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At least 433 records · Page 24
All sourcesNASA NTRSDOE OSTI
NASA NTRS2000

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni↗
NASA NTRS2000

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗
NASA NTRS2017

Prolonged 500 C Operation of 100+ Transistor Silicon Carbide Integrated Circuits

This report describes more than 5000 hours of successful 500 C operation of semiconductor integrated circuits (ICs) with more than 100 transistors. Multiple packaged chips with two different 4H-SiC junction field effect transistor (JFET) technology demonstrator circuits have surpassed thousands of hours of oven-testing at 500 C. After 100 hours of 500 C burn-in, the circuits (except for 2 failures) exhibit less than 10 change in output characteristics for the remainder of 500C testing. We also describe the observation of important differences in IC materials durability when subjected to the first nine constituents of Venus-surface atmosphere at 9.4 MPa and 460C in comparison to what is observed for Earth-atmosphere oven testing at 500 C.

Silicon Carbid↗
NASA NTRS2017

Prolonged 500 C Operation of 100+ Transistor Silicon Carbide Integrated Circuits

This report describes more than 5000 hours of successful 500 C operation of semiconductor integrated circuits (ICs) with more than 100 transistors. Multiple packaged chips with two different 4H-SiC junction field effect transistor (JFET) technology demonstrator circuits have surpassed thousands of hours of oven-testing at 500 C. After 100 hours of 500 C burn-in, the circuits (except for 2 failures) exhibit less than 10% change in output characteristics for the remainder of 500 C testing. We also describe the observation of important differences in IC materials durability when subjected to the first nine constituents of Venus-surface atmosphere at 9.4 MPa and 460 C in comparison to what is observed for Earth-atmosphere oven testing at 500 C.

Spry, David J.↗
DOE OSTI2026

Mu2e Production Target Thermal Test Project

The Mu2e experiment requires a production target that is capable of operating under extreme thermal conditions caused by an 8 GeV proton beam. This project’s objective supports the development of the Mu2e Pro- duction Target by testing the Stickman model’s thermal behavior. Angel Flores Luviano has assisted Jonathan Williams in progressing this project by contributing to the development of a Radiative Cooling Test Fixture (RCTF) that will be used to evaluate the thermal behavior of the new production target model. Engineering calculations were performed to an- alyze thermal performance and pressure drop within the cold well and wa- ter cooling circuit. These calculations also determined the optimal sizing for key components of the water system. An engineering note was made to document these calculations. CAD models of the water circuit piping, thermocouple mounting bars, and radiator chimney were developed, and prototype test rig components were fabricated using 3D printing. Future work will focus on continued RCTF development which includes control system integration, heater hardware design, and interfaces that can be scaled up to increase thermal capacity.

Flores Luviano, Angel Augusto [Unlisted, US]↗
NASA NTRS2016

Hot-Fire Test Results of an Oxygen/RP-2 Multi-Element Oxidizer-Rich Staged-Combustion Integrated Test Article

As part of the Combustion Stability Tool Development project funded by the Air Force Space and Missile Systems Center, the NASA Marshall Space Flight Center was contracted to assemble and hot-fire test a multi-element integrated test article demonstrating combustion characteristics of an oxygen/hydrocarbon propellant oxidizer-rich staged-combustion engine thrust chamber. Such a test article simulates flow through the main injectors of oxygen/kerosene oxidizer-rich staged combustion engines such as the Russian RD-180 or NK-33 engines, or future U.S.-built engine systems such as the Aerojet-Rocketdyne AR-1 engine or the Hydrocarbon Boost program demonstration engine. For the thrust chamber assembly of the test article, several configurations of new main injectors, using relatively conventional gas-centered swirl coaxial injector elements, were designed and fabricated. The design and fabrication of these main injectors are described in a companion paper at this JANNAF meeting. New ablative combustion chambers were fabricated based on hardware previously used at NASA for testing at similar size and pressure. An existing oxygen/RP-1 oxidizer-rich subscale preburner injector from a previous NASA-funded program, along with existing and new inter-connecting hot gas duct hardware, were used to supply the oxidizer-rich combustion products to the oxidizer circuit of the main injector of the thrust chamber. Results from independent hot-fire tests of the preburner injector in a combustion chamber with a sonic throat are described in companion papers at this JANNAF conference. The resulting integrated test article - which includes the preburner, inter-connecting hot gas duct, main injector, and ablative combustion chamber - was assembled at Test Stand 116 at the East Test Area of the NASA Marshall Space Flight Center. The test article was well instrumented with static and dynamic pressure, temperature, and acceleration sensors to allow the collected data to be used for combustion analysis model development. Hot-fire testing was conducted with main combustion chamber pressures ranging from 1400 to 2100 psia, and main combustion chamber mixture ratios ranging from 2.4 to 2.9. Different levels of fuel film cooling injected from the injector face were examined ranging from none to about 12% of the total fuel flow. This paper presents the hot-fire test results of the integrated test article. Combustion performance, stability, thermal, and compatibility characteristics of both the preburner and the thrust chamber are described. Another companion paper at this JANNAF meeting includes additional and more detailed test data regarding the combustion dynamics and stability characteristics.

Hulka, J. R.↗
NASA NTRS2023

An Examination of Heavy Ion-Induced Persistent Visual Error Signatures in an Electronic Display Driver Integrated Circuit

Heavy ion irradiation of a display driver integrated circuit (DDIC) was performed, and persistent visual error signatures were captured. Based on the heavy ion results, error signatures were localized to configuration registers motivate potential mitigation techniques and observations relating to single event effect susceptibility. DDICs serve as an integral component of integrated display systems that will require the development of single event effects test methodologies in anticipation of extensive use in crewed spacecrafts outside of the Earth’s geomagnetic protection.

Electronic Displays↗
NASA NTRS2020

Optoelectronics for Space Flight Instruments

The Photonics group top level processes regarding development and qualification of space flight hardware for optoelectronic components and optical systems along with our contributions and successes with LIDAR systems, space flight reliability heritage, and our testing capabilities are conveyed with this power point presentation.

Spaceflight↗
DOE OSTI2021

Radio frequency mixing modules for superconducting qubit room temperature control systems

As the number of qubits in nascent quantum processing units increases, the connectorized RF (radio frequency) analog circuits used in first generation experiments become exceedingly complex. The physical size, cost, and electrical failure rate all become limiting factors in the extensibility of control systems. We have developed a series of compact RF mixing boards to address this challenge by integrating I/Q quadrature mixing, intermediate frequency/LO (local oscillator)/RF power level adjustments, and direct current bias fine tuning on a 40 × 80 mm 2 four-layer printed circuit board with electromagnetic interference shielding. The RF mixing module is designed to work with RF and LO frequencies between 2.5 and 8.5 GHz. The typical image rejection and adjacent channel isolation are measured to be ~27 dBc and ~50 dB. By scanning the drive phase in a loopback test, the module short-term amplitude and phase linearity are typically measured to be 5 ×10 -4 (V pp /V mean ) and 1 ×10 -3 radian (pk-pk). The operation of the RF mixing board was validated by integrating it into the room temperature control system of a superconducting quantum processor and executing randomized benchmarking characterization of single and two qubit gates. We measured a single-qubit process infidelity of 9.3(3) × 10 -4 and a two-qubit process infidelity of 2.7(1) × 10 -2 .

47 OTHER INSTRUMENTATION↗
NASA NTRS2011

Mu-Spec - A High Performance Ultra-Compact Photon Counting spectrometer for Space Submillimeter Astronomy

We have designed and are testing elements of a fully integrated submillimeter spectrometer based on superconducting microstrip technology. The instrument can offer resolving power R approximately 1500, and its high frequency cutoff is set by the gap of available high performance superconductors. All functions of the spectrometer are integrated - light is coupled to the microstrip circuit with a planar antenna, the spectra discrimination is achieved using a synthetic grating, orders are separated using planar filter, and detected using photon counting MKID detector. This spectrometer promises to revolutionize submillimeter spectroscopy from space. It replaces instruments with the scale of 1m with a spectrometer on a 10 cm Si wafer. The reduction in mass and volume promises a much higher performance system within available resource in a space mission. We will describe the system and the performance of the components that have been fabricated and tested.

Moseley, H.↗
DOE OSTI2021

Case Study: Laboratory and Field Evaluation of Circuit-Level Electrical Submetering with Wireless Current Transformers

Laboratory and field demonstration of circuit-level electrical submetering technology that utilizes wireless current transformers to monitor circuits within the panel. Report provides a background of the technology and how it works, outlines the testing methodology and presents results on measurement accuracy and ability of the technology to be rapidly integrated into both electrical panels/infrastructure and into an analytics platform. Cost effectiveness results are discussed for the specific field demonstration site.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗
NASA NTRS1973

Logic-controlled solid state switchgear for 270 volts dc

A feasibility study to design and demonstrate solid state switchgear in the form of circuit breakers and a power transfer switch is described. The switchgear operates on a nominal 270 V dc circuit and controls power to a load of up to 15 amperes. One circuit breaker may be interconnected to a second breaker to form a power transfer switch. On-off and transfer functions of the breakers or the transfer switch are remotely controlled. A number of reclosures with variable time delay between tripout and reclosure are programmed and controlled by integrated analog and COSMOS logic circuits. A unique commutation circuit, that generates only minimal transient disturbance to either source or load, was developed to interrupt current flow through the main SCR switching element. Laboratory tests demonstrated performance of the solid state circuit breakers over specified voltage and temperature ranges.

Sundberg, G. R.↗
NASA NTRS1980

Improvement and scale-up of the NASA Redox storage system

A preprototype full-function 1.0 kW Redox system (2 kW peak) with 11 kW storage capacity has been built and integrated with the NASA/DOE photovoltaic test facility. The system includes four substacks of 39 cells each (1/3 sq ft active area) which are connected hydraulically in parallel and electrically in series. An open circuit voltage cell and a set of rebalance cells are used to continuously monitor the system state of charge and automatically maintain the anode and cathode reactants electrochemically in balance. Technological advances in membrane and electrodes and results of multicell stack tests are reviewed.

Reid, M. A.↗
NASA NTRS1992

Operational considerations of the Advanced Photovoltaic Solar Array

Issues affecting the long-term operational performance of the Advanced Photovoltaic Solar Array (APSA) are discussed, with particular attention given to circuit electrical integrity from shadowed and cracked cell modules. The successful integration of individual advanced array components provides a doubling of array specific performance from the previous NASA-developed advanced array (SAFE). Flight test modules both recently fabricated and under fabrication are described. The development of advanced high-performance blanket technology for future APSA enhancement is presented.

Stella, Paul M.↗
NASA NTRS2003

Pressure-Sensor Assembly Technique

Nielsen Engineering & Research (NEAR) recently developed an ultrathin data acquisition system for use in turbomachinery testing at NASA Glenn Research Center. This system integrates a microelectromechanical- systems- (MEMS-) based absolute pressure sensor [0 to 50 psia (0 to 345 kPa)], temperature sensor, signal-conditioning application-specific integrated circuit (ASIC), microprocessor, and digital memory into a package which is roughly 2.8 in. (7.1 cm) long by 0.75 in. (1.9 cm) wide. Each of these components is flip-chip attached to a thin, flexible circuit board and subsequently ground and polished to achieve a total system thickness of 0.006 in. (0.15 mm). Because this instrument is so thin, it can be quickly adhered to any surface of interest where data can be collected without disrupting the flow being investigated. One issue in the development of the ultrathin data acquisition system was how to attach the MEMS pressure sensor to the circuit board in a manner which allowed the sensor s diaphragm to communicate with the ambient fluid while providing enough support for the chip to survive the grinding and polishing operations. The technique, developed by NEAR and Jabil Technology Services Group (San Jose, CA), is described below. In the approach developed, the sensor is attached to the specially designed circuit board, see Figure 1, using a modified flip-chip technique. The circular diaphragm on the left side of the sensor is used to actively measure the ambient pressure, while the diaphragm on the right is used to compensate for changes in output due to temperature variations. The circuit board is fabricated with an access hole through it so that when the completed system is installed onto a wind tunnel model (chip side down), the active diaphragm is exposed to the environment. After the sensor is flip-chip attached to the circuit board, the die is underfilled to support the chip during the subsequent grinding and polishing operations. To prevent this underfill material from getting onto the sensor s diaphragms, the circuit board is fabricated with two 25- micrometer-tall polymer rings, sized so that the diaphragms fit inside the rings once the chip is attached.

Pruzan, Daniel A.↗
NASA NTRSDate not supplied

Progress Towards Prolonged Deployment of SiC JFET-R ICs Into Previously Inaccessible Hostile Environments

This invited presentation describes demonstration of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. SiC junction field effect transistor-resistor (JFET-R) ICs with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient [1], 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber [2], and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes [3]. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C T-span) without significant change in signal (input /output) or power supply voltages [4]. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards this end, the processing that forms the SiC JFETs and resistors (without interconnect) for the NASA Glenn “Generation 12” design prototype JFET-R ICs was conducted at GE Research. Once the COVID-delayed IC interconnect and bond pad fabrication processing on these wafers is completed at NASA Glenn, the resulting chips will be packaged and oven-tested [5]. It is expected that further technology transfer to complete commercial production will lower investment and risk barriers to useful application deployment. For NASA, an initial high-value deployment is opening the Venus surface to extended missions for robotic scientific exploration.

Silicon Carbide↗
NASA NTRS1993

Evaluation of actuators for the SDOF and MDOF active microgravity isolation systems

The University of Virginia examined the design of actuators for both single-degree-of-freedom (SDOF) and multiple-degree-of-freedom (MDOF) active microgravity isolation systems. For SDOF systems, two actuators were considered: a special large gap magnetic actuator and a large stroke Lorentz actuator. The magnetic actuator was viewed to be of greater difficulty than the Lorentz actuator with little compelling technical advantage and was dropped from consideration. A Lorentz actuator was designed and built for the SDOF test rig using magnetic circuit and finite element analysis. The design and some experimental results are discussed. The University also examined the design of actuators for MDOF isolation systems. This includes design of an integrated 1 cm gap 6-DOF noncontacting magnetic suspension system and of a 'coarse' follower which permits the practical extension of magnetic suspension to large strokes. The proposed 'coarse' actuator was a closed kinematic chain manipulator known as a Stewart Platform. The integration of the two isolation systems together, the isolation tasks assigned to each, and possible control architectures were also explored. The results of this research are examined.

Source record↗