radiation and neutrons, electronic parts are tested for SEE without any packaging and/or shielding over the top of the device. In the case of commercial HV parts, the top of the packaging is etched off and then a thin dielectric coating is placed over the part in order to avoid electrical arcing between the device surface and wire bonds and other components. Even though the effects of the thin dielectric layer on SEE testing can be accounted for, the dielectric layer significantly hinders post testing failure analysis. Replicating the test capability of state-of-the-art packaging while eliminating the need for post radiation test processing of the die surface (that obscures failure analysis) is the goal. To that end, a new packaging concept for HV parts has been developed that requires no dielectric coating over the part. Testing of prototype packages used with Schottky diodes (rated at 1200V) has shown no electrical arcing during testing and leakage currents during reverse bias testing are within the manufactures specifications.
High Voltage↗
X-ray telescope experiment package Final progress report, 12 Oct. 1965 - 15 Mar. 1966
Electronics of aluminum and beryllium window proportional counters for Aerobee X-ray telescope instrument package
ELECTRONICS↗
Double Data Rate (DDR) Memory Devices
This presentation will include information about Double Data Rate (DDR) technology, NASA Electronic Parts and Packaging (NEPP) tasks and their purpose, collaborations, a roadmap, NEPP partners, results to date, and future plans.
NASA Electronic Parts and Packaging (NEPP) Program↗
Graphics Processing Unit (GPU) Devices
This presentation will include information about Graphics Processing Unit (GPU) technology, NASA Electronic Parts and Packaging (NEPP) tasks and their purpose, collaborations, a roadmap, NEPP partners, results to date, and future plans.
Single Event Effects (SEE)↗
High Temperature Wireless Communication And Electronics For Harsh Environment Applications
In order for future aerospace propulsion systems to meet the increasing requirements for decreased maintenance, improved capability, and increased safety, the inclusion of intelligence into the propulsion system design and operation becomes necessary. These propulsion systems will have to incorporate technology that will monitor propulsion component conditions, analyze the incoming data, and modify operating parameters to optimize propulsion system operations. This implies the development of sensors, actuators, and electronics, with associated packaging, that will be able to operate under the harsh environments present in an engine. However, given the harsh environments inherent in propulsion systems, the development of engine-compatible electronics and sensors is not straightforward. The ability of a sensor system to operate in a given environment often depends as much on the technologies supporting the sensor element as the element itself. If the supporting technology cannot handle the application, then no matter how good the sensor is itself, the sensor system will fail. An example is high temperature environments where supporting technologies are often not capable of operation in engine conditions. Further, for every sensor going into an engine environment, i.e., for every new piece of hardware that improves the in-situ intelligence of the components, communication wires almost always must follow. The communication wires may be within or between parts, or from the engine to the controller. As more hardware is added, more wires, weight, complexity, and potential for unreliability is also introduced. Thus, wireless communication combined with in-situ processing of data would significantly improve the ability to include sensors into high temperature systems and thus lead toward more intelligent engine systems. NASA Glenn Research Center (GRC) is presently leading the development of electronics, communication systems, and sensors capable of prolonged stable operation in harsh 500C environments. This has included world record operation of SiC-based transistor technology (including packaging) that has demonstrated continuous electrical operation at 500C for over 2000 hours. Based on SiC electronics, development of high temperature wireless communication has been on-going. This work has concentrated on maturing the SiC electronic devices for communication purposes as well as the passive components such as resistors and capacitors needed to enable a high temperature wireless system. The objective is to eliminate wires associated with high temperature sensors which add weight to a vehicle and can be a cause of sensor unreliability. This paper discusses the development of SiC based electronics and wireless communications technology for harsh environment applications such as propulsion health management systems and in Venus missions. A brief overview of the future directions in sensor technology is given including maturing of near-room temperature "Lick and Stick" leak sensor technology for possible implementation in the Crew Launch Vehicle program. Then an overview of high temperature electronics and the development of high temperature communication systems is presented. The maturity of related technologies such as sensor and packaging will also be discussed. It is concluded that a significant component of efforts to improve the intelligence of harsh environment operating systems is the development and implementation of high temperature wireless technology
Hunter, G. W.↗
Velocity-space synthesis of ISEE-1 measurements of the three dimensional electron distribution function
A computer package which produces contour plots of the three dimensional electron distribution function measured by an electron spectrometer aboard ISEE-1 is described. Examples of the contour plots and an explanation of how to use the program, including the necessary computer code for running the program on the GSFC 360/91 computer is presented. The method by which the discrete measurements of the distribution function, given by points on the four dimensional surface are synthesized into a smooth surface in a three dimensional space which can be contoured is described. The velocity components are parallel and perpendicular to the magnetic field, respectively, in the proper frame of the electrons.
Fitzenreiter, R. J.↗
Nondestructive Detection of Cracks in Ceramics Using Vicinal Illumination
Cracks and other defects in ceramic materials can be difficult or impossible to examine and photograph due to the extreme lack of contrast. A method for inspecting translucent ceramics using scattered light, also known as vicinal illumination, will be described. This method has been known in the ceramics industry for quite some time, but is not well known in the testing and failure analysis community. Electronics applications include substrates, packages, multilayer capacitors, and thin film resistors. Ceramic materials are used in electronic applications as microcircuit packages and substrates which carry signals and power between microcircuits. Fine cracks in ceramic materials can result in mechanical failures, electrical failures, and loss of hermeticity. Often, fine cracks are difficult or impossible to detect using standard nondestructive inspection techniques such as visual inspection, ultrasonic inspection, or vapor crack detection. Dye penetrant inspection is usually effective, but contaminates the part, which is unacceptable for space flight hardware. One effective nondestructive inspection method of detecting cracks involves examining the way in which light scatters through the ceramic material when viewed with a standard bright field reflected light microscope. This method, termed vicinal illumination, has been used for detecting cracks during failure analyses of several part types, and screening of space flight hardware. The technique has proven effective on several different types of ceramic materials as well. A related method for use with dark field equipment has also been used to successfully locate otherwise invisible cracks.
Hull, Scott M.↗
The NASA Radiation Hardness Assurance (RHA) Process Standard
This paper presents status on the upcoming NASA Agency-level RHA Process Standard. Based on recommendations provided by the NASA Engineering and Safety Center (NESC), the NASA Electronic Parts and Packaging (NEPP) Program has led development of an agency-level standard for space flight avionics and electronics RHA. The standard introduces a novel RHA taxonomy and prescribes the process required by NASA programs and projects to baseline their RHA programs consistent with the MEAL (Mission, Environment, Application, and Lifetime) criteria including the risk tolerance posture. The standard also provides requirements for the RHA schedule integration in the program or project lifecycle and requirements for data deliverables content. Additional non-prescriptive technical content is provided in the standard appendices to guide development of RHA programs for NASA missions.
Avionics↗