Search NASA⌕ Search

SEARCH · Search NASA

Results for “Multilayer Insulation”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 433 records · Page 24

Radiation Test Results for a MEMS Microshutter Operating at 60 K

The James Webb Space Telescope (JWST), the successor to the Hubble Space Telescope, is due to be launched in 2013 with the goal of searching the very distant Universe for stars that formed shortly after the Big Bang. Because this occurred so far back in time, the available light is strongly red-shifted, requiring the use of detectors sensitive to the infrared portion of the electromagnetic spectrum. HgCdTe infrared focal plane arrays, cooled to below 30 K to minimize noise, will be used to detect the faint signals. One of the instruments on JWST is the Near Infrared Spectrometer (NIRSPEC) designed to measure the infrared spectra of up to 100 separate galaxies simultaneously. A key component in NIRSPEC is a Micro-Electromechanical System (MEMS), a two-dimensional micro-shutter array (MSA) developed by NASA/GSFC. The MSA is inserted in front of the detector to allow only the light from the galaxies of interest to reach the detector and to block the light from all other sources. The MSA will have to operate at 30 K to minimize the amount of thermal radiation emitted by the optical components from reaching the detector array. It will also have to operate in the space radiation environment that is dominated by the MSA will be exposed to a large total ionizing dose of approximately 200 krad(Si). Following exposure to ionizing radiation, a variety of MEMS have exhibited performance degradation. MEMS contain moving parts that are either controlled or sensed by changes in electric fields. Radiation degradation can be expected for those devices where there is an electric field applied across an insulating layer that is part of the sensing or controlling structure. Ionizing radiation will liberate charge (electrons and holes) in the insulating layers, some of which may be trapped within the insulating layer. Trapped charge will partially cancel the externally applied electric field and lead to changes in the operation of the MEMS. This appears to be a general principle for MEMS. Knowledge of the above principle has raised the concern at NASA that the MSA might also exhibit degraded performance because, i) each shutter flap is a multilayer structure consisting of metallic and insulating layers and ii) the movement of the shutter flaps is partially controlled by the application of an electric field between the shutter flap and the substrate (vertical support grid). The whole mission would be compromised if radiation exposure were to prevent the shutters from opening and closing properly. energetic ionizing particles. Because it is located A unique feature of the MSA is that, as outside the spacecraft and has very little shielding, previously mentioned, it will have to operate at temperatures near 30 K. To date, there are no published reports on how very low temperatures (- 30K) affect the response of MEMS devices to total ionizing dose. Experiments on SiO2 structures at low temperatures (80 K) indicate that the electrons generated by the ionizing radiation are mobile and will move rapidly under the application of an external electric field. Holes, on the other hand, that would normally move in the opposite direction through the SiO2 via a "thermal hopping" process, are effectively immobile at low electric fields as they are trapped close to their generation sites. However, for sufficiently large electric fields (greater than 3 MV/cm) holes are able to move through the SiO2. The larger the field, the more rapidly the holes move. The separation of the electrons and holes leads to a reduced electric field within the insulating layer. To overcome this reduction in electric field, a greater external voltage will have to be applied that alters the normal operation of the device. This report presents the results of radiation testing of the MSA at 60 K. The temperature was higher than the targeted temperature because of a faulty electrical interconnect on the test board. Specifically, our goal was to determine whether the MSA would function propey after a TID of 200 krad(Si).

Rapchun, David A.↗

Reflective insulator layers separated by bonded silica beads

Nonconductive silica beads are bonded to metallic reflecting insulation sheets prior to fabrication of multilayer reflectors. This eliminates the need for separate nonconductive sheets and simplifies the fabrication process.

Zuver, N. T., Jr.↗

Low temperature storage container for transporting perishables to space station

This invention is directed to the long term storage of frozen and refrigerated food and biological samples by the space shuttle to the space station. A storage container is utilized which has a passive system so that fluid/thermal and electrical interfaces with the logistics module is not required. The container for storage comprises two units, each having an inner storage shell and an outer shell receiving the inner shell and spaced about it. The novelty appears to lie in the integration of thermally efficient cryogenic storage techniques with phase change materials, including the multilayer metalized surface thin plastic film insulation and the vacuum between the shells. Additionally the fiberglass constructed shells having fiberglass honeycomb portions, and the lining of the space between the shells with foil combine to form a storage container which may keep food and biological samples at very low temperatures for very long periods of time utilizing a passive system.

Dean, William G↗

Humidity Steady State Low Voltage Testing of MLCCs (Based on NESC Technical Assessment Report)

Review of the low voltage reduced Insulation Resistance (IR) failure phenomenon in Multilayer ceramic capacitors (MLCCs)and NASA approaches to contend with this risk. 1. Analyze published materials on root cause mechanisms. 2. Investigate suitability of current test methods to assess MLCC lots for susceptibility. 3. Review current NASA parts selection and application guidelines in consideration of benefits vs. disadvantages.

Sampson, Mike↗

Measurement of Two-Phase Flow and Heat Transfer Parameters using Infrared Thermometry

A novel technique to measure heat transfer and liquid film thickness distributions over relatively large areas for two-phase flow and heat transfer phenomena using infrared (IR)thermometry is described. IR thermometry is an established technology that can be used to measure temperatures when optical access to the surface is available in the wavelengths of interest. In this work, a midwave IR camera (3.6-5.1 microns) is used to determine the temperature distribution within a multilayer consisting of a silicon substrate coated with a thin insulator. Since silicon is largely transparent to IR radiation, the temperature of the inner and outer walls of the multilayer can be measured by coating selected areas with a thin, IR opaque film. If the fluid used is also partially transparent to IR, the flow can be visualized and the liquid film thickness can be measured. The theoretical basis for the technique is given along with a description of the test apparatus and data reduction procedure. The technique is demonstrated by determining the heat transfer coefficient distributions produced by droplet evaporation and flow boiling heat transfer.

Kim, Tae-Hoon↗

VO 2 -based Thermochromic Variable Emittance Coating

As NASA’s Artemis program requirements become increasingly challenging for thermal control, novel passive thermal control solutions are needed to enable lunar surface and lunar transit operations. A thermochromic coating which changes its heat rejection with temperature could eliminate the need for dual loop thermal control architecture in human spacecraft and could reduce or eliminate the need for survival heaters in robotic spacecraft. The variable heat rejection is accomplished by incorporating a vanadium dioxide (VO 2 ) layer into a multilayer coating stack up. Intrinsically, VO 2 changes from an insulator to a metal at 68 °C, so a tungsten dopant is introduced to reduce the transition temperature to room temperature or below. This project is focused on developing a process for doping the VO 2 to achieve the desired transition temperature

Sydney Taylor↗

Metallization failures

Metallization-related failure mechanisms were shown to be a major cause of integrated circuit failures under accelerated stress conditions, as well as in actual use under field operation. The integrated circuit industry is aware of the problem and is attempting to solve it in one of two ways: (1) better understanding of the aluminum system, which is the most widely used metallization material for silicon integrated circuits both as a single level and multilevel metallization, or (2) evaluating alternative metal systems. Aluminum metallization offers many advantages, but also has limitations particularly at elevated temperatures and high current densities. As an alternative, multilayer systems of the general form, silicon device-metal-inorganic insulator-metal, are being considered to produce large scale integrated arrays. The merits and restrictions of metallization systems in current usage and systems under development are defined.

Beatty, R.↗

Accelerated life testing and reliability of high K multilayer ceramic capacitors

The reliability of one lot of high K multilayer ceramic capacitors was evaluated using accelerated life testing. The degradation in insulation resistance was characterized as a function of voltage and temperature. The times to failure at a voltage-temperature stress conformed to a lognormal distribution with a standard deviation approximately 0.5.

Minford, W. J.↗

Dewar technology study

The development of a Dewar system for handling liquid helium under weightless conditions is described. Porous plug designs for the prevention of superfluid creep out of the dewar through the vent line were evaluated. For the purpose of designing a neck to provide a transition from the cold cavity to the outside, the loads carried by the neck and equipment supports were studied. Temperature, pressure, and mass flow instrumentation for monitoring Dewar performance were also evaluated. In addition, multilayer blankets consisting of aluminized Mylar separated by Dacron net sheets were designed to insulate the pressure vessel. The dewar system is suggested for use with the star tracking telescope aboard the relativity satellite.

Davis, W.↗

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

dielectric performance↗

Multilayer Thermal Barrier Coating (TBC) Architectures Utilizing Rare Earth Doped YSZ and Rare Earth Pyrochlores

To allow for increased gas turbine efficiencies, new insulating thermal barrier coatings (TBCs) must be developed to protect the underlying metallic components from higher operating temperatures. This work focused on using rare earth doped (Yb and Gd) yttria stabilized zirconia (t' Low-k) and Gd2Zr2O7 pyrochlores (GZO) combined with novel nanolayered and thick layered microstructures to enable operation beyond the 1200 C stability limit of current 7 wt% yttria stabilized zirconia (7YSZ) coatings. It was observed that the layered system can reduce the thermal conductivity by approximately 45 percent with respect to YSZ after 20 hr of testing at 1316 C. The erosion rate of GZO is shown to be an order to magnitude higher than YSZ and t' Low-k, but this can be reduced by almost 57 percent when utilizing a nanolayered structure. Lastly, the thermal instability of the layered system is investigated and thought is given to optimization of layer thickness.

Thermal Barrier Coating↗

Mass loss of shuttle space suit orthofabric under simulated ionospheric atomic oxygen bombardment

Many polymeric materials used for thermal protection and insulation on spacecraft degrade significantly under prolonged bombardment by ionospheric atomic oxygen. The covering fabric of the multilayered shuttle space suit is composed of a loose weave of GORE-TEX fibers, Nomex and Kevlar-29, which are all polymeric materials. The complete evaluation of suit fabric degradation from ionospheric atomic oxygen is of importance in reevaluating suit lifetime and inspection procedures. The mass loss and visible physical changes of each test sample was determined. Kapton control samples and data from previous asher and flight tests were used to scale the results to reflect ionospheric conditions at about 220 km altitude. It is predicted that the orthofabric loses mass in the ionosphere at a rate of about 66% of the original orthofabric mass/yr. The outer layer of the two-layer orthofabric test samples shows few easily visible signs of degradation, even when observed at 440X. It is concluded that the orthofabric could suffer significant loss of performance after much less than a year of total exposure time, while the degradation might be undetectable in post flight visual examinations of space suits.

Miller, W. L.↗

Compact Interconnection Networks Based on Quantum Dots

Architectures that would exploit the distinct characteristics of quantum-dot cellular automata (QCA) have been proposed for digital communication networks that connect advanced digital computing circuits. In comparison with networks of wires in conventional very-large-scale integrated (VLSI) circuitry, the networks according to the proposed architectures would be more compact. The proposed architectures would make it possible to implement complex interconnection schemes that are required for some advanced parallel-computing algorithms and that are difficult (and in many cases impractical) to implement in VLSI circuitry. The difficulty of implementation in VLSI and the major potential advantage afforded by QCA were described previously in Implementing Permutation Matrices by Use of Quantum Dots (NPO-20801), NASA Tech Briefs, Vol. 25, No. 10 (October 2001), page 42. To recapitulate: Wherever two wires in a conventional VLSI circuit cross each other and are required not to be in electrical contact with each other, there must be a layer of electrical insulation between them. This, in turn, makes it necessary to resort to a noncoplanar and possibly a multilayer design, which can be complex, expensive, and even impractical. As a result, much of the cost of designing VLSI circuits is associated with minimization of data routing and assignment of layers to minimize crossing of wires. Heretofore, these considerations have impeded the development of VLSI circuitry to implement complex, advanced interconnection schemes. On the other hand, with suitable design and under suitable operating conditions, QCA-based signal paths can be allowed to cross each other in the same plane without adverse effect. In principle, this characteristic could be exploited to design compact, coplanar, simple (relative to VLSI) QCA-based networks to implement complex, advanced interconnection schemes. The proposed architectures require two advances in QCA-based circuitry beyond basic QCA-based binary-signal wires described in the cited prior article. One of these advances would be the development of QCA-based wires capable of bidirectional transmission of signals. The other advance would be the development of QCA circuits capable of high-impedance state outputs. The high-impedance states would be utilized along with the 0- and 1-state outputs of QCA.

Fijany, Amir↗

Study of noise reduction characteristics of double-wall panels

The noise reduction characteristics of general aviation type, flat, double-wall structures were investigated. The experimental study was carried out on 20-by-20 inch panels with an exposed area of 18 by 18 inches. A frequency range from 20 to 5000 Hz was covered. The experimental results, in general, follow the expected trends. At low frequencies the double-wall structures are no better than the single-wall structures. However, for depths normally used in the general aviation industry, the double-wall panels are very attractive. The graphite-spoxy skin panels have higher noise reduction at very low frequencies ( 100 Hz) than the Kevlar skin panels. But the aluminum panels have higher noise reduction in the high frequency region, due to their greater mass. Use of fiberglass insulation is not effective in the low frequency region, and at times it is even negative. But the insulation is effective in the high-frequency region. The theoretical model for predicting the transmission loss of these multilayered panels is also discussed.

Navaneethan, R.↗

Thermal Insulation Test Apparatuses

The National Aeronautics and Space Administration (NASA) seeks to license its Thermal Insulation Test Apparatuses. Designed by the Cryogenics Test Laboratory at the John F. Kennedy Space Center (KSC) in Florida, these patented technologies (U.S. Patent Numbers: Cryostat 1 - 6,742,926, Cryostat 2 - 6,487,866, and Cryostat 4 - 6,824,306) allow manufacturers to fabricate and test cryogenic insulation at their production and/or laboratory facilities. These new inventions allow for the thermal performance characterization of cylindrical and flat specimens (e.g., bulk-fill, flat-panel, multilayer, or continuously rolled) over the full range of pressures, from high vacuum to no vacuum, and over the full range of temperatures from 77K to 300K. In today's world, efficient, low-maintenance, low-temperature refrigeration is taking a more significant role, from the food industry, transportation, energy, and medical applications to the Space Shuttle. Most countries (including the United States) have laws requiring commercially available insulation materials to be tested and rated by an accepted methodology. The new Cryostat methods go beyond the formal capabilities of the ASTM methods to provide testing for real systems, including full-temperature differences plus full-range vacuum conditions.

Berman, Brion↗

Thin-Film Power Transformers

Transformer core made of thin layers of insulating material interspersed with thin layers of ferromagnetic material. Flux-linking conductors made of thinner nonferromagnetic-conductor/insulator multilayers wrapped around core. Transformers have geometric features finer than those of transformers made in customary way by machining and mechanical pressing. In addition, some thin-film materials exhibit magnetic-flux-carrying capabilities superior to those of customary bulk transformer materials. Suitable for low-cost, high-yield mass production.

Katti, Romney R.↗

Anomalous Hall Crystals in Rhombohedral Multilayer Graphene. I. Interaction-Driven Chern Bands and Fractional Quantum Hall States at Zero Magnetic Field

Recent experiments on rhombohedral pentalayer graphene with a substrate-induced moiré potential have identified both Chern insulators and fractional quantum Hall states at zero magnetic field. Surprisingly, these states are observed in strong displacement fields where the effects of the moiré lattice are weak, and seem to be readily accessed without fine-tuning. To address these experimental puzzles, we study a model of interacting electrons in this geometry. Within self-consistent Hartree-Fock (SCHF) calculations, we find an isolated Chern band with small bandwidth and good quantum geometry. Exact diagonalization and density-matrix renormalization group calculations both confirm the band hosts fractional quantum Hall states without a magnetic field. Remarkably, the Chern band is stable at a wide range of angles, at four through six rhombohedral layers, at varying rhombohedral hopping parameters, and—most strikingly—survives in SCHF calculations when the moiré potential vanishes. In this limit, the state spontaneously breaks time-reversal and translation symmetry simultaneously, giving a topological crystalline state that we term the “anomalous Hall crystal.” We argue this is a general mechanism to create stable Chern bands in rhombohedral multilayer graphene, opening the door to studying the interplay between electronic topology, fractionalization, and spontaneous translation symmetry breaking.

36 MATERIALS SCIENCE↗

Metallic Panels Would Insulate at 2,700 Degrees F

Multiwall metallic panels now under development as replacements for ceramic surface-insulation tiles of Space Shuttle could eventually be used in other aircraft, possibly even as thermal protection in ground-based applications. Various configurations of basic multilayer sandwich are expected to protect against temperatures ranging from 700 degrees to 2,700 degrees F (370 degrees -1, 480 degrees C). With assistance from heat-pipe cooling, panels should withstand temperature to 3,500 degrees F (1,930 degrees C); however, heat pipes would not exceed 1,600 degrees F (870 degrees C).

Jackson, R. L.↗