SEARCH · Search NASA
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
7th International sCO2 Power Cycles Symposium, Virtual, February 21-24, 2022
A new set of critical experiments exploring the temperature-dependence of the reactivity in a critical assembly is described. In the experiments, the temperature of the critical assembly will be varied to determine the temperature that produces the highest reactivity in the assembly. This temperature is the inversion point of the isothermal reactivity coefficient of the assembly. An analysis of relevant configurations is presented. Existing measurements are described and an analysis of these experiments presented. The overall experimental approach is described as are the modifications to the critical assembly needed to perform the experiments.
A REBCO superconductor tape that can achieve a lift factor greater than or equal to approximately 3.0 or 4.0 in an approximately 3 T magnetic field applied perpendicular to a REBCO tape at approximately 30 K. In an embodiment, the REBCO superconductor tape can include a critical current density less than or equal to approximately 4.2 MA/cm2 at 77 K in the absence of an external magnetic field. In another embodiment, the REBCO superconductor tape can include a critical current density greater than or equal to approximately 12 MA/cm2 at approximately 30 K in a magnetic field of approximately 3 T having an orientation parallel to a c-axis.
This poster was prepared for the Intern Poster Session 2023, and it contains pre-transient analysis from destructive and non-destructive characterization for THOR-M-TOP-1.
Abstract not provided.
Abstract not provided.
Abstract not provided.
Abstract not provided.
Explore the source record for details and available documents.
Explore the source record for details and available documents.
Explore the source record for details and available documents.
Determine the most probable root cause of the LaSalle fuel rod failure, distinguish primary failure mechanisms from post-failure degradation, and assess whether the condition is isolated or indicative of a broader issue affecting similar rods or assemblies. Results will support decisions related to core operation, fuel management, and corrective actions.
One particular concern of polymer matrix composite laminates is the relatively low resistance to delamination cracking, in particular when the dominant type of failure is mode I opening. One method proposed for alleviating this problem involves the insertion pultruded carbon pins through the laminate thickness. The pins, known as z-pins, are inserted into the prepreg laminate using an ultrasonic hammer prior to the curing process, resulting in a field of pins embedded normal to the laminate plane as illustrated in Figure. 1. Pin diameters range between 0.28-mm to 0.5-mm and standard areal densities range from 0.5% to 4%. The z-pins are provided by the manufacturer, Aztex(Registered TradeMark) , in a low-density foam preform, which acts to stabilize orientation of the pins during the insertion process [1-3]. Typical pin materials include boron and carbon fibers embedded in a polymer matrix. A number of methods have been developed for predicting delamination growth in laminates reinforced with z-pins. During a study on the effect of z-pin reinforcement on mode I delamination resistance, finite element analyses of z-pin reinforced double cantilever beam (DCB) specimens were performed by Cartie and Partridge [4]. The z-pin bridging stresses were modeled by applying equivalent forces at the pin locations. Single z-pin pull-out tests were performed to characterize the traction law of the pins under mode I loading conditions. Analytical solutions for delamination growth in z-pin reinforced DCB specimens were independently derived by Robinson and Das [5] and Ratcliffe and O'Brien [6]. In the former case, pin bridging stresses were modeled using a distributed load and in the latter example the bridging stresses were discretely modeled by way of grounded springs. Additionally, Robinson and Das developed a data reduction strategy for calculating mode I fracture toughness, G(sub Ic), from a z-pin reinforced DCB specimen test [5]. In both cases a traction law similar to that adopted by Cartie and Partridge was used to represent z-pin failure under mode I loading conditions. In the current work spring elements available in most commercial finite element codes were used to model z-pins. The traction law used in previous analyses [4-6] was employed to represent z-pin damage. This method is intended for and is limited to simulating z-pins in composite laminate structure containing mode I-dominated delamination cracking. The current technique differs from previous analyses in that spring finite elements (available in commercial codes) are employed for simulating zpins, reducing the complexity of the analysis construction process. Furthermore, the analysis method can be applied to general structure that experiences mode I-dominated delamination cracking, in contrast to existing analytical solutions that are only applicable to coupon DCB specimens.
The failure of fuel pins in nuclear reactors is intrinsically stochastic. Typically, a combination of variation in manufacturing that affects the material characteristics and the fuel assembly dimensions, variation in operating conditions, such as local power, coolant flow rate, and irradiation induced changes in material properties lead to a large uncertainty in failure margin of the fuel pins. Failure, therefore, may occur in exceptional pins with adverse combinations of these variations. Upon a metal fuel pin (U-Pu-Zr/HT9) failure, depressurization of the fuel pin takes place by release of fission gas, liquid sodium bond, and potentially solid fuel particles or molten/eutectic fuel droplets through the hole in cladding. The effect of a fission gas jet on neighbor fuel pins and possible propagation of a clad damage during normal operation was studied experimentally in 1970s and it was found that the post-failure fission gas jet insulates the jet impingement area of the target fuel pin surface and could increase the target pin’s surface temperature by as much as 100 – 200 K during the failed pin depressurization. It was concluded that the effect should not lead to fuel pin failure propagation during normal operation. In accident scenarios of sodium and lead fast reactors such as Unprotected Loss-Of-Flow (ULOF) or Unprotected Transient Over Power (UTOP), the fuel pins can be subjected to higher clad temperatures and fuel pin pressures or fuel clad mechanical/chemical interaction where thermal creep margin becomes significantly lower compared to the normal operation conditions. Therefore, possible stochastic failure and the post-failure fission gas/fuel jet impingement could be critical in order to predict fuel pin failure propagation. Pin depressurization due to fission gas release may degrade the heat transfer by formation of a gas blanket on a neighboring pin surface, which is a local phenomenon, and by causing coolant flow deceleration and starvation, which could affect a surrounding region as well. Furthermore, the potential presence of solid fuel particles or molten fuel at the time of clad failure could boost post-failure jet induced degradation even further. The present study models the U-Pu-Zr/HT9 metal fuel pin failure and stochastic clad damage propagation by biased sampling based on a Cumulative Damage Fraction (CDF) type clad failure criterion and the normal distribution of fuel failure probability density as a function of logarithm of Cumulative Damage Fraction. In addition, the effect of post-failure fission gas jet on heat transfer degradation is modeled for the target pins. This model is called stochastic Clad Damage Propagation (CDAP). The CDAP model is now fully integrated into developmental version of PRONGHORN-SC subchannel analysis code, allowing for modeling local failures and its propagation potential. Section 2 describes the components of the CDAP models. Section 3 describes the model implementation to PRONGHORN-SC and input specifications. Section 4 describes the CDAP model validation coupled to PRONGHORN-SC.
An electronic instrument has been developed as a prototype of a portable crane-load contact sensor. Such a sensor could be helpful in an application in which the load rests on a base in a horizontal position determined by vertical alignment pins (see Figure 1). If the crane is not positioned to lift the load precisely vertically, then the load can be expected to swing once it has been lifted clear of the pins. If the load is especially heavy, large, and/or fragile, it could hurt workers and/or damage itself and nearby objects. By indicating whether the load remains in contact with the pins when it has been lifted a fraction of the length of the pins, the crane-load contact sensor helps the crane operator determine whether it is safe to lift the load clear of the pins: If there is contact, then the load is resting against the sides of the pins and, hence, it may not be safe to lift; if contact is occasionally broken, then the load is probably not resting against the pins, so it should be safe to lift. It is assumed that the load and base, or at least the pins and the surfaces of the alignment holes in the load, are electrically conductive, so the instrument can use electrical contact to indicate mechanical contact. However, DC resistance cannot be used as an indicator of contact for the following reasons: The load and the base are both electrically grounded through cables (the load is grounded through the lifting cable of the crane) to prevent discharge of static electricity. In other words, the DC resistance between the load and the pins is always low, as though they were always in direct contact. Therefore, instead of DC resistance, the instrument utilizes the AC electrical impedance between the pins and the load. The signal frequency used in the measurement is high enough (.1 MHz) that the impedance contributed by the cables and the electrical ground network of the building in which the crane and the base are situated is significantly greater than the contact impedance between the pins and the load. The instrument includes a signal generator and voltage-measuring circuitry, and is connected to the load and the base as shown in Figure 2. The output of the signal generator (typically having amplitude of the order of a volt) is applied to the load via a 50-resistor, and the voltage between the load and the pins is measured. When the load and the pins are not in contact, the impedance between them is relatively high, causing the measured voltage to exceed a threshold value. When the load and the pins are in contact, the impedance between them falls to a much lower value, causing the voltage to fall below the threshold value. The voltage-measuring circuitry turns on a red light-emitting diode (LED) to indicate the lower-voltage/ contact condition. Whenever the contact has been broken and the non-contact/higher-voltage condition has lasted for more than 2 ms, the voltage-measuring circuitry indicates this condition by blinking a green LED.
A sensor provides a measurement of the degree of seating of an electrical connector. This sensor provides a number of discrete distances that a plug is inserted into a socket or receptacle. The number of measurements is equal to the number of pins available in the connector for sensing. On at least two occasions, the Shuttle Program has suffered serious time delays and incurred excessive costs simply because a plug was not seated well within a receptacle. Two methods were designed to address this problem: (1) the resistive pin technique and (2) the discrete length pins technique. In the resistive pin approach, a standard pin in a male connector is replaced with a pin that has a uniform resistivity along its length. This provides a variable resistance on that pin that is dependent on how far the pin is inserted into a socket. This is essentially a linear potentiometer. The discrete approach uses a pin (or a few pins) in the connector as a displacement indicator by truncating the pin length so it sits shorter in the connector than the other pins. A loss of signal on this pin would indicate a discrete amount of displacement of the connector. This approach would only give discrete values of connector displacement, and at least one pin would be needed for each displacement value that would be of interest.
A rocker arm includes an outer arm defining a lock pin bore which is centered about a lock pin bore axis and an inner arm which selectively pivots relative to the outer arm about a pivot axis which is parallel to the lock pin bore axis. The inner arm includes a protrusion which defines an inner arm stop surface which is planar. A lock pin is disposed within the lock pin bore, the lock pin having a lock pin slot extending there into and also having a lock pin stop surface which is planar. The lock pin is displaced within the lock pin bore between a coupled position in which the lock pin stop surface is aligned with the inner arm stop surface and a decoupled position in which the lock pin slot is aligned with the protrusion.
Thermal effects on the pin-bearing behavior of an IM7/PET15 composite laminate are studied comprehensively. A hypothesis presents factors influencing a change in pin-bearing strength with a change in temperature for a given joint design. The factors include the change in the state of residual cure stress, the material properties, and the fastener fit with a change in temperature. Experiments are conducted to determine necessary lamina and laminate material property data for the IM7/PET15 being utilized in this study. Lamina material properties are determined between the assumed stress free temperature of 460 F down to -200 F. Laminate strength properties are determined for several lay-ups at the operating temperatures of 350 F, 70 F, and -200 F. A three-dimensional finite element analysis model of a composite laminate subject to compressive loading is developed. Both the resin rich layer located between lamina and the thermal residual stresses present in the laminate due to curing are determined to influence the state of stress significantly. Pin-bearing tests of several lay-ups were conducted to develop an understanding on the effect of temperature changes on the pin-bearing behavior of the material. A computational study investigating the factors influencing pin-bearing strength was performed. A finite element model was developed and used to determine the residual thermal cure stresses in the laminate containing a hole. Very high interlaminar stress concentrations were observed two elements away from the hole boundary at all three operating temperatures. The pin-bearing problem was modeled assuming a rigid frictionless pin and restraining only radial displacements at the hole boundary. A uniform negative pressure load was then applied to the straight end of the model. A solution, where thermal residual stresses were combined with the state of stress due to pin-bearing loads was evaluated. The presence of thermal residual stresses intensified the interlaminar stresses predicted at the hole boundary in the pin-bearing problem. This dissertation shows that changes in material properties drives pin-bearing strength degradation with increasing temperature.