Complex interconnecting of flat packs without multilayer boards.
Stick module interconnection of flat packs into single-axis motherboard
PRINTED CIRCUIT↗
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Reduced costs for solar-cell modules
Production expenses are decreased by embossing encapsulating plastic film to position and secure cells. Electric circuit is printed on plastic film simultaneously with cell encapsulation process. Procedure can be used with standard-contact and wraparound contact cells.
Forestieri, A. F.↗
Low-Dielectric-Constant Polyimide Fibers
In experiments performed at NASA Langley Research Center, low-dielectric-constant polyimide fibers produced by use of resin extrusion. These fibers also have high thermal stability and good tensile properties. Useful in industrial and aerospace applications in which fibers required to have dielectric constants less than 3, high thermal stability, and tensile properties in range of those of standard textile fibers. Potential applications include use in printed circuit-boards and in aircraft composites.
Dorogy, William E., Jr.↗
Electronic Packaging Techniques
A characteristic of aerospace system design is that equipment size and weight must always be kept to a minimum, even in small components such as electronic packages. The dictates of spacecraft design have spawned a number of high-density packaging techniques, among them methods of connecting circuits in printed wiring boards by processes called stitchbond welding and parallel gap welding. These processes help designers compress more components into less space; they also afford weight savings and lower production costs.
Source record↗
Embedded Resistors and Capacitors in Organic and Inorganic Substrates
Embedded resistors and capacitors were purchased from two technology; organic PWB and inorganic low temperature co-fire ceramic (LTCC). Small groups of each substrate were exposed to four environmental tests and several characterization tests to evaluate their performance and reliability. Even though all passive components maintained electrical performance throughout environmental testing, differences between the two technologies were observed. Environmental testing was taken beyond manufacturers' reported testing, but general not taken to failure. When possible, data was quantitatively compared to manufacturer's data.
printed circuit board (PCB)↗
Components to Assembly: Role of Model Based Physics-of-Failure (PoF) Reliability Assessment
No abstract available
Physics of Failure↗
Marshall Space Flight Center Faculty Fellowship Program
The 2017 Marshall Faculty Fellowship Program involved 21 faculty in the laboratories and departments at Marshall Space Flight Center. These faculty engineers and scientists worked with NASA collaborators on NASA projects, bringing new perspectives and solutions to bear. This Technical Memorandum is a compilation of the research reports of the 2017 Marshall Faculty Fellowship program, along with the Program Announcement (Appendix A) and the Program Description (Appendix B). The research affected the following six areas: (1) Materials (2) Propulsion (3) Instrumentation (4) Spacecraft systems (5) Vehicle systems (6) Space science The materials investigations included composite structures, printing electronic circuits, degradation of materials by energetic particles, friction stir welding, Martian and Lunar regolith for in-situ construction, and polymers for additive manufacturing. Propulsion studies were completed on electric sails and low-power arcjets for use with green propellants. Instrumentation research involved heat pipes, neutrino detectors, and remote sensing. Spacecraft systems research was conducted on wireless technologies, layered pressure vessels, and two-phase flow. Vehicle systems studies were performed on life support-biofilm buildup and landing systems. In the space science area, the excitation of electromagnetic ion-cyclotron waves observed by the Magnetospheric Multiscale Mission provided insight regarding the propagation of these waves. Our goal is to continue the Marshall Faculty Fellowship Program funded by Center internal project offices. Faculty Fellows in this 2017 program represented the following minority-serving institutions: Alabama A&M University and Oglala Lakota College.
Six, N. F.↗
Printed Wiring Board Technology Infusion and Supplier Capability Overview
Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at QLF 2018 provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.
PCB fabrication↗
PCB Quality Metrics that Drive Reliability
Risk-based technology infusion is a deliberate and systematic process that defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2021 Events provides the audience a snapshot of quality variations in printed-wiring-board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed-wiring-board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends are then matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk-based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.
Printed circuit boards↗
Analysis of a Dynamic Flexed Flat Cable Harness
Explore the source record for details and available documents.
Flexible PCB↗
Process Development for Printing Copper Conductible Ink on Flexible Substrates Using Aerosol Jet Technology
Rise in demand for wearable consumer electronics products has given an impetus to the development of flexible electronics technology encompassing flexible substrates and compatible circuitry. Also, additive manufacturing of flexible electronics is emerging rapidly via several techniques such as Inkjet and Aerosol Jet Printing (AJP). The basic component of all flexible circuits to be printed by these technologies is conductible ink, which is generally silver ink. Few studies exist on the printing of copper conductible ink and not many copper ink formulations are available in the market as that of silver inks. This study aims to develop a process development study for deposition of copper conductible lines on flexible substrates using the aerosol jet printing technology. The process development study includes investigation of photosintering parameters for obtaining desirable electrical resistance and shear load to failure values for the printed line. Different pre-drying techniques such as oven pre-drying and platen pre-drying have been used for improving the electrical and mechanical properties of the conductive traces. Techniques such as optical microscopy and white light interferometry have been used for the characterization of print quality of the conductible lines.
printed electronics↗
Screen-Printed YBa2Cu3O7-x Films On Alumina
Superconducting films made in relatively simple process. Thick films of YBa2Cu3O7-x superconductor deposited on highly-polished alumina substrates by screen printing. In addition to simplicity, screen-printing technique offers advantage that patterns for electronic and microwave circuits and devices printed directly, without additional etching steps.
Bansal, Narottam P.↗
One-count memory circuit prevents machine mode interaction
One-count memory logic circuit used with electromechanical counter-printer machines operates in either count or print mode. The circuit advances the counter when the machine is in the count mode and provides storage for the count pulse when the machine is in the print mode.
De~forest, B.↗
On-Demand Manufacturing of Electronics
The On-Demand Manufacturing of Electronics (ODME) project develops materials, processes, and device designs to enable electronics, sensors, and semiconductors to be produced in microgravity environments. The demonstration of these technologies provides a pathway for space-based manufacturing of circuits, wearables, energy storage devices, and other electronics. This has facilitated the terrestrial production of devices including a wide range of sensors, printed batteries, and circuits that are additively manufactured using techniques available on the Advanced Toolplate System (ATS). Recent parabolic flight campaigns conducted with the ATS suggest that direct ink write (DIW) technology is suitable for depositing functional material inks in reduced gravity environments. The development of the Advanced Toolplate system also includes several other new tools, including miniaturized versions of the direct write head, fused filament fabrication head, micro-mill, component pick & place head, and two newly developed deposition technologies, the Electrohydrodynamic (EHD) inkjet head (for semiconductors), and the Electrodeposition head (for high performance circuits). These experiments are designed to compare processing and material behavior in zero gravity versus ground-based data for validation of microgravity advantages and de-risking of future orbital demonstrations of these technologies. The ability to conduct experiments in microgravity is a pivotal step in enabling electronic manufacturing technology in space for both terrestrial and deep space applications.
Cadre Francis↗
SPS solid state antenna power combiner
A concept for a solar power satellite antenna power combiner which utilizes solid state dc-rf converters is described. To avoid the power combining losses associated with circuit hybrids it is proposed that the power from multiple solid state amplifiers be combined by direct coupling of each amplifier's output to the radiating antenna structure. The selected power-combining antenna consists of a printed (metalized) microstrip circuit on a ceramic type dielectric substrate which is backed by a shallow lightweight aluminum cavity which sums the power of four microwave sources. The antenna behaves like two one-half wavelength slot-line antennas coupled together via their common cavity structure. A significant feature of the antenna configuration selected is that the radiated energy is summed to yield a single radiated output phase which represents the average insertion phase of the four power amplifiers. This energy may be sampled and, by comparison with the input signal, one can phase error correct to maintain the insertion phase of all solid state power combining modules at exactly the same value. This insures that the insertion phase of each SPS power combining antenna module is identical. An experiment verification program is described.
Fitzsimmons, G. W.↗
SPS solid state antenna power combiner
Solid state dc-rf converters offer potential improvements in reliability, mass and low voltage operation, provided that anticipated efficiencies in excess of 80 percent can be realized. Field effect transistors offer the greatest potential in the SPS frequency band at 2.45 GHz. To implement this approach it is essential that means be found to sum the power of many relatively low power solid state sources in a low-loss manner, and that means be provided to properly control the phase of the outputs of the large number of solid state sources required. To avoid the power combining losses associated with circuit hybrids it was proposed that the power from multiple solid state amplifiers be combined by direct coupling of each amplifier's output to the radiating antenna structure. The selected power-combining antenna consists of a unique printed (metalized) microstrip circuit on a ceramic type dielectric substrate which is backed by a shallow lightweight aluminum cavity which sums the power of four microwave sources. The antenna behaves like two one-half wavelength slot-line antennas coupled together via their common cavity structure.
Fitzsimmons, G. W.↗
Improved printed-wiring boards for high-reliability circuits
Experimental board includes three layers of special tridirectionally woven fabric. Alumina particles play major role in reducing coefficient of expansion. They also serve as heat sink for heat-generating components.
Patterson, W. J.↗