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Results are presented from tests to establish design allowables data for the following room temperature vulcanizing (RTV) silicone rubber based adhesives: (1) General Electric's RTV-560; (2) Dow Corning's 93-046; and (3) Martin Marietta's SLA-561. These adhesives are being evaluated for attaching reusable surface insulation to space shuttle structure.
Adhesion experiments with polytetra-fluoroethylene (PTFE) and polyimide contacting tungsten indicate that the polymers bond chemically to the clean metal surface. Polymer chain fragments which transfer to the surface of tungsten in field ion microscopy adhesion studies are highly oriented. Auger emission spectroscopy of PTFE transfer films to various metal surfaces indicates that the PTFE is bonded to the metal surface via the carbon atom. With PTFE in sliding contact with different orientations of aluminum, metal orientation is found to influence surfaces in sliding. The lowest friction and least amount of surface damage is detected on the highest atomic density (111) plane. The friction process itself can initiate polymer film formation from simple organic molecules.
The feasibility of a new approach for the development of stable, easily handled, room temperature (293 K - 311 K) curing adhesives was studied and demonstrated. The work concentrated on a family of unsaturated amide/ester resins. Twelve candidate resins were synthesized and tested for completeness of cure at room temperature, adhesion to aluminum and titanium, shear strength, moisture resistance and heat stability. The three most promising candidate resins were selected and recommended for further development.
An energy-balance analysis is presented for adhesive failure in end loaded cantilever beams. The analysis includes the effects of input work, stored strain energy, dissipated plastic energy, and specific adhesive surface energy. Experimental results obtained with 6061-T6 aluminum are presented as evidence for the validity of the approach.-
Several aspects of adhesive-bonded joint analysis and design are presented from the reference of size of structure or load intensity. This integrates the individual characterizations of double-lap, single-lap, stepped-lap, tapered-lap and scarf joints. The paper includes an overview of bonded joint selection from the standpoints of design, fabrication, and processing, each bearing in mind the influence of such considerations on the strength of the joint. A case study is presented of the optimization of a specific relatively thick titanium-to-graphite epoxy stepped-lap joint, using the digital computer analysis program A4EG. The factors accounted for are adhesive plasticity, adherend stiffness imbalance, adherend thermal mismatch, and change of material properties within the range of temperature environment and with load direction. The strength increases obtainable by refining the initial design are demonstrated.
The mechanical properties of a symmetrical, eight-step, titanium-boron-epoxy joint are discussed. A study of the effect of adhesive and matrix stiffnesses on the axial, normal, and shear stress distributions was made using the finite element method. The NASA Structural Analysis Program (NASTRAN) was used for the analysis. The elastic modulus of the adhesive was varied from 345 MPa to 3100 MPa with the nominal value of 1030 MPa as a standard. The nominal values were used to analyze the stability of the joint. The elastic moduli were varied to determine their effect on the stresses in the joint.
A process of preparing aromatic polyamide-acids for use as adhesives is described. An equimolar quantity of an aromatic dianhydride is added to a stirred solution of an aromatic diamine in a water or alcohol-miscible ether solvent to obtain a viscous polymer solution. The polymeric-acid intermediate polymer does not become insoluble but directly forms a smooth viscous polymer solution. These polyamic-acid polymers are converted, by heating in the range of 200-300 C and with pressure, to form polyimides with excellent adhesive properties.
Bonding method, which reduces amount and weight of adhesive, is applicable to foam-filled honeycomb constructions. Novel features of process include temperature-viscosity control and removal of excess adhesive by transfer to cellophane film.
Sliding friction experiments were conducted in vacuum with thin films of titanium, chromium, iron, and platinum sputter deposited on quartz or mica substrates. A single crystal hemispherically tipped gold slider was used in contact with the films at loads of 1.0 to 30.0 and at a sliding velocity of 0.7 mm/min at 23 C. Test results indicate that the friction coefficient is dependent on the adhesion of two interfaces, that between the film and its substrate and the slider and the film. There exists a relationship between the percent d bond character of metals in bulk and in thin film form and the friction coefficient. Oxygen can increase adhesive bonding of a metal film (platinum) to a substrate.
The nature of the interface, adhesion and friction properties of noble metals, platinum metals, Group IV (B) metals and transition metals were considered. The surface chemical activity of the noble and platinum metals is shown to effect metal to metal interfaces as does a valance bonding in the transition metals. With the Group IV (B) metals the degree of metallic nature of the elements is shown to effect interfacial behavior. The effect of surface segregation of alloy constituents such as silicon in iron and its influence on the metal to metal interface is discussed. In addition the effect of alloy constituents on changes in bulk properties such as transformations in tin are shown to effect interfacial adhesion and friction behavior.
Studies on two adhesives (Metlbond 1113 and 1113-2) identified as having applications in the bonding of composite materials are presented. Constitutive equations capable of describing changes in material behavior with strain rate are derived from various theoretical approaches. It is shown that certain unique relationships exist between these approaches. It is also shown that the constitutive equation derived from mechanical models can be used for creep and relaxation loading. A creep to failure phenomenon is shown to exist and is correlated with a delayed yield equation proposed by Crochet. Loading-unloading results are presented and are shown to correlate well with the proposed form of the loading-unloading equations for the modified Bingham model. Experimental results obtained for relaxation tests above and below the glass transition temperature are presented. It is shown that the adhesives obey the time-temperature superposition principle.
This paper describes a test program conducted to determine the electrical properties of adhesives used in hybrid microelectronic applications and to develop test methods for measuring these properties. The electrical properties of transistor chips mounted with conductive adhesives are also measured, and the effect of long term storage at high temperature on these devices is determined.
Adhesion and friction experiments were conducted with single crystals of iron and gold in contact with single crystals of germanium and silicon. Surfaces were examined in the sputter cleaned state and in the presence of oxygen and a lubricant. All experiments were conducted at room temperature with loads of 1 to 50 grams, and sliding friction was at a sliding velocity of 0.7 mm/min. Results indicate that the friction nature of metals in contact with semiconductors is sensitive to orientation, that strong adhesion of metals to both germanium and silicon occurs, and that friction is lower with silicon than with germanium for the same orientation. Surface effects are highly sensitive to environment. Silicon, for example, behaves in an entirely brittle manner in the clean state, but in the presence of a lubricant the surface deforms plastically.
The specification results for the finished tape properties were as follows: (1) adhesive strength (180 deg peel) on aluminum from 107 to 143 grams per centimeter (0.6 to 0.8 pounds per inch); (2) adhesive strength (180 deg peel) on stainless steel from 71 to 107 grams per centimeter (0.4 to 0.6 pounds per inch); (3) unwind resistance of 536 to 714 grams per centimeter (3 to 4 pounds per inch); (4) tensile strength minimum of 7143 grams per centimeter (40 pounds per inch); (5) elongation from 5 to 10% at break; (6) tear strength, Elmendorf from 200 to 350 grams (0.44 to 0.77 pounds); and (7) tear strength, tongue from 363 to 408 grams (0.8 to 0.9) pounds).
Abstracts of primary documents containing original experimental data on the properties of adhesives and sealants at cryogenic temperatures are presented. The most important references mentioned in each document are cited. In addition, a brief annotation is given for documents considered secondary in nature, such as republications or variations of original reports, progress reports leading to final reports included as primary documents, and experimental data on adhesive properties at temperatures between about 130 K and room temperature.
Adhesive materials of aliphatic polyester, linear hydroxyl end-capped polybutadienes, or SBS block copolymers are studied with the objective to replace conventional partially aromatic end-reactive polyester-isocyanate adhesives that have shown embrittlement
The ability of SEM/EDAX to determine the physical and chemical composition of very small areas was used to study several diverse types of samples representative of NASA-LaRC technology. More systematic investigation was carried out on differences in the results of grit-blasting Ti 6-4 adherends and the presence of extraneous elements, primarily silicon, in some polymer/HT-S fiber composites. Initial results were obtained from a fractured (ILS) short-beam shear specimen, and from Ti 6-4 alloy, before and after a proprietary Boeing anodizing surface preparation for adhesive bonding. Photomicrographs and EDAX spectra were also obtained from new, fractured lap shear strength specimens that employed PPQ and LARC-13 adhesives.
A polyurethane resin with paste activator, capable of providing useful bond strengths over the temperature range of -184 C to 149 C, is described. The adhesive system has a pot life of over one hour. Tensile shear strength ratings are given for various adhesive formulations.