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At least 379 records · Page 21

A precision mechanical nerve stimulator

An electromechanical device, used to apply and monitor stimulating pulses to a mammalian motor nerve, has been successfully developed at NASA Langley Research Center. Two existing force transducers, a flight skin friction balance and a miniature skin friction balance which were designed for making aerodynamic drag measurements, were modified and incorporated to form this precision instrument. The nerve stimulator is a type one servomechanism capable of applying and monitoring stimulating pulses of 0 to 10 grams with a precision of better than +/- 0.05 grams. Additionally, the device can be independently used to apply stimulating pulses by displacing the nerve from 0 to 0.25 mm with a precision of better than +/- 0.001 mm while measuring the level of the load applied.

Tcheng, Ping↗

Rotary Release Mechanism With Fusible Link

Rotary release mechanism includes fusible rotary link made of alloy that melts at relatively low temperature of 60 degrees C. When solid, link couples driving shaft to driven shaft. When necessary, link melted to temporarily decouple two shafts. Upon cooling below melting temperature link hardens, so it once again couples two shafts. Release mechanism extremely compact alternative to pyrotechnic release device. Basic concept applied to such other mechanisms as pin pullers, pin pushers, electrical-disconnection mechanisms, and clutches.

Sevilla, Donald R.↗

The Global File System

The global file system (GFS) is a prototype design for a distributed file system in which cluster nodes physically share storage devices connected via a network-like fiber channel. Networks and network-attached storage devices have advanced to a level of performance and extensibility so that the previous disadvantages of shared disk architectures are no longer valid. This shared storage architecture attempts to exploit the sophistication of storage device technologies whereas a server architecture diminishes a device's role to that of a simple component. GFS distributes the file system responsibilities across processing nodes, storage across the devices, and file system resources across the entire storage pool. GFS caches data on the storage devices instead of the main memories of the machines. Consistency is established by using a locking mechanism maintained by the storage devices to facilitate atomic read-modify-write operations. The locking mechanism is being prototyped in the Silicon Graphics IRIX operating system and is accessed using standard Unix commands and modules.

Soltis, Steven R.↗

Nickel-Graphite Composite Compliant Interface and/or Hot Shoe Material

Next-generation high-temperature thermoelectric-power-generating devices will employ segmented architectures and will have to reliably withstand thermally induced mechanical stresses produced during component fabrication, device assembly, and operation. Thermoelectric materials have typically poor mechanical strength, exhibit brittle behavior, and possess a wide range of coefficient of thermal expansion (CTE) values. As a result, the direct bonding at elevated temperatures of these materials to each other to produce segmented leg components is difficult, and often results in localized microcracking at interfaces and mec hanical failure due to the stresses that arise from the CTE mismatch between the various materials. Even in the absence of full mechanical failure, degraded interfaces can lead to increased electrical and thermal resistances, which adversely impact conversion efficiency and power output. The proposed solution is the insertion of a mechanically compliant layer, with high electrical and thermal conductivity, between the low- and high-temperature segments to relieve thermomechanical stresses during device fabrication and operation. This composite material can be used as a stress-relieving layer between the thermoelectric segments and/or between a thermoelectric segment and a hot- or cold-side interconnect material. The material also can be used as a compliant hot shoe. Nickel-coated graphite powders were hot-pressed to form a nickel-graphite composite material. A freestanding thermoelectric segmented leg was fabricated by brazing the compliant pad layer between the high-temperature p- Zintl and low-temperature p-SKD TE segments using Cu-Ag braze foils. The segmented leg stack was heated in vacuum under a compressive load to achieve bonding. The novelty of the innovation is the use of composite material that re duces the thermomechanical stresses en - countered in the construction of high-efficiency, high-temperature therm - o-electric devices. The compliant pad enables the bonding of dissimilar thermoelectric materials while maintaining the desired electrical and thermal properties essential for efficient device operation. The modulus, CTE, electrical, and thermal conductances of the composite can be controlled by varying the ratio of nickel to graphite.

Firdosy, Samad A.↗

High-Temperature Smart Structures for Engine Noise Reduction and Performance Enhancement

One of key NASA goals is to develop and integrate noise reduction technology to enable unrestricted air transportation service to all communities. One of the technical priorities of this activity has been to account for and reduce noise via propulsion/airframe interactions, identifying advanced concepts to be integrated with the airframe to mitigate these noise-producing mechanisms. An adaptive geometry chevron using embedded smart structures technology offers the possibility of maximizing engine performance while retaining and possibly enhancing the favorable noise characteristics of current designs. New high-temperature shape memory alloy (HTSMA) materials technology enables the devices to operate in both low-temperature (fan) and high-temperature (core) exhaust flows. Chevron-equipped engines have demonstrated reduced noise in testing and operational use. It is desirable to have the noise benefits of chevrons in takeoff/landing conditions, but have them deployed into a minimum drag position for cruise flight. The central feature of the innovation was building on rapidly maturing HTSMA technology to implement a next-generation aircraft noise mitigation system centered on adaptive chevron flow control surfaces. In general, SMA-actuated devices have the potential to enhance the demonstrated noise reduction effectiveness of chevron systems while eliminating the associated performance penalty. The use of structurally integrated smart devices will minimize the mechanical and subsystem complexity of this implementation. The central innovations of the effort entail the modification of prior chevron designs to include a small cut that relaxes structural stiffness without compromising the desired flow characteristics over the surface; the reorientation of SMA actuation devices to apply forces to deflect the chevron tip, exploiting this relaxed stiffness; and the use of high-temperature SMA (HTSMA) materials to enable operation in the demanding core chevron environment. The overall conclusion of these design studies was that the cut chevron concept is a critical enabling step in bringing the variable geometry core chevron within reach. The presence of the cut may be aerodynamically undesirable in some respects, but it is present only when the chevron is not immersed in the core jet exhaust. When deployed, the gap closes as the chevron tip enters the high-speed, high-temperature core stream. Aeroacoustic testing and flow visualization support the contention that this cut is inconsequential to chevron performance.

Quackenbush, Todd R.↗

Annular momentum-control device

Rotating ring stores momentum in mechanical system. Drag is reduced by suspending rotating part in magnetic field. Combination of composites and forroceramic materials are used, providing a strong stiff device, which is better damped than metals.

Lyman, J.↗

A Resonant Pulse Detonation Actuator for High-Speed Boundary Layer Separation Control

A variety of different types of actuators have been previously investigated as flow control devices. Potential applications include the control of boundary layer separation in external flows, as well as jet engine inlet and diffuser flow control. The operating principles for such devices are typically based on either mechanical deflection of control surfaces (which include MEMS flap devices), mass injection (which includes combustion driven jet actuators), or through the use of synthetic jets (diaphragm devices which produce a pulsating jet with no net mass flow). This paper introduces some of the initial flow visualization work related to the development of a relatively new type of combustion-driven jet actuator that has been proposed based on a pulse detonation principle. The device is designed to utilize localized detonation of a premixed fuel (Hydrogen)-air mixture to periodically inject a jet of gas transversely into the primary flow. Initial testing with airflow successfully demonstrated resonant conditions within the range of acoustic frequencies expected for the design. Schlieren visualization of the pulsating air jet structure revealed axially symmetric vortex flow, along with the formation of shocks. Flow visualization of the first successful sustained oscillation condition is also demonstrated for one configuration of the current test section. Future testing will explore in more detail the onset of resonant combustion and the approach to conditions of sustained resonant detonation.

Beck, B. T.↗

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni↗

Development of concepts for satellite retrieval devices

The teleoperator being developed to augment the Space Transportation System (STS) for satellite placement, retrieval, or servicing at altitudes or orbital planes where it would be impractical to use the shuttle is primarily a general purpose propulsion stage that can be fitted with manipulator arms, automated servicers and satellite retrieval devices for particular missions. Design concepts for a general purpose retrieval device for docking with a satellite to which a grappling fixture has been attached, and for a retrieval device for docking with the Solar Maximum Mission (SMM) spacecraft were defined. The mechanical aspects of these two devices are discussed as well as the crew operations involved and problems created by the requirement for remote control. Drawings for the two retrieval device concepts are included.

Pruett, E. C.↗

Electro-Active Polymer (EAP) Actuators for Planetary Applications

NASA is seeking to reduce the mass, size, consumed power, and cost of the instrumentation used in its future missions. An important element of many instruments and devices is the actuation mechanism and electroactive polymers (EAP) are offering an effective alternative to current actuators. In this study, two families of EAP materials were investigated, including bending ionomers and longitudinal electrostatically driven elastomers. These materials were demonstrated to effectively actuate manipulation devices and their performance is being enhanced in this on-going study. The recent observations are reported in this paper, include the operation of the bending-EAP at conditions that exceed the harsh environment on Mars, and identify the obstacles that its properties and characteristics are posing to using them as actuators. Analysis of the electrical characteristics of the ionomer EAP showed that it is a current driven material rather than voltage driven and the conductivity distribution on the surface of the material greatly influences the bending performance. An accurate equivalent circuit modeling of the ionomer EAP performance is essential for the design of effective drive electronics. The ionomer main limitations are the fact that it needs to be moist continuously and the process of electrolysis that takes place during activation. An effective coating technique using a sprayed polymer was developed extending its operation in air from a few minutes to about four months. The coating technique effectively forms the equivalent of a skin to protect the moisture content of the ionomer. In parallel to the development of the bending EAP, the development of computer control of actuated longitudinal EAP has been pursued. An EAP driven miniature robotic arm was constructed and it is controlled by a MATLAB code to drop and lift the arm and close and open EAP fingers of a 4-finger gripper. Keywords: Miniature Robotics, Electroactive Polymers, Electroactive Actuators, EAP Materials

Bar-Cohen, Y.↗

Active Tailoring of Lift Distribution to Enhance Cruise Performance

During Phase I of this project, Raytheon Aircraft Company (RAC) has analytically and experimentally evaluated key components of a system that could be implemented for active tailoring of wing lift distribution using low-drag, trailing-edge modifications. Simple systems such as those studied by RAC could be used to enhance the cruise performance of a business jet configuration over a range of typical flight conditions. The trailing-edge modifications focus on simple, deployable mechanisms comprised of extendable small flap panels over portions of the span that could be used to subtly but positively optimize the lift and drag characteristics. The report includes results from low speed wind tunnel testing of the trailing-edge devices, descriptions of potential mechanisms for automation, and an assessment of the technology.

Flamm, Jeffrey D.↗

Dip molding to form intricately-shaped medical elastomer devices

Preshaped mandrel mounted on rotating mechanism is partically immersed in tank filled with liquid elastomer. While mandrel rotates, elastomer film forms om mandrel surface due to surface tension and capillary behavior of liquid. Devices with well-defined flanges can be made using process.

Broyles, H. F.↗

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗

Annual Conference on Nuclear and Space Radiation Effects, 18th, University of Washington, Seattle, WA, July 21-24, 1981, Proceedings

Single event upset phenomena are discussed, taking into account cosmic ray induced errors in IIL microprocessors and logic devices, single event upsets in NMOS microprocessors, a prediction model for bipolar RAMs in a high energy ion/proton environment, the search for neutron-induced hard errors in VLSI structures, soft errors due to protons in the radiation belt, and the use of an ion microbeam to study single event upsets in microcircuits. Basic mechanisms in materials and devices are examined, giving attention to gamma induced noise in CCD's, the annealing of MOS capacitors, an analysis of photobleaching techniques for the radiation hardening of fiber optic data links, a hardened field insulator, the simulation of radiation damage in solids, and the manufacturing of radiation resistant optical fibers. Energy deposition and dosimetry is considered along with SGEMP/IEMP, radiation effects in devices, space radiation effects and spacecraft charging, EMP/SREMP, and aspects of fabrication, testing, and hardness assurance.

Tasca, D. M.↗

Transverse Mode Electron Beam Microwave Generator

An electron beam microwave device having an evacuated interaction chamber to which are coupled a resonant cavity which has an opening between the resonant cavity and the evacuated interaction chamber and an electron gun which causes a narrow beam of electrons to traverse the evacuated interaction chamber. The device also contains a mechanism for feeding back a microwave electromagnetic field from the resonant cavity to the evacuated interaction chamber in such a way as to modulate the direction of propagation of the electron beam, thereby further amplifyjng the microwave electromagnetic field. Furthermore, provision is made for coupling the electromagnetic field out of the electron beam microwave device.

Wharton, Lawrence E.↗

On the Recovery Stress of a Ni50.3Ti29.7Hf20 High Temperature Shape Memory Alloy

Recovery stress in shape memory alloys (SMAs), also known as blocking stress, is an important property generally obtained during heating under a dimensional constraint as the material undergoes the martensitic phase transformation. This property has been instinctively utilized in most SMA shape-setting procedures, and has been used in numerous applications such as fastening and joining, rock splitting, safety release mechanisms, reinforced composites, medical devices, and many other applications. The stress generation is also relevant to actuator applications where jamming loads (e.g., in case the actuator gets stuck and is impeded from moving) need to be determined for proper hardware sizing. Recovery stresses in many SMA systems have been shown to reach stresses in the order of 800 MPa, achieved via thermo-mechanical training such as pre-straining, heat treatments or other factors. With the advent of high strength, high temperature SMAs, recovery stress data has been rarely probed, and there is no information pertinent to the magnitudes of these stresses. Thus, the purpose of this work is to investigate the recovery stress capability of a precipitation strengthened, Ni50.3Ti29.7Hf20 (at.) high temperature SMA in uniaxial tension and compression. This material has been shown to exhibit outstanding strength and stability during constant-stress, thermal cycling, but no data exists on constant-strain thermal cycling. Several training routines were implemented as part of this work including isothermal pre-straining, isobaric thermal cycling, and isothermal cyclic training routines. Regardless of the training method used, the recovery stress was characterized using constant-strain (strain-controlled condition) thermal cycling between the upper and lower cycle temperatures. Preliminary results indicate recovery stresses in excess of 1.5 GPa were obtained after a specific training routine. This stress magnitude is significantly higher than conventional NiTi stress generation capability.

Recovery Stress↗

The flight instrument design for the Terrestrial Planet Finder Interferometer

This paper describes the opto-mechanical systems of the telescopes and beramcombiner spacecraft including the wavefront and optical path control devices and alignment systems. The mechanical layouts of the spacecraft are described along with the predicted performance of the structure in terms of thermal and vibration control. The layout of the control system is also described.

interferometry↗

Hybrid-Electric Aero-Propulsion Controls Testbed Results with Energy Storage

Electrified aircraft propulsion (EAP) research is a priority of the National Aeronautics and Space Administration (NASA) for its potential to increase propulsion system efficiency, performance, and operability at the subsystem and vehicle levels while decreasing emissions. These EAP systems demand more advanced control algorithms due to increased complexity. NASA has developed a reconfigurable, hardware-in-the-loop rig to verify control algorithm performance using a sub-scale electro-mechanical system. A novel capability of this rig is the ability to test full scale EAP control algorithms on a sub-scale representation of the electro-mechanical system without turbomachinery/rotors. A novel feature is the use of a physical energy storage device within the electro-mechanical system. A dual spool, parallel hybrid-electric turbofan architecture and energy management control system is tested with the goal of verifying the ability to obtain turbomachinery model operability benefits while controlling sub-scale electro-mechanical hardware. Pre-test predictions of the turbofan model, control, and rig performance were obtained through simulation using a software model of the rig. Theoretical results showing the true performance of the turbofan model were obtained through a software simulation using full-scale mechanical shaft models. The paper compares theoretical, predicted, and actual test results from the turbofan model, energy management control and rig perspectives. The results show that the presence of sub-scale electro-mechanical hardware did not inhibit the energy management algorithm from achieving turbomachinery operability benefits.

hybrid↗