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At least 379 records · Page 21

Design concepts of the Shuttle mission simulator

The Shuttle mission simulator is designed to simulate all phases of the Space Shuttle mission from the last 30 minutes of countdown to launch, ascent, operations in orbit, deorbit, reentry, and landing with full participation by astronaut trainees and the mission control center. This paper reviews the design concepts of the simulator with attention given to the simulation hardware, crew stations, instructor/operator stations, digital computers, flight computer simulation interface device, mission control center interface, visual systems, aural cue system, mathematical modeling, digital computer complex, motion system, and the payload accommodation system.

Bird, J. D.↗

Phase 3 study of selected tether applications in space. Volume 1: Executive summary

A tethered launch assist from the Shuttle for payloads with up to 10,000 kg mass for the mission model and the tethering of a 15,000 kg science platform for the space station were addressed. Also encompassed was the design and cost analysis for a variable g device that could be placed on the tether and allow ultralow g or other types of experiments to be conducted. Numerous tether applications were examined and their theoretical feasibility and technology requirements were assessed.

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Electrical Devices and Circuits for Low Temperature Space Applications

The environmental temperature in many NASA missions, such as deep space probes and outer planetary exploration, is significantly below the range for which conventional commercial-off-the-shelf electronics is designed. Presently, spacecraft operating in the cold environment of such deep space missions carry a large number of radioisotope or other heating units in order to maintain the surrounding temperature of the on-board electronics at approximately 20 C. Electronic devices and circuits capable of operation at cryogenic temperatures will not only tolerate the harsh environment of deep space but also will reduce system size and weight by eliminating or reducing the heating units and their associate structures; thereby reducing system development cost as well as launch costs. In addition, power electronic circuits designed for operation at low temperatures are expected to result in more efficient systems than those at room temperature. This improvement results from better behavior in the electrical and thermal properties of some semiconductor and dielectric materials at low temperatures. An on-going research and development program on low temperature electronics at the NASA Glenn Research Center focuses on the development of efficient electrical systems and circuits capable of surviving and exploiting the advantages of low temperature environments. An overview of the program will be presented in this paper. A description of the low temperature test facilities along with selected data obtained from in-house component testing will also be discussed. On-going research activities that are being performed in collaboration with various organizations will also be presented.

Patterson, R. L.↗

NASA Tech Briefs, January 2012

Contents of this issue are: (1) Energy-Based Tetrahedron Sensor for High-Temperature, High-Pressure Environments (2) Handheld Universal Diagnostic Sensor (3) Large-Area Vacuum Ultraviolet Sensors (4) Fiber Bragg Grating Sensor System for Monitoring Smart Composite Aerospace Structures (5) Health-Enabled Smart Sensor Fusion Technology (6) Extended-Range Passive RFID and Sensor Tags (7) Hybrid Collaborative Learning for Classification and Clustering in Sensor Networks (8) Self-Healing, Inflatable, Rigidizable Shelter (9) Improvements in Cold-Plate Fabrication (10) Technique for Radiometer and Antenna Array Calibration - TRAAC (11) Real-Time Cognitive Computing Architecture for Data Fusion in a Dynamic Environment (12) Programmable Digital Controller (13) Use of CCSDS Packets Over SpaceWire to Control Hardware (14) Key Decision Record Creation and Approval Module (15) Enhanced Graphics for Extended Scale Range (16) Debris Examination Using Ballistic and Radar Integrated Software (17) Data Distribution System (DDS) and Solar Dynamic Observatory Ground Station (SDOGS) (18) Integration Manager (19) Eclipse-Free-Time Assessment Tool for IRIS (20) Automated and Manual Rocket Crater Measurement Software (21) MATLAB Stability and Control Toolbox Trim and Static Stability Module (22) Patched Conic Trajectory Code (23) Ring Image Analyzer (24) SureTrak Probability of Impact Display (25) Implementation of a Non-Metallic Barrier in an Electric Motor (26) Multi-Mission Radioisotope Thermoelectric Generator Heat Exchangers for the Mars Science Laboratory Rover (27) Uniform Dust Distributor for Testing Radiative Emittance of Dust-Coated Surfaces (28) MicroProbe Small Unmanned Aerial System (29) Highly Stable and Active Catalyst for Sabatier Reactions (30) Better Proton-Conducting Polymers for Fuel-Cell Membranes (31) CCD Camera Lens Interface for Real-Time Theodolite Alignment (32) Peregrine 100-km Sounding Rocket Project (33) SOFIA Closed- and Open-Door Aerodynamic Analyses (34) Sonic Thermometer for High-Altitude Balloons (35) Near-Infrared Photon-Counting Camera for High-Sensitivity Observations (36) Integrated Optics Achromatic Nuller for Stellar Interferometry (37) High-Speed Digital Interferometry (38) Ultra-Miniature Lidar Scanner for Launch Range Data Collection (39) Shape and Color Features for Object Recognition Search (40) Explanation Capabilities for Behavior-Based Robot Control (41) A DNA-Inspired Encryption Methodology for Secure, Mobile Ad Hoc Networks (42) Quality Control Method for a Micro-Nano-Channel Microfabricated Device (43) Corner-Cube Retroreflector Instrument for Advanced Lunar Laser Ranging (44) Electrospray Collection of Lunar Dust (45) Fabrication of a Kilopixel Array of Superconducting Microcalorimeters with Microstripline Wiring Spacecraft Attitude Tracking and Maneuver Using Combined Magnetic Actuators (46) Coherent Detector for Near-Angle Scattering and Polarization Characterization of Telescope Mirror Coatings

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Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗

Summary Report of Mission Acceleration Measurements for STS-65, Launched 8 July 1994

The second flight of the International Microgravity Laboratory (IML-2) payload on board the STS-65 mission was supported by three accelerometer instruments: The Orbital Acceleration Research Experiment (OARE) located close to the orbiter center of mass; the Quasi-Steady Acceleration Measurement experiment, and the Space Acceleration Measurement System (SAMS), both in the Spacelab module. A fourth accelerometer, the Microgravity Measuring Device recorded data in the middeck in support of exercise isolation tests.Data collected by OARE and SAMS during IML-2 are displayed in this report. The OARE data represent the microgravity environment below 1 Hz. The SAMS data represent the environment in the 0.01 Hz to 100 Hz range. Variations in the environment caused by unique activities are presented. Specific events addressed are: crew activity, crew exercise, experiment component mixing activities, experiment centrifuge operations, refrigerator/freezer operations and circulation pump operations. The analyses included in this report complement analyses presented in other mission summary reports.

Rogers, Melissa J. B.↗

Focus drive mechanism for the IUE scientific instrument

A compact, lightweight mechanism was developed for in-orbit adjustment of the position of the secondary mirror (focusing) of the International Ultraviolet Explored telescope. This device is a linear drive with small (.0004 in.) and highly repeatable step increments. Extremely close tolerances are also held in tilt and decentering. The unique mechanization is described with attention to the design details that contribute to positional accuracy. Lubrication, materials, thermal considerations, sealing, detenting against launch loads, and other features peculiar to flight hardware are discussed. The methods employed for mounting the low expansion quartz mirror with minimum distortion are also given.

Devine, E. J.↗

Development of Insect Habitat System for Studying Long Duration Circadian Rhythm Changes on Mir Space Station

A habitat for housing up to 32 black body beetles (Trigonoscelis gigas) has been developed at Ames Research Center for conducting studies to evaluate the effects of long duration spaceflight upon insect circadian timing systems. This habitat, identified as the Beetle Kit Assembly, provides an automatically controlled lighting system and activity and temperature recording devices, as well as individual beetle enclosures. Each of the 32 enclosures allows for ad lib movement of the beetle, as well as providing a simple food source and allowing ventilation of the beetle volume via an externally operated hand pump. The Beetle Kit Assemblies will be launched on STS-84 (Shuttle-Mir Mission-06) in May, 1997 and will be transferred to the Priroda module of the Russian Mir space station. he beetles will remain on Mir for approximately 125 days, and will be returned to earth on STS-86 in September, 1997.

Savage, P. D.↗

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗

Application of computational fluid dynamics to the design of the film cooled STME subscale nozzle for the National Launch System

The status of computational fluid dynamics (CFD) calculations for the Space Transportation Main Engine (STME) film/dump cooled nozzle design is presented, with an emphasis on the timely impact of CFD on the design of the sub-scale nozzle coolant system. The following aspects of the sub-scale coolant delivery system were analyzed with CFD: 1) a design trade study of a mechanical flow splitting device for uniform distribution of the subsonic cavity flow, 2) a design trade study of the subsonic cavity lip to achieve film integrity, and 3) an analysis of the primary flow interaction with the core/secondary coolant streams. All design calculations were performed with the Generalized Aerodynamic Simulation Program (GASP), a 3-D, multi-block, generalized Navier-Stokes code capable of solving with frozen, finite-rate or equilibrium chemical kinetics. The initial design of the subsonic cavity flow used square posts to distribute the sonic orifice jets into a uniform flow. Calculations for this design indicated that an unacceptable mal-distribution of film occurred. Design modifications involving curved and slotted posts were computed in an effort to uniformly distribute the secondary coolant flow. Analysis of these configurations showed that although the flowfield improved in uniformity, it was still unacceptable, especially at higher feed pressures. Results from these studies were then incorporated into a design that resulted in the insertion of a porous metal ring into the subsonic cavity. Subsequent water flow model studies showed that this concept was successful in uniformly distributing flow exiting the cavity. In addition to the design of the subsonic cavity, CFD was also used to analyze the secondary coolant lip and the primary flow interaction with the core/secondary coolant streams. A series of calculations were first performed to modify the subsonic cavity lip contour. The flow over the modified lip was then computed simultaneously with the primary injectors to determine the impact of the subsonic coolant stream on the primary slot jets. Pressure, temperature, velocity, and coolant mass fraction contours are presented for these configurations. Information is given in viewgraph form.

Garrett, Joseph L.↗

Lightweight spacecraft propulsion system selection

Various methods of significantly reducing the mass of planetary spacecraft propulsion systems were addressed. Because of the Space Shuttle Challenger accident, the availability of the Space Transportation System for planetary missions may be limited. Mounting a future planetary mission with lower-energy launch vehicles will require a significant reduction in the spacecraft mass. Smaller launch vehicles for planetary missions were considered. In this study, the assumed payload capability for the planetary missions were considered. In this study, the assumed payload capability for the planetary missions was restricted to the Delta and the Atlas-Centaur launch vehicles. Several propulsion and propulsion-related technologies for spacecraft mass reduction were investigated; ion, arcjet, resistojet, and Magneto-Plasma-Dynamic propulsion and earth-storable high-energy propulsion system thrusters were candidates. The propulsion-related technologies included a start-basket Propellant Management Device, a nitrogen tetroxide diaphragm, and a solid-cryogen cooler. Xenon-ion propulsion allowed the greatest mass reduction.

Palaszewski, B.↗

Performance of the Microwave Anisotropy Probe AST-201 Star Trackers

The Microwave Anisotropy Probe (MAP) was launched to create a full-sky map of the cosmic microwave background. MAP incorporates two modified Lockheed Martin AST-201 (Autonomous Star Tracker) star trackers. The AST-201 employs an eight element radiation hardened lens assembly which is used to focus an image on a charge coupled device (CCD). The CCD image is then processed by a star identification algorithm which outputs a three-axis attitude. A CCD-shift algorithm called Time Delayed Integration (TDI) was also included in each star tracker. In order to provide some radiation effect filtering during MAP's three to five phasing loop passes through the Van Allen radiation belts, a simple pixel filtering scheme was implemented, rather than using a more complex, but more robust windowing algorithm. The trackers also include a fiber optic data interface. This paper details the ground testing that was accomplished on the MAP trackers.

Ward, David K.↗

Traveling Wave Tube (TVT) RF Power Combining Demonstration for use in the Jupiter Icy Moons Orbiter (JIMO)

The Jupiter Icy Moons Orbiter (JIMO) is set to launch between the years 2012 and 2015. It will possibly utilize a nuclear reactor power source and ion engines as it travels to the moons of Jupiter. The nuclear reactor will produce hundreds of kilowatts of power for propulsion, communication and various scientific instruments. Hence, the RF amplification devices aboard will be able to operate at a higher power level and data rate. The initial plan for the communications system is for an output of 1000 watts of RF power, a data rate of at least 10 megabits a second, and a frequency of 32 GHz. A higher data rate would be ideal to fully utilize the instruments aboard JIMO. At NASA Glenn, one of our roles in the JIMO project is to demonstrate RF power combining using multiple traveling wave tubes (TWT). In order for the power of separate TWT s to be combined, the RF output waves from each must be in-phase and have the same amplitude. Since different tubes act differently, we had to characterize each tube using a Network Analyzer. We took frequency sweeps and power sweeps to characterize each tube to ensure that they will behave similarly under the same conditions. The 200 watt Dornier tubes had been optimized to run at a lower power level (120 watts) for their extensive use in the ACTS program, so we also had to experiment with adjusting the voltage settings on several internal components (helix, anode, collector) of the tubes to reach the full 200 watt potential. from the ACTS program. Phase shifters and power attenuators were placed in the waveguide circuit at the inputs to the tubes so that adjustments could be made individually to match them exactly. A magic tee was used to route and combine the amplified electromagnetic RF waves on the tube output side. The demonstration of 200 watts of combined power was successful with efficiencies greater than 90% over a 500 MHz bandwidth. The next step will be to demonstrate the use of three amplifiers using two magic tees by adding a 200 watt Dornier tube to the Varian and Logimetrics combined setup for a total of 400 watts. After that we will use two 200 watt Dorniers for 400 watts and eventually four 200 watt Dornier tubes to demonstrate 800 watts. After demonstrating the success of power combining, we will need to verify the integrity of a modulated signal sent through the combined tubes. The purpose will be to see what effects separating and recombining will have on the modulated signal and also what effect it will have on combining efficiency. A Bit Error Rate (BER) will be determined by a Bit Error Rate Tester (BERT) by comparing the random information it transmits to what it receives back. The process began with two 100 watt tubes, a Varian and a Logimetrics, salvaged

Downey, Joseph A.↗

High-Temperature Optical Sensor

A high-temperature optical sensor (see Figure 1) has been developed that can operate at temperatures up to 1,000 C. The sensor development process consists of two parts: packaging of a fiber Bragg grating into a housing that allows a more sturdy thermally stable device, and a technological process to which the device is subjected to in order to meet environmental requirements of several hundred C. This technology uses a newly discovered phenomenon of the formation of thermally stable secondary Bragg gratings in communication-grade fibers at high temperatures to construct robust, optical, high-temperature sensors. Testing and performance evaluation (see Figure 2) of packaged sensors demonstrated operability of the devices at 1,000 C for several hundred hours, and during numerous thermal cycling from 400 to 800 C with different heating rates. The technology significantly extends applicability of optical sensors to high-temperature environments including ground testing of engines, flight propulsion control, thermal protection monitoring of launch vehicles, etc. It may also find applications in such non-aerospace arenas as monitoring of nuclear reactors, furnaces, chemical processes, and other hightemperature environments where other measurement techniques are either unreliable, dangerous, undesirable, or unavailable.

Adamovsky, Grigory↗

WFL: Microwave Applications of Thin Ferroelectric Films

We have developed a family of tunable microwave circuits, operating from X- through Ka-band, based on laser ablated BaxSr1-xTiO films on lanthanum aluminate and magnesium oxide substrates. Circuits include voltage controlled oscillators, filters, phase shifters and antennas. A review of the basic theory of operation of these devices will be presented along with measured performance. Emphasis has been on low-loss phase shifters to enable a new phased array architecture. The critical role of phase shifter loss and transient response in reflectarray antennas will be discussed. The Ferroelectric Reflectarray Critical Components Space Experiment was launched on the penultimate Space Shuttle, STS-134, in May of 2011. It included a bank of ferroelectric phase shifters with two different stoichiometries as well as ancillary electronics. The experiment package and status will be reported. In addition, unusual results of a Van der Pauw measurement involving a ferroelectric film grown on buffered high resisitivity silicon will be discussed.

Romanofsky, Robert↗

Hold Down and Release Mechanism Hardware Simulator for Ground Deployment Testing

Hold Down and Release Mechanisms (HDRMs) are a common piece of spacecraft hardware which restrain components during launch, transit, and later allow them to be extended, jettisoned, separated, etc. at the spacecraft’s destination. Due to prohibitively high cost, long lead times, and limited reset capability, testing of mechanisms that require HDRMs is often difficult. This project explored the possibility of designing HDRM-analogue devices that would replicate the function of flight HDRMs during ground-based testing for a fraction of the cost of a flight HDRM. These devices were designed with the requirements of the Spin Eject Mechanism to be used on the Mars Sample Return (MSR) Capture, Containment, and Return System (CCRS) in mind. A trade study was conducted to determine the optimal internal mechanism design of the device, comparing several mechanisms from existing HDRMs to several simpler, more novel mechanisms. CAD software was used to create a preliminary design of the device utilizing a mix of commercial off-the-shelf parts and custom-manufactured parts. Several straightforward analyses were conducted to determine the most effective models for the off-the-shelf parts. A prototype largely composed of 3D-printed components was also created to proof the design concept. Although this HDRM simulator was designed for a particular mechanism for the CCRS mission, its general design is useful for ground testing of a variety of mechanisms requiring similar HDRM simulators.

Kian Vilhauer↗

Launch commit criteria performance trending analysis, phase 1, revision A. SRM and QA mission services

An assessment of quantitative methods and measures for measuring launch commit criteria (LCC) performance measurement trends is made. A statistical performance trending analysis pilot study was processed and compared to STS-26 mission data. This study used four selected shuttle measurement types (solid rocket booster, external tank, space shuttle main engine, and range safety switch safe and arm device) from the five missions prior to mission 51-L. After obtaining raw data coordinates, each set of measurements was processed to obtain statistical confidence bounds and mean data profiles for each of the selected measurement types. STS-26 measurements were compared to the statistical data base profiles to verify the statistical capability of assessing occurrences of data trend anomalies and abnormal time-varying operational conditions associated with data amplitude and phase shifts.

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Electronic Components and Systems for Cryogenic Space Applications

Electronic components and systems capable of operation at cryogenic temperatures are anticipated in many future NASA space missions such as deep space probes and planetary surface exploration. For example, an unheated interplanetary probe launched to explore the rings of Saturn would reach an average temperature near Saturn of about - 183 C. In addition to surviving the deep space harsh environment, electronics capable of low temperature operation would contribute to improving circuit performance, increasing system efficiency, and reducing payload development and launch costs. Terrestrial applications where components and systems must operate in low temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation system, and arctic exploration. An on-going research and development program at the NASA Glenn Research Center focuses on the development of reliable electronic devices and efficient power systems capable of surviving in low temperature environments. An overview of the program will be presented in this paper. A description of the low temperature test facilities along with selected data obtained from in-house component testing will also be discussed. Ongoing research activities that are being performed in collaboration with various organizations will also be presented.

Patterson, R. L.↗