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ASIC Readout Circuit Architecture for Large Geiger Photodiode Arrays

The objective of this work was to develop a new class of readout integrated circuit (ROIC) arrays to be operated with Geiger avalanche photodiode (GPD) arrays, by integrating multiple functions at the pixel level (smart-pixel or active pixel technology) in 250-nm CMOS (complementary metal oxide semiconductor) processes. In order to pack a maximum of functions within a minimum pixel size, the ROIC array is a full, custom application-specific integrated circuit (ASIC) design using a mixed-signal CMOS process with compact primitive layout cells. The ROIC array was processed to allow assembly in bump-bonding technology with photon-counting infrared detector arrays into 3-D imaging cameras (LADAR). The ROIC architecture was designed to work with either common- anode Si GPD arrays or common-cathode InGaAs GPD arrays. The current ROIC pixel design is hardwired prior to processing one of the two GPD array configurations, and it has the provision to allow soft reconfiguration to either array (to be implemented into the next ROIC array generation). The ROIC pixel architecture implements the Geiger avalanche quenching, bias, reset, and time to digital conversion (TDC) functions in full-digital design, and uses time domain over-sampling (vernier) to allow high temporal resolution at low clock rates, increased data yield, and improved utilization of the laser beam.

Vasile, Stefan↗

Terahertz Array Receivers with Integrated Antennas

Highly sensitive terahertz heterodyne receivers have been mostly single-pixel. However, now there is a real need of multi-pixel array receivers at these frequencies driven by the science and instrument requirements. In this paper we explore various receiver font-end and antenna architectures for use in multi-pixel integrated arrays at terahertz frequencies. Development of wafer-level integrated terahertz receiver front-end by using advanced semiconductor fabrication technologies has progressed very well over the past few years. Novel stacking of micro-machined silicon wafers which allows for the 3-dimensional integration of various terahertz receiver components in extremely small packages has made it possible to design multi-pixel heterodyne arrays. One of the critical technologies to achieve fully integrated system is the antenna arrays compatible with the receiver array architecture. In this paper we explore different receiver and antenna architectures for multi-pixel heterodyne and direct detector arrays for various applications such as multi-pixel high resolution spectrometer and imaging radar at terahertz frequencies.

direct detector arrays↗

Image Correlation Pattern Optimization for Micro-Scale In-Situ Strain Measurements

The accuracy and precision of digital image correlation (DIC) is a function of three primary ingredients: image acquisition, image analysis, and the subject of the image. Development of the first two (i.e. image acquisition techniques and image correlation algorithms) has led to widespread use of DIC; however, fewer developments have been focused on the third ingredient. Typically, subjects of DIC images are mechanical specimens with either a natural surface pattern or a pattern applied to the surface. Research in the area of DIC patterns has primarily been aimed at identifying which surface patterns are best suited for DIC, by comparing patterns to each other. Because the easiest and most widespread methods of applying patterns have a high degree of randomness associated with them (e.g., airbrush, spray paint, particle decoration, etc.), less effort has been spent on exact construction of ideal patterns. With the development of patterning techniques such as microstamping and lithography, patterns can be applied to a specimen pixel by pixel from a patterned image. In these cases, especially because the patterns are reused many times, an optimal pattern is sought such that error introduced into DIC from the pattern is minimized. DIC consists of tracking the motion of an array of nodes from a reference image to a deformed image. Every pixel in the images has an associated intensity (grayscale) value, with discretization depending on the bit depth of the image. Because individual pixel matching by intensity value yields a non-unique scale-dependent problem, subsets around each node are used for identification. A correlation criteria is used to find the best match of a particular subset of a reference image within a deformed image. The reader is referred to references for enumerations of typical correlation criteria. As illustrated by Schreier and Sutton and Lu and Cary systematic errors can be introduced by representing the underlying deformation with under-matched shape functions. An important implication, as discussed by Sutton et al., is that in the presence of highly localized deformations (e.g., crack fronts), error can be reduced by minimizing the subset size. In other words, smaller subsets allow the more accurate resolution of localized deformations. Contrarily, the choice of optimal subset size has been widely studied and a general consensus is that larger subsets with more information content are less prone to random error. Thus, an optimal subset size balances the systematic error from under matched deformations with random error from measurement noise. The alternative approach pursued in the current work is to choose a small subset size and optimize the information content within (i.e., optimizing an applied DIC pattern), rather than finding an optimal subset size. In the literature, many pattern quality metrics have been proposed, e.g., sum of square intensity gradient (SSSIG), mean subset fluctuation, gray level co-occurrence, autocorrelation-based metrics, and speckle-based metrics. The majority of these metrics were developed to quantify the quality of common pseudo-random patterns after they have been applied, and were not created with the intent of pattern generation. As such, it is found that none of the metrics examined in this study are fit to be the objective function of a pattern generation optimization. In some cases, such as with speckle-based metrics, application to pixel by pixel patterns is ill-conditioned and requires somewhat arbitrary extensions. In other cases, such as with the SSSIG, it is shown that trivial solutions exist for the optimum of the metric which are ill-suited for DIC (such as a checkerboard pattern). In the current work, a multi-metric optimization method is proposed whereby quality is viewed as a combination of individual quality metrics. Specifically, SSSIG and two auto-correlation metrics are used which have generally competitive objectives. Thus, each metric could be viewed as a constraint imposed upon the others, thereby precluding the achievement of their trivial solutions. In this way, optimization produces a pattern which balances the benefits of multiple quality metrics. The resulting pattern, along with randomly generated patterns, is subjected to numerical deformations and analyzed with DIC software. The optimal pattern is shown to outperform randomly generated patterns.

Bomarito, G. F.↗

Fabrication of a Hybrid Transition Edge Sensor Array for Lynx

Lynx is a proposed NASA X-Ray telescope flight mission aimed at achieving state-of-the-art angular and energy resolution with a 100 kilopixel array to probe the hot energetic young universe in unprecedented detail. To achieve these goals, our team plans on leveraging our current work in development of the focal plane for the Athena X-Ray Integral Field Unit (X-IFU) while advancing the state-of-the-art in transition edge sensor (TES) X-ray detector technology. The TES is an optimal technology for achieving both high energy and fine angular resolution at the same time because pixel features can be made extremely small and the absorber which dominates the heat capacity can be tuned to meet resolution requirements. Specifically, the proposed mission concept calls for a hybrid detector of three different arrays fabricated in the same planar process in one focal plane and optimized for different science goals. The main arrays consist of 5x5 hydras, 25 pixels of 4 micron thick Au absorbers each with a different thermal link to one common TES. The outer array has absorbers on a 50-micron pitch for most of the 5 arc-minute field-of-view, and the inner array has 25-micron absorbers for the central 1 arc-minute region. A high resolution array consisting of single pixel 1 micron thick Au absorbers on 50-micron pitch will lie off to the side. Reading out an array of this magnitude will likely require improvements in indium bump bonding to superconducting flexible wiring. Fabrication of absorbers of two different sizes requires electroplating through a photoresist mold by careful tuning of the current density to achieve uniform flat absorbers on a fine pitch scale, followed by ion milling to yield narrow streets separating the pixels while preserving high quantum efficiency. We report on progress made at fabricating the hybrid array with different absorber sizes and thicknesses. Further, we also report on ongoing work to adequately heat sink the pixels with backside wire bonding and copper coating. We also report on work to improve detector pixel yield and top side indium bump bonding to flexible wiring.

Focal plane array↗

Prototype Magnetic Calorimeter Arrays with Buried Wiring for the Lynx X-Ray Microcalorimeter

Metallic magnetic calorimeter (MMC) technology is a leading contender for detectors for the Lynx X-ray Microcalorimeter, which is an imaging spectrometer consisting of an array of greater than 100,000 pixels. The fabrication of such large arrays presents a challenge when attempting to route the superconducting wiring from the pixels to the multiplexed readout. If the wiring is designed to be planar, then an aggressive, submicron scale wiring pitch has to be employed, which is technically challenging to design and fabricate on account of the requirements of low inductance, low cross-talk, high critical currents and high yield. An alternative way to achieve large scale, high density wiring is through the use of multiple buried metal layers, planarized by Chemical Mechanical Planarization. This approach is well-suited for connecting thousands of pixels on a large focal plane to readout chips, and also for fabricating sensor meander coils with narrow line widths, which helps in increasing the sensor inductance and thus alleviates stray inductance issues associated with the wiring in large size arrays. In this work we describe the fabrication of high sensor inductance MMC arrays implementing Lynx concepts and incorporating multiple layers of buried Nb wiring. The detector array is composed of three sub-arrays with pixels optimized to meet the different science driven performance requirements of Lynx. In two of the sub-arrays we adopt a thermal multiplexing scheme to read out pixels by coupling 25 absorbers to a single sensor through thermal links of varied thermal conductance. We demonstrate the successful fabrication of multi-absorber MMCs with fine pitch pixels in very large size arrays.

Solid-State Physics↗

Target Optimal Aperture Selection

This document describes the computation of optimal pixels for planetary transit targets. The method we describe is based on that used in the End-to-End Model (ETEM), which simulates Kepler science output. An optimal aperture for a target is defined as the set of pixels which maximizes the signal-to-noise ratio (SNR) for that target. The optimal aperture for a target is determined by using catalog data to generate, for that target, a synthetic image with all background stars and signals and a second synthetic image with the target star's flux only. These images are incorporated into a noise model, from which the SNR of each pixel is computed. The pixels around a target are summed in an order that maximizes the SNR with each term. As dimmer and dimmer pixels contribute to this sum, the SNR reaches a maximum and further terms decrease the SNR. The set of pixels whose SNR sums to this maximum value defines the optimal aperture.

Bryson, Stephen↗

Measuring Electron Temperature Using a Linear Polarizer Versus a Polarization Camera

Polarized K-coronal brightness (pB) of the solar corona can be measured by taking four successive coronal brightness images through a linear polarizer, by turning it through four successive angles in intervals of 45∘ and using a standard formula to measure pB from the total coronal brightness (TB) that contains both the polarized K- and the unpolarized F-coronal brightness. The question is: will the time-dependent, highly dynamic corona illuminate each pixel with the same brightness during the time it takes to take the four successive images? To mitigate this problem we now have the polarization camera, in which, each super-pixel is made up of four sub-pixels, and built in to these four sub-pixels is a polarization mask that contains four linear polarizers orientated at four angles 45∘ apart. This allows the measurement of pB to be made in a single exposure. Here, the question is: will the variations of the coronal brightness in the four adjacent sub-pixels in a super-pixel be sufficiently negligible to assume that they observe the same part of the corona? This article looks for answers to these two questions by conducting two synthetic experiments to measure the electron temperature in the plane of the sky on a spherically asymmetric model (SAM) corona by first using a linear polarizer, and then replacing it with a polarization camera and use statistical analyses to determine how well the measured temperature matched the true temperature for the two cases.

Reginald, Nelson↗

Detecting Nighttime Fire Combustion Phase by Hybrid Application of Visible and Infrared Radiation from Suomi NPP VIIRS

An accurate estimation of biomass burning emissions is 1 partially limited by the lack of knowledge of fire burning phase (smoldering vs. flaming). In recent years, several fire detection products have been developed to provide information of fire radiative power (FRP), location, size, and temperature of fire pixels, but no information regarding fire burning phase is retrieved. The Day-Night band (DNB) aboard Visible Infrared Imaging Radiometer Suite (VIIRS) is sensitive to visible light from flaming fires in nighttime scenes. In contrast, VIIRS 4 m moderate resolution band #13 (M13), though capable of detecting fires at all phases, has no direct sensitivity for discerning fire phase. However, the hybrid usage of VIIRS DNB and M-bands data is hampered by their different scanning technology and spatial resolution. In this study, we present a novel method to rapidly and accurately resample DNB pixel radiances to the footprint of M-band pixels, accounting for onboard detector aggregation schemes and bowtie effect removals. The visible energy fraction (VEF) is subsequently introduced as an indicator of fire burning phase VEF is calculated as the ratio of visible light power (VLP) to FRP for each fire pixel retrieved from the VIIRS 750 m active fire product. A global distribution of VEF values, and thereby the fire phase, is quantitatively obtained, showing smaller VEF values in regions with mostly smoldering wildfires, such as peatland fires in Indonesia, larger VEF values in regions with flaming wildfires over grasslands and savannas in the sub-Sahelian region, and the largest VEF values associated with gas flaring in the Middle East. Mean VEF for different land cover types or regions is highly correlated with modified combustion efficiency (MCE). These results, together with a case study of the 2018 California Camp Fire, show that the VEF has the potential to be an indicator of fire combustion phase for each fire pixel, appropriate for estimating emission factors at the satellite pixel level.

Jun Wang↗

Sensor Chip Assembly (SCA) Test Report

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

WFIRST SCA TEST REPORT↗

SCA Test Report: H4RG-20828 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below.The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗

SCA Test Report, H4RG-20829 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan R Miko↗

SCA Test Report: H4RG-20833 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below.The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗

SCA Test Report: H4RG-20849 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗

Fine Optimization of TES Design for the X-IFU Instrument on ATHENA

The X-ray Integral Field Unit (X-IFU) instrument on the Advanced Telescope for High ENergy Astrophysics (ATHENA) is baselined to have 3168 transition-edge sensor (TES) microcalorimeter pixels. These pixels will be DC biased and readout using time division multiplexing. We recently reported a demonstration of the required pixel and readout performance in 252 pixels from a 1 kilo-pixel array (e.g. 2.16 eV resolution for 6.9 keV X-rays). Having achieved the required performance, the 50um square TES design in this demonstration array is considered the baseline pixel design for X-IFU. However, by making small adjustments to the TES design, we may be able to make small but consequential improvements to the instrument performance, while staying within the many constraints of the X-IFU requirements. In this presentation, we will show results from newly fabricated devices with subtle changes from the baseline TES design to further optimize the performance for X-IFU. We will discuss optimizing the TES sheet resistance, normal metal features, X-ray absorber attachment points, TES aspect ratio, and heat capacity. These minor design changes can have significant effects on thermo-electric time constants, thermal fluctuation noise, resistive transition shape and uniformity, and non-linearity of X-ray event pulses. In addition, full characterization of these new TES designs allows greater understanding of the relevant physics within the TES and gives routes for further optimization.

Nick Wakeham↗

Probabilistic Processing of Asynchronous Geiger-Mode Avalanche Photodiode Arrays for Background Rate Measurements

A system-level performance evaluation of Geiger-mode avalanche photodiode (GmAPD) arrays requires accurate measurement and prediction of the background rate of the device due to dark counts and other spurious detection events. Since a GmAPD detector reports only a binary value and timestamp associated with an avalanche event, dark count rates are typically measured by averaging thousands of frames to support a statistically significant measurement. For both synchronous and asynchronous detector, the Poisson distributed background rates are referenced to the time each pixel is armed. Unlike for synchronous GmAPD imagers where all the pixels are armed to an array-wide arm signal, an asynchronous pixel operates independently from its neighboring pixels; requiring the background rates to be calculated using an interarrival histogram. For both types of imagers, the background rate is typically evaluated by fitting an exponential distribution to a fixed window within a measured histogram of time intervals between detection events However, if the statistics of the background rate are insufficient – whether that is due to low population sizes, saturation, or a large dynamic range of population size across the array, the pixel, or array-wide, performance metrics may report results with varying accuracy. This paper reports on an implementation of an algorithm that evaluates GmAPD background rates based on statistical metrics rather than fixed windows. The algorithm functions by determining the appropriate integration window within the interarrival time histogram based on a per-pixel count rate set by a predetermined tolerable measurement error. The implementation of the algorithm allows us to characterize GmAPD arrays with orders of magnitude spread in background rates across the detector using common statistical parameters.

Mumolo, J.↗

A New Machine Learning Based Analysis for Improving Satellite Retrieved Atmospheric Composition Data: OMI SO2 as an Example

Despite recent progress, satellite retrievals of anthropogenic SO2 still suffer from relatively low signal-tonoise ratios. In this study, we demonstrate a new machine learning data analysis method to improve the quality of satellite SO2 products. In the absence of large ground-truth datasets for SO2, we start from SO2 slant column densities (SCDs) retrieved from the Ozone Monitoring Instrument (OMI) using a data-driven, physically based algorithm and calculate the ratio between the SCD and the root mean square (rms) of the fitting residuals for each pixel. To build the training data, we select presumably clean pixels with small SCD / rms ratios (SRRs) and set their target SCDs to zero. For polluted pixels with relatively large SRRs, we set the target to the original retrieved SCDs. We then train neural networks (NNs) to reproduce the target SCDs using predictors including SRRs for individual pixels, solar zenith, viewing zenith and phase angles, scene reflectivity, and O3 column amounts, as well as the monthly mean SRRs. For data analysis, we employ two NNs: (1) one trained daily to produce analyzed SO2 SCDs for polluted pixels each day and (2) the other trained once every month to produce analyzed SCDs for less polluted pixels for the entire month. Test results for 2005 show that our method can significantly reduce noise and artifacts over background regions. Over polluted areas, the monthly mean NN-analyzed and original SCDs generally agree to within ±15 %, indicating that our method can retain SO2 signals in the original retrievals except for large volcanic eruptions. This is further confirmed by running both the NN-analyzed and original SCDs through a topdown emission algorithm to estimate the annual SO2 emissions for ∼ 500 anthropogenic sources, with the two datasets yielding similar results. We also explore two alternative approaches to the NN-based analysis method. In one, we employ a simple linear interpolation model to analyze the original SCD retrievals. In the other, we develop a PCA–NN algorithm that uses OMI measured radiances, transformed and dimension-reduced with a principal component analysis (PCA) technique, as inputs to NNs for SO2 SCD retrievals. While the linear model and the PCA–NN algorithm can reduce retrieval noise, they both underestimate SO2 over polluted areas. Overall, the results presented here demonstrate that our new data analysis method can significantly improve the quality of existing OMI SO2 retrievals. The method can potentially be adapted for other sensors and/or species and enhance the value of satellite data in air quality research and applications.

Can Li↗

Geometric Assessment of PlanetScope Imagery

Commercial companies such as Maxar, Planet Labs, and BlackSky have built large archives of high resolution (1-3 m) Earth observing data. The high temporal resolution and global coverage of these satellites makes commercial satellite images ideal for scientists studying rapidly changing processes such as flooding and fires. The high spatial resolution allows scientists to push studies to a fine scale such as monitoring agricultural growth experiments or detecting vehicles for traffic management. Scientists using these data need to know geolocation accuracy, band-to-band registration (BBR), and pixel footprint size to best determine appropriate applications as well as what extra steps they will need to take to use the data. Here, we find those key geometric properties for images from Planet Labs’ SuperDove constellation. Geolocation accuracy is assessed relative to WorldView images at globally distributed cities, band-to-band registration (BBR) is examined for every image we acquired (200+ images), and pixel footprint sizes are calculated from edge responses of the images over Cal/Val sites in China, India, or USA both near launch time and 1+ years after launch. We find that SuperDove geolocation is highly self-consistent with average global offsets among SuperDove images of 3.80 m (1.27 pixels). Despite this self-consistency, relative geolocation accuracy (with WorldView images as reference) varies by location from 3.20 m – 28.09 m mean offset. SuperDove BBR is sub-pixel and varies by band, with a mean radial offset relative to red band varying from 0.39 - 1.13 m. SuperDove image footprint size improves after 1+ years in orbit, with an average footprint size of 3.41 pixels (10.24 m) soon after launch and 3.23 pixels (9.7 m) 1+ years after launch. The BBR and self-consistency offsets are relatively small, given the large footprint sizes. A similarly extensive investigation is in progress for Planet Labs’ Dove-R series.

Alana G. Semple↗

Investigation of correlation classification techniques

A two-step classification algorithm for processing multispectral scanner data was developed and tested. The first step is a single pass clustering algorithm that assigns each pixel, based on its spectral signature, to a particular cluster. The output of that step is a cluster tape in which a single integer is associated with each pixel. The cluster tape is used as the input to the second step, where ground truth information is used to classify each cluster using an iterative method of potentials. Once the clusters have been assigned to classes the cluster tape is read pixel-by-pixel and an output tape is produced in which each pixel is assigned to its proper class. In addition to the digital classification programs, a method of using correlation clustering to process multispectral scanner data in real time by means of an interactive color video display is also described.

Haskell, R. E.↗