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At least 433 records · Page 24

Evaluation of Power Electronic Components and Systems at Cryogenic Temperatures For Space Missions

Power electronic circuits and systems designed for deep space applications and outer planetary exploration are required to operate reliably and efficiently under extreme temperature conditions. This requirement is dictated by the fact that the operational environments associated with some of the space missions would encompass temperatures as low as -183 C. The development and utilization of electronics capable of low temperature operation would not only fulfill the advanced technology requirements, but also would contribute to improving circuit performance, increasing system efficiency, and reducing development and launch costs. These benefits are generally achieved by the improved intrinsic properties of some of the electronic materials at low temperature, reduced device losses, and the elimination of heating elements used in conventional systems at low temperatures. Power electronic circuits are widely used in space power systems in the areas of power management, conditioning, and control. In this work, the performance of certain power electronic components and systems was investigated under low temperature. These include inductors, capacitors, pulse-width-modulation (PWM) controllers, and advanced commercial DC/DC converter modules. Different properties were determined as a function of temperature in the range of 20 C to -140 C, at various current and voltages levels. The experimental procedures along with the experimental data obtained are presented and discussed in this paper.

Elbuluk, Malik E.↗

Low-Thermal-Conductivity Pyrochlore Oxide Materials Developed for Advanced Thermal Barrier Coatings

When turbine engines operate at higher temperatures, they consume less fuel, have higher efficiencies, and have lower emissions. The upper-use temperatures of the base materials (superalloys, silicon-based ceramics, etc.) used for the hot-section components of turbine engines are limited by the physical, mechanical, and corrosion characteristics of these materials. Thermal barrier coatings (TBCs) are applied as thin layers on the surfaces of these materials to further increase the operating temperatures. The current state-of-the-art TBC material in commercial use is partially yttria-stabilized zirconia (YSZ), which is applied on engine components by plasma spraying or by electron-beam physical vapor deposition. At temperatures higher than 1000 C, YSZ layers are prone to sintering, which increases thermal conductivity and makes them less effective. The sintered and densified coatings can also reduce thermal stress and strain tolerance, which can reduce the coating s durability significantly. Alternate TBC materials with lower thermal conductivity and better sintering resistance are needed to further increase the operating temperature of turbine engines.

Bansal, Narottam P.↗

Upgrades to Electronic Speckle Interferometer (ESPI) Operation and Data Analysis at NASA's Goddard Space Flight Center

The authors report operational upgrades and streamlined data analysis of a commissioned electronic speckle interferometer (ESPI) in a permanent in-house facility at NASA's Goddard Space Flight Center. Our ESPI was commercially purchased for use by the James Webb Space Telescope (JWST) development team. We have quantified and reduced systematic error sources, improved the software operability with a user-friendly graphic interface, developed an instrument simulator, streamlined data analysis for long-duration testing, and implemented a turn-key approach to speckle interferometry. We also summarize results from a test of the JWST support structure (previously published), and present new results from several pieces of test hardware at various environmental conditions.

Connelly, Joseph↗

Evaluation of COTS Electronic Parts for Extreme Temperature Use in NASA Missions

Electronic systems capable of extreme temperature operation are required for many future NASA space exploration missions where it is desirable to have smaller, lighter, and less expensive spacecraft and probes. Presently, spacecraft on-board electronics are maintained at about room temperature by use of thermal control systems. An Extreme Temperature Electronics Program at the NASA Glenn Research Center focuses on development of electronics suitable for space exploration missions. The effects of exposure to extreme temperatures and thermal cycling are being investigated for commercial-off-the-shelf components as well as for components specially developed for harsh environments. An overview of this program along with selected data is presented.

Patterson, Richard L.↗

Evaluation of Advanced COTS Passive Devices for Extreme Temperature Operation

Electronic sensors and circuits are often exposed to extreme temperatures in many of NASA deep space and planetary surface exploration missions. Electronics capable of operation in harsh environments would be beneficial as they simplify overall system design, relax thermal management constraints, and meet operational requirements. For example, cryogenic operation of electronic parts will improve reliability, increase energy density, and extend the operational lifetimes of space-based electronic systems. Similarly, electronic parts that are able to withstand and operate efficiently in high temperature environments will negate the need for thermal control elements and their associated structures, thereby reducing system size and weight, enhancing its reliability, improving its efficiency, and reducing cost. Passive devices play a critical role in the design of almost all electronic circuitry. To address the needs of systems for extreme temperature operation, some of the advanced and most recently introduced commercial-off-the-shelf (COTS) passive devices, which included resistors and capacitors, were examined for operation under a wide temperature regime. The types of resistors investigated included high temperature precision film, general purpose metal oxide, and wirewound.

Patterson, Richard↗

Cryogenic Behavior of the High Temperature Crystal Oscillator PX-570

Microprocessors, data-acquisition systems, and electronic controllers usually require timing signals for proper and accurate operation. These signals are, in most cases, provided by circuits that utilize crystal oscillators due to availability, cost, ease of operation, and accuracy. Stability of these oscillators, i.e. crystal characteristics, is usually governed, amongst other things, by the ambient temperature. Operation of these devices under extreme temperatures requires, therefore, the implementation of some temperature-compensation mechanism either through the manufacturing process of the oscillator part or in the design of the circuit to maintain stability as well as accuracy. NASA future missions into deep space and planetary exploration necessitate operation of electronic instruments and systems in environments where extreme temperatures along with wide-range thermal swings are countered. Most of the commercial devices are very limited in terms of their specified operational temperature while very few custom-made and military-grade parts have the ability to operate in a slightly wider range of temperature. Thus, it is becomes mandatory to design and develop circuits that are capable of operation efficiently and reliably under the space harsh conditions. This report presents the results obtained on the evaluation of a new (COTS) commercial-off-the-shelf crystal oscillator under extreme temperatures. The device selected for evaluation comprised of a 10 MHz, PX-570-series crystal oscillator. This type of device was recently introduced by Vectron International and is designed as high temperature oscillator [1]. These parts are fabricated using proprietary manufacturing processes designed specifically for high temperature and harsh environment applications [1]. The oscillators have a wide continuous operating temperature range; making them ideal for use in military and aerospace industry, industrial process control, geophysical fields, avionics, and engine control. They exhibit low jitter and phase noise, consume little power, and are suited for high shock and vibration applications. The unique package design of these crystal oscillators offers a small ceramic package footprint, as well as providing both through-hole mounting and surface mount options.

Patterson, Richard↗

Characterization of Titanium Alloys Produced by Electron Beam Directed Energy Deposition

Functionally graded materials offer the potential to improve structural efficiency by allowing the material composition and/or microstructural features to spatially vary within a component. Additive manufacturing techniques enable the fabrication of such graded materials and structures. While examining several titanium alloys, this paper focuses on Ti-8Al-1Er as it has a unique microstructure that is only feasible when produced by rapid solidification methods like electron beam directed energy deposition, an additive manufacturing process. The results show that, when mixed, Ti-8Al-1Er and commercially-pure titanium uniformly mix at various ratios and the resultant static tensile properties of the mixed alloys behave according to rule-of-mixtures. At discontinuous interfaces between Ti-8Al-1Er and commercially-pure titanium, the crack growth behavior progresses smoothly across the discontinuity as the crack transitions from one crack growth regime into another. Studies on monolithic samples shows the mechanisms of damage in the Ti-8Al-1Er; specifically, that strain localization occurs near grain boundaries of high mis-orientation on the microscale and that twinning and dislocation density is concentrated near erbia-strengthening particles (Er2O3) on the nanoscale.

Newman, John A.↗

Operations of the Optical Communications Demonstration for the Orion EM-2 Mission

The GSFC implementation of an Optical Communication System to demonstrate an operational optical communication link for Orion EM-2. It will serve as a base for providing an operational optical communications capability for future Orion missions. GSFC plans to maintain a development path for the optical communication flight terminal to allow commercialization and implementation on future Orion missions. The Orion optical module part of the optical communications flight terminal and its control electronics have a common architecture with the ILLUMA-T optical terminal provided by GSFC for use on the ISS. The plan is to flow data from Orion through the Optical Communication Fight Terminal to the Optical Communication Ground Terminal and reverse. NASA's Orion spacecraft is an exploratory vehicle designed for longer-duration flights beyond the Moon. Following Orion's Exploration Mission-1 (EM-1), during which the spacecraft will travel beyond the Moon, enter a distant retrograde orbit around the Moon and return to Earth unmanned, Exploration Mission-2 (EM-2) will see a crewed spacecraft complete a slightly different flight path. First crewed test flight of the Orion spacecraft, currently targeting a June 30, 2022 launch. The mission involves: One revolution in Low Earth Orbit (LEO) parking orbit to verify basic Orion systems functionality and deploy solar arrays. A single 42-hour Highly Elliptical Orbit (HEO) intermediate checkout orbit allows characterization of the Orion vehicle system performance prior to committing to a cis-lunar flight. Trans Lunar Injection (TLI) burn using Orion Service Module (SM) main engine, which sends Orion on a lunar flyby and free return. Skip reentry at lunar return velocities to splashdown off the coast of San Diego. Total mission duration is approximately 10 days. EM-2 is the first crewed mission of the Orion Spacecraft that crew brings more video up/downloads, file transfers, and real-time chats with family back home and high-rate communications enables live HD streaming for Crew conferences, Public Affairs Office (PAO) events, and significant mission events. Also still collecting vehicle data on numerous Orion subsystems via Development Flight Instrumentation (DFI) allows large data volume returns sooner for DFI and future science payloads, as opposed to waiting for end-of-mission. O2O is a demonstration of operational utility system tested as a Developmental Test Objective (DTO) and not required to meet mission requirements/success/ Flight Test Objectives (FTO). EM-2 architecture is as close to future mission operational architecture as possible.Orion subsystems (video, DFI, etc.) expected to generate ~250 GB of data in the first 24 hours of flight. Total data generated over the mission estimated to be more than 400 GBUsing S-Band alone, Orion limited to ~ 6GB of data downlink per day. Because of this limitation, Orion is planning to limit live video downlinks on EM-1 in order to downlink high priority fileswith 1 hour/day of Optical Communication, Orion could downlink ~6x more data per day (~ 36GB/day).The optical communication system is capable of multiple data rates up to at least 80 Mbps downlink for the transfer of Orion data to Earth while Orion is operating in the lunar vicinity.

Optical Communication↗

Robust, Radiation Tolerant Command and Data Handling and Power System Electronics for SmallSats

In today's budgetary environment, there is significant interest within the National Aeronautics and Space Administration (NASA) to enable small robotic science missions that can be executed faster and cheaper than previous larger missions. To help achieve this, focus has shifted from using exclusively radiation-tolerant or radiation-hardened parts to using more commercial-off-the-shelf (COTS) components for NASA small satellite missions that can last at least one year in orbit. However, there are some portions of a spacecraft's avionics, such as the Command and Data Handling (C&DH) subsystem and the Power System Electronics (PSE) that need to have a higher level of reliability that goes beyond what is attainable with currently available COTS parts. While there are a number of COTS components that can withstand a total ionizing dose (TID) of tens or hundreds of kilorads, there is still a great deal of concern about tolerance to and mitigation of single-event effects (SEE).

6U satellite↗

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Aquirre, Fernando↗

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Schatzel, Donald↗

Advanced Data Acquisition Systems

Current and future requirements of the aerospace sensors and transducers field make it necessary for the design and development of new data acquisition devices and instrumentation systems. New designs are sought to incorporate self-health, self-calibrating, self-repair capabilities, allowing greater measurement reliability and extended calibration cycles. With the addition of power management schemes, state-of-the-art data acquisition systems allow data to be processed and presented to the users with increased efficiency and accuracy. The design architecture presented in this paper displays an innovative approach to data acquisition systems. The design incorporates: electronic health self-check, device/system self-calibration, electronics and function self-repair, failure detection and prediction, and power management (reduced power consumption). These requirements are driven by the aerospace industry need to reduce operations and maintenance costs, to accelerate processing time and to provide reliable hardware with minimum costs. The project's design architecture incorporates some commercially available components identified during the market research investigation like: Field Programmable Gate Arrays (FPGA) Programmable Analog Integrated Circuits (PAC IC) and Field Programmable Analog Arrays (FPAA); Digital Signal Processing (DSP) electronic/system control and investigation of specific characteristics found in technologies like: Electronic Component Mean Time Between Failure (MTBF); and Radiation Hardened Component Availability. There are three main sections discussed in the design architecture presented in this document. They are the following: (a) Analog Signal Module Section, (b) Digital Signal/Control Module Section and (c) Power Management Module Section. These sections are discussed in detail in the following pages. This approach to data acquisition systems has resulted in the assignment of patent rights to Kennedy Space Center under U.S. patent # 6,462,684. Furthermore, NASA KSC commercialization office has issued licensing rights to Circuit Avenue Netrepreneurs, LLC , a minority-owned business founded in 1999 located in Camden, NJ.

Perotti, J.↗

The Design and Synthesis of Epoxy Matrix Composites Curable by Electron Beam Induced Cationic Polymerization

Several new series of novel, high reactivity epoxy resins are described which are designed specifically for the fabrication of high performance carbon fiber reinforced composites for commercial aircraft structural applications using cationic UV and e-beam curing. The objective of this investigation is to provide resin matrices which rapidly and efficiently cure under low e-beam doses which are suitable to high speed automated composite fabrication techniques such as automated tape and tow placement. It was further the objective of this work to provide resins with superior thermal, oxidative and atomic oxygen resistance.

Crivello, James V.↗

Electrical, Electronic and Electromechanical (EEE) Parts in the New Space Paradigm: When is Better the Enemy of Good Enough?

As the space business rapidly evolves to accommodate a lower cost model of development and operation via concepts such as commercial space and small spacecraft (aka, CubeSats), traditional EEE parts screening and qualification methods are being scrutinized under a risk-reward trade space. In this presentation, two basic concepts will be the overarching theme: 1) The movement from complete risk aversion EEE parts methods to managing and or accepting risk via alternate approaches; and, 2) A discussion of over-design focusing on both electrical design performance and bounding margins.

Electrical↗

Electrical, Electronic and Electromechanical (EEE) Parts in the New Space Paradigm: When is Better the Enemy of Good Enough?

As the space business rapidly evolves to accommodate a lower cost model of development and operation via concepts such as commercial space and small spacecraft (aka, CubeSats), traditional EEE parts screening and qualification methods are being scrutinized under a risk-reward trade space. In this presentation, two basic concepts will be the overarching theme: 1) The movement from complete risk aversion EEE parts methods to managing andor accepting risk via alternate approaches; and, 2) A discussion of over-design focusing on both electrical design performance and bounding margins.

Electrical, Electronic, and Electromechanical (EEE↗

HgCdTe 256x256 NWIR FPA

Researchers developed a HgCdTe 256x256 focal plane array (FPA) which operates in the 1 to 5 micron band. This is presently the largest demonstrated HgCdTe FPA. The detector material is HgCdTe on sapphire (PACE-1 technology) which has a low thermal expansion mismatch with silicon. The multiplexer is a CMOS FET-switch device processed through a commercial silicon foundry. The multiplexer input is direct injection and the charge capacity is about 2 times 10 to the 7th power electrons. The kTC limited read noise is 400 electrons. Researchers demonstrated high background imaging using the device. The broadband quantum efficiency is measured to be 59 percent. Dark currents less than 0.1 pA were measured at 77 K for detectors processed on PACE-1 material with 4.9 microns cutoff. The dark currents decrease as the temperature is lowered, and researchers are presently studying the T less than 77 K characteristics. The interconnect yield is greater than 95 percent. The devices are available for astronomical applications.

Vural, Kadri↗

Proceedings of the Second Annual Symposium on Industrial Involvement and Successes in Commercial Space

The proceedings of the conference are presented. It is proposed that commercial development in space is an important element in the future competitive posture of the industrial nations of the world. The resources and characteristics of space will play a major role in opening a new economic frontier for all the spacefaring nations of the world. Some topics of discussion are as follow: NASA's mission and the role of CCD's; A balanced commercial access to space; Systems for COMET; SPACEHAB; Space Station Freedom; The center for macromolecular crystallography; Center for space power and advanced electronics; and The center for mapping.

Source record↗

Signal Processor Development by Personnel of the JSC Signal Processing Section

The purpose of this paper is to describe systems and components of systems developed by personnel in the Signal Processing Section of the Tracking and Communications Division. The scope of this includes past developments which are in current use in NASA flight operations and future developments which are targeted for upcoming NASA applications. These projects specifically are: (1) NASA High Definition Television (HDTV) Project, (2) Video Codecs, (3) NASA Electronic Still Camera (ESC) Project, (4) Hercules Payload, (5) Ku-band Communications Adapter (KCA), (6) Windows Drivers for Satellite Interfacing to Commercial Equipment, and (7) Advanced Statistical Multiplexers. The methods used to determine what projects should be done in-house as opposed to which should not is based in NASA applications versus commercially available systems to meet those applications. If a commercial-off-the-shelf (COTS) component or system is available which meets the need, the first choice is to use COTS equipment. If it is not, and there is a NASA requirement, it is developed in-house. This results in technology which is being developed which otherwise was not available. Personnel involved in these projects have been contacted by many commercial companies interested in licensing or obtaining the NASA design.

Holland, S. Douglas↗