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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 379 records · Page 21
All sourcesNASA NTRSDOE OSTI
NASA NTRS1988

The effect of diamic acid additives on the dielectric constant of polyimides

The effect of six selected diamic acids additives (including 2,2-prime bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride-aniline (An); 4,4-prime-oxydiphthalic anhydride-An, 3,3-prime diaminodiphenyl sulfone-phthalic anhydride (PA); 4,4-prime-oxydianiline-PA; 2,2-bis 4(4-aminophenoxy)phenyl hexafluoropropane-PA; and 2,2-bis 4(3-aminophenoxy)phenyl hexafluoropropane-PA) on the dielectric constants of low-dielectric-constant polyimide resins was evaluated. It was found that the effect of the incorporation of the diamic acids on reducing the dielectric constant of polyimides may be limited as the dielectric constant of the base resin itself becomes very low. The additives were found to lower the resin's values of glass transition temperature, with no effect on thermooxidative stability.

Stoakley, Diane M.↗
NASA NTRS1987

Lanthanide-containing polyimides

The preparation of a variety of lanthanide-containing polyimide films is described, and results of their characterization are presented. The properties investigated include the glass transition temperature, thermooxidative stability, magnetic susceptibility, and electrical conductivity of the polymer. Films containing lanthanide chlorides, fluorides, and sulfides are flexible, but those containing lanthanide nitrates are extremely brittle. The addition of lanthanide acetates and acetylacetonates caused immediate gelation of two of the synthesis-mixture ingredients. It was found that, in general, the addition of lanthanide to the polyimide increases the density and glass transition temperature of the polymer but slightly decreases the thermooxidative stability.

Stoakley, D. M.↗
NASA NTRS1994

Insoluble, Low-Dielectric-Constant Polyimides

In process, insoluble, low-dielectric-constant polyimides produced by combining dianhydride of bis{4-(3,4-dicarboxyphenoxy) phenyl}perfluoroisopropylidene (BFDA) with fluorinated aromatic diamine; each molecule contains at least one or more CF3 groups. These fully fluorinated polyimides have dielectric constants in range of 2.4 to 2.5 at 10 GHz. Suitable for use as composite matrix resins in advanced aerospace applications. Potential use in microelectronics industry, particularly as insulating resins in production of printed-circuit boards.

St. Clair, Anne K.↗
NASA NTRS1994

Low-Toxicity PMR Polyimide

New low-toxicity PMR system developed and designated LaRC-RP46. Exhibits better processability, toughness, and thermo-oxidative stability than does PMR-15. Polyimide inexpensive and readily processed into high-quality graphite-fiber-reinforced composite. Used as high-performance, high-temperature-resistant adhesive, molding, composite, film, and coating material where low toxicity desired characteristic. Significantly extends applications of PMR-type polyimides.

Pater, Ruth H.↗
NASA NTRS1994

Easily Processable High-Temperature Polyimide

Polymerization without volatile gases leads to high-quality resins. N-CYCAP (amiNe substituted CYClophane Addition Polyimide) is thermoset polyimide developed containing 4-amino{2.2}paracyclophane as end cap. Current improvements in synthesis of end cap include increasing yield to 60 percent overall and decreasing manufacturing time by simplifying synthetic procedure. Enables large-scale production and increases viability of cyclophane end caps for polymers for high-temperature applications. In comparison with neat resin moldings and composite matrix resins made of PMR-II-50, those made of N-CYCAP polymers found to be processable with lower void content and higher thermo-oxidative stability.

Sutter, James K.↗
NASA NTRS1994

Polyimides Containing Silver Trifluoroacetylacetonate

Mechanically strong, flexible, thermally stable, electrically conductive films and coatings suitable for use in electronics industry made by incorporating silver trifluoroacetylacetonate into linear aromatic condensation polyimides. In experimental films, most successful combinations of flexibility and conductivity obtained by use of 1:1, 1:1.74, and 1:2 mole ratios of silver trifluoroacetylacetonate per polyimide repeat unit. Other concentrations of silver trifluoroacetylacetonate used with different heat-treatment schedules to obtain conductive silver-impregnated films.

Stoakley, Diane M.↗
NASA NTRS1994

Electrically Conductive Polyimide Films Containing Gold Surface

Polyimide films exhibiting high thermo-oxidative stability and including electrically conductive surface layers containing gold made by casting process. Many variations of basic process conditions, ingredients, and sequence of operations possible, and not all resulting versions of process yield electrically conductive films. Gold-containing layer formed on film surface during cure. These metallic gold-containing polyimides used in film and coating applications requiring electrical conductivity, high reflectivity, exceptional thermal stability, and/or mechanical integrity. They also find commercial potential in areas ranging from thin films for satellite antennas to decorative coatings and packaging.

Caplan, Maggie L.↗
NASA NTRS1994

Phenylethynyl-Terminated Polyimides

Phenylethynyl-terminated polyimides exhibit properties suitable for films, moldings, adhesives, and composite-material matrices. Polyimides synthesized at various molecular weights, selected to obtain desirable properties for specific applications. Thermally cured to form cross-linked molecular structures typically increasing resistance to solvents, glass-transition temperatures, and moduli of elasticity. Also have low molecular weights and low melt viscosities for easier processing into composites and adhesive bonds.

Jensen, Brian J.↗
NASA NTRS1993

Polyimide based amorphous silicon solar modules

Requirements for space power are increasingly emphasizing lower costs and higher specific powers. This results from new fiscal constraints, higher power requirements for larger applications, and the evolution toward longer distance missions such as a Lunar or Mars base. The polyimide based a-Si modules described are being developed to meet these needs. The modules consist of tandem a-Si solar cell material deposited directly on a roll of polyimide. A laser scribing/printing process subdivides the deposition into discrete cell strips which are series connected to produce the required voltage without cutting the polymer backing. The result is a large, monolithic, blanket type module approximately 30 cm wide and variable in length depending on demand. Current production modules have a specific power slightly over 500 W/Kg with room for significant improvement. Costs for the full blanket modules range from $30/Watt to $150/Watt depending on quantity and engineering requirements. Work to date focused on the modules themselves and adjusting them for the AMO spectrum. Work is needed yet to insure that the modules are suitable for the space environment.

Jeffrey, Frank R.↗
NASA NTRS1994

Tough, processable simultaneous semi-interpenetrating polyimides

A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance, and mechanical performance when compared to the commercial Thermid materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR150B2) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process.

Pater, Ruth H.↗
NASA NTRS1994

Process for preparing an assembly of an article and a polyimide which resists dimensional change, delamination and debonding when exposed to changes in temperature

An assembly of an article and a polyimide composition is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A polyamic acid solution which yields a polyimide having a low coefficient of thermal expansion (CTE) was prepared. Equimolar quantities of an aromatic diamine and an aromatic dianhydride were reacted in a solvent medium to form a polyamic acid solution. A metal ion-containing additive was added to the solution. Examples of this additive are: TbCl3, DyCl3, ErCl3, TmCl3, Al(C5H7O2)3, and Er2S3. The polyamic acid solution was imidized and is combined with the article to form the assembly.

Stoakley, Diane M.↗
NASA NTRS1994

Structure-property relationships in addition polyimides. 1: Resins from four-ring aromatic diamines containing carbonyl and methylene groups

In an effort to improve the processing characteristics of addition-type polyimide resins the use of flexibilized four-ring aromatic diamine moieties was investigated. A series of 12 diamines containing carbonyl and methylene, as well as oxo and thio bridging groups, was synthesized. The diamines were polymerized with the dimethyl ester of 3.3', 4.4' - benzophenonetetracarboxylic acid (BTDE), using the monomethyl ester of nadic acid (NE) as an end-cap. The effect of diamine structure on the solubility and rheological properties during cure was determined. This paper also describes the effect of diamine structure and formulated molecular weight on the glass transition temperature and thermo-oxidative stability at elevated temperatures after various post-cure regimes. The results indicate that polyimides from some of the diamines containing methylene connecting groups have potential as matrix resins for long-term applications at temperatures up to 300 C.

Delvigs, Peter↗
NASA NTRS1995

Polyimides Made From PDMDA

Thermally stable linear aromatic polyimides with improved optical, electrical, and processing characteristics made from 3,3'-bis(3,4-dicarboxyphenoxy)diphenylmethane dianhydride (PDMDA). Made in form of powders that can be dissolved to cast thin films. Potentially useful as coating and matrix materials. Films made vary from transparent to pale yellow. Greater degrees of transparency and lower dielectric constants make these polyimides more suitable for use in some electronic and optical applications; e.g., as insulating materials on wires and protective films on solar photovoltaic cells.

St. Clair, Anne K.↗
NASA NTRS1995

A simulated RTM process for fabricating polyimide (AMB-21) carbon fiber composites

An experimental polyimide matrix, AMB-21 - supplied by NASA/LeRC, was especially formulated to be non-carcinogenic. It was also expected to be amenable to a Resin Transfer Molding Process (RTM). AMB-21 is a solid at room temperature and must be heated to a very high temperature to obtain a fluid state. However, even after heating it to a realistic high temperature, it was found to be too viscous for use in a RTM process. As a result, a promising approach was experimented leading to the introduction of the resin into a solvent solution in order to obtain a viscosity suitable for RTM. A mixture of methanol and tetrahydroferone was found to be a suitable solvent mixture. The matrix solution was introduced into carbon-fiber preform using two techniques: (1) injection of matrix into a Resin Transfer Mold after positioning the preform into the 'mold cavity', and (2) infiltration of matrix into the preform using the 'autoclave through-the-thickness transfer process'. After completing the resin transfer (infiltration) process, the 'filled' preform was heated to 300 F for one hour to reduce the solvent content. The temperature was then increased to 400 F under a vacuum to complete the solvent evaporation and to remove volatile products of the polyimide imidization. The impregnated preform was removed from the mold and press-cured at 200 psi and 600 FF for two hours. The resulting panel was found to be of reasonably good quality. This observation was based on the results obtained from short beam shear strength (700-8000 psi) tests and microscopic examination of the cross-section indicating a very low level of porosity. Further, the flash around the molded panels from the compression molding was free of porosity indicating the removal of volatiles, solvents, and other imidization products. Based on these studies, a new RTM mold containing a diaphragm capable of applying 200 psi at 600 F has been designed and constructed with the expectation that it will allow the incorporation of all of the above processing steps, including the consolidation with the preform in the mold cavity. Moreover, the new diaphragm design will enable to process larger preform panels. Processing studies with the diaphragm mold are being initiated.

Avva, V. Sarma↗
NASA NTRS1995

Statistical Design in Isothermal Aging of Polyimide Resins

Recent developments in research on polyimides for high temperature applications have led to the synthesis of many new polymers. Among the criteria that determines their thermal oxidative stability, isothermal aging is one of the most important. Isothermal aging studies require that many experimental factors are controlled to provide accurate results. In this article we describe a statistical plan that compares the isothermal stability of several polyimide resins, while minimizing the variations inherent in high-temperature aging studies.

Sutter, James K.↗
NASA NTRS1994

Effect Of Molecular Weight On Adhesive Properties Of The Phenylethynyl-Terminated Polyimide LARC(sup TM)-PETI-5

Future civilian aircraft will require the use of advanced adhesive systems with high temperature capabilities. One such material has been developed at the NASA Langley Research Center, a phenylethynyl-terminated polyimide given the designation LARC(sup TM)-PETI-5. Recent work has shown the advantages of similar phenylethynyl-terminated polyimides as films, moldings, adhesives, and composite matrix resins. Phenylethynyl-terminated oligomers provide greater processing windows than materials which incorporate simple ethynyl endcaps. Since these low molecular weight, low melt viscosity oligomers thermally cure without the evolution of volatile by-products, they provide an excellent means of producing polymers with high glass transition temperatures, excellent solvent resistance, and high mechanical properties. Three different versions of LARC(sup TM)-PETI-5 with theoretical number average molecular weights (M(sub n)s) of 250, 5000, and 10000 g/mol were synthesized in this work. Differential Scanning Calorimetry (DSC) measurements were performed on the dry powder form of these materials to establish cure conditions which result in high glass transition temperatures (T(sub g)s). Lap shear specimens were prepared from adhesive tape made from each material and with the thermal cure conditions determined from the DSC data. The tensile shear data established processing conditions which provided the best adhesive strengths. Further testing was performed to establish the properties of LARC(sup TM)-PETI-5 as an adhesive material and to determine its solvent resistance.

Cano, Roberto J.↗
NASA NTRS1998

Synthesis and Characterization of Polyimides with Ether Linkages

A series of polyimides derived from a newly synthesized diamine, namely, 4,4-bis(4-aminophenoxy)-2,2-dimethylbiphenyl (BAPD), were developed and characterized. Their physical and thermal properties were compared to polyimides based on'commercially available 2,2-bis(4-(4-aminophenoxy)phenyl)propane (BAPP).

Chuang, Kathy C.↗