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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 397 records · Page 22
All sourcesNASA NTRSDOE OSTI
NASA NTRS1995

Electrical short circuit and current overload tests on aircraft wiring

The findings of electrical short circuit and current overload tests performed on commercial aircraft wiring are presented. A series of bench-scale tests were conducted to evaluate circuit breaker response to overcurrent and to determine if the wire showed any visible signs of thermal degradation due to overcurrent. Three types of wire used in commercial aircraft were evaluated: MIL-W-22759/34 (150 C rated), MIL-W-81381/12 (200 C rated), and BMS 1360 (260 C rated). A second series of tests evaluated circuit breaker response to short circuits and ticking faults. These tests were also meant to determine if the three test wires behaved differently under these conditions and if a short circuit or ticking fault could start a fire. It is concluded that circuit breakers provided reliable overcurrent protection. Circuit breakers may not protect wire from ticking faults but can protect wire from direct shorts. These tests indicated that the appearance of a wire subjected to a current that totally degrades the insulation looks identical to a wire subjected to a fire; however the 'fire exposed' conductor was more brittle than the conductor degraded by overcurrent. Preliminary testing indicates that direct short circuits are not likely to start a fire. Preliminary testing indicated that direct short circuits do not erode insulation and conductor to the extent that ticking faults did. Circuit breakers may not safeguard against the ignition of flammable materials by ticking faults. The flammability of materials near ticking faults is far more important than the rating of the wire insulation material.

Cahill, Patricia↗
NASA NTRS1996

Electromagnetic radiation generated by arcing in low density plasma

An unavoidable step in the process of space exploration is to use high-power, very large spacecraft launched into Earth orbit. Obviously, the spacecraft will need powerful energy sources. Previous experience has shown that electrical discharges occur on the surfaces of a high-voltage array, and these discharges (arcs) are undesirable in many respects. Moreover, any high voltage conductor will interact with the surrounding plasma, and that interaction may result in electrical discharges between the conductor and plasma (or between two conductors with different potentials, for example, during docking and extravehicular activity). One very important aspect is the generation of electromagnetic radiation by arcing. To prevent the negative influence of electromagnetic noise on the operation of spacecraft systems, it seems necessary to determine the spectra and absolute levels of the radiation, and to determine limitations on the solar array bias voltage that depend on the parameters of LEO plasma and the technical requirements of the spacecraft equipment. This report describes the results of an experimental study and computer simulation of the electromagnetic radiation generated by arcing on spacecraft surfaces. A large set of high quality data was obtained during the Solar Array Module Plasma Interaction Experiment (SAMPIE, flight STS-62) and ground test. These data include the amplitudes of current, pulse forms, duration of each arc, and spectra of plasma waves. A theoretical explanation of the observed features is presented in this report too. The elaborated model allows us to determine the parameters of the electromagnetic noise for different frequency ranges, distances from the arcing site, and distinct kinds of plasma waves.

Vayner, Boris V.↗
NASA NTRS2001

A Cool Tool for Deicing Planes

Nicknamed the "ice zapper," the Electro Expulsive Separation System (EESS) is an aircraft ice removal system that "pulverizes ice and removes layers of ice as thin as frost or as thick as an inch of glaze," according to the principle inventor of the technology. Patented by NASA's Ames Research Center, the EESS consists of layers of conductors encased in materials that are bonded directly to the airframe structure. When ice accumulates on the aircraft, an electric current is sent through the conductors, causing them to pulse. Even though the conductors move less than a twenty-thousandth of an inch in just a millisecond, the movement is sufficient to pulverize the ice. It is this highly accelerated motion that shatters the ice into particles the size of table salt; too small to be harmful to the aircraft. When compared with other systems in use, such as thermal deicers and pneumatic boots, the ice zapper does very well. Thermal deicers are fairly common, although they use an enormous amount of energy and present the possibility of ice refreezing. Pneumatic boots are not always effective because they require an inflation device that is unable to work until a quarter inch of ice has accumulated. With both systems, the ice that is loosened may still be large enough to cause problems for the plane once dislodged.

Source record↗
NASA NTRS1989

Breaking the Ice

Electro-Expulsive Separation System, a low power electro-thermal deicer, was invented by Leonard A. Haslim from the Ames Research Center, who was named 1988 NASA Inventor of the Year for his work. Sold under license by Dataproducts New England, Inc., it consists of an elastic, rubber-like deicer boot on the wing's leading edge with copper ribbons embedded in it. Conductors are separated by slits in between and parallel to the ribbons. When the system is switched on, a bank of capacitors in the power supply discharges into the conductors which induces the conductor pairs to repel each other. This results in a powerful force causing the slit voids to expand explosively, removing ice on the wing. EESS is more flexible, more effective, and easier to maintain than previous systems. Potential ship, bridge and industrial applications are under study.

Source record↗
NASA NTRS2003

Aging Wire Insulation Assessment by Phase Spectrum Examination of Ultrasonic Guided Waves

Wire integrity has become an area of concern to the aerospace community including DoD, NASA, FAA, and Industry. Over time and changing environmental conditions, wire insulation can become brittle and crack. The cracks expose the wire conductor and can be a source of equipment failure, short circuits, smoke, and fire. The technique of using the ultrasonic phase spectrum to extract material properties of the insulation is being examined. Ultrasonic guided waves will propagate in both the wire conductor and insulation. Assuming the condition of the conductor remains constant then the stiffness of the insulator can be determined by measuring the ultrasonic guided wave velocity. In the phase spectrum method the guided wave velocity is obtained by transforming the time base waveform to the frequency domain and taking the phase difference between two waveforms. The result can then be correlated with a database, derived by numerical model calculations, to extract material properties of the wire insulator. Initial laboratory tests were performed on a simple model consisting of a solid cylinder and then a solid cylinder with a polymer coating. For each sample the flexural mode waveform was identified. That waveform was then transformed to the frequency domain and a phase spectrum was calculated from a pair of waveforms. Experimental results on the simple model compared well to numerical calculations. Further tests were conducted on aircraft or mil-spec wire samples, to see if changes in wire insulation stiffness can be extracted using the phase spectrum technique.

Anastasi, Robert F.↗
NASA NTRS2004

Characteristics of Electromagnetic Pulse Propagation in Metal

It is well known that the solution of the diffusion equation for an electromagnetic field with a time harmonic term, e(sup iwt), is in the form of a traveling wave whose amplitude attenuates over distance into a conducting medium. As the attenuation is an increasing function of frequency, the high frequency components attenuate more rapidly than those of low ones upon entering a well conducting object. At the same time, the phase velocity of an individual component is also an increasing function of frequency causing a broadening of the pulse traveling inside a conductor. In the results of our previous study of numerical simulations, the problem of using a gaussian input pulse was immediately clear. First, having the dominant frequency components distributed around zero, the movement of the peak was not well defined. Second, with the amplitude of fourier components varying slowly over a wide range, the dispersion-induced blurring of the peak position was seen to be severe. For the present study, we have used a gaussian modulated single frequency sinusoidal wave, i. e., the carrier, as an input pulse in an effort to improve the issues related to the unclear movement of peak and dispersion as described above. This was based on the following two anticipated advantages: First, the packet moves in a conductor at the group velocity calculated at the carrier frequency, which means it is well controllable. Second, the amplitude of frequency components other than that of the carrier can be almost negligible, such that the effect of dispersion can be significantly reduced. A series of experiments of transmitting electromagnetic pulses through aluminum plates of various thickness was performed to test the validity of the above points. The results of numerical simulation based on wave propagation are discussed with respect to the experimental results. Finally, a simple simulation was performed based on diffusion of a continuous sine wave input and the results are compared with those of a single frequency sinusoidal wave observed over time at difference locations inside a conductor.

Namkung, M.↗
NASA NTRS2006

Fast Erase Method and Apparatus For Digital Media

A non-contact fast erase method for erasing information stored on a magnetic or optical media. The magnetic media element includes a magnetic surface affixed to a toroidal conductor and stores information in a magnetic polarization pattern. The fast erase method includes applying an alternating current to a planar inductive element positioned near the toroidal conductor, inducing an alternating current in the toroidal conductor, and heating the magnetic surface to a temperature that exceeds the Curie-point so that information stored on the magnetic media element is permanently erased. The optical disc element stores information in a plurality of locations being defined by pits and lands in a toroidal conductive layer. The fast erase method includes similarly inducing a plurality of currents in the optical media element conductive layer and melting a predetermined portion of the conductive layer so that the information stored on the optical medium is destroyed.

Oakely, Ernest C.↗
NASA NTRS1998

Magnetic current sensor

A current determiner having an output at which representations of input currents are provided having an input conductor for the input current and a current sensor supported on a substrate electrically isolated from one another but with the sensor positioned in the magnetic fields arising about the input conductor due to any input currents. The sensor extends along the substrate in a direction primarily perpendicular to the extent of the input conductor and is formed of at least a pair of thin-film ferromagnetic layers separated by a non-magnetic conductive layer. The sensor can be electrically connected to a electronic circuitry formed in the substrate including a nonlinearity adaptation circuit to provide representations of the input currents of increased accuracy despite nonlinearities in the current sensor, and can include further current sensors in bridge circuits.

Black, Jr., William C.↗
NASA NTRS2001

Magnetically coupled signal isolator

A current determiner having an output at which representations of input currents are provided having an input conductor for the input current and a current sensor supported on a substrate electrically isolated from one another but with the sensor positioned in the magnetic fields arising about the input conductor due to any input currents. The sensor extends along the substrate in a direction primarily perpendicular to the extent of the input conductor and is formed of at least a pair of thin-film ferromagnetic layers separated by a non-magnetic conductive layer. The sensor can be electrically connected to electronic circuitry formed in the substrate including a nonlinearity adaptation circuit to provide representations of the input currents of increased accuracy despite nonlinearities in the current sensor, and can include further current sensors in bridge circuits.

Black, Jr., William C.↗
NASA NTRS1993

Reversible non-volatile switch based on a TCNQ charge transfer complex

A solid-state synaptic memory matrix (10) having switchable weakly conductive connections at each node (24) whose resistances can be selectably increased or decreased over several orders of magnitude by control signals of opposite polarity, and which will remain stable after the signals are removed, comprises an insulated substrate (16), a set of electrical conductors (14) upon which is deposited a layer (18) of an organic conducting polymer, which changes from an insulator to a conductor upon the transfer of electrons, such as polymerized pyrrole doped with 7,7,8,8-tetracyanoquinodimethane (TCNQ), covered by a second set of conductors (20) laid at right angles to the first.

Nagasubramanian, Ganesan↗
NASA NTRS1989

Thin film memory matrix using amorphous and high resistive layers

Memory cells in a matrix are provided by a thin film of amorphous semiconductor material overlayed by a thin film of resistive material. An array of parallel conductors on one side perpendicular to an array of parallel conductors on the other side enable the amorphous semiconductor material to be switched in addressed areas to be switched from a high resistance state to a low resistance state with a predetermined level of electrical energy applied through selected conductors, and thereafter to be read out with a lower level of electrical energy. Each cell may be fabricated in the channel of an MIS field-effect transistor with a separate common gate over each section to enable the memory matrix to be selectively blanked in sections during storing or reading out of data. This allows for time sharing of addressing circuitry for storing and reading out data in a synaptic network, which may be under control of a microprocessor.

Thakoor, Anilkumar P.↗
NASA NTRS2009

Lunar Module Wiring Design Considerations and Failure Modes

This slide presentation reviews the considerations for the design of wiring for the Lunar Module. Included are a review of the choice of conductors and insulations, the wire splicing (i.e., crimping, and soldering), the wire connectors, and the fabrication of the wire harnesses. The problems in fabrication include the wires being the wrong length, the damage due to the sharp edges, the requried use of temproary protective covers and inadequate training. The problems in the wire harness installation include damge from sharp eges, work on adjacent harnesses, connector damage, and breaking wires. Engineering suggestions from the Apollo-era in reference to the conductors that are reviewed include: the use of plated conductors, and the use of alloys for stronger wiring. In refernce to insulation, the suggestions from Apollo era include the use of polymer tape-wrap wire insulation due to the light weight, however, other types of modern insulation might be more cost-effective. In reference to wire splices and terminal boards the suggestions from the Apollo Era include the use of crimp splices as superior to solder splices, joining multiple wire to a common point using modular plug-ins might be more reliable, but are heavier than crimp splicing. For connectors, the lessons from the Apollo era indicate that a rear environmental seal that does not require additional potting is preferred, and pins should be crimped or welded to the incoming wires and be removable from the rear of the connector.

Interbartolo, Michael↗
NASA NTRS2010

Special Component Designs for Differential-Amplifier MMICs

Special designs of two types of electronic components transistors and transmission lines have been conceived to optimize the performances of these components as parts of waveguide-embedded differential-amplifier monolithic microwave integrated circuits (MMICs) of the type described in the immediately preceding article. These designs address the following two issues, the combination of which is unique to these particular MMICs: Each MMIC includes a differential double-strip transmission line that typically has an impedance between 60 and 100 W. However, for purposes of matching of impedances, transmission lines having lower impedances are also needed. The transistors in each MMIC are, more specifically, one or more pair(s) of InP-based high-electron-mobility transistors (HEMTs). Heretofore, it has been common practice to fabricate each such pair as a single device configured in the side-to-side electrode sequence source/gate/drain/gate/source. This configuration enables low-inductance source grounding from the sides of the device. However, this configuration is not suitable for differential operation, in which it is necessary to drive the gates differentially and to feed the output from the drain electrodes differentially. The special transmission-line design provides for three conductors, instead of two, in places where lower impedance is needed. The third conductor is a metal strip placed underneath the differential double-strip transmission line. The third conductor increases the capacitance per unit length of the transmission line by such an amount as to reduce the impedance to between 5 and 15 W. In the special HEMT-pair design, the side-to-side electrode sequence is changed to drain/gate/source/gate/ drain. In addition, the size of the source is reduced significantly, relative to corresponding sizes in prior designs. This reduction is justified by the fact that, by virtue of the differential configuration, the device has an internal virtual ground, and therefore there is no need for a low-resistance contact between the source and the radio-frequency circuitry. The source contact is needed only for DC biasing. These designs were implemented in a single-stage-amplifier MMIC. In a test at a frequency of 305 GHz, the amplifier embedded in a waveguide exhibited a gain of 0 dB; after correcting for the loss in the waveguide, the amplifier was found to afford a gain of 0.9 dB. In a test at 220 GHz, the overall gain of the amplifier- and-waveguide assembly was found to be 3.5 dB.

Kangaslahti, Pekka↗
NASA NTRS2010

Radio frequency power load and associated method

A radio frequency power load and associated method. A radio frequency power load apparatus includes a container and a fluid having an ion source therein, the fluid being contained in the container. Two conductors are immersed in the fluid. A radio frequency transmission system includes a radio frequency transmitter, a radio frequency amplifier connected to the transmitter and a radio frequency power load apparatus connected to the amplifier. The apparatus includes a fluid having an ion source therein, and two conductors immersed in the fluid. A method of dissipating power generated by a radio frequency transmission system includes the steps of: immersing two conductors of a radio frequency power load apparatus in a fluid having an ion source therein; and connecting the apparatus to an amplifier of the transmission system.

Sims, III, William Herbert↗
NASA NTRS2006

Modified Coaxial Probe Feeds for Layered Antennas

In a modified configuration of a coaxial probe feed for a layered printed-circuit antenna (e.g., a microstrip antenna), the outer conductor of the coaxial cable extends through the thickness of at least one dielectric layer and is connected to both the ground-plane conductor and a radiator-plane conductor. This modified configuration simplifies the incorporation of such radio-frequency integrated circuits as power dividers, filters, and low-noise amplifiers. It also simplifies the design and fabrication of stacked antennas with aperture feeds.

Fink, Patrick W.↗
NASA NTRS2012

Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system

The present invention provides a method of manufacturing an electronic apparatus, such as a lighting device having light emitting diodes (LEDs) or a power generating device having photovoltaic diodes. The exemplary method includes depositing a first conductive medium within a plurality of channels of a base to form a plurality of first conductors; depositing within the plurality of channels a plurality of semiconductor substrate particles suspended in a carrier medium; forming an ohmic contact between each semiconductor substrate particle and a first conductor; converting the semiconductor substrate particles into a plurality of semiconductor diodes; depositing a second conductive medium to form a plurality of second conductors coupled to the plurality of semiconductor diodes; and depositing or attaching a plurality of lenses suspended in a first polymer over the plurality of diodes. In various embodiments, the depositing, forming, coupling and converting steps are performed by or through a printing process.

Ray, William Johnstone↗
NASA NTRS2013

Light emitting, photovoltaic or other electronic apparatus and system

The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of lenses suspended in a polymer deposited or attached over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses and diodes are substantially spherical, and have a ratio of mean diameters or lengths between about 10:1 and 2:1. The diodes may be LEDs or photovoltaic diodes, and in some embodiments, have a junction formed at least partially as a hemispherical shell or cap.

Ray, William Johnstone↗
NASA NTRS2013

Light emitting, photovoltaic or other electronic apparatus and system

The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of substantially spherical or optically resonant diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of substantially spherical lenses suspended in a polymer attached or deposited over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses and diodes have a ratio of mean diameters or lengths between about 10:1 and 2:1. The diodes may be LEDs or photovoltaic diodes, and in some embodiments, have a junction formed at least partially as a hemispherical shell or cap.

Ray, William Johnstone↗