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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Easily constructed tool can be used to pull dual in-line packaged integrated circuits off printed-wiring boards without damaging pins. Extractor can be designed for most popular IC configurations and sizes.
Nondestructive testing techniques for multilayer printed wiring boards stressing axial transverse laminography and mutual coupling
The paper describes the operation of a patented wireless RF telemetry system, consisting of a bio-MEMS implantable sensor and an external hand held unit, operating over the frequency range of few hundreds of MHz. A MEMS capacitive pressure sensor integrated with a miniature inductor/antenna together constitute the implantable sensor. Signal processing circuits collocated with a printed loop antenna together form the hand held unit, capable of inductively powering and also receiving the telemetry signals from the sensor. The paper in addition, demonstrates a technique to enhance the quality factor and inductance of the inductor in the presence of a lower ground plane and also presents the radiation characteristics of the loop antenna.
To aid engineers that design power supply systems two analysis tools that can be used with the state equation analysis package were developed. These tools include integration routines that start with the description of a power supply in state equation form and yield analytical results. The first tool uses a computer program that works with the SUPER SCEPTRE circuit analysis program and prints the state equation for an electrical network. The state equations developed automatically by the computer program are used to develop an algorithm for reducing the number of state variables required to describe an electrical network. In this way a second tool is obtained in which the order of the network is reduced and a simpler terminal model is obtained.
Progress was made in the continuing development of the ink jet printing system for thick film circuits. The unit being used is a prototype ink jet printer. One of the first tasks completed was the complete documentation of this ink jet printing system as it existed. It was determined that this was an essential step in deciding what modifications were needed to the system and how these modifications would be implemented. Design modification studies were started for electronic, mechanical, and programming aspects of the ystem. The areas needeing improvement were discussed and applicable changes decided upon. Some improvments were completed. Although the general areas needing improving were identified and some changes decided upon, the exact details of how other changes can be implemented are yet been decided.
Electronic circuit is used in a paper chromatograph instrument that has excellent sensitivity and furnishes a printed record of each test. The circuit measures and records changes in conductivity in a strip of chromatographic paper as different solutions are placed on it.
A new technique is presented for in-vivo remote query measurement of the complex permittivity spectra of a biological culture solution. A sensor comprised of a printed inductor-capacitor resonant-circuit is placed within the culture solution of interest, with the impedance spectrum of the sensor measured using a remotely located loop antenna; the complex permittivity spectra of the culture is calculated from the measured impedance spectrum. The remote query nature of the sensor platform enables, for example, the in-vivo real-time monitoring of bacteria or yeast growth from within sealed opaque containers. The wireless monitoring technique does not require a specific alignment between sensor and antenna. Results are presented for studies conducted on laboratory strains of Bacillus subtilis, Escherichia coli JM109, Pseudomonas putida and Saccharomyces cerevisiae.
The goal of this technology is to provide improved calibration and measurement sensitivity to the Soil Moisture Active Passive Mission (SMAP) radiometer. While RF switches have been used in the past to calibrate microwave radiometers, the switch used on SMAP employs several techniques uniquely tailored to the instrument requirements and passive remote-sensing in general to improve radiometer performance. Measurement error and sensitivity are improved by employing techniques to reduce thermal gradients within the device, reduce insertion loss during antenna observations, increase insertion loss temporal stability, and increase rejection of radar and RFI (radio-frequency interference) signals during calibration. The two legs of the single-pole double-throw reference switch employ three PIN diodes per leg in a parallel-shunt configuration to minimize insertion loss and increase stability while exceeding rejection requirements at 1,413 MHz. The high-speed packaged diodes are selected to minimize junction capacitance and resistance while ensuring the parallel devices have very similar I-V curves. Switch rejection is improved by adding high-impedance quarter-wave tapers before and after the diodes, along with replacing the ground via of one diode per leg with an open circuit stub. Errors due to thermal gradients in the switch are reduced by embedding the 50-ohm reference load within the switch, along with using a 0.25-in. (approximately equal to 0.6-cm) aluminum prebacked substrate. Previous spaceflight microwave radiometers did not embed the reference load and thermocouple directly within the calibration switch. In doing so, the SMAP switch reduces error caused by thermal gradients between the load and switch. Thermal issues are further reduced by moving the custom, highspeed regulated driver circuit to a physically separate PWB (printed wiring board). Regarding RF performance, previous spaceflight reference switches have not employed high-impedance tapers to improve rejection. The use of open-circuit stubs instead of a via to provide an improved RF short is unique to this design. The stubs are easily tunable to provide high rejection at specific frequencies while maintaining very low insertion loss in-band.
In-flight facility data acquisition, distribution, and recording on the NASA Ames Research Center (ARC) DC-8 are performed by the Data Acquisition and Distribution System (DADS). Navigational and environmental data collected by the DADS are converted to engineering units and distributed real-time to investigator stations once per second. Selected engineering units data are printed and displayed on closed circuit television monitors throughout flights. An in-flight graphical display of the DC-8 flight track (with barbs indicating wind direction and magnitude) has recently been added to the DADS capabilities. Logging of data run starts/stops and commentary from the mission director are also provided. All data are recorded to hard disk in-flight and archived to tape medium post-flight. Post-flight, hard copies of the track map and mission director's log are created by the DADS. The DADS is a distributed system consisting of a data subsystem, an Avionic Serial Data-to-VMEbus (ASD2VME) subsystem, and a host subsystem. Each subsystem has a dedicated central processing unit (CPU) and is capable of stand-alone operation. All three subsystems are housed in a single 20-slot VME chassis and communicate with each other over the VMEbus. The data and host subsystems are briefly discussed, and the DC-8 DADS internal configuration and system block diagram are presented.
An ultracapacitor made from a polymer loaded with ceramic powder would have several advantages over current ultracapacitors and batteries. First is the possibility of it being printable, which would allow for printing the energy storage device along with the circuit instead of having to find a way to add one later without damaging the rest of the components. When not printed in a specific design for use on a printed wiring board, this type of ultracapacitor could still be cured via a mold to a shape suitable to specific applications. Many polymers maintain some flexibility even after curing, such as the silicone used in this study. The manufacturing process would also be far simpler than that of conventional ultracapacitors.In this work, solid-state ultracapacitors were made by adding the dielectric powder to a two-part polymer (resin and hardener) at the same time. The mixture was then cured in the desired shape at a low temperature until completely set. The addition of the powder to the polymer increased its dielectric properties while leaving most of its physical properties unaltered. At higher powder loading percentages, there were some physical changes as the maximum loading point was approached. To determine the efficiency of these solid-state ultracapacitors, their capacitances were tested, and their dielectric constants (DCs) were measured and compared.
The major impetus for flight qualifying Chip-On-Board (COB) packaging technology is the shift in emphasis for space missions to smaller, better, and cheaper spacecraft and satellites resulting from the NASA New Millenium initiative and similar requirements in DoD-sponsored programs. The most important benefit that can potentially be derived from miniaturizing spacecraft and satellites is the significant cost saving realizable if a smaller launch vehicle may be employed. Besides the program cost saving, there are several other advantages to building COB-based space hardware. First, once a well-controlled process is established, COB can be low cost compared to standard Multi-Chip Module (MCM) technology. This cost competitiveness is regarded as a result of the generally greater availability and lower cost of Known Good Die (KGD). Coupled with the elimination of the first level of packaging (chip package), compact, high-density circuit boards can be realized with Printed Wiring Boards (PWB) that can now be made with ever-decreasing feature size in line width and via hole. Since the COB packaging technique in this study is based mainly on populating bare dice on a suitable multi-layer laminate substrate which is not hermetically sealed, die coating for protection from the environment is required. In recent years, significant improvements have been made in die coating materials which further enhance the appeal of COB. Hysol epoxies, silicone, parylene and silicon nitride are desirable because of their compatible Thermal Coefficient of Expansion (TCE) and good moisture resistant capability. These die coating materials have all been used in the space and other industries with varying degrees of success. COB technology, specifically siliconnitride coated hardware, has been flown by Lockheed on the Polar satellite. In addition, DARPA has invested a substantial amount of resources on MCM and COB-related activities recently. With COB on the verge of becoming a dominant player in DoD programs, DARPA is increasing its support of the availability of KGDs which will help decrease their cost. Aside from the various major developments and trends in the space and defense industries that are favorable to the acceptance and widespread use of'COB packaging technology, implementing COB can be appealing in other aspects. Since the interconnection interface is usually the weak link in a system, the overall circuit or system reliability may actually be improved because of the elimination of a level of interconnect/packaging at the chip. With COB, mixing packaging technologies is possible. Because some devices are only available in commercial plastic packages, populating a multi-layer laminate substrate with both bare dice and plastic-package parts is inevitable. Another attractive feature of COB is that re-workability is possible if die coating is applied only on the die top. This method allows local replacement of individual dice that were found to be defective instead of replacing an entire board. In terms of thermal management, unpackaged devices offer a shorter thermal resistance path than their packaged counterparts thereby improving thermal sinking and heat removal from the parts.
Application of the microhm measuring circuit to measurement of plated-through hole resistances, when combined with appropriate probes, provides data that can be related to the quality of copper plating on printed wiring boards. Acceptance limits can be established and continuous inspection performed, with plating defects causing abnormal readings.
Handtool has bifurcated handle that can be tightened so that clamping head grips pack securely. Tool easily removes hybrid integrated-ciruit flat packs from printed-wiring boards. It does not damage circuit or board; thus, board can be reused with replacement circuit, and old circuit can be analyzed for faults and, if possible, repaired.
A computer program, PROSE, that produces nonlinear state equations from a simple topological description of an electrical or mechanical network is described. Unnecessary states are also automatically eliminated, so that a simplified terminal circuit model is obtained. The program also prints out the eigenvalues of a linearized system and the sensitivities of the eigenvalue of largest magnitude.
Technique involves modifying fuseholder cap with drilled hole to allow each circuit to be connected to automatic circuit analyzer. Tester is commercially-available continuity device used for checking out wiring harnesses that sequentially steps from one circuit to the next automatically. Test results are printed.
The process for producing space qualified solar cells in both the conventional and wraparound configuration using screen printing techniques was investigated. Process modifications were chosen that could be easily automated or mechanized. Work was accomplished to optimize the tradeoffs associated with gridline spacing, gridline definition and junction depth. An extensive search for possible front contact metallization was completed. The back surface field structures along with the screen printed back contacts were optimized to produce open circuit voltages of at least an average of 600 millivolts. After all intended modifications on the process sequence were accomplished, the cells were exhaustively tested. Electrical tests at AMO and 28 C were made before and after boiling water immersion, thermal shock, and storage under conditions of high temperature and high humidity.
In-Space Manufacturing (ISM) centers around NASA’s growing need and ability to produce space technologies on demand in space. As the future of long term presence in space and deep space exploration approach, fundamental questions of our dependence on earth resupply to Low Earth Orbit (LEO) remain unanswered. ISM is leading various effort to evaluate the feasibility of producing essential spares and redundant parts on demand to enable a sustainable space-based supply chain model for part resupply. Among the parts and systems being considered, Avionics form the neural network of modern day aircraft and space vehicles providing a wealth of information ranging from Guidance, Navigation, and Control (GN&C) systems to on board Environmental Control and Life Support (ECLS) systems. Recent advances in the use of Aerosol Jet Technology to print Avionics components ranging from electrical traces on a circuit board to complex transistors and sensors raise the possibility of using such technology to reproduce or recreate electronic parts on demand with the help of custom electronics 3D printers. The challenge herein lies within the ability of such printers to generate and deposit an aerosol of electronic material utilizing processes independent of or enhanced by gravity to ensure controllably identical or improved behavior of the aerosol in an International Space Station (ISS) laboratory and on the ground. The behavior as well as the hazards and properties associated with such aerosols in a microgravity environment must be understood well in order to merit a feasible approach to utilizing them for manufacturing in space. In this report, we outline the experimental setup of a modified conventional vaping device to be used as the ideal gravity independent thermal atomization mechanism to generate aerosol. Our objective is to identify the ideal mass, density, and volume of our aerosolized droplets of ink to conclude that there exist a threshold of aerosolized ink droplet sizes that are indeed independent of the effects of gravity and remain stable after atomization. We use a Malvern Spraytec® Spray Particle Size Analyzer to perform real-time laser diffraction measurement of our ink droplets during atomization. The droplet size between conductive ink, dielectric ink and vegetable glycerin have been measured and contrasted. Furthermore, the mechanism of thermal atomization versus traditional pneumatic and ultrasonic atomization for operation in microgravity have been explored.
Improved joining method uses wave-soldering techniques developed for integrated-circuit-board assemblies. Thermosetting plastic is replaced by wave soldering, which applies a thin even coat of solder to mating copper surfaces. This is done after ink holes and channels have been protected by water-soluble, high-temperature solder mask which prevents wetting and clogging.