Search NASA⌕ Search

SEARCH · Search NASA

Results for “High Temperature Metals”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 397 records · Page 22
All sourcesNASA NTRSDOE OSTI
NASA NTRS1995

Microwave Induced Combustion Synthesis of Ceramic and Ceramic-Metal Composites

In recent years, there has been a renewed interest in combustion synthesis reactions, commonly called self-propagating high-temperature synthesis. These reactions are an attractive, energy efficient approach to the synthesis of high temperature composite materials and metastable phases. Microwaves are used to induce self-propagating high temperature synthesis of ceramic and ceramic-metal composites.

high-temperature ceramics high-temperature synthes↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗
NASA NTRS2013

Packaging Technologies for 500C SiC Electronics and Sensors

Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

Chen, Liang-Yu↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗
NASA NTRS1983

Unique material requirements in the Space Shuttle Main Engines

Components operating in staged-combustion cycle liquid fuel rocket engines such as the Space Shuttle Main Engines (SSMEs) are subjected to severe temperature changes during start/stop transients, together with extremely high pressures, corrosive gases, high fluid velocities, demanding weight-control criteria, etc. Attention is given to the selection and application of metallic and nonmetallic materials for high temperature resistance, cryogenic properties, and hydrogen and oxygen compatibility. The materials in question include polyimides, Kel-F, Armalon, and Teflon among plastics, and gold and copper platings, weld-overlays and heat treatment modifications among metals and metallic processing techniques. The polymeric materials are oxygen-resistant, and the metallic ones hydrogen-resistant.

Fulton, D. L.↗
NASA NTRS1997

Capability of Thermographic Imaging Defined for Detection in High-Temperature Composite Materials

Significant effort and resources are being expended to develop ceramic matrix (CMC), metal matrix (MMC), and polymer matrix (PMC) composites for high-temperature engine components and other parts in advanced aircraft. The objective of this NASA Lewis Research Center study was to evaluate the ability of a thermographic imaging technique for detecting artificially created defects (flat-bottom holes) of various diameters and depths in four composite systems (two CMC's, one MMC, and one PMC) of interest as high-temperature structural materials.

Roth, Don J.↗
NASA NTRS2009

Operation of SOI P-Channel Field Effect Transistors, CHT-PMOS30, under Extreme Temperatures

Electronic systems are required to operate under extreme temperatures in NASA planetary exploration and deep space missions. Electronics on-board spacecraft must also tolerate thermal cycling between extreme temperatures. Thermal management means are usually included in today s spacecraft systems to provide adequate temperature for proper operation of the electronics. These measures, which may include heating elements, heat pipes, radiators, etc., however add to the complexity in the design of the system, increases its cost and weight, and affects its performance and reliability. Electronic parts and circuits capable of withstanding and operating under extreme temperatures would reflect in improvement in system s efficiency, reducing cost, and improving overall reliability. Semiconductor chips based on silicon-on-insulator (SOI) technology are designed mainly for high temperature applications and find extensive use in terrestrial well-logging fields. Their inherent design offers advantages over silicon devices in terms of reduced leakage currents, less power consumption, faster switching speeds, and good radiation tolerance. Little is known, however, about their performance at cryogenic temperatures and under wide thermal swings. Experimental investigation on the operation of SOI, N-channel field effect transistors under wide temperature range was reported earlier [1]. This work examines the performance of P-channel devices of these SOI transistors. The electronic part investigated in this work comprised of a Cissoid s CHT-PMOS30, high temperature P-channel MOSFET (metal-oxide semiconductor field-effect transistor) device [2]. This high voltage, medium-power transistor is designed for geothermal well logging applications, aerospace and avionics, and automotive industry, and is specified for operation in the temperature range of -55 C to +225 C. Table I shows some specifications of this transistor [2]. The CHT-PMOS30 device was characterized at various temperatures over the range of -190 C to +225 C in terms of its voltage/current characteristic curves. The test temperatures included +22, -50, -100, -150, -175, -190, +50, +100, +150, +175, +200, and +225 C. Limited thermal cycling testing was also performed on the device. These tests consisted of subjecting the transistor to a total of twelve thermal cycles between -190 C and +225 C. A temperature rate of change of 10 C/min and a soak time at the test temperature of 10 minutes were used throughout this work. Post-cycling measurements were also performed at selected temperatures. In addition, re-start capability at extreme temperatures, i.e. power switched on while the device was soaking for a period of 20 minutes at the test temperatures of -190 C and +225 C, was investigated.

Patterson, Richard↗
NASA NTRS2017

Anionic Pt in Silicate Melts at Low Oxygen Fugacity: Speciation, Partitioning and Implications for Core Formation Processes on Asteroids

Most siderophile element concentrations in planetary mantles can be explained by metal/ silicate equilibration at high temperature and pressure during core formation. Highly siderophile elements (HSE = Au, Re, and the Pt-group elements), however, usually have higher mantle abundances than predicted by partitioning models, suggesting that their concentrations have been set by late accretion of material that did not equilibrate with the core. The partitioning of HSE at the low oxygen fugacities relevant for core formation is however poorly constrained due to the lack of sufficient experimental constraints to describe the variations of partitioning with key variables like temperature, pressure, and oxygen fugacity. To better understand the relative roles of metal/silicate partitioning and late accretion, we performed a self-consistent set of experiments that parameterizes the influence of oxygen fugacity, temperature and melt composition on the partitioning of Pt, one of the HSE, between metal and silicate melts. The major outcome of this project is the fact that Pt dissolves in an anionic form in silicate melts, causing a dependence of partitioning on oxygen fugacity opposite to that reported in previous studies.

Medard, E.↗
NASA NTRS2022

The Lithophile Element Budget of Earth’s Core

The relative composition of Earth’s core and mantle were set during core formation. By determining how elements partition between metal and silicate at high pressures and temperatures, measurements of the mantle composition and geophysical observations of the core can be used to understand the mechanisms by which Earth formed. Here we present the results of metal–silicate partitioning experiments for a range of nominally lithophile elements (Al, Ca, K, Mg, O, S, Si, Th, U) and S to 85 GPa and up to 5400 K. With our results and a compilation of literature data, we developed a parameterization for partitioning that accounts for compositional dependencies in both the metal and silicate phases. Using this parameterization in a range of planetary growth models, we find that, in general, lithophile element partitioning into the metallic phase is enhanced at high temperatures. The relative abundances of FeO, SiO2 and MgO in the mantle vary significantly between planetary growth models, and the mantle abundances of these elements can be used to provide important constraints on Earth’s accretion. To match Earth’s core mass and mantle composition, Earth’s building blocks must have been enriched in Fe and depleted in Si compared with CI chondrites. Finally, too little Mg, Si and O are partitioned into the core for precipitation of oxides to be a major source of energy for the geodynamo. In contrast, several ppb of U can be partitioned into the core at high temperatures, and this energy source must be accounted for in thermal evolution models.

dynamo↗
NASA NTRS1951

A Specially Constructed Metallograph for Use at Elevated Temperatures

A Metallographic microscope was developed with provision for heating a specimen to 1800 F in protective atmospheres, that is, vacuum or gas. A special objective was constructed of reflecting elements with an unusually long working distance (7/16 in.) and a high numerical aperture (0.5). Changes in specimen microstructure were observed and recorded on 35-millimeter motion-picture film. The resulting pictures were projected as motion pictures and individual frames were cut and enlargements made for close observation. Structural changes upon heating a 0.35-percent annealed carbon steel and a 5-percent tin phosphor bronze specimen were observed and recorded. Newly formed microstructure were revealed by selective vacuum etching and specimen relief resulting from recrystallization and varying grain orientation.

INSTRUMENTS, LABORATORY↗
NASA NTRS1981

High power densities from high-temperature material interactions

Thermionic energy conversion (TEC) and metallic-fluid heat pipes (MFHPs), offering unique advantages in terrestrial and space energy processing by virtue of operating on working-fluid vaporization/condensation cycles that accept great thermal power densities at high temperatures, share complex materials problems. Simplified equations are presented that verify and solve such problems, suggesting the possibility of cost-effective applications in the near term for TEC and MFHP devices. Among the problems discussed are: the limitation of alkali-metal corrosion, protection against hot external gases, external and internal vaporization, interfacial reactions and diffusion, expansion coefficient matching, and creep deformation.

Morris, J. F.↗
NASA NTRS1983

Process for the production of metal nitride sintered bodies and resultant silicon nitride and aluminum nitride sintered bodies

A process for the manufacture of metal nitride sintered bodies, in particular, a process in which a mixture of metal nitrite powders is shaped and heated together with a binding agent is described. Of the metal nitrides Si3N4 and AIN were used especially frequently because of their excellent properties at high temperatures. The goal is to produce a process for metal nitride sintered bodies with high strength, high corrosion resistance, thermal shock resistance, thermal shock resistance, and avoidance of previously known faults.

Yajima, S.↗
NASA NTRS2003

The Interaction Between an Insoluble Particle and an Advancing Solid/Liquid Interface: Micro-Gravity Experiments and Theoretical Developments

The interaction of an insoluble particle with an advancing solid/liquid interface (SLI) has been a subject of investigation for the past four decades. While the original interest stemmed from geology applications (e.g., frost heaving in soil), researchers soon realized that the complex science associated with such an interaction is relevant to many other scientific fields encompassing metal matrix composites (MMCs), high temperature superconductors, inclusion management in steel, growth of monotectics, and preservation of biological cells. During solidification of a liquid containing an insoluble particle, three distinct interaction phenomena have been experimentally observed: instantaneous engulfment of the particle, continuous pushing, and particle pushing followed by engulfment. It was also observed that for given experimental conditions and particle size there is a critical solidification velocity, V(sub cr), above which a particle is engulfed. During solidification of MMCs pushing leads to particle agglomeration at the grain boundaries and this has detrimental effects on mechanical properties of the casting. Consequently, the process must be designed for instantaneous engulfment to occur. This implies the development of accurate theoretical models to predict V(sub cr), and perform benchmark experiments to test the validity of such models. Although considerable progress has been made in understanding the pushing/engulfment phenomenon (PEP), its quantification in terms of the material and processing parameters remains a focus of research. Since natural convection currents occurring during terrestrial solidification experiments complicate the study of PEP, execution of experiments on the International Space Station (ISS) has been approved and funded by NASA. Extensive terrestrial (1g) experiments and preliminary micro-gravity (mu g) experiments on two space shuttle missions have been conducted in preparation for future experiments on the ISS. The investigated systems included metal-ceramic particles (pure aluminum - zirconia particles) and transparent organic - non-reactive particles (succinonitrile - polystyrene and biphenyl - glass). This paper will discuss the experimental results obtained in both lg and pg conditions and the influence of the natural convection on V(sub cr). A summary of past mathematical models and our recent theoretical developments will also be presented to explain the experimentally observed particle/SLI interaction.

Catalina, Adrian V.↗
NASA NTRS1992

Fabrication Of Metal Chloride Cathodes By Sintering

Transition-metal chloride cathodes for use in high-temperature rechargeable sodium batteries prepared by sintering transition-metal powders mixed with sodium chloride. Need for difficult and dangerous chlorination process eliminated. Proportions of transition metal and sodium chloride in mixture adjusted to suit specific requirements. Cathodes integral to sodium/metal-chloride batteries, which have advantages over sodium/sulfur batteries including energy densities, increased safety, reduced material and thermal-management problems, and ease of operation and assembly. Being evaluated for supplying electrical power during peak demand and electric vehicles.

Bugga, Ratnakumar V.↗
NASA NTRS2005

Performance of Ceramics in Severe Environments

Ceramics are generally stable to higher temperatures than most metals and alloys. Thus the development of high temperature structural ceramics has been an area of active research for many years. While the dream of a ceramic heat engine still faces many challenges, niche markets are developing for these materials at high temperatures. In these applications, ceramics are exposed not only to high temperatures but also aggressive gases and deposits. In this chapter we review the response of ceramic materials to these environments. We discuss corrosion mechanisms, the relative importance of a particular corrodent, and, where available, corrosion rates. Most of the available corrosion information is on silicon carbide (SIC) and silicon nitride (Si3N4) monolithic ceramics. These materials form a stable film of silica (SO2) in an oxidizing environment. We begin with a discussion of oxidation of these materials and proceed to the effects of other corrodents such as water vapor and salt deposits. We also discuss oxidation and corrosion of other ceramics: precurser derived ceramics, ceramic matrix composites (CMCs), ceramics which form oxide scales other than silica, and oxide ceramics. Many of the corrosion issues discussed can be mitigated with refractory oxide coatings and we discuss the current status of this active area of research. Ultimately, the concern of corrosion is loss of load bearing capability. We discuss the effects of corrosive environments on the strength of ceramics, both monolithic and composite. We conclude with a discussion of high temperature wear of ceramics, another important form of degradation at high temperatures.

Jacobson, Nathan S.↗