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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 433 records · Page 24
All sourcesNASA NTRSDOE OSTI
DOE OSTI2024

A high-resolution pseudo-polygon discrete element model for regional sea ice

Here, this work presents a pseudo-polygon discrete element model for high-resolution sea ice simulations. A scale-invariant bonded particle contact model is proposed to model joints between sea ice floes based on the smeared fracture model and a lattice spring beam model, and the Mohr–Coulomb failure criterion is implemented to represent the shearing failure mechanism of sea ice packings under complex loadings. All mechanical parameters of the bond model can be directly determined from laboratory tests. Validations of the proposed model are made by investigations of mechanical response and failure criteria of field sea ice sheets. Compared with the field observations of sea ice from satellite radar and in situ stress sensors, the proposed model is capable of reproducing the typical constitutive behavior and the Coulomb friction envelope of field sea ice. Finally, the proposed discrete element sea ice model is used to study the effect of loading rates on mechanical behavior including failure strength of regional sea ice.

54 ENVIRONMENTAL SCIENCES↗
DOE OSTI2024

Effect of die design on microstructure and mechanical joint strength in friction self-piercing riveted AA7055-T76 and AA7055-T76

In the present study, a unique friction self-piercing riveting (F-SPR) was applied to join high-strength, low-ductility aluminum alloy (AA) 7055-T76 and AA7055-T76 to mitigate a cracking issue. Also, the effect of die design on both joint formation and the mechanical joint performance were investigated. A crack-free joint was achieved when joining AA7055-T76 and AA7055-T76 by F-SPR. As the bottom diameter of the die increased, the mechanical interlocking distance initially increased then became almost saturated. At the same time, the solid-state bonding gradually disappeared, and the lap-shear fracture changed from bottom aluminum fracture to rivet pull-out with partial bottom aluminum fracture. The average maximum lap-shear joint strength of 11.57 kN and cross tension of 5.65 kN were achieved from the D2 die design owing to the combined contributions from high mechanical interlocking distance and good solid-state bonding at the joint interface. Ultrafine grain refinement was observed at the region next to the rivet shank outer surface and along the materials flow line between the top and bottom aluminum sheet in the rivet cavity. Further, because of the same joint-process parameters, the hardness profile at the joints made by different dies did not show obvious differences. As the distance from the base metal to the rivet outer surface decreased, frictional heat caused the hardness to initially decrease from 190 to 150 HV in the heat-affected zone. Hardness increased up to 175 HV in the thermomechanical affected zone (TMAZ-I) owing to large plastic deformation.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Activation Energy for Solder Bond Degradation: Thermal Cycling of Field-aged Modules at Multiple Upper Temperatures

The reliability of solder joints in the solar cell metallization-interconnect system influences the lifetime of photovoltaic modules. Two field-aged modules-one with Sn 62 Pb 36 Ag 2 solder at the solder joints (Solarex MSX 60), and the other with the standard Sn 60 Pb 40 solder (Siemens M55)-were subjected to a modified thermal cycling (TC) test of IEC 61215. Three sections in each module were maintained at 85 degrees C, 95 degrees C, and 105 degrees C during the 15-minute high temperature dwell time. Current equivalent to the module short-circuit current was injected through the module when the chamber temperature was above 25 degrees C to simulate regular field operation. This novel approach aims to induce thermomechanical fatigue (TMF) at the solder joints and intermetallic compound (IMC) formation at the metal/solder interfaces. The activation energy (E a ) for solder bond degradation was calculated based on the series resistance (R s ) increase in TC testing rather than power drop to avoid the effect of confounding variables. Module-level R s increase in MSX 60 module after TC800 cycles and in M55 module after TC400 cycles was 1.22% and 183.7%, respectively. The E a determined for the module with 2wt% Ag is 0.24 eV and for that with the standard solder is 0.27 eV. The solder bond degradation seems to have been driven by TMF rather than IMC formation for both modules.

14 SOLAR ENERGY↗
NASA NTRS1969

Nondestructive testing of welds on thin-walled tubing

Special ultrasonic search unit, or transducer assembly, reliably inspects the quality of melt-through welds of fusion welded tubing couplers for hydraulic lines. This instrumentation can also be used to detect faulty braze bonds in thin-walled, small diameter joints and wall thickness of thin-walled metal tubing.

Hagemaier, D. J.↗
NASA NTRS1976

Weld-bonded titanium structures

Structurally stronger titanium articles are produced by a weld-bonding technique comprising fastening at least two plates of titanium together using spotwelding and curing an adhesive interspersed between the spot-weld nuggets. This weld-bonding may be employed to form lap joints or to stiffen titanium metal plates.

Vaughan, R. W.↗
NASA NTRS1982

New Method For Joining Stainless Steel to Titanium

In new process, edge of stainless-steel sheet is perforated, and joined to titanium by resistance seam welding. Titanium flows into perforations, forming a strong interlocking joint. Process creates a quasi-metallurgical bond between the thin sheets of stainless steel and titanium.

Emanuel, W. H.↗
NASA NTRS1989

Stand Alone Pressure Measurement Device (SAPMD) for the space shuttle Orbiter, part 1

The specifications for the Stand Alone Pressure Measurement Device (SAPMD) are as follows: the SAPMD shall measure ambient pressure at the surface of the Orbiter TPS in the range of 0 to 15 pounds per square inch absolute (PSIA). Measurement will begin at solid rocket booster (SRB) ignition as sensed by appropriate vibration sensing elements in the SAPMD. Pressure and corresponding real-time data are to be recorded every one tenth second for 140 seconds and at the end of the recording period, the operation will be discontinued with the data preserved for interrogation subsequent to Orbiter re-entry and landing. The type and size of the battery shall be such as to allow the vibration sensing elements and a real-time clock to be initialized a minimum of 30 day prior to launch and still provide power as necessary to perform the 140 second data recording period after SRB ignition. Battery installation shall be in such a manner as to allow battery replacement without removing the SAPMD from its position or removing more than one TPS tile. The SAPMD must be mounted in specific locations under tile of the TPS. To accommodate such mounting, the absolute maximum physical dimensions much not exceed 6.0 inches in length, 1.5 inches in width, and 0.4 inches in height, and the device shall be of such configuration that it can be bonded to the Orbiter skin at the joint line of two TPS tiles with the pressure sensing port at the surface of the tile. The SAPMD must remain operational in the temperature range of -40 to +85 C and survive storage temperature of -55 to +125 C. The pressure port must withstand 934 C without causing damage to the TPS during entry and must remain functional at 262 C during ascent. The accuracy of the pressure measurement must be plus or minus one-half PSIA over a temperature range of 0 to +36 C. All the specifications were met and verified by prototype testing and documented in the enclosed test data. Four flight-qualified models were fabricated and of these, two were delivered and successfully flown in the cargo bay of STS-26.

Tomlinson, Bill↗
NASA NTRS2002

STS-113 Flight Day 9 Highlights

This video shows the activities of the STS-113 (Jim Wetherbee, Commander; Paul Lockhart, Pilot; Michael Lopez-Alegria, John Herrington, Mission Specialists) crew during flight day 9. Also seen are the outgoing Expedition 5 (Valeri Korzun, Commander; Peggy Whitsun, ISS Science Officer/Flight Engineer; Sergei Treschev, Flight Engineer) and incoming Expedition 6 (Kenneth Bowersox, Commander; Donald Pettit, Nikolai Budarin, Flight Engineers) crews of the ISS (International Space Station). Flight day 9 is a relatively inactive day, with some off-time scheduled for crew bonding and enjoying views. Seven of the joint crew members, including Lopez-Alegria, Wetherbee, Herrington, and Whitsun, pose together and answer questions. Footage shows ISS Science Officers Whitsun and Pettit troubleshooting equipment. The video also contains a clear view of southern South America, a cloudy view of the South Pacific, and external footage of the ISS including the Canadarm robotic arm. The payload bay of the shuttle Endeavour is also shown.

Source record↗
NASA NTRS2003

Development of a 1K x 1K GaAs QWIP Far IR Imaging Array

In the on-going evolution of GaAs Quantum Well Infrared Photodetectors (QWIPs) we have developed a 1,024 x 1,024 (1K x1K), 8.4-9 microns infrared focal plane array (FPA). This 1 megapixel detector array is a hybrid using the Rockwell TCM 8050 silicon readout integrated circuit (ROIC) bump bonded to a GaAs QWIP array fabricated jointly by engineers at the Goddard Space Flight Center (GSFC) and the Army Research Laboratory (ARL). The finished hybrid is thinned at the Jet Propulsion Lab. Prior to this development the largest format array was a 512 x 640 FPA. We have integrated the 1K x 1K array into an imaging camera system and performed tests over the 40K-90K temperature range achieving BLIP performance at an operating temperature of 76K (f/2 camera system). The GaAs array is relatively easy to fabricate once the superlattice structure of the quantum wells has been defined and grown. The overall arrays costs are currently dominated by the costs associated with the silicon readout since the GaAs array fabrication is based on high yield, well-established GaAs processing capabilities. In this paper we will present the first results of our 1K x 1K QWIP array development including fabrication methodology, test data and our imaging results.

Jhabvala, M.↗
NASA NTRS1988

Hot wire anemometer measurements in the unheated air flow tests of the SRB nozzle-to-case joint

Hot-Wire Anemometer measurements made in the Solid Rocket Booster (SRB) nozzle-to-case joint are discussed. The study was undertaken to glean additional information on the circumferential flow induced in the SRB nozzle joint and the effect of this flow on the insulation bonding flaws. The tests were conducted on a full-scale, 2-D representation of a 65-in long segment of the SRB nozzle joint, with unheated air as the working fluid. Both the flight Mach number and Reynolds number were matched simultaneously and different pressure gradients imposed along the joint face were investigated. Hot-wire anemometers were used to obtain velocity data for different joint gaps and debond configurations. The procedure adopted for hot-wire calibration and use is outlined and the results from the tests summarized.

Ramachandran, N.↗
DOE OSTI2023

Galvanic corrosion of AZ31B joined to dual-phase steel with and without Zn layer by ultrasonic and friction stir welding

Galvanic corrosion of AZ31B joined with bare or Zn-coated DP590 steel by ultrasonic spot welding or linear friction stir welding was quantitatively studied by pre-defining anode and cathode in the lap joint samples. Corrosion volume and depth from Mg anode surfaces exposed to 0.1 M sodium chloride solution was analyzed as functions of cathode surface type and welding method. Characterization of as-welded joints was performed to identify any microstructural feature of the bonding zone that could impact galvanic corrosion behavior. COMSOL modeling with modified user subroutine was conducted to simulate the progression of Mg corrosion in the same joint and electrode configurations used for the corrosion experiments. The experimental results indicated that Zn-coated cathode surface can reduce Mg galvanic corrosion significantly as galvanic polarization and cathodic current on Zn-coated surface remained relatively low for Mg in the weld joints. COMSOL modeling described the growth of Mg galvanic corrosion in a reasonable manner but showed limitation by underestimating the corrosion volume as it did not capture self-corrosion.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Heterogeneous Integration Technologies for High-temperature, High-density, Low-profile Power Modules of Wide Bandgap Devices in Electric Drive Applications (Final Technical Report)

The goal of this project is to develop packaging technologies for making high-temperature, high-density, and low-profile wide-bandgap (WBG) power electronics modules for electric drives. These modules are aimed at enabling the DOE’s University Consortium to reach its 2025 inverter targets of ≥ 100 kW/L and ≤ 2.7 $/kW. The specific objectives are to: design and fabricate SiC half-bridge power modules with double-sided cooling and parasitic inductances < 5 nH, heat flux density > 400 W/cm 2 , and working junction temperature of 200 o C; design, fabricate, and deliver a gate driver with double-sided cooled modules for the construction of a 100 kW/L inverter at Oak Ridge National Lab; and design and prototype intelligent gate drivers with integrated current sensor and a low-profile DC-DC power supply with air-core transformer for testing power modules at 200 o C junction temperature. We followed an iterative technical approach of design, simulation, fabrication, and testing of various versions of modules, current sensors, and power supply. The state-of-the-art silicon carbide devices rated at 1.2 kV and 149 A were packaged by sintered-silver bonding on an aluminum nitride direct-bond-copper substrate for high thermal conductivity, high working temperature, and high joint reliability. Porous silver posts were used to interconnect the device’s source pads to the other direct-bond-copper substrate for low mechanical stresses, ease of manufacturing, and double-sided cooling. A current sensor based on package parasitic inductance was developed to measure switching current. A dynamic feedback scheme was developed to compensate the effect of parasitic resistance and temperature variation. A constant-current class-E dc-dc converter with air-core transformer was developed. Air-core transformer was used due to the unavailability of magnetic core at high temperatures. Gate driver and power supply were integrated with the double-side cooled, high temperature SiC power modules for testing the modules at 200 o C junction temperature. Double-pulse and continuous testing of the integrated technologies validated the design and fabrication of the three component technologies. Throughout the project, we overcame the challenge for design verification caused by low prototyping yield, which then helped train the graduate students, the future workforce, to learn the engineering know-how for low-cost manufacturing of reliable products. Below is a summary of the major accomplishments of this project: development of a prototyping process for fabricating double-side cooled (1200 V, 149 A) SiC phase-leg modules capable of working to 200 o C Tj; simulation and experimental verification of the improvement of thermo-mechanical reliability of the double-side cooled SiC phase-leg module by using rigid encapsulant; design and experimental validation of a current sensor based on package parasitic inductance and a compensation solution for eliminating the effect of parasitic resistance; design and experimental validation of a low-profile power supply with six-output air-core transformer for gate driver; functional demonstration of a SiC phase-leg module integrated with its gate driver, current sensor, and an air-core power supply at 200 o C Tj in a double-pulse switching test setup and Buck converter continuous test setup; successful completion of six PhD and two MS students who are or will work at Apple Inc., Tesla Inc., Wolfspeed Inc., Microchip Inc., Monolithic Power Systems Inc., and LG Magna Inc.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
NASA NTRS2007

High Temperature Stability of Dissimilar Metal Joints in Fission Surface Power Systems

Future generations of power systems for spacecraft and lunar surface systems will likely require a strong dependence on nuclear power. The design of a space nuclear power plant involves integrating together major subsystems with varying materia1 requirements. Refractory alloys are repeatedly considered for major structural components in space power reactor designs because refractory alloys retain their strength at higher temperatures than other classes of metals. The relatively higher mass and lower ductility of the refractory alloys make them less attractive for lower temperature subsystems in the power plant such as the power conversion system. The power conversion system would consist more likely of intermediate temperature Ni-based superalloys. One of many unanswered questions about the use of refractory alloys in a space power plant is how to transition from the use of the structural refractory alloy to more traditional structural alloys. Because deleterious phases can form when complex alloys are joined and operated at elevated temperatures, dissimilar material diffusion analyses of refractory alloys and superalloys are needed to inform designers about options of joint temperature and operational lifetime. Combinations of four superalloys and six refractory alloys were bonded and annealed at 1150 K and 1300 K to examine diffusional interactions in this study. Joints formed through hot pressing and hot isostatic pressing were compared. Results on newer alloys compared favorably to historical data. Diffusional stability is promising for some combinations of Mo-Re alloys and superalloys at 1150 K, but it appears that lower joint temperatures would be required for other refractory alloy couples.

Locci, Ivan E.↗
NASA NTRS1984

Joining Tubes With Adhesive

Cylindrical tubes joined together, end to end, by method employing adhesive, tapered ends, and spacing wires. Tapered joint between tubular structural elements provides pressure between bonding surfaces during adhesive curing. Spacing wires prevent adhesive from being scraped away when one element inserted in other. Method developed for assembling structural elements made of composite materials.

Bateman, W. A.↗
DOE OSTI2020

Selective bond-breaking in formic acid by dissociative electron attachment

We report the results of a joint experimental and theoretical study of dissociative electron attachment to formic acid (HCOOH) in the 6–9 eV region, where H- fragment ions are a dominant product. Breaking of the C–H and O–H bonds is distinguished experimentally by deuteration of either site. We show that in this region H- ions can be produced by formation of two or possibly three Feshbach resonance (doubly-excited anion) states, one of which leads to either C–H or O–H bond scission, while the other can only produce formyloxyl radicals by O–H bond scission. Comparison of experimental and theoretical angular distributions of the anion fragment allows the elucidation of state specific pathways to dissociation.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
NASA NTRS1981

Preliminary results on the development of vacuum brazed joints for cryogenic wind tunnel aerofoil models

The results of initial experiments show that high-strength void-free bonds can be formed by vacuum brazing of stainless steels using copper and nickel-based filler metals. In Nitronic 40, brazed joints have been formed with strengths in excess of the yield strength of the parent metal, and even at liquid nitrogen temperatures the excellent mechanical properties of the parent metal are only slightly degraded. The poor toughness of 15-5 P.H. stainless steel at cryogenic temperatures is lowered even further by the presence of the brazed bonds investigated. It is highly unlikely that the technique would be used for any critical areas of aerofoil models intended for low-temperature service. Nevertheless, the potential advantages of this simplified method of construction still have attractions for use at ambient temperatures.

Wigley, D. A.↗
NASA NTRS2018

Joint Strength Optimization and Damping Assessment of NiTi-Polymer Matrix Hybrid Composites

Approaches to optimize the adhesive joint strength between shape memory alloy ribbons and carbon fiber-reinforced epoxy composites were investigated for potential use as either an actuating structure or a dampening composite for structural applications. The interfacial bond strength between nickel-titanium (NiTi) and a polymer matrix composite (PMC) was measured by double lap shear testing as a function of NiTi surface treatment and adhesive material. The effect of NiTi surface treatment on damping was investigated using dynamic mechanical analysis. Lap shear data show that treating the surfaces of NiTi ribbons by light sandblasting and primer application increased the interfacial bond strength by 20 percent over the baseline composite structure. Lap shear data also reveal that out of three different film adhesives investigated, samples bonded with AF 191U and Hysol® 9696U display the highest adhesive joint strengths. Optical microscopy reveals that most samples failed by either cohesive failure within the adhesive or by adhesive failure at either the adhesive/PMC or NiTi/adhesive interface. Adhering NiTi to the PMC did not appear to negatively impact damping performance; however, a more thorough examination into NiTi's role on vibration damping should be investigated.

lap shear↗
DOE OSTI2023

A Micro-scale Numerical Investigation of Internal and Interfacial Void Defects in Adhesive on Failure Behavior of Adhesively-Bonded Materials with Rough Surfaces

This paper studied the effects of air void defects on the failure behavior of adhesively-bonded materials under global shear via micro-scale computational modeling. The numerical results indicated that interfacial void defects can largely facilitate interfacial debonding of a weaker adherend/adhesive interface under shear. However, this is not the case for a stronger adherend/adhesive interface, showing the reduction on the nominal shear strength of an adhesive joint is mainly due to internal void defects. The reduced bonding performance due to voids can be improved by leveraging an appropriate surface roughness. This preliminary investigation is a first step to better understand the micro-mechanics of interfacial failure in the adhesion of a roughened/patterned adherend via surface modification(s) and an adhesive, and also shows the importance of minimizing interfacial void defects in particular at a weaker adherend/adhesive interface via different techniques.

Qiao, Yao↗