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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 397 records · Page 22
All sourcesNASA NTRSDOE OSTI
DOE OSTI2026

Power Electronics Module with Integrated Ceramic Heat Exchanger

NREL, in partnership with Synteris and Packet Digital, has developed a 3D-printable ceramic package for power electronic modules to improve their thermal management, power density, performance, and lifetime. Existing power modules contain flat ceramic substrates that serve as both the electrically insulating component and thermal conductor that transfer the large heat outputs of these devices. The team has developed an additive manufacturing process that replaces the traditional insulating metalized substrate, substrate attach, and baseplate/heat exchanger with an additively-manufactured ceramic packaging that acts as both an electrical insulator and heat exchanger for better thermal management. The design, manufacturability, and function of this power module will be discussed.

25 ENERGY STORAGE↗
NASA NTRS2000

NASA Parts Selection List (NPSL) WWW Site http://nepp.nasa.gov/npsl

The NASA Parts Selection List (NPSL) is an on-line resource for electronic parts selection tailored for use by spaceflight projects. The NPSL provides a list of commonly used electronic parts that have a history of satisfactory use in spaceflight applications. The objective of this www site is to provide NASA projects, contractors, university experimenters, et al with an easy to use resource that provides a baseline of electronic parts from which designers are encouraged to select. The NPSL is an ongoing resource produced by Code 562 in support of the NASA HQ funded NASA Electronic Parts and Packaging (NEPP) Program. The NPSL is produced as an electronic format deliverable made available via the referenced www site administered by Code 562. The NPSL does not provide information pertaining to patented or proprietary information. All of the information contained in the NPSL is available through various other public domain resources such as US Military procurement specifications for electronic parts, NASA GSFC's Preferred Parts List (PPL-21), and NASA's Standard Parts List (MIL-STD975).

Brusse, Jay↗
NASA NTRS1974

Television observations of artificial aurora and analyses of flight data from NASA payload 12.18 NE

An accelerator nominally capable of ejecting pulses of electrons up to 6 sec in length, current to 500 ma and energy to 20 keV was flown on a rocket at 1500 October 15, 1972. The Strypi rocket was launched from the Pacific Missile Range Facility at Kauai, Hawaii. The intent was to eject electron pulses of various characteristics upwards along the magnetic field so as to produce artificial auroras in the conjugate (Southern Hemisphere) atmosphere and possibly to produce weaker auroras in the nearby atmosphere as a consequence of backscattered electrons. The accelerator package included a gas jet actuated attitude control system controlled by gyros. Attitude sensing also was accomplished by a two-axis fluxgate magnetometer, and a large foil was deployed to collect ambient electrons to neutralize the accelerator when it ejected high-energy electrons. Scientific instrumentation contained on the flight package included retarding potential analyzers, energetic electron detectors, and detectors to sense very low frequency radio noise. Image orthicon television systems and other optical sensors were operated in the conjugate region aboard two NC-135 jet aircrafts based in Samoa. Similar devices were operated at Haleakala, Hawaii, to attempt detection of auroras caused by backscattered electrons.

Davis, T. N.↗
NASA NTRS1986

Theoretical and Experimental Beam Plasma Physics (TEBPP)

The theoretical and experimental beam plasma physics (TEBPP) consists of a package of five instruments to measure electric and magnetic fields, plasma density and temperature, neutral density, photometric emissions, and energetic particle spectra during firings of the particle injector (SEPAC) electron beam. The package is developed on a maneuverable boom (or RMS) and is used to measure beam characteristics and induced perturbations field ( 10 m) and mid field ( 10 m to 100 m) along the electron beam. The TEBPP package will be designed to investigate induced oscillations and induced electromagnetic mode waves, neutral and ion density and temperature effects, and beam characteristics as a function of axial distance.

Roberts, B.↗
NASA NTRS1985

Theoretical and Experimental Beam Plasma Physics (TEBPP)

The theoretical and experimental beam plasma physics (TEBPP) consists of a package of five instruments to measure electric and magnetic fields, plasma density and temperature, neutral density, photometric emissions, and energetic particle spectra during firings of the particle injector (SEPAC) electron beam. The package is deployed on a maneuverable boom (or RMS) and is used to measure beam characteristics and induced perturbations in the near field ( 10 m) and mid field (10 m to 100 m) along the electron beam. The TEBPP package will be designed to investigate induced oscillations and induced electromagnetic mode waves, neutral and ion density and temperature effects, and beam characteristics as a function of axial distance.

Roberts, W. T.↗
NASA NTRS2019

Standardizing Microprocessor and GPU Radiation Test Approaches

Microprocessor, Graphics Processing Units (GPUs) and DDRx memory devices have emerged as promising next-generation technologies that enables both high performance processing and acceleration of complex algorithms for the latest challenges in human spaceflight, autonomous vehicles and artificial intelligence (AI). The feature sets of these devices offer exponential increases to throughput, calculation capability and system autonomy when compared to legacy flight systems. NASA's Electronic Part and Packaging (NEPP) Program has conducted an investigation into the radiation susceptibility of leading edge devices and process technologies by establishing standardized test approaches. Unlike most discrete devices, these require state of the art test systems to induce specific hardware activity similar to application software, thus allowing the characterization of failure modes within the system. To best characterize the tested part, NEPP eliminates variables that may impact device performance under radiation. Simplification of remaining system-level variables leads to an improved understanding of complex computational devices and their intended applications. The failure modes and error signatures that are recorded during testing are used to determine radiation sensitivity of the semiconductor process and the microcode architecture of the design. This presentation will discuss the test methodology that NASA Electronic Parts and Packaging (NEPP) is working to establish for its microprocessor, GPU and DDRx memory test programs to provide guidance on these devices and their underlying technology, in regards to their potential usage in future space flight systems.

GPU↗
NASA NTRS1982

Thematic mapper flight model preshipment review data package. Volume 4: Appendix. Part E: Electronics module data

Tests to verify the as-designed performance of all circuits within the thematic mapper electronics module unit are described. Specifically, the tests involved the evaluation of the scan line corrector driver, shutter drivers function, cal lamp controller function, post amplifier function, command decoder verification unit, and the temperature and actuator controllers function.

Source record↗
NASA NTRS2009

Evaluation methodology guidance for stack packages

This report provides evaluation methodology guidance based on previous National Aeronautics and Space Administration (NASA) reports and literature surveys for 3D stack packages and assemblies. Two aspects of technology are covered: the package itself (guidance for functional packages) and package assembly manufacturing and reliability. This work was funded by the NASA Electronic Parts and Packaging (NEPP) Program. The objectives of this NEPP project are to: Perform a literature survey of 3D stack technology; perform a literature survey on the evaluation methodology for 3D package and assembly; combine the two aspects to provide evaluation methodology for both aspects with consideration of interactions between package and assembly; generate guidance on the evaluation methodology for 3D stack package integrity prior to and after assembly; provide recommendations on future experimental activities. The qualification and evaluation methodology guidelines will facilitate NASA projects in effectively evaluating the reliability of very dense and newly available high-density 3D stack packages, allowing more processing power in a smaller board footprint and lower system weight.

Gerke, David↗
NASA NTRS2002

Low Temperature Reliability of Electronic Packages/Assemblies for Space Missions

A NASA-wide team, funded under the NASA Electronic Parts and Packaging Program (NEPP), was formed to collaborate and to establish reliability of various electronic parts/packaging and assemblies for operation under extreme cold temperatures. One of the primary objectives of the NEPP is to expedite the infusion of cutting edge technologies into the present and future NASA missions. Commercial-off-the-shelf (COTS) emerging electronic parts/packages due to their lower weight, increased functionality, and lower cost are excellent candidates for space missions if they are characterized to show that they will meet the stringent reliability and quality requirements. Characterizations, especially for the extreme cold temperatures, are required since very limited data are available by manufacturers or users. For severe military environments, the temperature conditions to -65 C are the lowest temperature for which these parts/packages and assemblies are qualified. New data beyond this relatively benign cold temperature are required for numerous NASA missions. Several parts/packages, based on the project recommendation for their immediate and future needs, were selected for detailed characterization to cold temperature regimes down to liquid nitrogen (-196 C), covering both Mars cold temperature (-125 C) and asteroid (- 180 C) lander environmental requirements. Numerous parts/packages and assemblies were characterized during extreme temperature environmental tests. Several electrical parameters were characterized at discrete temperatures to -185 C to determine if they remain within their specification ranges. Both packages and circuit boards were subjected to nondestructive testing including optical, X-ray, and acoustic microscopy to document their integrity prior to environment exposure. Package/board assemblies were also subjected to X-ray to characterize solder joint integrity including void levels. Both parts and assemblies were subjected to thermal cycling with a large temperature swing enveloping numerous NASA missions. Details of the performed tests and the results obtained are presented.

Patterson, Richard L.↗