Apparatus and method for measuring the Seebeck coefficient and resistivity of materials
An apparatus for measuring the thermoelectric properties of materials under high pressure is described that includes a pair of force transmitting assemblies constructed of thermally and electrically conductive material positioned between the ram and anvil of a press. Each force transmitting assembly has a small diameter pressing portion for contacting a face of the sample so that the sample can be squeezed between them. Each assembly also includes a heat exchanger to maintain the sample face at a controlled temperature, and an electrical conductor to carry current generated by the sample. A sleeve of thermally and electrically insulative material closely surrounds the pressing portions of the two assemblies.