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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 397 records · Page 22

Heating of the ambient ionosphere by an artificially injected electron beam

An electrostatic analyzer on the electron accelerator of the Electron Echo 2 experiment showed that the electrons of the background plasma were heated to 10,000 K or more within 8 ms of the start of gun pulses. The degree of heating was dependent on the orientation of the rocket with respect to the magnetic field but was not measurably dependent on ambient electron density, neutral atmosphere density, or on the pitch angle at which the 40-keV electron beam was injected. This heating was also accompanied by an increase of plasma density. No evidence was found for an ion-free region around the rocket during gun pulses. These observations show that significant amounts of ionization are taking place around the rocket. During part of the flight a two-temperature electron distribution was found. It is believed that the high-temperature part of these distributions represents secondaries produced by the beam.

Cartwright, D. G.↗

Electron temperature measurements using a 12-channel array probe

The most common technique for determining the mean kinetic energy of electrons in low-temperature plasmas utilizes the so-called Langmuir probe. The present investigation is concerned with the study of the electron temperature in a pulsed high-beta plasma as a function of time by means of a miniature array of 12 planar Langmuir probes. By using a probe with many individually collecting surfaces, each biased at a different fixed voltage, an approximation to the true probe characteristic is obtained when monitoring the collected currents for each independent subprobe. The employed method, by using many points, provides enough information to reconstruct the entire I-V curve. Attention is given to the principle of operation of the new probe, calibration, accuracy, time resolution, and applications of the new method. By employing two probes it is possible to perform correlation measurements to study heat flow and temperature fluctuations.

Wild, N.↗

Large-scale variations of thermal electron parameters in the solar wind between 0.3 and 1 AU

Variations of thermal electron parameters in the solar wind are studied at heliocentric distances from 0.3 to 1 AU using Helios data from 1974 to spring 1976 just before solar minimum. Consideration is given to variations across plasma streams and across the sector structure of the IMF. It is found that, in high-speed streams in the interior of magnetic sectors, the electron temperatures are relatively low and strongly anisotropic. The electron temperatures become larger and less anisotropic toward sector boundaries in the slow solar wind. Radial gradients for the thermal electron parameters and polytrope indices for the core temperatures and electron temperatures are studied. Evidence is presented that the electrons in high-speed streams are heated by external heat sources. Interplanetary electrostatic potential differences caused by the thermal electron pressure gradients are estimated to be between 30 and 90 V.

Pilipp, W. G.↗

Evaluation of high temperature superconductive thermal bridges for space-borne cryogenic infrared detectors

The focus of this research is on the reduction of the refrigeration requirements for infrared sensors operating in space through the use of high temperature superconductive (HTS) materials as electronic leads between the cooled sensors and the relatively warmer data acquisition components. Specifically, this initial study was directed towards the design of an experiment to quantify the thermal performance of these materials in the space environment. First, an intensive review of relevant literature was undertaken, and then, design requirements were formulated. From this background information, a preliminary experimental design was developed. Additional studies will involve a thermal analysis of the experiment and further modifications of the experimental design.

Scott, Elaine P.↗

Electromagnetic Radiation in the Plasma Environment Around the Shuttle

As part of the SAMPIE (The Solar Array Module Plasma Interaction Experiment) program, the Langmuir probe (LP) was employed to measure plasma characteristics during the flight STS-62. The whole set of data could be divided into two parts: (1) low frequency sweeps to determine voltage-current characteristics and to find electron temperature and number density; (2) high frequency turbulence (HFT dwells) data caused by electromagnetic noise around the shuttle. The broadband noise was observed at frequencies 250-20,000 Hz. Measurements were performed in ram conditions; thus, it seems reasonable to believe that the influence of spacecraft operations on plasma parameters was minimized. The average spectrum of fluctuations is in agreement with theoretical predictions. According to purposes of SAMPIE, the samples of solar cells were placed in the cargo bay of the shuttle, and high negative bias voltages were applied to them to initiate arcing between these cells and surrounding plasma. The arcing onset was registered by special counters, and data were obtained that included the amplitudes of current, duration of each arc, and the number of arcs per one experiment. The LP data were analyzed for two different situations: with arcing and without arcing. Electrostatic noise spectra for both situations and theoretical explanation of the observed features are presented in this report.

Vayner, Boris V.↗

Low Frequency Waves in the Plasma Environment Around the Shuttle

As a part of the SAMPIE (The Solar Array Module Plasma Interaction Experiment) program, the Langmuir probe (LP) was employed to measure plasma characteristics during the flight of STS-62. The whole set of data could be divided into two parts: (1) low frequency sweeps to determine voltage-current characteristics and to find the electron temperature and number density; (2) high frequency turbulence (HFT) data caused by electromagnetic noise around the Shuttle. Broadband noise was observed at 250-20,000 Hz frequencies. Measurements were performed in ram conditions; thus, it seems reasonable to believe that the influence of spacecraft operations on plasma parameters was minimized. It is shown that ion acoustic waves were observed, and two kinds of instabilities are suggested for explanation of the origin of these waves. According to the purposes of SAMPIE, samples of solar cells were placed in the cargo bay of the Shuttle, and high negative bias voltages were applied to them to initiate arcing between these cells and the surrounding plasma. The arcing onset was registered by special counters, and data were obtained that included the amplitudes of current, duration of each arc, and the number of arcs per one experiment. The LP data were analyzed for two different situations: with arcing and without arcing. Electrostatic noise spectra for both situations and a theoretical explanation of the observed features are presented in this paper.

Vayner, Boris V.↗

Electron Microscopy of Natural and Epitaxial Diamond

Semiconducting diamond films have the potential for use as a material in which to build active electronic devices capable of operating at high temperatures or in high radiation environments. Ultimately, it is preferable to use low-defect-density single crystal diamond for device fabrication. We have previously investigated polycrystalline diamond films with transmission electron microscopy (TEM) and scanning electron microscopy (SEM), and homoepitaxial films with SEM-based techniques. This contribution describes some of our most recent observations of the microstructure of natural diamond single crystals and homoepitaxial diamond thin films using TEM.

Posthill, J. B.↗

Materials Development for Auxiliary Components for Large Compact Mo/Au TES Arrays

We describe our current fabrication process for arrays of superconducting transition edge sensor microcalorimeters, which incorporates superconducting Mo/Au bilayers and micromachined silicon structures. We focus on materials and integration methods for array heatsinking with our bilayer and micromachining processes. The thin superconducting molybdenum bottom layer strongly influences the superconducting behavior and overall film characteristics of our molybdenum/gold transition-edge sensors (TES). Concurrent with our successful TES microcalorimeter array development, we have started to investigate the thin film properties of molybdenum monolayers within a given phase space of several important process parameters. The monolayers are sputtered or electron-beam deposited exclusively on LPCVD silicon nitride coated silicon wafers. In our current bilayer process, molybdenum is electron-beam deposited at high wafer temperatures in excess of 500 degrees C. Identifying process parameters that yield high quality bilayers at a significantly lower temperature will increase options for incorporating process-sensitive auxiliary array components (AAC) such as array heat sinking and electrical interconnects into our overall device process. We are currently developing two competing technical approaches for heat sinking large compact TES microcalorimeter arrays. Our efforts to improve array heat sinking and mitigate thermal cross-talk between pixels include copper backside deposition on completed device chips and copper-filled micro-trenches surface-machined into wafers. In addition, we fabricated prototypes of copper through-wafer microvias as a potential way to read out the arrays. We present an overview on the results of our molybdenum monolayer study and its implications concerning our device fabrication. We discuss the design, fabrication process, and recent test results of our AAC development.

Finkbeiner, F. m.↗

A Cooling System for the EAPU Shuttle Upgrade

The Shuttle orbiter currently uses hydrazine-powered APU's for powering its hydraulic system pumps. To enhance vehicle safety and reliability, NASA is pursuing an APU upgrade where the hydrazine powered turbine is replaced by an electric motor pump and battery power supply. This EAPU (Electric APU) upgrade presents several thermal control challenges most notably the new requirement for moderate temperature control of high-power electron ics at 132 of (55.6 C). This paper describes how the existing Water Spray Boiler (WSB), which currently cools the hydraulic fluid and APU lubrication oil, is being modified to provide EAPU thermal management.

Tongue, Stephen↗

Carbon Nanotube-Based Digital Vacuum Electronics and Miniature Instrumentation for Space Exploration

JPL has developed high performance cold cathodes using arrays of carbon nanotube bundles that produce > 15 A/sq cm at applied fields of 5 to 8 V/micron without any beam focusing. They have exhibited robust operation in poor vacuums of 10(exp -6) to 10(exp -4) Torr- a typically achievable range inside hermetically sealed microcavities. Using these CNT cathodes JPL has developed miniature X-ray tubes capable of delivering sufficient photon flux at acceleration voltages of <20kV to perform definitive mineralogy on planetary surfaces; mass ionizers that offer two orders of magnitude power savings, and S/N ratio better by a factor of five over conventional ionizers. JPL has also developed a new class of programmable logic gates using CNT vacuum electronics potentially for Venus in situ missions and defense applications. These digital vacuum electronic devices are inherently high-temperature tolerant and radiation insensitive. Device design, fabrication and DC switching operation at temperatures up to 700 C are presented in this paper.

Carbon Nanotube↗

Visualization techniques for the gyrokinetic tokamak simulation code

Gyrokinetic simulations of plasma microturbulence in tokamaks are challenging to visualize because the compute grid follows the magnetic field lines that spiral around the torus. We have overcome this challenge by developing three new approaches that improve visualization of gyrokinetics. Our techniques work directly with the topology of magnetic flux surfaces where the simulation stores variables in concentric rings on poloidal planes (vertical cross sections of the torus). Our visualization preview step triangulates each consecutive pair of rings to display the data on a poloidal plane. The second visualization technique follows spiral field lines around the torus and constructs polygons to visualize a flux surface. Third, the poloidal triangles are connected between planes to form prisms that compose a 3-D model of the entire torus. The visualization workflow produces detailed geometry that matches the high resolution, irregular compute grid for every time step. The surface and solid models are displayed in scientific visualization programs to effectively explore and communicate the results, including fluctuation of electron density, ion temperature, and electrostatic potential. Highly detailed renderings verify plasma behavior along magnetic field lines over time.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire -bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500°C are reviewed.

High Temperature, Packaging, Alumina, Thick Film↗

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3 ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3 ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire - bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500oC are reviewed.

high temperature↗

Cryogenic Quenching Process for Electronic Part Screening

The use of electronic parts at cryogenic temperatures (less than 100 C) for extreme environments is not well controlled or developed from a product quality and reliability point of view. This is in contrast to the very rigorous and well-documented procedures to qualify electronic parts for mission use in the 55 to 125 C temperature range. A similarly rigorous methodology for screening and evaluating electronic parts needs to be developed so that mission planners can expect the same level of high reliability performance for parts operated at cryogenic temperatures. A formal methodology for screening and qualifying electronic parts at cryogenic temperatures has been proposed. The methodology focuses on the base physics of failure of the devices at cryogenic temperatures. All electronic part reliability is based on the bathtub curve, high amounts of initial failures (infant mortals), a long period of normal use (random failures), and then an increasing number of failures (end of life). Unique to this is the development of custom screening procedures to eliminate early failures at cold temperatures. The ability to screen out defects will specifically impact reliability at cold temperatures. Cryogenic reliability is limited by electron trap creation in the oxide and defect sites at conductor interfaces. Non-uniform conduction processes due to process marginalities will be magnified at cryogenic temperatures. Carrier mobilities change by orders of magnitude at cryogenic temperatures, significantly enhancing the effects of electric field. Marginal contacts, impurities in oxides, and defects in conductor/conductor interfaces can all be magnified at low temperatures. The novelty is the use of an ultra-low temperature, short-duration quenching process for defect screening. The quenching process is designed to identify those defects that will precisely (and negatively) affect long-term, cryogenic part operation. This quenching process occurs at a temperature that is at least 25 C colder than the coldest expected operating temperature. This quenching process is the opposite of the standard burn-in procedure. Normal burn-in raises the temperature (and voltage) to activate quickly any possible manufacturing defects remaining in the device that were not already rejected at a functional test step. The proposed inverse burn-in or quenching process is custom-tailored to the electronic device being used. The doping profiles, materials, minimum dimensions, interfaces, and thermal expansion coefficients are all taken into account in determining the ramp rate, dwell time, and temperature.

Sheldon, Douglas J.↗

Pseudogap in electron-doped cuprates: Strong correlation leading to band splitting

The pseudogap phenomena have been a long-standing mystery of the cuprate high-temperature superconductors. The pseudogap in the electron-doped cuprates has been attributed to band folding due to antiferromagnetic (AFM) long-range order or short-range correlation. We performed an angle-resolved photoemission spectroscopy study of the electron-doped cuprates Pr 1.3−x La 0.7 Ce x CuO 4 showing spin-glass, disordered AFM behaviors, and superconductivity at low temperatures and, by measurements with fine momentum cuts, found that the gap opens on the unfolded Fermi surface rather than the AFM Brillouin zone boundary. The gap did not show a node, following the full symmetry of the Brillouin zone, and its magnitude decreased from the zone-diagonal to (π,0) directions, opposite to the hole-doped case. These observations were reproduced by cluster dynamical-mean-field-theory calculation, which took into account electron correlation precisely within a (CuO 2 ) 4 cluster. In conclusion, the present experimental and theoretical results are consistent with the mechanism that electron or hole doping into a Mott insulator creates an in-gap band that is separated from the upper or lower Hubbard band by the pseudogap.

74 ATOMIC AND MOLECULAR PHYSICS↗

Diffusion mechanisms in Ir-coated Re for high-temperature, radiation-cooled rocket thrusters

Materials used for radiation-cooled rocket thrusters must be capable of surviving under extreme conditions of high temperatures and oxidizing environments. Thruster chambers were developed using chemical-vapor-deposited (CVD) Re coated with CVD Ir on the inside surface which is exposed to hot combustion gases. Ir serves as an oxidation barrier protecting the Re which maintains structural integrity at high temperatures. In order to predict and extend the performance limits of these Ir-coated Re thrusters, the diffusion kinetics of CVD materials at temperature are studied. Thruster end ring sections were examined using electron microprobe analysis both before and after exposure to high temperature vacuum environments. The resulting elemental maps for Re, Ir, and Mo in the near-surface region allow identification of diffusion mechanisms operating at these temperatures. Line scans for Ir and Re were fit using a diffusion model to extract relevant diffusion constants. The fastest diffusion process is seen to be grain boundary diffusion with Re diffusing down grain boundaries in the Ir overlayer. The measured dependence of the diffusion rate on temperature will allow prediction of operating lifetimes for these thrusters.

Hamilton, J. C.↗

A Risk Analysis Tool for Estimating the Risk of Electrical Failures Due to Human Induced Defects

Aerospace electrical systems are required to withstand and adequately operate in extremely harsh environments that include, for example, high radiation exposure, temperature extremes, intense vibrational stress and drastic temperature cycling. The nature of aerospace electronics also demands high reliability since, with very few exceptions, there is no chance for hardware servicing or repairs. Common risk mitigation techniques for this type of situation are to perform a Reliability Analysis of the system throughout the development cycle, and to use electrical components that are regarded as “high reliability” because of additional controls and requirements applied in their design, manufacturing and testing. Unfortunately, studies have shown that even though these techniques are used, many systems fail to meet mission requirements well before the predicted lifetimes. This paper presents the analysis of failures of electrical parts, experienced during various stages of system development, at NASA Goddard Space Flight Center, Greenbelt MD, between the years 2001 and 2013. These components were subjected to qualification, screening and testing in which the goal was to ensure that the components would survive the stresses of the mission. The analysis categorizes failures by part type and failure mechanisms. One of the results of the analysis was the realization that a surprising proportion of failures experienced during system integration and testing were caused by human error (i.e. human induced defect). Further analysis included the determination of root failure mechanisms and any influencing factors contributing to these failures. The major causes of these defects were attributed to electrostatic damage (ESD), electrical overstress (EOS), mechanical overstress (MOS), and thermal overstress (TOS). Finally, the study proposes a risk analysis tool which incorporates these major causes for the failures, termed error-producing conditions (EPCs), and a proportionality factor representing the number of each type of failure that has occurred at the facility under study. These factors are quantified and used to communicate the risk of human induced defects for the assembly, integration and testing of space hardware based on the system’s electrical parts list. The new risk identification can trigger risk-mitigating actions more effectively, based on the presence of component categories or other hazardous conditions that have a history of failure due to human error.

Majewicz, Peter J.↗

Electron temperature anisotropy in the polar wind

The steady state flow of a fully ionized H(+)-O(+)-electron plasma along geomagnetic field lines in the high-latitude topside ionosphere is investigated theoretically, with emphasis on the electron temperature anisotropy and heat flow in the polar wind. The 13-moment system of transport equations developed by Schunk (1975, 1977), which contains a continuity, momentum, internal energy, stress tensor and heat flow equation for each species, is employed to represent the electrons, with a simplified set of transport equations used for the ions, and the transport equations are solved at altitudes from 1500 to 12,000 km for both subsonic and supersonic H(+) outflows. For subsonic H(+) outflows, the electron gas is found to remain collision dominated to high altitudes. For supersonic H(+) outflows, the electron gas is also found to be collision dominated at altitudes below 2500 km, with an anisotropy in electron temperature distribution developing such that the temperature of the perpendicular electrons is greater than that of the parallel electrons at higher altitudes. In addition, the magnitude of downward electron heat flux at 1500 km is shown to have a dramatic effect on the individual parallel and perpendicular electron temperatures.

Schunk, R. W.↗