Copper Electrodeposition in High Aspect Ratio Mesoscale Through-Silicon Vias: Scaling from Die Level to Wafer Level Plating.
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APS March Meeting 2022, Virtual, March 13-18, 2022
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2022 Society for Industrial and Applied Mathematics Annual Meeting, Pittsburgh, PA, July 11-15, 2022
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This paper describes film cooling performance of V-shaped downstream vortex generators under perpendicular coolant crossflow. A novel experimental method is also described to measure adiabatic film effectiveness and local heat transfer coefficients in a non-adiabatic test rig.