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At least 451 records · Page 25
All sourcesNASA NTRSDOE OSTI
NASA NTRS1985

TWT efficiency enhancement with textured carbon surfaces on copper MDC electrodes

A method of improving the efficiency of multistage depressed collectors (MDC's) for traveling-wave tubes (TWT's) has been demonstrated at the NASA Lewis Research Center. A significant increase in MDC efficiency was brought about by the application of a thin layer of highly-textured carbon to the surfaces of oxygen-free, high-conductivity (OFHC) copper collector electrodes in an experimental TWT. The textured carbon layer was applied by means of a NASA developed sputtering procedure. In an experimental investigation recently completed, this electrode surface modification resulted in an increase in MDC efficiency by as much as 8.6 percentage points relative to that of the same MDC with untreated copper electrode surfaces. This increase in MDC efficiency was reflected by an increase in overall TWT efficiency by as much as 5.4 percentage points.

Curren, A. N.↗
NASA NTRS1988

Copper peroxide

A number of oxidizing agents, including chlorine, bromine, ozone and other peroxides, were allowed to act on copper solutions with the intention of forming copper peroxide. The only successful agent appears to be hydrogen peroxide. It must be used in a neutral 50 to 30 percent solution at a temperature near zero. Other methods described in the literature apparently do not work. The excess of hydrogen must be quickly sucked out of the brown precipitate, which it is best to wash with alcohol and ether. The product, crystalline under a microscope, can be analyzed only approximately. It approaches the formula CuO2H2O. In alkaline solution it appears to act catalytically in causing the decomposition of other peroxides, so that Na2O2 cannot be used to prepare it. On the addition of acids the H2O2 is regenerated. The dry substance decomposes much more slowly than the moist but is not very stable.

Moser, L.↗
NASA NTRS1988

Thermal conductivity, electrical conductivity and specific heat of copper-carbon fiber composite

We have developed a new copper-carbon fiber composite which possesses properties of copper, i.e., excellent thermal and electrical conductivities, in combination with a property of carbon fiber, i.e., a small thermal expansion coefficient. The composite properties can be controlled by the amount, type and orientation of the carbon fibers they contain. Therefore, this composite is considered to be useful as an electrical material. The effects of volume and arrangement of fibers on the thermal conductivity, electrical conductivity and specific heat of the composite were studied. The results obtained were as follows: (1) The thermal and electrical conductivities of the composite became smaller as the volume of carbon fibers increased, and they were also influenced by the fiber arrangement. (2) The above conductivities could be calculated by careful application of the “rule of mixtures” for composites. (3) The specific heat of the composite was dependent not on the fiber arrangement but on the fiber volume. (4) In thermal fatigue tests, no degradation in electrical conductivity was observed.

Keiichi Kuniya↗
NASA NTRS1989

Characterization of failure processes in tungsten copper composites under fatigue loading conditions

A fractographic and metallographic investigation was performed on specimens of a tungsten fiber reinforced copper matrix composite (9 vol percent), which had experienced fatigue failures at elevated temperatures. Major failure modes and possible failure mechanisms, with an emphasis placed on characterizing fatigue damage accumulation, were determined. Metallography of specimens fatigued under isothermal cyclic loading suggested that fatigue damage initiates in the matrix. Cracks nucleated within the copper matrix at grain boundaries, and they propagated through cavity coalescence. The growing cracks subsequently interacted with the reinforcing tungsten fibers, producing a localized ductile fiber failure. Examinations of interrupted tests before final failure confirmed the suggested fatigue damage processes.

Kim, Yong-Suk↗
NASA NTRS1989

High temperature fatigue behavior of tungsten copper composites

The high temperature fatigue behavior of a 9 vol percent, tungsten fiber reinforced copper matrix composite was investigated. Load-controlled isothermal fatigue experiments at 260 and 560 C and thermomechanical fatigue (TMF) experiments, both in phase and out of phase between 260 and 560 C, were performed. The stress-strain response displayed considerable inelasticity under all conditions. Also, strain ratcheting was observed during all the fatigue experiments. For the isothermal fatigue and in-phase TMF tests, the ratcheting was always in a tensile direction, continuing until failure. The ratcheting during the out-of-phase TMF test shifted from a tensile direction to a compressive direction. This behavior was thought to be associated with the observed bulging and the extensive cracking of the out-of-phase specimen. For all cases, the fatigue lives were found to be controlled by damage to the copper matrix. Grain boundary cavitation was the dominant damage mechanism of the matrix. On a stress basis, TMF loading reduced lives substantially, relative to isothermal cycling. In-phase cycling resulted in the shortest lives, and isothermal fatigue at 260 C, the longest.

Verrilli, Michael J.↗
NASA NTRS1991

Grain boundary sliding behaviour of copper and alpha brass at intermediate temperatures

The role of grain boundary sliding in copper and Cu-30 pct Zn in the temperature range 0.50-0.72 Tm, where Tm is the absolute melting point of the material, is examined. First, sliding data obtained on these materials are presented. The results indicate that the stress exponent for sliding is similar to that for lattice deformation, while the activation energy for sliding varies between 0.5 and 1.6 of the activation energy for creep. Several models proposed for grain boundary sliding are discussed, and it is shown that they do not account for the observed results on copper and alpha brass. A phenomenological model is proposed, where it is assumed that grain boundary sliding results from the glide of dislocations on secondary slip planes.

Raj, S. V.↗
NASA NTRS1990

High temperature fatigue behavior of tungsten copper composites

The present study investigates the high-temperature fatigue behavior of a 9-v/o tungsten fiber-reinforced copper matrix composite. Load-controlled isothermal fatigue at 260 and 560 C and thermomechanical fatigue (TMF) experiments, both in-phase and out-of-phase between 260 and 560 C, were performed. The stress-strain response under all conditions displayed considerable inelasticity. Strain ratchetting was observed during all the fatigue experiments. For the isothermal fatigue and in-phase TMF tests, the ratchetting was always in a tensile direction, continuing until failure. The ratchetting during the out-of-phase TMF test shifted from a tensile to a compressive direction. For all cases, the fatigue lives were found to be controlled by the damage of the copper matrix. On a stress basis, TMF loading substantially reduced lives relative to isothermal cycling.

Verrilli, M. J.↗
NASA NTRS1990

Chemical reaction of atomic oxygen with evaporated films of copper, part 4

Evaporated copper films were exposed to an atomic oxygen flux of 1.4 x 10(exp 17) atoms/sq cm per sec at temperatures in the range 285 to 375 F (140 to 191 C) for time intervals between 2 and 50 minutes. Rutherford backscattering spectroscopy (RBS) was used to determine the thickness of the oxide layers formed and the ratio of the number of copper to oxygen atoms in the layers. Oxide film thicknesses ranged from 50 to 3000 A (0.005 to 0.3 microns, or equivalently, 5 x 10(exp -9) to 3 x 10(exp -7); it was determined that the primary oxide phase was Cu2O. The growth law was found to be parabolic (L(t) varies as t(exp 1/2)), in which the oxide thickness L(t) increases as the square root of the exposure time t. The analysis of the data is consistent with either of the two parabolic growth laws. (The thin-film parabolic growth law is based on the assumption that the process is diffusion controlled, with the space charge within the growing oxide layer being negligible. The thick-film parabolic growth law is also based on a diffusion controlled process, but space-charge neutrality prevails locally within very thick oxides.) In the absence of a voltage measurement across the growing oxide, a distinction between the two mechanisms cannot be made, nor can growth by the diffusion of neutral atomic oxygen be entirely ruled out. The activation energy for the reaction is on the order of 1.1 eV (1.76 x 10(exp -19) joule, or equivalently, 25.3 kcal/mole).

Fromhold, A. T.↗
NASA NTRS1992

Analysis of Yttrium-Barium-Copper-Oxide by x ray diffraction and mechanical characterization

The efforts in developing high-temperature superconductor (HTSC) YBa2Cu3O7 electrical leads are to benefit future NASA missions that will carry payloads with sensitive instruments operating at cryogenic temperatures. Present-day leads made of copper or magnesium are responsible for as much as 50 percent of the parasitic heat load on cryogenic systems. A reduction of this load could be achieved by replacing the conventional materials with HTSC ceramic electrical leads. Superconductor quality has become a concern in the industry, as has the development of effective evaluation methods. The factors that need to be examined for these materials include material purity, mechanical properties, and superconducting ability below the critical temperature. We applied several methods to study these factors: thermogravimetric analysis, x-ray diffraction, tensile testing, and laser-generated ultrasound. Our objectives were to determine the average tensile strength and Young's modulus of the HTSC material and to compare them to those values for copper and manganin.

Arsenovic, Petar↗
NASA NTRS1990

Cyclic hot firing results of tungsten-wire-reinforced, copper-lined thrust chambers

An advanced thrust liner material for potential long life reusable rocket engines is described. This liner material was produced with the intent of improving the reusable life of high pressure thrust chambers by strengthening the chamber in the hoop direction, thus avoiding the longitudinal cracking due to low cycle fatigue that is observed in conventional homogeneous copper chambers, but yet not reducing the high thermal conductivity that is essential when operating with high heat fluxes. The liner material produced was a tungsten wire reinforced copper composite. Incorporating this composite into two hydrogen-oxygen test rocket chambers was done so that its performance as a reusable liner material could be evaluated. Testing results showed that both chambers failed prematurely, but the crack sites were perpendicular to the normal direction of cracking indicating a degree of success in containing the tremendous thermal strain associated with high temperature rocket engines. The failures, in all cases, were associated with drilled instrumentation ports and no other damages or deformations were found elsewhere in the composite liners.

Kazaroff, John M.↗
NASA NTRS1991

The effect of copper, chromium, and zirconium on the microstructure and mechanical properties of Al-Zn-Mg-Cu alloys

The present study evaluates the effect of the systematic variation of copper, chromium, and zirconium contents on the microstructure and mechanical properties of a 7000-type aluminum alloy. Fracture toughness and tensile properties are evaluated for each alloy in both the peak aging, T8, and the overaging, T73, conditions. Results show that dimpled rupture essentially characterize the fracture process in these alloys. In the T8 condition, a significant loss of toughness is observed for alloys containing 2.5 pct Cu due to the increase in the quantity of Al-Cu-Mg-rich S-phase particles. An examination of T8 alloys at constant Cu levels shows that Zr-bearing alloys exhibit higher strength and toughness than the Cr-bearing alloys. In the T73 condition, Cr-bearing alloys are inherently tougher than Zr-bearing alloys. A void nucleation and growth mechanism accounts for the loss of toughness in these alloys with increasing copper content.

Wagner, John A.↗
NASA NTRS1993

Ultraviolet optical absorptions of semiconducting copper phosphate glasses

Results are presented of a quantitative investigation of the change in UV optical absorption in semiconducting copper phosphate glasses with batch compositions of 40, 50, and 55 percent CuO, as a function of the Cu(2+)/Cu(total) ratio in the glasses for each glass composition. It was found that optical energy gap, E(opt), of copper phosphate glass is a function of both glass composition and Cu(2+)/Cu(total) ratio in the glass. E(opt) increases as the CuO content for fixed Cu(2+)/Cu(total) ratio and the Cu(2+)/Cu(total) ratio for fixed glass composition are reduced.

Bae, Byeong-Soo↗
NASA NTRS1994

Copper Alloy For High-Temperature Uses

Alloy of Cu/8Cr/4Nb (numbers indicate parts by atom percent) improved over older high-temperature copper-based alloys in that it offers enhanced high temperature strength, resistance to creep, and ductility while retaining most of thermal conductivity of pure copper; in addition, alloy does not become embrittled upon exposure to hydrogen at temperatures as high as 705 degrees C. Designed for use in presence of high heat fluxes and active cooling; for example, in heat exchangers in advanced aircraft and spacecraft engines, and other high-temperature applications in which there is need for such material. High conductivity and hardness of alloy exploited in welding electrodes and in high-voltage and high-current switches and other applications in which wear poses design problem.

Dreshfield, Robert L.↗
NASA NTRS1993

The Sixth Copper Mountain Conference on Multigrid Methods, part 2

The Sixth Copper Mountain Conference on Multigrid Methods was held on April 4-9, 1993, at Copper Mountain, Colorado. This book is a collection of many of the papers presented at the conference and so represents the conference proceedings. NASA Langley graciously provided printing of this document so that all of the papers could be presented in a single forum. Each paper was reviewed by a member of the conference organizing committee under the coordination of the editors. The multigrid discipline continues to expand and mature, as is evident from these proceedings. The vibrancy in this field is amply expressed in these important papers, and the collection clearly shows its rapid trend to further diversity and depth.

Melson, N. Duane↗
NASA NTRS1993

The Sixth Copper Mountain Conference on Multigrid Methods, part 1

The Sixth Copper Mountain Conference on Multigrid Methods was held on 4-9 Apr. 1993, at Copper Mountain, CO. This book is a collection of many of the papers presented at the conference and as such represents the conference proceedings. NASA LaRC graciously provided printing of this document so that all of the papers could be presented in a single forum. Each paper was reviewed by a member of the conference organizing committee under the coordination of the editors. The multigrid discipline continues to expand and mature, as is evident from these proceedings. The vibrancy in this field is amply expressed in these important papers, and the collection clearly shows its rapid trend to further diversity and depth.

Melson, N. Duane↗
NASA NTRS1995

Forming Refractory Insulation On Copper Wire

Alternative insulating process forms flexible coat of uncured refractory insulating material on copper wire. Coated wire formed into coil or other complex shape. Wire-coating apparatus forms "green" coat on copper wire. After wire coiled, heating converts "green" coat to refractory electrical insulator. When cured to final brittle form, insulating material withstands temperatures above melting temperature of wire. Process used to make coils for motors, solenoids, and other electrical devices to be operated at high temperatures.

Setlock, J.↗
NASA NTRS1995

Texturing Copper To Reduce Secondary Emission Of Electrons

Ion-beam process produces clean, deeply textured surfaces on copper substrates with reduced secondary electron emission. In process, molybdenum ring target positioned above and around copper substrate. Target potential repeatedly switched on and off. Switching module described in "High-Voltage MOSFET Switching Circuit" (LEW-15986). Useful for making collector electrodes for traveling-wave-tube and klystron microwave amplifiers, in which secondary emission of electrons undesirable because of reducing efficiency.

Jensen, Kenneth A.↗
NASA NTRS1996

Seventh Copper Mountain Conference on Multigrid Methods

The Seventh Copper Mountain Conference on Multigrid Methods was held on April 2-7, 1995 at Copper Mountain, Colorado. This book is a collection of many of the papers presented at the conference and so represents the conference proceedings. NASA Langley graciously provided printing of this document so that all of the papers could be presented in a single forum. Each paper was reviewed by a member of the conference organizing committee under the coordination of the editors. The vibrancy and diversity in this field are amply expressed in these important papers, and the collection clearly shows the continuing rapid growth of the use of multigrid acceleration techniques.

Melson, N. Duane↗