Single substrate camera device with CMOS image sensor
Single substrate device is formed to have an image acquisition device and a controller. The controller on the substrate controls the system operation.
Fossum, Eric R.↗
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Single substrate camera device with CMOS image sensor
Single substrate device is formed to have an image acquisition device and a controller. The controller on the substrate controls the system operation.
Fossum, Eric R.↗
Progress Towards III-V Photovoltaics on Flexible Substrates
Presented here is the recent progress of the NASA Glenn Research Center OMVPE group's efforts in the development of high efficiency thin-film polycrystalline III-V photovoltaics on optimum substrates. By using bulk polycrystalline germanium (Ge) films, devices of high efficiency and low mass will be developed and incorporated onto low-cost flexible substrates. Our progress towards the integration of high efficiency polycrystalline III-V devices and recrystallized Ge films on thin metal foils is discussed.
McNatt, Jeremiah S.↗
Using ALD To Bond CNTs to Substrates and Matrices
Atomic-layer deposition (ALD) has been shown to be effective as a means of coating carbon nanotubes (CNTs) with layers of Al2O3 that form strong bonds between the CNTs and the substrates on which the CNTs are grown. ALD is a previously developed vaporphase thin-film-growth technique. ALD differs from conventional chemical vapor deposition, in which material is deposited continually by thermal decomposition of a precursor gas. In ALD, material is deposited one layer of atoms at a time because the deposition process is self-limiting and driven by chemical reactions between the precursor gas and the surface of the substrate or the previously deposited layer.
Wong, Eric W.↗
Microstrip Antenna Arrays on Multilayer LCP Substrates
A research and development effort now underway is directed toward satisfying requirements for a new type of relatively inexpensive, lightweight, microwave antenna array and associated circuitry packaged in a thin, flexible sheet that can readily be mounted on a curved or flat rigid or semi-rigid surface. A representative package of this type consists of microwave antenna circuitry embedded in and/or on a multilayer liquid- crystal polymer (LCP) substrate. The circuitry typically includes an array of printed metal microstrip patch antenna elements and their feedlines on one or more of the LCP layer(s). The circuitry can also include such components as electrostatically actuated microelectromechanical systems (MEMS) switches for connecting and disconnecting antenna elements and feedlines. In addition, the circuitry can include switchable phase shifters described below. LCPs were chosen over other flexible substrate materials because they have properties that are especially attractive for high-performance microwave applications. These properties include low permittivity, low loss tangent, low water-absorption coefficient, and low cost. By means of heat treatments, their coefficients of thermal expansion can be tailored to make them more amenable to integration into packages that include other materials. The nature of the flexibility of LCPs is such that large LCP sheets containing antenna arrays can be rolled up, then later easily unrolled and deployed. Figure 1 depicts a prototype three- LCP-layer package containing two four-element, dual-polarization microstrip-patch arrays: one for a frequency of 14 GHz, the other for a frequency of 35 GHz. The 35-GHz patches are embedded on top surface of the middle [15-mil (approx.0.13-mm)-thick] LCP layer; the 14- GHz patches are placed on the top surface of the upper [9-mil (approx. 0.23-mm)-thick] LCP layer. The particular choice of LCP layer thicknesses was made on the basis of extensive analysis of the effects of the thicknesses on cross-polarization levels, bandwidth, and efficiency at each frequency.
Thompson, Dane↗
Fully Printed High-Frequency Phased-Array Antenna on Flexible Substrate
To address the issues of flexible electronics needed for surface-to-surface, surface-to-orbit, and back-to-Earth communications necessary for manned exploration of the Moon, Mars, and beyond, a room-temperature printing process has been developed to create active, phased-array antennas (PAAs) on a flexible Kapton substrate. Field effect transistors (FETs) based on carbon nanotubes (CNTs), with many unique physical properties, were successfully proven feasible for phased-array antenna systems. The carrier mobility of an individual CNT is estimated to be at least 100,000 sq cm/V(dot)s. The CNT network in solution has carrier mobility as high as 46,770 sq cm/V(dot)s, and has a large current-density carrying capacity of approx. 1,000 mA/sq cm , which corresponds to a high carrying power of over 2,000 mW/ sq cm. Such high carrier mobility, and large current carrying capacity, allows the achievement of high-speed (>100 GHz), high-power, flexible electronic circuits that can be monolithically integrated on NASA s active phasedarray antennas for various applications, such as pressurized rovers, pressurized habitats, and spacesuits, as well as for locating beacon towers for lunar surface navigation, which will likely be performed at S-band and attached to a mobile astronaut. A fully printed 2-bit 2-element phasedarray antenna (PAA) working at 5.6 GHz, incorporating the CNT FETs as phase shifters, is demonstrated. The PAA is printed out at room temperature on 100-mm thick Kapton substrate. Four CNT FETs are printed together with microstrip time delay lines to function as a 2-bit phase shifter. The FET switch exhibits a switching speed of 0.2 ns, and works well for a 5.6-GHz RF signal. The operating frequency is measured to be 5.6 GHz, versus the state-of-the-art flexible FET operating frequency of 52 MHz. The source-drain current density is measured to be over 1,000 mA/sq cm, while the conventional organic FETs, and single carbon nanotube-based FETs, are typically in the mA to mA/sq cm range. The switching voltage used is 1.8 V, while the state-of-the-art flexible FET has a gate voltage around 50 V. The gate voltage can effectively control the source-drain current with an ON-OFF ratio of over 1,000 obtained at a low Vds bias of 1.8 V. The azimuth steering angles of PAA are measured at 0deg, -14.5deg, -30deg, and 48.6deg. The measured far-field patterns agree well with simulation results. The efficiency of the 2-bit 2-element PAA is measured to be 39 percent, including the loss of transmission line, FET switch, and coupling loss of RF probes. With further optimization, the efficiency is expected to be around 50-60 percent.
Chen, Yihong↗
Methods of repairing a substrate
A precursor of a ceramic adhesive suitable for use in a vacuum, thermal, and microgravity environment. The precursor of the ceramic adhesive includes a silicon-based, preceramic polymer and at least one ceramic powder selected from the group consisting of aluminum oxide, aluminum nitride, boron carbide, boron oxide, boron nitride, hafnium boride, hafnium carbide, hafnium oxide, lithium aluminate, molybdenum silicide, niobium carbide, niobium nitride, silicon boride, silicon carbide, silicon oxide, silicon nitride, tin oxide, tantalum boride, tantalum carbide, tantalum oxide, tantalum nitride, titanium boride, titanium carbide, titanium oxide, titanium nitride, yttrium oxide, zirconium boride, zirconium carbide, zirconium oxide, and zirconium silicate. Methods of forming the ceramic adhesive and of repairing a substrate in a vacuum and microgravity environment are also disclosed, as is a substrate repaired with the ceramic adhesive.
Riedell, James A.↗
Common Ion Effects In Zeoponic Substrates: Dissolution And Cation Exchange Variations Due to Additions of Calcite, Dolomite and Wollastonite
c1inoptilolite-rich tuff-hydroxyapatite mixture (zeoponic substrate) has the potential to serve as a synthetic soil-additive for plant growth. Essential plant macro-nutrients such as calcium, phosphorous, magnesium, ammonium and potassium are released into solution via dissolution of the hydroxyapatite and cation exchange on zeolite charged sites. Plant growth experiments resulting in low yield for wheat have been attributed to a Ca deficiency caused by a high degree of cation exchange by the zeolite. Batch-equilibration experiments were performed in order to determine if the Ca deficiency can be remedied by the addition of a second Ca-bearing, soluble, mineral such as calcite, dolomite or wollastonite. Variations in the amount of calcite, dolomite or wollastonite resulted in systematic changes in the concentrations of Ca and P. The addition of calcite, dolomite or wollastonite to the zeoponic substrate resulted in an exponential decrease in the phosphorous concentration in solution. The exponential rate of decay was greatest for calcite (5.60 wt. % -I), intermediate for wollastonite (2.85 wt.% -I) and least for dolomite (1.58 wt.% -I). Additions of the three minerals resulted in linear increases in the calcium concentration in solution. The rate of increase was greatest for calcite (3.64), intermediate for wollastonite (2.41) and least for dolomite (0.61). The observed changes in P and Ca concentration are consistent with the solubilities of calcite, dolomite and wollastonite and with changes expected from a common ion effect with Ca. Keywords: zeolite, zeoponics, common-ion effect, clinoptilolite, hydroxyapatite
Beiersdorfer, R. E.↗
PVD Silicon Carbide as a Thin Film Packaging Technology for Antennas on LCP Substrates for Harsh Environments
This paper describes an effort to develop a thin film packaging technology for microfabricated planar antennas on polymeric substrates based on silicon carbide (SiC) films deposited by physical vapor deposition (PVD). The antennas are coplanar waveguide fed dual frequency folded slot antennas fabricated on liquid crystal polymer (LCP) substrates. The PVD SiC thin films were deposited directly onto the antennas by RF sputtering at room temperature at a chamber pressure of 30 mTorr and a power level of 300 W. The SiC film thickness is 450 nm. The return loss and radiation patterns were measured before and after the SiC-coated antennas were submerged into perchloric acid for 1 hour. No degradation in RF performance or physical integrity of the antenna was observed.
Scardelletti, Maximilian C.↗
Measurement of an Evaporating Drop on a Reflective Substrate
A figure depicts an apparatus that simultaneously records magnified ordinary top-view video images and laser shadowgraph video images of a sessile drop on a flat, horizontal substrate that can be opaque or translucent and is at least partially specularly reflective. The diameter, contact angle, and rate of evaporation of the drop as functions of time can be calculated from the apparent diameters of the drop in sequences of the images acquired at known time intervals, and the shadowgrams that contain flow patterns indicative of thermocapillary convection (if any) within the drop. These time-dependent parameters and flow patterns are important for understanding the physical processes involved in the spreading and evaporation of drops. The apparatus includes a source of white light and a laser (both omitted from the figure), which are used to form the ordinary image and the shadowgram, respectively. Charge-coupled-device (CCD) camera 1 (with zoom) acquires the ordinary video images, while CCD camera 2 acquires the shadowgrams. With respect to the portion of laser light specularly reflected from the substrate, the drop acts as a plano-convex lens, focusing the laser beam to a shadowgram on the projection screen in front of CCD camera 2. The equations for calculating the diameter, contact angle, and rate of evaporation of the drop are readily derived on the basis of Snell s law of refraction and the geometry of the optics.
Chao, David F.↗
Common Practice Lightning Strike Protection Characterization Technique to Quantify Damage Mechanisms on Composite Substrates
To support FAA certification airworthiness standards, composite substrates are subjected to lightning direct-effect electrical waveforms to determine performance characteristics of the lightning strike protection (LSP) conductive layers used to protect composite substrates. Test results collected from independent LSP studies are often incomparable due to variability in test procedures & applied practices at different organizations, which impairs performance correlations between different LSP data sets. Under a NASA supported contract, The Boeing Company developed technical procedures and documentation as guidance in order to facilitate a test method for conducting universal common practice lightning strike protection test procedures. The procedures obtain conformity in future lightning strike protection evaluations to allow meaningful performance correlations across data sets. This universal common practice guidance provides the manufacturing specifications to fabricate carbon fiber reinforced plastic (CFRP) test panels, including finish, grounding configuration, and acceptable methods for pretest nondestructive inspection (NDI) and posttest destructive inspection. The test operations guidance elaborates on the provisions contained in SAE ARP5416 to address inconsistencies in the generation of damage protection performance data, so as to provide for maximum achievable correlation across capable lab facilities. In addition, the guidance details a direct effects test bed design to aid in quantification of the multi-physical phenomena surrounding a lightning direct attachment supporting validation data requirements for the development of predictive computational modeling. The lightning test bed is designed to accommodate a repeatable installation procedure to secure the test panel and eliminate test installation uncertainty. It also facilitates a means to capture the electrical waveform parameters in 2 dimensions, along with the mechanical displacement and thermal heating parameters which occur during lightning attachment. Following guidance defined in the universal common practice LSP test documents, protected and unprotected CFRP panels were evaluated at 20, 40 and 100KAmps. This report presents analyzed data demonstrating the scientific usefulness of the common practice approach. Descriptions of the common practice CFRP test articles, LSP test bed fixture, and monitoring techniques to capture the electrical, mechanical and thermal parameters during lightning attachment are presented here. Two methods of measuring the electrical currents were evaluated, inductive current probes and a newly developed fiberoptic sensor. Two mechanical displacement methods were also examined, optical laser measurement sensors and a digital imaging correlation camera system. Recommendations are provided to help users implement the common practice test approach and obtain LSP test characterizations comparable across data sets.
Szatkowski, George N.↗
10 GHz YBa2Cu3O7-delta Superconducting Ring Resonators on NdGaO3 Substrates
YBa2Cu3O7-delta thin films were formed on NdGaO3 substrates by laser ablation. Critical temperatures greater than 89 K and critical current densities exceeding 2 x 10(exp.6) A cm(exp.-2) at 77 K were obtained. The microwave performance of films patterned into microstrip ring resonators with gold ground planes was measured. An unloaded quality factor six times larger than a that of a gold resonator of identical geometry was achieved. The unloaded quality factor decreased below 70 K for both the superconducting and gold resonators due to increasing dielectric losses in the substrate. The temperature dependence of the loss tangent of NdGaO3 was extracted from the measurements.
To, H. Y.↗
Design Trade Study for a 4-Meter Off-Axis Primary Mirror Substrate and Mount for the Habitable-Zone Exoplanet Direct Imaging Mission
An extensive trade study was conducted to evaluate primary mirror substrate design architectures for the HabEx mission baseline 4-meter off-axis telescope. The study’s purpose is not to produce a final design, but rather to established a design methodology for matching the mirror’s properties (mass and stiffness) with the mission’s optical performance specifications (static dynamic wavefront error, WFE). The study systematically compares the effect of proven design elements (closed-back vs. open-back vs. partial-back; meniscus vs. flat back vs. shaped back; etc.), which can be implemented with proven space mirror materials (ULE and Zerodur), on static and dynamic WFE. Additionally, the study compares static and dynamic WFE of each substrate point design integrated onto three and six point mounts.
space↗
Increased Flexibility in Polyimide Aerogel Substrates for Conformal, Lightweight Antennas
Polyimide aerogels are desirable for many aerospace applications due to their high porosity, low density, low thermal conductivity, and superior mechanical properties. They have also been demonstrated as lightweight substrates for antennas since they possess very low dielectric constants, approaching one as density decreases. Increasing the flexibility of the aerogel would allow them to be used as conformal antennas for use on aerospace vehicles, leading to significant space and weight savings. In this research, we demonstrate that the flexibility can be increased depending on the polyimide oligomer backbone structures. We have substituted up to 75 mol % of the aromatic diamines typically used in polyimide aerogels with 1, 3-bis (4-aminophenoxy)-2, 2-dimethylpropane (BAPN). Twenty different formulations of polyimide aerogels were synthesized from 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) and a combination of BAPN and 2,2'-dimethylbenxidine (DMBZ) and cross-linked with 1, 3, 5 triaminophenoxybenzene (TAB). The polymer concentration, n-value, and molar concentration of BAPN and DMBZ were varied to determine an ideal formulation that has both a high bend radius and low dielectric constant. With only aromatic diamines in the backbone, the aerogels are flexible only as very thin films, nominally 0.5 mm thick. Samples containing at least 25 mol % BAPN have higher flexibility in substrates as thick as 2-3 mm and dielectric constants ranging from 1.11-1.26.
Cashman, Jessica↗
Self-assembled InAsSb quantum dots on (001) InP substrates
Self-assembled InAsSb quantum dots (QD) on (001) InP substrates have been grown using metalorganic vapor phase epitaxy. The dot density and size are found to be strongly dependent on the presence of arsine. Direct deposition of InSb on InP and GaSb substrates formed large islands of InSb with low density of less than 53109/cm², however, InAsSb QDs of density as high as 4 X10¹º/cm² could be self-assembled by alternating group III and group V precursors, and high density almost pure InSb QDs were achieved on In0.53Ga0.47As/InP. The formation of high density InAsSb QDs is a result of a local nonequilibrium process and a reduction in mobility of In adatoms on the growth surface due to the presence of arsenic atoms, and in the case of high density almost pure InSb QDs on InGaAs/InP, the InAs interface layer is believed to be responsible. Photoluminescence shows that InSb QDs emit light at room temperature in the range of 1.7–2.2µm.
Uhl, David↗
Process Development for Printing Copper Conductible Ink on Flexible Substrates Using Aerosol Jet Technology
Rise in demand for wearable consumer electronics products has given an impetus to the development of flexible electronics technology encompassing flexible substrates and compatible circuitry. Also, additive manufacturing of flexible electronics is emerging rapidly via several techniques such as Inkjet and Aerosol Jet Printing (AJP). The basic component of all flexible circuits to be printed by these technologies is conductible ink, which is generally silver ink. Few studies exist on the printing of copper conductible ink and not many copper ink formulations are available in the market as that of silver inks. This study aims to develop a process development study for deposition of copper conductible lines on flexible substrates using the aerosol jet printing technology. The process development study includes investigation of photosintering parameters for obtaining desirable electrical resistance and shear load to failure values for the printed line. Different pre-drying techniques such as oven pre-drying and platen pre-drying have been used for improving the electrical and mechanical properties of the conductive traces. Techniques such as optical microscopy and white light interferometry have been used for the characterization of print quality of the conductible lines.
printed electronics↗
Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate
Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. The technology provides an effective and convenient method to additively deposit conductive and insulating materials on any type of substrate. Comparing with traditional manufacturing processes, which involves chemical etching, this technology also comes to be relatively environmental friendly. Despite its status, it is not without its challenges. Starting from the material being compatible in the printer equipment to the point of achieving fine resolutions, and with excellent properties are some of the challenges that printed electronics face. Among the myriad of printing technologies such as Aerosol Jet, micro-dispensing, gravure printing, screen printing, Inkjet printing, Inkjet has gained much attention due to its low-cost, low material consumption, and roll-to-roll capability for mass manufacturing. The technology has been widely used in home and office, but recently gained interest in printed electronics in a research and development setting. Conductive materials used in Inkjet printing generally comprises of metal Nanoparticles that need to be thermally sintered for it to be conductive. The preferred metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given towards photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper Nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate, due to which it is also preferred in low temperature applications. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the resolution of the print along with the effect of post-print processes on electrical and mechanical properties. In this paper, a copper Inkjet ink is utilized for understanding the effect of Inkjet print parameters on the ejected droplet and its resolution. Post-print process is also quantified using a photonic sintering equipment for excellent electrical and mechanical properties. To demonstrate the complete process, commercial-off-the-shelf components will also be mounted on the additively printed pads via Inkjet. Statistically, control charting technique will be utilized to understand the capability of the Inkjet process.
printed electronics↗
3D Printed Substrate
In preparation for long-term, manned, deep space missions, NASA requires a sustainable system for crop and food production. This system has a variety of benefits, including a fresh food supply, improvements in air quality, a lower need to resupply and psychological benefits for the gardeners. Specifically, NASA is attempting to improve and iterate their Vegetable Production System (VEGGIE), a plant growth unit currently aboard the International Space Station (ISS). The VEGGIE unit is highly dependent on a variety of factors, including passive water delivery, growth lights, rooting pillows and cabin conditions. While previous teams have improved and redesigned water reservoirs, the primary objective of the project was to create a new substrate unit to replace the current rooting pillow design. The current design consists of an electrostatic bag filled with arcillite and a slow-release fertilizer pellet. The prototype design retains the fertilizer pellet for nutrient consistency, however the outer bag and arcillite fillings have been replaced with a 3D printed lattice block. This lattice block has several key points that allow it to function in similar ways to the current design: 1. The lattice planes are porous, with each pore offset such that the overall porosity is the same as the arcillite filling. 2. The block demonstrates a wicking nature and is able to pull water upwards towards the roots. This minimizes time needed to integrate with the existing water reservoir. 3. The filament used is highly flexible and is able to pull apart to accommodate root growth. 4. The lattice planes are connected by microfibers left behind from the printing process. These fibers provide support for the growing roots and keep the lattice planes properly aligned. The substrate block design seeks to reduce the payload costs by being entirely 3D printed. While filament would still need to be provided to the ISS, it is far less expensive than shipping arcillite due to the significantly lower weight. The final design has iterated the lattice plane concept and utilizes vertically placed planes with pores running parallel to the water reservoir. This design has reliably shown water uptake and retention and has been successful in growing multiple romaine lettuce plants. Future work should include further growth testing using multiple plant species, compost and reusability testing, food safety testing and microgravity growth testing.
Affan Bhutta↗