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At least 469 records · Page 26

Unreal Engine Testbed for Computer Vision of Tall Lunar Tower Assembly

The Tall Lunar Tower project at the NASA Langley Research Center is focused on the design, modeling, fabrication, and testing of a supervised autonomously assembly engineering development unit for tall lunar towers. The lunar south pole environment poses many challenges for robotic assembly of the tall tower, particularly to computer vision camera systems due to a high-contrast lighting environment. This paper will present an Unreal Engine 5 video game engine Lunar South Pole Lighting Testbed to simulate realistic lunar lighting conditions for synthetic image generation. The fidelity of the simulation environment is investigated by comparing the accuracy of computer vision models trained using synthetic image data and trained from real image data collected in a lunar analog environment.

Unreal Engine↗

Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications

A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.

High temperature↗

Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications

A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.

High temperature↗

NASA Tech Briefs, February 2007

Topics covered include: Calibration Test Set for a Phase-Comparison Digital Tracker; Wireless Acoustic Measurement System; Spiral Orbit Tribometer; Arrays of Miniature Microphones for Aeroacoustic Testing; Predicting Rocket or Jet Noise in Real Time; Computational Workbench for Multibody Dynamics; High-Power, High-Efficiency Ka-Band Space Traveling-Wave Tube; Gratings and Random Reflectors for Near-Infrared PIN Diodes; Optically Transparent Split-Ring Antennas for 1 to 10 GHz; Ice-Penetrating Robot for Scientific Exploration; Power-Amplifier Module for 145 to 165 GHz; Aerial Videography From Locally Launched Rockets; SiC Multi-Chip Power Modules as Power-System Building Blocks; Automated Design of Restraint Layer of an Inflatable Vessel; TMS for Instantiating a Knowledge Base With Incomplete Data; Simulating Flights of Future Launch Vehicles and Spacecraft; Control Code for Bearingless Switched- Reluctance Motor; Machine Aided Indexing and the NASA Thesaurus; Arbitrating Control of Control and Display Units; Web-Based Software for Managing Research; Driver Code for Adaptive Optics; Ceramic Paste for Patching High-Temperature Insulation; Fabrication of Polyimide-Matrix/Carbon and Boron-Fiber Tape; Protective Skins for Aerogel Monoliths; Code Assesses Risks Posed by Meteoroids and Orbital Debris; Asymmetric Bulkheads for Cylindrical Pressure Vessels; Self-Regulating Water-Separator System for Fuel Cells; Self-Advancing Step-Tap Drills; Array of Bolometers for Submillimeter- Wavelength Operation; Delta-Doped CCDs as Detector Arrays in Mass Spectrometers; Arrays of Bundles of Carbon Nanotubes as Field Emitters; Staggering Inflation To Stabilize Attitude of a Solar Sail; and Bare Conductive Tether for Decelerating a Spacecraft.

Source record↗

Unreal Engine Testbed for Computer Vision of Tall Lunar Tower Assembly

The Tall Lunar Tower project at the NASA Langley Research Center is focused on the design, modeling, fabrication, and testing of a supervised autonomously assembly engineering development unit for tall lunar towers. The lunar south pole environment poses many challenges for robotic assembly of the tall tower, particularly to computer vision camera systems due to a high-contrast lighting environment. This paper will present an Unreal Engine 5 video game engine Lunar South Pole Lighting Testbed to simulate realistic lunar lighting conditions for synthetic image generation. The fidelity of the simulation environment is investigated by comparing the accuracy of computer vision models trained using synthetic image data and trained from real image data collected in a lunar analog environment.

Unreal Engine↗

Unreal Engine Testbed for Computer Vision of Tall Lunar Tower Assembly

The Tall Lunar Tower project at the NASA Langley Research Center is focused on the design, modeling, fabrication, and testing of a supervised autonomously assembled engineering development unit for tall lunar towers. The lunar south pole environment poses many challenges for robotic assembly of the tall tower, particularly to computer vision camera systems due to a high-contrast lighting environment. This paper will present an Unreal Engine 5 video game engine Lunar South Pole Lighting Testbed to simulate realistic lunar lighting conditions for synthetic image generation. The fidelity of the simulation environment is investigated by comparing the accuracy of computer vision models trained using synthetic image data and trained from real image data collected in a lunar analog environment.

Unreal Engine↗

Arrays of Miniature Microphones for Aeroacoustic Testing

A phased-array system comprised of custom-made and commercially available microelectromechanical system (MEMS) silicon microphones and custom ancillary hardware has been developed for use in aeroacoustic testing in hard-walled and acoustically treated wind tunnels. Recent advances in the areas of multi-channel signal processing and beam forming have driven the construction of phased arrays containing ever-greater numbers of microphones. Traditional obstacles to this trend have been posed by (1) the high costs of conventional condenser microphones, associated cabling, and support electronics and (2) the difficulty of mounting conventional microphones in the precise locations required for high-density arrays. The present development overcomes these obstacles. One of the hallmarks of the new system is a series of fabricated platforms on which multiple microphones can be mounted. These mounting platforms, consisting of flexible polyimide circuit-board material (see left side of figure), include all the necessary microphone power and signal interconnects. A single bus line connects all microphones to a common power supply, while the signal lines terminate in one or more data buses on the sides of the circuit board. To minimize cross talk between array channels, ground lines are interposed as shields between all the data bus signal lines. The MEMS microphones are electrically connected to the boards via solder pads that are built into the printed wiring. These flexible circuit boards share many characteristics with their traditional rigid counterparts, but can be manufactured much thinner, as small as 0.1 millimeter, and much lighter with boards weighing as much as 75 percent less than traditional rigid ones. For a typical hard-walled wind-tunnel installation, the flexible printed-circuit board is bonded to the tunnel wall and covered with a face sheet that contains precise cutouts for the microphones. Once the face sheet is mounted, a smooth surface is established over the entire array due to the flush mounting of all microphones (see right side of figure). The face sheet is made from a continuous glass-woven-fabric base impregnated with an epoxy resin binder. This material offers a combination of high mechanical strength and low dielectric loss, making it suitable for withstanding the harsh test section environment present in many wind tunnels, while at the same time protecting the underlying polyimide board. Customized signal-conditioning hardware consisting of line drivers and antialiasing filters are coupled with the array. The line drivers are constructed using low-supply-current, high-gain-bandwidth operational amplifiers designed to transmit the microphone signals several dozen feet from the array to external acquisition hardware. The anti-alias filters consist of individual Chebyshev low-pass filters (one for each microphone channel) housed on small printed-circuit boards mounted on one or more motherboards. The mother/daughter board design results in a modular system, which is easy to debug and service and which enables the filter characteristics to be changed by swapping daughter boards with ones containing different filter parameters. The filter outputs are passed to commercially- available acquisition hardware to digitize and store the conditioned microphone signals. Wind-tunnel testing of the new MEMS microphone polyimide mounting system shows that the array performance is comparable to that of traditional arrays, but with significantly less cost of construction.

Shams, Qamar A.↗

NASA Tech Briefs, February 2005

Topics discussed include: Instrumentation for Sensitive Gas Measurements; Apparatus for Testing Flat Specimens of Thermal Insulation; Quadrupole Ion Mass Spectrometer for Masses of 2 to 50 Da; Miniature Laser Doppler Velocimeter for Measuring Wall Shear; Coherent Laser Instrument Would Measure Range and Velocity; Printed Microinductors for Flexible Substrates; Digital Receiver for Microwave Radiometry; Printed Antennas Made Reconfigurable by Use of MEMS Switches; Traffic-Light-Preemption Vehicle-Transponder Software Module; Intersection-Controller Software Module; Central-Monitor Software Module; Estimating Effects of Multipath Propagation on GPS Signals; Parallel Adaptive Mesh Refinement Library; Predicting Noise From Aircraft Turbine-Engine Combustors; Generating Animated Displays of Spacecraft Orbits; Diagnosis and Prognosis of Weapon Systems; Training Software in Artificial-Intelligence Computing Techniques; APGEN Version 5.0; Single-Command Approach and Instrument Placement by a Robot on a Target; Three-Dimensional Audio Client Library; Isogrid Membranes for Precise, Singly Curved Reflectors; Nickel-Tin Electrode Materials for Nonaqueous Li-Ion Cells; Photocatalytic Coats in Glass Drinking-Water Bottles; Fast Laser Shutters With Low Vibratory Disturbances; Series-Connected Buck Boost Regulators; Space Physics Data Facility Web Services; Split-Resonator, Integrated-Post Vibratory Microgyroscope; Blended Buffet-Load-Alleviation System for Fighter Airplane; Gifford-McMahon/Joule-Thomson Refrigerator Cools to 2.5 K; High-Temperature, High-Load-Capacity Radial Magnetic Bearing; Fabrication of Spherical Reflectors in Outer Space; Automated Rapid Prototyping of 3D Ceramic Parts; Tissue Engineering Using Transfected Growth-Factor Genes; Automation of Vapor-Diffusion Growth of Protein Crystals; Atom Skimmers and Atom Lasers Utilizing Them; Gears Based on Carbon Nanotubes; Patched Off-Axis Bending/Twisting Actuators for Thin Mirrors; and Improving Control in a Joule-Thomson Refrigerator.

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The Biolink Implantable Telemetry System

Most biotelemetry applications deal with the moderated data rates of biological signals. Few people have studied the problem of transcutaneous data transmission at the rates required by NASA's Life Sciences-Advanced BioTelemetry System (LS-ABTS). Implanted telemetry eliminate the problems associated with wire breaking the skin, and permits experiments with awake and unrestrained subjects. Our goal is to build a low-power 174-216MHz Radio Frequency (RF) transmitter suitable for short range biosensor and implantable use. The BioLink Implantable Telemetry System (BITS) is composed of three major units: an Analog Data Module (ADM), a Telemetry Transmitter Module (TTM), and a Command Receiver Module (CRM). BioLink incorporates novel low-power techniques to implement a monolithic digital RF transmitter operating at 100kbps, using quadrature phase shift keying (QPSK) modulation in the 174-216MHz ISM band. As the ADM will be specific for each application, we focused on solving the problems associated with a monolithic implementation of the TTM and CRM, and this is the emphasis of this report. A system architecture based on a Frequency-Locked Loop (FLL) Frequency Synthesizer is presented, and a novel differential frequency that eliminates the need for a frequency divider is also shown. A self sizing phase modulation scheme suitable for low power implementation was also developed. A full system-level simulation of the FLL was performed and loop filter parameters were determined. The implantable antenna has been designed, simulated and constructed. An implant package compatible with the ABTS requirements is also being proposed. Extensive work performed at 200MHz in 0.5um complementary metal oxide semiconductors (CMOS) showed the feasibility of integrating the RF transmitter circuits in a single chip. The Hajimiri phase noise model was used to optimize the Voltage Controlled Oscillator (VCO) for minimum power consumption. Two test chips were fabricated in a 0.5pm, 3V CMOS process. Measured phase noise for a 1.5mW, 200MHz ring oscillator VCO is -80dBc/Hz at 100KHZ offset, showing good agreement with the theory. We also propose a novel superregenerative receiver architecture for implementing the command receiver. The superregenerative receiver's simplicity, low cost, and low power consumption has made it the receiver of choice for short-distance data communications, remote control and home automation. We present the design of a superregenerative AM receiver implemented in a 0.5um CMOS technology that operates at 433.92MHz and dissipates only 300uW. Further work entails detailed transistor-level design of the FLL and superregenerative receiver and a monolithic implementation of an implantable transceiver in 0.5um CMOS technology.

Betancourt-Zamora, Rafael J.↗

NASA Tech Briefs, October 2010

Topics covered include: Hybrid Architecture Active Wavefront Sensing and Control; Carbon-Nanotube-Based Chemical Gas Sensor; Aerogel-Positronium Technology for the Detection of Small Quantities of Organic and/or Toxic Materials; Graphene-Based Reversible Nano-Switch/Sensor Schottky Diode; Inductive Non-Contact Position Sensor; High-Temperature Surface-Acoustic-Wave Transducer; Grid-Sphere Electrodes for Contact with Ionospheric Plasma; Enabling IP Header Compression in COTS Routers via Frame Relay on a Simplex Link; Ka-Band SiGe Receiver Front-End MMIC for Transponder Applications; Robust Optimization Design Algorithm for High-Frequency TWTs; Optimal and Local Connectivity Between Neuron and Synapse Array in the Quantum Dot/Silicon Brain; Method and Circuit for In-Situ Health Monitoring of Solar Cells in Space; BGen: A UML Behavior Network Generator Tool; Platform for Post-Processing Waveform-Based NDE; Electrochemical Hydrogen Peroxide Generator; Fabrication of Single, Vertically Aligned Carbon Nanotubes in 3D Nanoscale Architectures; Process to Create High-Fidelity Lunar Dust Simulants; Lithium-Ion Electrolytes Containing Phosphorous-Based, Flame-Retardant Additives; InGaP Heterojunction Barrier Solar Cells; Straight-Pore Microfilter with Efficient Regeneration; Determining Shear Stress Distribution in a Laminate; Self-Adjusting Liquid Injectors for Combustors; Handling Qualities Prediction of an F-16XL-Based Reduced Sonic Boom Aircraft; Tele-Robotic ATHLETE Controller for Kinematics - TRACK; Three-Wheel Brush-Wheel Sampler; Heterodyne Interferometer Angle Metrology; Aligning Astronomical Telescopes via Identification of Stars; Generation of Optical Combs in a WGM Resonator from a Bichromatic Pump; Large-Format AlGaN PIN Photodiode Arrays for UV Images; Fiber-Coupled Planar Light-Wave Circuit for Seed Laser Control in High Spectral Resolution Lidar Systems; On Calculating the Zero-Gravity Surface Figure of a Mirror; Optical Modification of Casimir Forces for Improved Function of Micro- and Nano-Scale Devices; Analysis, Simulation, and Verification of Knowledge-Based, Rule-Based, and Expert Systems; Core and Off-Core Processes in Systems Engineering; Digital Reconstruction Supporting Investigation of Mishaps; and Template Matching Approach to Signal Prediction.

Source record↗

The Rapid Response Radiation Survey (R3S) Mission Using the HiSat Conformal Satellite Architecture

The Rapid Response Radiation Survey (R3S) experiment, designed as a quick turnaround mission to make radiation measurements in Low Earth Orbit (LEO), will fly as a hosted payload in partnership with NovaWurks using their Hyper-integrated Satlet (HISat) architecture. The need for the mission arises as the Nowcast of Atmospheric Ionization Radiation for Aviation Safety (NAIRAS) model moves from a research effort into an operational radiation assessment tool. Currently, airline professionals are the second largest demographic of radiation workers and to date their radiation exposure is undocumented in the USA. The NAIRAS model seeks to fill this information gap. The data collected by R3S, in addition to the complementary data from a NASA Langley Research Center (LaRC) atmospheric balloon mission entitled Radiation Dosimetry Experiment (RaD-X), will validate exposure prediction capabilities of NAIRAS. The R3S mission collects total dose and radiation spectrum measurements using a Teledyne μDosimeter and a Liulin-6SA2 LED spectrometer. These two radiation sensors provide a cross correlated radiometric measurement in combination with the Honeywell HMR2300 Smart Digital Magnetometer. The magnetometer assesses the Earth's magnetic field in the LEO environment and allows radiation dose to be mapped as a function of the Earth's magnetic shielding. R3S is also unique in that the radiation sensors will be exposed on the outer surface of the spacecraft, possibly making this the first measurements of the LEO radiation environment with bare sensors. Viability of R3S as an extremely fast turnaround mission is due, in part, to the nature of the robust, well-defined interfaces of the conformal satellite HiSat Architecture. The HiSat architecture, which was developed with the support of the Defense Advanced Research Projects Agency's (DARPA's) Phoenix Program, enabled the R3S system to advance from the first concept to delivery of preliminary design review (PDR) level documents in 29 calendar days. The architecture allows for interface complexities between the specific devices and the satellite bus to be resolved in a standardized interface control document (ICD). The ICD provided a readymade framework to interface to the modular satellite bus. This modularity allowed for approximately 90% of the R3S system to be designed and fabricated in two months without constraint of the hosting satellite's development cycle. This paper discusses the development of the R3S experiment as made possible by use of the HiSat architecture. The system design and operational modes of the experiment are described, as well as the experiment interfaces to the HiSat satellite via the user defined adapter (UDA) provided by NovaWurks. This paper outlines the steps taken by the project to execute the R3S mission in the 4 months of design, build, and test. Additionally portrayed is the ground work done at LaRC to posture the organization for a fast response and the process by which the opportunity was identified as aligning with key strategic goals. Finally, a description of the engineering process is provided, including the use of facilitated rapid/concurrent engineering sessions, the associated documentation, and the review process employed.

Miller, Nathanael A.↗

Convergent Manufacturing of Large-Scale Components for Nuclear Applications, via Additive Manufacturing and Powder Metallurgy Hot Isostatic Pressing

Powder metallurgy (PM)–hot isostatic pressing (PM-HIP) has long been recognized as a powerful route for producing fully dense, near net shape metallic components. By consolidating powders under high temperature and pressure, HIP provides isotropic properties, uniform microstructures, and scalability to complex geometries that are vital for sectors such as aerospace, energy, and nuclear power. Yet despite these advantages, the technology has remained constrained by costly trial and error canister fabrication, limitations of conventional forging, and incomplete knowledge about how the canister design influences final part properties. Additive manufacturing (AM), by contrast, thrives on design freedom and geometric flexibility but struggles with speed, scalability, and cost when applied to very large structures. The research presented in this report investigated how a convergent manufacturing approach, combining AM with PM-HIP, can merge the strengths of both technologies, leveraging AM’s flexibility for canister design and HIP’s consolidation capability to deliver reliable, large, and complex parts. The work progressed through three case studies that built on one another in scale and complexity. Small cylindrical canisters fabricated by conventional methods, laser powder bed fusion, and directed energy deposition were filled with stainless steel powders and subjected to HIP. The resulting parts demonstrated near-full density and mechanical properties on par with wrought stainless steel, showing for the first time that AM canisters can be a direct substitute for conventional ones without sacrificing quality. The next step involved a medium-scale, noncentrosymmetric T-valve, which is an enclosed, multibranch geometry that tested the limits of AM + PM-HIP integration. The T-valve achieved predictable shrinkage and uniform densification, confirming feasibility for enclosed designs. However, this study also revealed oxide inclusions and interfacial challenges at the AM + HIP boundary, underscoring the critical importance of controlling interface chemistry and employing robust, in situ strategies, such as melt pool monitoring and thermal monitoring, coupled with nondestructive evaluation techniques such as x-ray computed tomography. Finally, the effort culminated in fabricating a large-scale impeller weighing nearly 2000 lb and spanning 5 ft in diameter. Produced via multirobot wire arc AM and hot isostatic pressed to near-full density, the impeller validated industrial-scale feasibility. Predictive models closely matched experimental shrinkage, tensile properties were spatially uniform across the component, and the AM + PM-HIP interface proved mechanically sound despite the presence of oxide-decorated prior particle boundaries. This large-scale demonstration is a major milestone, showing that hybrid AM + PM‑HIP can reliably deliver components at reactor-relevant scales. Collectively, these studies charted a logical pathway: small-scale work built scientific confidence, medium-scale work highlighted opportunities and challenges, and large-scale work proved industrial impact. The overarching conclusion of this report is that AM + PM-HIP should not be seen as a replacement for forging but as a complementary pathway that provides the US with flexibility, resilience, and new options for manufacturing nuclear-grade components. Looking ahead, several directions emerge as critical to sustaining progress. Predictive modeling must become faster, more accessible, and more accurate, with digital twins and machine learning reducing reliance on trial and error. Powders and alloys must be optimized for HIP, with improved cleanliness, reduced oxides, and tailored chemistries that enhance creep, fatigue, and irradiation resistance. Interfaces between AM and HIP regions must be better engineered through coatings, machining strategies, and surface treatments to mitigate oxide formation and ensure reliable bonding to explore opportunities for HIP of targeted compositional parts, as well as multimaterial HIP cladding applications. Monitoring and nondestructive evaluation need to expand, incorporating multimodal sensors, x-ray computed tomography, and real-time data integration through platforms such as Pelican. At the same time, the pathway to industrial adoption requires techno-economic analysis, machinability studies, and qualification frameworks aligned with industry and regulatory standards. Finally, workforce and academic engagement must be strengthened. Programs that train technicians and engineers for US Navy and US Department of Energy manufacturing challenges should be paired with academic partnerships to support fundamental research, with open sharing of non-export-controlled data to accelerate innovation and build the next generation of experts. In conclusion, this report demonstrates that hybrid AM + PM-HIP is scientifically viable and strategically important. By combining the design agility of AM with the consolidation strength of HIP and embedding modeling, monitoring, and workforce development, this approach provided a transformative new capability for US manufacturing. The path forward is clear: hybrid AM + PM-HIP is not just a promising research direction but is also potentially an industrially relevant pathway that can reshape how nuclear-grade components are designed, qualified, and deployed.

36 MATERIALS SCIENCE↗

Design of Test Support Hardware for Advanced Space Suits

As a member of the Space Suit Assembly Development Engineering Team, I designed and built test equipment systems to support the development of the next generation of advanced space suits. During space suit testing it is critical to supply the subject with two functions: (1) cooling to remove metabolic heat, and (2) breathing air to pressurize the space suit. The objective of my first project was to design, build, and certify an improved Space Suit Cooling System for manned testing in a 1‐G environment. This design had to be portable and supply a minimum cooling rate of 2500 BTU/hr. The Space Suit Cooling System is a robust, portable system that supports very high metabolic rates. It has a highly adjustable cool rate and is equipped with digital instrumentation to monitor the flowrate and critical temperatures. It can supply a variable water temperature down to 34 deg., and it can generate a maximum water flowrate of 2.5 LPM. My next project was to design and build a Breathing Air System that was capable of supply facility air to subjects wearing the Z‐2 space suit. The system intakes 150 PSIG breathing air and regulates it to two operating pressures: 4.3 and 8.3 PSIG. It can also provide structural capabilities at 1.5x operating pressure: 6.6 and 13.2 PSIG, respectively. It has instrumentation to monitor flowrate, as well as inlet and outlet pressures. The system has a series of relief valves to fully protect itself in case of regulator failure. Both projects followed a similar design methodology. The first task was to perform research on existing concepts to develop a sufficient background knowledge. Then mathematical models were developed to size components and simulate system performance. Next, mechanical and electrical schematics were generated and presented at Design Reviews. After the systems were approved by the suit team, all the hardware components were specified and procured. The systems were then packaged, fabricated, and thoroughly tested. The next step was to certify the equipment for manned used, which included generating a Hazard Analysis and giving a presentation to the Test Readiness Review Board. Both of these test support systems will perform critical roles in the development of next‐generation space suits. They will used on a regular basis to test the NASA's new Z‐2 Space Suit. The Space Suit Cooling System is now the primary cooling system for all advanced suit tests.

Watters, Jeffrey A.↗

NASA Tech Briefs, May 2009

Topics covered include: Valve-"Health"-Monitoring System; Microstrip Antenna for Remote Sensing of Soil Moisture and Sea Surface Salinity; Biomedical Wireless Ambulatory Crew Monitor; Wireless Avionics Packet to Support Fault Tolerance for Flight Applications; Aerobot Autonomy Architecture; Submillimeter Confocal Imaging Active Module; Traveling-Wave Maser for 32 GHz; System Synchronizes Recordings from Separated Video Cameras; Piecewise-Planar Parabolic Reflectarray Antenna; Reducing Interference in ATC Voice Communication; EOS MLS Level 1B Data Processing, Version 2.2; Auto-Generated Semantic Processing Services; Geospatial Authentication; Maneuver Automation Software; Event Driven Messaging with Role-Based Subscriptions; Estimating Relative Positions of Outer-Space Structures; Fabricating PFPE Membranes for Capillary Electrophoresis; Linear Actuator Has Long Stroke and High Resolution; Installing a Test Tap on a Metal Battery Case; Fabricating PFPE Membranes for Microfluidic Valves and Pumps; Room-Temperature-Cured Copolymers for Lithium Battery Gel Electrolytes; Catalysts for Efficient Production of Carbon Nanotubes; Amorphous Silk Fibroin Membranes for Separation of CO2; "Zero-Mass" Noninvasive Pressure Transducers; Radial-Electric-Field Piezoelectric Diaphragm Pumps; Ejector-Enhanced, Pulsed, Pressure-Gain Combustor; Suppressing Ghost Diffraction in E-Beam-Written Gratings; Target-Tracking Camera for a Metrology System; Polarimetric Imaging using Two Photoelastic Modulators; Miniature Wide-Angle Lens for Small-Pixel Electronic Camera; Modal Filters for Infrared Interferometry; Mo(3)Sb(7-x)Te(x) for Thermoelectric Power Generation; Two-Dimensional Quantum Model of a Nanotransistor; Scanning Miniature Microscopes without Lenses; Manipulating Neutral Atoms in Chip-Based Magnetic Traps; Expansion Compression Contacts for Thermoelectric Legs; Processing Electromyographic Signals to Recognize Words; Physical Principle for Generation of Randomness; DSN Beowulf Cluster-Based VLBI Correlator; Hybrid NN/SVM Computational System for Optimizing Designs; Criteria for Modeling in LES of Multicomponent Fuel Flow; Computerized Machine for Cutting Space Shuttle Thermal Tiles; Orbiting Depot and Reusable Lander for Lunar Transportation; FPGA-Based Networked Phasemeter for a Heterodyne Interferometer; Aquarius Digital Processing Unit; Three-Dimensional Optical Coherence Tomography; Benchtop Antigen Detection Technique using Nanofiltration and Fluorescent Dyes; Isolation of Precursor Cells from Waste Solid Fat Tissue; Identification of Bacteria and Determination of Biological Indicators; Further Development of Scaffolds for Regeneration of Nerves; Chemically Assisted Photocatalytic Oxidation System; Use of Atomic Oxygen for Increased Water Contact Angles of Various Polymers for Biomedical Applications; Crashworthy Seats Would Afford Superior Protection; Open-Access, Low-Magnetic-Field MRI System for Lung Research; Microfluidic Mixing Technology for a Universal Health Sensor; Microfluidic Extraction of Biomarkers using Water as Solvent; Microwell Arrays for Studying Many Individual Cells; Droplet-Based Production of Liposomes; and Identifying and Inactivating Bacterial Spores

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A Sub-Threshold Low-Power Integrated Bandpass Filter for Highly-Integrated Spectrum Analyzers

Low-power analog filter banks provide frequency analysis with minimal power and space requirements, making them viable solutions for integrated remote audio- and vibration-sensing applications. Compared with their digital counterparts, analog filter banks are better suited to achieve the lower power consumption necessary for IoT applications, while maintaining high dynamic range and a wide operational frequency range. In this work, the design and implementation of a sub-threshold complementary metal-oxide semiconductor (CMOS) integrated low-power tunable analog filter channel for signal spectrum analysis and signal discrimination is presented. Project specifications required a programmable, high-order, monolithic bandpass filter channel with small chip area, low power consumption, high dynamic range, and wide operational frequency range. The 8th-order filter channel presented in this work provides an effective Q-factor of 4.5 and a minimum dynamic range (DR) of approximately 85 dB, while allowing for tuning across a range of center frequencies from 2 kHz to 100 kHz, with power consumption of a single 8th-order filter channel measured at 256 µW nominally at the highest center frequency. An integrated analog Gm-C filter topology was selected for this application. Functionally, the high-Q bandpass filter transfer function is implemented via four cascaded 2nd-order filter cells, resulting in a single 8th-order filter channel, fabricated in 130-nm 1.2-V CMOS technology, suitable for use in monolithic integrated spectral analysis (MISA1) applications.

Long, Gavin B.↗

Development of Thermal Tomography Imaging System for In-Service Nondestructive Evaluation of Additively Manufactured Components

Additive manufacturing (AM) is an emerging method for cost-efficient fabrication of nuclear reactor parts. AM of metallic structures for nuclear energy applications is currently based on laser powder bed fusion (LPBF) process, which can introduce internal material flaws, such as pores and anisotropy. Integrity of AM structures needs to be evaluated nondestructively because material flaws could lead to premature failures due to exposure to high temperature, radiation and corrosive environment in a nuclear reactor. Thermal tomography (TT) provides a capability for non-destructive evaluation of sub-surface defects in arbitrary size structures. We investigate TT of AM stainless steel 316L specimen with imprinted internal porosity defects using relatively low-cost, small form factor infrared (IR) camera based on uncooled micro bolometer detector. Sparse coding related K-means singular value decomposition (SVD) machine learning, image processing algorithms are developed to improve quality of TT images through removal of Additive white Gaussian noise without blurring the images. Following initial qualification of an AM component for deployment in a nuclear reactor, a compact TT can also be used for in-service nondestructive evaluation (NDE). With capability to perform in-service NDE of the AM component lifecycle, TT data can be used for development of a component digital twin. MIT research reactor (MITR) has been identified as a representative environment to perform investigation of feasibility of in-service NDE during shutdown. Preliminary study of radiation level in the MITR viewport, with geometric parameters potentially compatible with compact TT system, has been conducted.

36 MATERIALS SCIENCE↗

Superconducting Hyperdimensional Associative Memory Circuit for Scalable Machine Learning

Here we propose a generalized architecture for the first rapid-single-flux-quantum (RSFQ) associative memory circuit. The circuit employs hyperdimensional computing (HDC), a machine learning (ML) paradigm utilizing vectors with dimensionality in the thousands to represent information. HDC designs have small memory footprints, simple computations, and simple training algorithms compared to superconducting neural network accelerators (SNNAs), making them a better option for scalable SFQ machine learning (ML) solutions. The proposed superconducting HDC (SHDC) circuit uses entirely on-chip RSFQ memory which is tightly integrated with logic, operates at 33.3 GHz, is applicable to general ML tasks, and is manufacturable at practically useful scales given current SFQ fabrication limits. Tailored to a language recognition task, SHDC consists of ~ 2-20 M Josephson junctions (JJs) and consumes up to three times less power than an analogous CMOS HDC circuit while achieving 78-84% higher throughput. SHDC is capable of outperforming the state of the art RSFQ SNNA, SuperNPU, by 48-99% for all benchmark NN architectures tested while occupying up to 90% less area and consuming up to nine times less power. To the best of the authors' knowledge, SHDC is currently the only superconducting ML approach feasible at practically useful scales for real-world ML tasks and capable of online learning.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Hyperspectral Microwave Atmospheric Sounder (HyMAS) Architecture and Design Accommodations

The Hyperspectral Microwave Atmospheric Sounder (HyMAS) is being developed at Lincoln Laboratories and accommodated by the Goddard Space Flight Center for a flight opportunity on a NASA research aircraft. The term "hyperspectral microwave" is used to indicate an all-weather sounding that performs equivalent to hyperspectral infrared sounders in clear air with vertical resolution of approximately 1 km. Deploying the HyMAS equipped scanhead with the existing Conical Scanning Microwave Imaging Radiometer (CoSMIR) shortens the path to a flight demonstration. Hyperspectral microwave is achieved through the use of independent RF antennas that sample the volume of the Earth s atmosphere through various levels of frequencies, thereby producing a set of dense, spaced vertical weighting functions. The simulations proposed for HyMAS 118/183-GHz system should yield surface precipitation rate and water path retrievals for small hail, soft hail, or snow pellets, snow, rainwater, etc. with accuracies comparable to those of the Advanced Technology Microwave Sounder. Further improvements in retrieval methodology (for example, polarization exploitation) are expected. The CoSMIR instrument is a packaging concept re-used on HyMAS to ease the integration features of the scanhead. The HyMAS scanhead will include an ultra-compact Intermediate Frequency Processor (IFP) module that is mounted inside the door to improve thermal management. The IFP is fabricated with materials made of Low-Temperature Co-fired Ceramic (LTCC) technology integrated with detectors, amplifiers, A/D conversion and data aggregation. The IFP will put out 52 channels of 16 bit data comprised of 4-9 channel data streams for temperature profiles and 2-8 channel streams for water vapor. With the limited volume of the existing CoSMIR scanhead and new HyMAS front end components, the HyMAS team at Goddard began preliminary layout work inside the new drum. Importing and re-using models of the shell, the scan head computer, and the slip rings developed for CoSMIR was the starting point. The next step was to modify the antenna faceplate to accommodate the dimensions of the three dual polarization Gaussian Optics Antenna (GOA) assemblies. Two mechanical concepts for the core technology, the hyperspectral IFP, were captured in a design tradeoff. Connector models considered minimum bend radii for the IFP analog connectors. Hyperspectral imaging is accomplished by strategically using a short wavelength intermediate frequency of 18-29 GHz, and thus reducing the size of components in the connection of the front end to the IFP. The SMK (2.92mm) Series connector will lay near the hinge line to minimize its flexing. The digital output of the IFP will use a Serial Peripheral Interface (SPI) that must be accommodated by the scan head computer. To make that computer more reliable, maintainable, and forward compatible with the 52 HyMAS channels, a testbed of the scan head, calibration, and archive computers and the PIC24 microprocessor that resides on the IFP is in development. The computers will be programmed using a new framework application called Interoperable Remote Component (IRC). This software allows flexibility to program computers that communicate with each other and can adapt easily to the emerging HyMAS requirements for data format, algorithms, and graphical user interface (GUI). It is expected that the CoSMIR instrument will cut over to the IRC after it is adapted on an updated CoSMIR testbed.

Hilliard, Lawrence↗