High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings
The increasing density of electronic devices underscores the need for efficient thermal management. Silver nanowires (AgNWs), as one-dimensional nanostructures, possess a high aspect ratio and intrinsic thermal conductivity. However, high electrical conductivity of AgNWs limits their application for electronic packaging. We synthesized boron nitride-coated silver nanowires (AgNWs@BN) using a flexible and fast method followed by incorporation into synthetic polyimide (PI) for enhanced thermal conductivity and dielectric properties of nanocomposites. The thinner boron nitride intermediate nanolayer on AgNWs not only alleviated the mismatch between AgNWs and PI but also enhanced their interfacial interaction. Hence, the maximum thermal conductivity of an AgNWs@BN/PI composite with a filler loading up to 20% volume was increased to 4.33 W/m K, which is an enhancement by nearly 23.3 times compared with that of the PI matrix. The relative permittivity and dielectric loss were about 9.89 and 0.015 at 1 MHz, respectively. Compared with AgNWs@SiO{sub 2}/PI and Ag@BN/PI composites, boron nitride-coated core-shell structures effectively increased the thermal conductivity and reduced the permittivity of nanocomposites. The relative mechanism was studied and discussed. This study enables the identification of appropriate modifier fillers for polymer matrix nanocomposites.