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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 397 records · Page 22
All sourcesNASA NTRSDOE OSTI
NASA NTRS1990

Healing of voids in the aluminum metallization of integrated circuit chips

The thermal stability of GaAs modulation-doped field effect transistors (MODFETs) is evaluated in order to identify failure mechanisms and validate the reliability of these devices. The transistors were exposed to thermal step-stress and characterized at ambient temperatures to indicate device reliability, especially that of the transistor ohmic contacts with and without molybdenum diffusion barriers. The devices without molybdenum exhibited important transconductance deterioration. MODFETs with molybdenum diffusion barriers were tolerant to temperatures above 300 C. This tolerance indicates that thermally activated failure mechanisms are slow at operational temperatures. Therefore, high-reliability MODFET-based circuits are possible.

Cuddihy, Edward F.↗
NASA NTRS1991

An area model for on-chip memories and its application

An area model suitable for comparing data buffers of different organizations and arbitrary sizes is described. The area model considers the supplied bandwidth of a memory cell and includes such buffer overhead as control logic, driver logic, and tag storage. The model gave less than 10 percent error when verified against real caches and register files. It is shown that, comparing caches and register files in terms of area for the same storage capacity, caches generally occupy more area per bit than register files for small caches because the overhead dominates the cache area at these sizes. For larger caches, the smaller storage cells in the cache provide a smaller total cache area per bit than the register set. Studying cache performance (traffic ratio) as a function of area, it is shown that, for small caches, direct-mapped caches perform significantly better than four-way set-associative caches and, for caches of medium areas, both direct-mapped and set-associative caches perform better than fully associative caches.

Mulder, Johannes M.↗
NASA NTRS1991

Single-chip microcontrollers for switchgear control

A switchgear controller utilizing a microcontroller is described. The primary goal was to mimic the functions and performance of the generic controller board with a microcontroller board which will cause the power automation system to consume less power. The code for the microcontroller implementation on a development board has been developed, and the signal conditioning for the signals to the microcontroller has been designed and tested. The implementation of this decision system for data gathering, command control, fault detection, and circuit protection, when compared to other implementations, provides more functions and better response while reducing weight, volume, and power consumption.

Watson, Karan↗
NASA NTRS1990

Narrow bandgap semiconducting silicides: Intrinsic infrared detectors on a silicon chip

Work done during the final report period is presented. The main technical objective was to achieve epitaxial growth on silicon of two semiconducting silicides, ReSi2 and CrSi2. ReSi2 thin films were grown on (001) silicon wafers by vacuum evaporation of rhenium onto hot substrates in ultrahigh vacuum. The preferred epitaxial relationship was found to be ReSi2(100)/Si(001) with ReSi2(010) parallel to Si(110). The lattice matching consists of a common unit mesh of 120 A(sup 2) area, and a mismatch of 1.8 percent. Transmission electron microscopy revealed the existence of rotation twins corresponding to two distinct but equivalent azimuthal orientations of the common unit mesh. MeV He(+) backscattering spectrometry revealed a minimum channeling yield of 2 percent for an approximately 1,500 A thick film grown at 650 C. Although the lateral dimension of the twins is on the order of 100 A, there is a very high degree of alignment between the ReSi2(100) and the Si(001) planes. Highly oriented films of CrSi2 were grown on (111) silicon substrates, with the matching crystallographic faces being CrSi2(001)/Si(111). The reflection high-energy electron diffraction (RHEED) patterns of the films consist of sharp streaks, symmetrically arranged. The predominant azimuthal orientation of the films was determined to be CrSi2(210) parallel to Si(110). This highly desirable heteroepitaxial relationship has been obtained previously by others; it may be described with a common unit mesh of 51 A(sup 2) and mismatch of 0.3 percent. RHEED also revealed the presence of limited film regions of a competing azimuthal orientation, CrSi2(110) parallel to Si(110). A channeling effect for MeV He(+) ions was not found for this material. Potential commercial applications of this research may be found in silicon-integrated infrared detector arrays. Optical characterizations showed that semiconducting ReSi2 is a strong absorber of infrared radiation, with the adsorption constant increasing above 2 x 10(exp 4) cm(sup -1) for photon energies above 0.2 eV. CrSi2 is of potential utility for detection at photon energies above approximately 0.3 eV.

Mahan, John E.↗
NASA NTRS1993

Chips off of asteroid 4 Vesta - Evidence for the parent body of basaltic achondrite meteorites

For more than two decades, asteroid 4 Vesta has been debated as the source for the eucrite, diogenite, and howardite classes of basaltic achondrite meteorites. Its basaltic achondrite spectral properties are unlike those of other large main-belt asteroids. Telescopic measurements have revealed 20 small main-belt asteroids that have distinctive optical reflectance spectral features similar to those of Vesta and eucrite and diogenite meteorites. Twelve have orbits that are similar to Vesta's and were previously predicted to be dynamically associated with Vesta. Eight bridge the orbital space between Vesta and the 3:1 resonance, a proposed source region for meteorites. These asteroids are most probably multikilometer-sized fragments excavated from Vesta through one or more impacts. The sizes, ejection velocities of 500 meters per second, and proximity of these fragments to the 3:1 resonance establish Vesta as a dynamically viable source for eucrite, diogenite, and howardite meteorites.

Binzel, Richard P.↗
NASA NTRS1992

Quartz/fused silica chip carriers

The primary objective of this research and development effort was to develop monolithic microwave integrated circuit (MMIC) packaging which will operate efficiently at millimeter-wave frequencies. The packages incorporated fused silica as the substrate material which was selected due to its favorable electrical properties and potential performance improvement over more conventional materials for Ka-band operation. The first step towards meeting this objective is to develop a package that meets standard mechanical and thermal requirements using fused silica and to be compatible with semiconductor devices operating up to at least 44 GHz. The second step is to modify the package design and add multilayer and multicavity capacity to allow for application specific integrated circuits (ASIC's) to control multiple phase shifters. The final step is to adapt the package design to a phased array module with integral radiating elements. The first task was a continuation of the SBIR Phase 1 work. Phase 1 identified fused silica as a viable substrate material by demonstrating various plating, machining, and adhesion properties. In Phase 2 Task 1, a package was designed and fabricated to validate these findings. Task 2 was to take the next step in packaging and fabricate a multilayer, multichip module (MCM). This package is the predecessor to the phased array module and demonstrates the ability to via fill, circuit print, laminate, and to form vertical interconnects. The final task was to build a phased array module. The radiating elements were to be incorporated into the package instead of connecting to it with wire or ribbon bonds.

Source record↗
NASA NTRS1992

Applications of correlator chips in radio science

Spectral line observations in radio astronomy require simultaneous power estimation in many (often hundreds to thousands) frequency bins. Digital autocorrelation spectrometers, which appeared thirty years ago, are now being implemented in VLSI. The same architecture can be used to implement transversal digital filters. This was done at the Arecibo Observatory for pulse compression in radar observations of Venus.

Hagen, John B.↗
NASA NTRS1995

Averting Denver Airports on a Chip

As a result of recent advances in software engineering capabilities, we are now in a more stable environment. De-facto hardware and software standards are emerging. Work on software architecture and design patterns signals a consensus on the importance of early system-level design decisions, and agreements on the uses of certain paradigmatic software structures. We now routinely build systems that would have been risky or infeasible a few years ago. Unfortunately, technological developments threaten to destabilize software design again. Systems designed around novel computing and peripheral devices will spark ambitious new projects that will stress current software design and engineering capabilities. Micro-electro-mechanical systems (MEMS) and related technologies provide the physical basis for new systems with the potential to produce this kind of destabilizing effect. One important response to anticipated software engineering and design difficulties is carefully directed engineering-scientific research. Two specific problems meriting substantial research attention are: A lack of sufficient means to build software systems by generating, extending, specializing, and integrating large-scale reusable components; and a lack of adequate computational and analytic tools to extend and aid engineers in maintaining intellectual control over complex software designs.

Sullivan, Kevin J.↗
NASA NTRS1999

System-on-Chip Data Processing and Data Handling Spaceflight Electronics

This paper presents a methodology and a tool set which implements automated generation of moderate-size blocks of customized intellectual property (IP), thus effectively reusing prior work and minimizing the labor intensive, error-prone parts of the design process. Customization of components allows for optimization for smaller area and lower power consumption, which is an important factor given the limitations of resources available in radiation-hardened devices. The effects of variations in HDL coding style on the efficiency of synthesized code for various commercial synthesis tools are also discussed.

Kleyner, I.↗
NASA NTRS1998

ELIPS: Toward a Sensor Fusion Processor on a Chip

The paper presents the concept and initial tests from the hardware implementation of a low-power, high-speed reconfigurable sensor fusion processor. The Extended Logic Intelligent Processing System (ELIPS) processor is developed to seamlessly combine rule-based systems, fuzzy logic, and neural networks to achieve parallel fusion of sensor in compact low power VLSI. The first demonstration of the ELIPS concept targets interceptor functionality; other applications, mainly in robotics and autonomous systems are considered for the future. The main assumption behind ELIPS is that fuzzy, rule-based and neural forms of computation can serve as the main primitives of an "intelligent" processor. Thus, in the same way classic processors are designed to optimize the hardware implementation of a set of fundamental operations, ELIPS is developed as an efficient implementation of computational intelligence primitives, and relies on a set of fuzzy set, fuzzy inference and neural modules, built in programmable analog hardware. The hardware programmability allows the processor to reconfigure into different machines, taking the most efficient hardware implementation during each phase of information processing. Following software demonstrations on several interceptor data, three important ELIPS building blocks (a fuzzy set preprocessor, a rule-based fuzzy system and a neural network) have been fabricated in analog VLSI hardware and demonstrated microsecond-processing times.

Daud, Taher↗
NASA NTRS2001

Chip for CCSDS Compatible Serial Data Streams

A configurable service processor for telemetry ground stations is totally implemented in VLSI/ASIC hardware and finds use in spacecraft systems and other communications systems that operate according to CCSDS and CCSDS-like protocols. The service processor performs the traditional functions of data extraction at very high data and packet rates.

Jason T Dowling↗
NASA NTRS2001

A 1.2 THz Planar Tripler Using GaAs Membrane Based Chips

Fabrication technology for submillimeter-wave monolithic circuits has made tremendous progress in recent years and it is now possible to fabricate sub-micron GaAs Schottky devices on a number of substrate types, such as membranes, frame-less membranes or substrateless circuits. These new technologies allow designers to implement very high frequency circuits, either Schottky mixers or multipliers, in a radically new manner. This paper will address the design, fabrication, and preliminary results of a 1.2 THz planar tripler fabricated on a GaAs frame-less membrane, the concept of which was described previously. The tripler uses a diode pair in an antiparallel configuration similar to designs used at lower frequency. To date, this tripler has produced a peak output power of 80 microW with 0.9% efficiency at room temperature (at 1126 GHz). The measured fix-tuned 3 dB bandwidth is about 3.5%. When cooled, the output power reached a peak of 195 microW at 120 K and 250 microW at 50 K. The ease with which this circuit was implemented along with the superb achieved performance indicates that properly designed planar devices such as this tripler can now usher in a new era of practical very high frequency multipliers.

Bruston, J.↗
NASA NTRS1998

Anti-Hassle Chip

With assistance from NASA's Ames Research Center, the iTV Corporation has developed a full custom microprocessor that enables access to the Internet through a $49 device. The microprocessor is supported with a compliment of design tools for customization and adaptation as either a licensable core or as a complete microprocessor. Other uses include cell phones, DVD (digital versatile disk) players, cable modems, video conferencing equipment, digital cameras, wireless LANs (Local Area Network) and WANs (Wide Area Network). iTV continues to design new, low-cost consumer products.

Source record↗
NASA NTRS1998

All-in-One Chip

Under an SBIR contract, EMC Technology, Inc., was funded to develop a family of Temperature Compensating Attenuators. These devices are used to compensate for changes in amplifier gain with temperatures. Special thermistor materials were developed that not only satisfied NASA requirements, but also proved useful on several new commercial products. New Thermopad devices with greater compensation and lower loss were developed and used by companies such as Hughes Space and Communications, Motorola, Lucent, Ericsson, and General Instrument. A Power Sensing Termination (Smartload) was also developed for use in communication systems that require accurate, reliable, low cost power detection for level control and alarm circuits.

Source record↗
NASA NTRS2003

Carbon Nanotube Nanoelectrode Array as an Electronic Chip for Ultrasensitive Label-free DNA Detection

A reliable nanoelectrode array based on vertically aligned multi-walled carbon nanotubes (MWNTs) embedded in SiO2 is used for ultrasensitive DNA detection. Characteristic nanoelectrode behavior is observed using low-density MWNT arrays for measuring both bulk and surface immobilized redox species such as K4Fe(CN)6 and ferrocene derivatives. The open-end of MWNTs are found to present similar properties as graphite edge-plane electrodes with wide potential window, flexible chemical functionalities, and good biocompatibility. BRCA1 related oligonucleotide probes with 18 bp are selectively functionalized at the open ends of the nanotube array and specifically hybridized with oligonucleotide targets incorporated with a polyG tag. The guanine groups are employed as the signal moieties in the electrochemical measurements. R(bpy)(sup 2+, sub 3) mediator is used to further amplify the guanine oxidation signal. The hybridization of sub-attomoles of DNA targets is detected electrochemically by combining the MWNT nanoelectrode array with the R(bpy)(sup 2+, sub 3) amplification mechanism. This technique was employed for direct electrochemical detection of label-free PCR amplicon from a healthy donor through specific hybridization with the BRCA1 probe. The detection limit is estimated to be less than 1000 DNA molecules since abundant guanine bases in the PCR amplicon provides a large signal. This system provides a general platform for rapid molecular diagnostics in applications requiring ultrahigh sensitivity, high-degree of miniaturization, and simple sample preparation, and low-cost operation.

Li, Jun↗
NASA NTRS2004

Spiral Chip Implantable Radiator and Printed Loop External Receptor for RF Telemetry in Bio-Sensor Systems

The paper describes the operation of a patented wireless RF telemetry system, consisting of a bio-MEMS implantable sensor and an external hand held unit, operating over the frequency range of few hundreds of MHz. A MEMS capacitive pressure sensor integrated with a miniature inductor/antenna together constitute the implantable sensor. Signal processing circuits collocated with a printed loop antenna together form the hand held unit, capable of inductively powering and also receiving the telemetry signals from the sensor. The paper in addition, demonstrates a technique to enhance the quality factor and inductance of the inductor in the presence of a lower ground plane and also presents the radiation characteristics of the loop antenna.

Simons, Rainee N.↗
NASA NTRS2005

MEMS Direct Chip Attach Packaging Methodologies and Apparatuses for Harsh Environments

Methods of bulk manufacturing high temperature sensor sub-assembly packages are disclosed and claimed. Sensors are sandwiched between a top cover and a bottom cover so as to enable the peripheries of the top covers, sensors and bottom covers to be sealed and bound securely together are disclosed and claimed. Sensors are placed on the bottom covers leaving the periphery of the bottom cover exposed. Likewise, top covers are placed on the sensors leaving the periphery of the sensor exposed. Individual sensor sub- assemblies are inserted into final packaging elements which are also disclosed and claimed. Methods of directly attach- ing wires or pins to contact pads on the sensors are disclosed and claimed. Sensors, such as pressure sensors and accelerometers, and headers made out of silicon carbide and aluminum nitride are disclosed and claimed. Reference cavities are formed in some embodiments disclosed and claimed herein where top covers are not employed.

Okojie, Robert S.↗