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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 487 records · Page 27
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Proposed Material Properties, Allowable Stresses, and Design Curves of Diffusion Bonded Alloy 800H for the ASME Code Section III Division 5

Abstract Increased interest in compact heat exchangers (CHXs) to serve as intermediate heat exchangers of very high temperature reactors resulted in significant research and development on their design, analysis, and construction. Printed circuit heat exchangers are a type of CHXs with high thermal efficiency and compactness achieved through diffusion bonding a stack of etched plates with millimeter scaled channels. The diffusion bonding process changes the microstructural and mechanical properties of the wrought metal plates. The current nonnuclear design code ASME section VIII, division 1 captures the material property change through a “joint efficiency factor.” However, the current nuclear design code ASME section III, division 5 does not address or support the diffusion bonded material properties. Hence, there is a need to develop allowable stresses, isochronous curves, and fatigue life curves for various diffusion bonded alloys. In this study, Alloy 800H material was selected to establish the diffusion bonded material properties under tension, creep, fatigue, and creep-fatigue loads at elevated temperatures in the range 550–760 °C. A set of tests on diffusion bonded Alloy 800H (DB 800H) were performed and the acquired data are used in developing allowable stresses Sy, Su, Sr, Sm, St, Smt, So, isochronous curves and fatigue life curves according to the ASME section III, division 5 requirements. This paper also presents detailed procedures used in developing the ASME code section III division 5 design provisions for diffusion bonded Alloy 800H.

Engineering↗
DOE OSTI2020

The correlation between N deficiency and the mechanical properties of the Ti 2 AlNy MAX phase

The role of X deficiency on the mechanical properties of MAX phases was studied by synthesizing Ti 2 AlN through powder metallurgy in stoichiometric and sub/extra-stoichiometric nitrogen compositions. XRD analyses and ab initio calculations indicate that nitrogen vacancies result in a lattice contraction predominantly along the c-axis. The elastic moduli and intrinsic hardness of substoichiometric Ti 2 AlN 0.9 measured from nanoindentation tests are shown to be slightly smaller than that of Ti 2 AlN. The key mechanical indexes, bulk (B), shear (G) and Young’s (E) moduli as well as the hardness variation are calculated in density functional theory, and show different responses depending on the concentration of N vacancies. Overall, this joint experimental and theoretical study provides a full understanding of the energetics, chemical bonding, electronic structure, and mechanics of the N deficient MAX phases which would increase the application of nitride ceramics.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Measurement of crack length in width tapered beam experiments

The width tapered beam method for measuring fracture toughness has been contemplated for use in measuring the adhesion of photovoltaic materials, is promoted by it being a viable method for use directly on modules rather than to engineered test specimens. However, precise determination of crack length is often difficult as failure often involves tendril formation, cavitation voids, and other plastic deformation at the crack front in addition to obfuscation by opaque materials. Because fracture energy varies as the square of crack length, imprecise crack tip length results in large measurement uncertainties. In this work, we develop a method to estimate the crack tip length using the relationship between the applied force and the displacement of the load frame. The crack tip is determined for every data point and can be defined from a calibration curve related to the amount of energy put into the beam, or from a theoretically idealized estimation. Once a calibration curve is set up and the equations programmed, the fracture energy as a function of position on the newly formed crack interface can be accurately estimated. The test additionally provides much easier analysis and insight into the joint failure through more precise knowledge of fracture toughness at each de-bonded area.

42 ENGINEERING↗
DOE OSTI2021

High Flux Microchannel Receiver Development (Final Report)

The opportunity addressed in this project was using microscale heat exchanger technology for improving solar thermal central receiver efficiency. This will result in smaller, less expensive components and reduce the levelized cost of electricity from concentrated solar thermal power. This micro-pin solar receiver (MSR) directly heats high pressure (25 MPa) supercritical carbon dioxide (sCO 2 ) from 550°C to 720°C with an incident flux of at least 120 W/cm 2 at a receiver efficiency of >90% (assuming availability of 95% absorptivity coating), and receiver cost target of less than $\$$150/kWt. Realization of the MSR required an understanding of thermal hydraulic performance of sCO 2 in micro-pin passages, mechanical behavior of high nickel alloys at high temperatures including joints, advanced fabrication methods of high nickel alloys (etching, machining, brazing, welding, diffusion bonding), and the cost implications of these when the concept is scaled to production volumes. The technology can be used with gases (sCO 2 , helium, etc.) or with liquids such as molten salt or liquid metal. Given the high pressure associated with sCO 2 , its use demonstrates a “worst case” scenario, and the successful development of the MSR for this application will result in the development of a technology also applicable to a range of other heat transfer fluids that will enable next generation CSP plants, including support of the Gen3CSP program.

14 SOLAR ENERGY↗
NASA NTRS1991

Applying NASA's explosive seam welding

The status of an explosive seam welding process, which was developed and evaluated for a wide range of metal joining opportunities, is summarized. The process employs very small quantities of explosive in a ribbon configuration to accelerate a long-length, narrow area of sheet stock into a high-velocity, angular impact against a second sheet. At impact, the oxide films of both surface are broken up and ejected by the closing angle to allow atoms to bond through the sharing of valence electrons. This cold-working process produces joints having parent metal properties, allowing a variety of joints to be fabricated that achieve full strength of the metals employed. Successful joining was accomplished in all aluminum alloys, a wide variety of iron and steel alloys, copper, brass, titanium, tantalum, zirconium, niobium, telerium, and columbium. Safety issues were addressed and are as manageable as many currently accepted joining processes.

Bement, Laurence J.↗
NASA NTRS1993

Welding Wires To Thin Thermocouple Films

Parallel-gap resistance welding yields joints surviving temperatures of about 1,000 degrees C. Much faster than thermocompression bonding. Also exceeds conductive-paste bonding and sputtering thin films through porous flame-sprayed insulation on prewelded lead wires. Introduces no foreign material into thermocouple circuit and does not require careful control of thickness of flame-sprayed material.

Holanda, Raymond↗
DOE OSTI2020

Parametric Design Study of a Power Electronics Package for Improving Solder Joint Reliability

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗
NASA NTRS2012

Modified Process Reduces Porosity when Soldering in Reduced Gravity Environments

A modified process yields lower levels of internal porosity for solder joints produced in reduced-gravity environments. The process incorporates both alternative materials and a modified procedure. The process provides the necessary cleaning action to enable effective bonding of the applied solder alloy with the materials to be joined. The modified process incorporates a commercially available liquid flux that is applied to the solder joint before heating with the soldering iron. It is subsequently heated with the soldering iron to activate the cleaning action of the flux and to evaporate most of the flux, followed by application of solder alloy in the form of commercially available solid solder wire (containing no flux). Continued heating ensures adequate flow of the solder alloy around and onto the materials to be joined. The final step is withdrawal of the soldering iron to allow alloy solidification and cooling of the solder joint.

Watson, Kevin↗
DOE OSTI2021

A Combined Experimental and Modeling Approach to Investigate the Performance of Joint Between AZ31 Magnesium and Uncoated DP590 Steel Using Friction Stir-Assisted Scribe Technique

In this study, friction stir assisted scribe technique is used to achieve a viable joint between AZ31 magnesium alloy and uncoated DP590 steel. Here, the mechanical properties and performance of the joint are investigated using finite element modeling and electron microscopy. The joint strength can be ascribed to two factors, the mechanical interlocking and the metallurgical bonding of two materials at their interface. The contribution of both factors is intended, and the metallurgical bonding is studied to understand the basic joining phenomenon.

36 MATERIALS SCIENCE↗
NASA NTRS1968

Evaluation of methods for nondestructive testing of brazed joints

Evaluation of nondestructive methods of testing brazed joints reveals that ultrasonic testing is effective in the detection of nonbonds in diffusion bonded samples. Radiography provides excellent resolutions of void or inclusion defects, and the neutron radiographic technique shows particular advantage for brazing materials containing cadmium.

Kanno, A.↗
NASA NTRS2016

Latent Hardeners for the Assembly of Epoxy Composites

Large-scale composite structures are commonly joined by secondary bonding of molded-and-cured thermoset components. This approach may result in unpredictable joint strengths. In contrast, assemblies made by co-curing, although limited in size by the mold, result in stable structures, and are certifiable for commercial aviation because of structural continuity through the joints. Multifunctional epoxy resins were prepared that should produce fully-cured subcomponents with uncured joining surfaces, enabling them to be assembled by co-curing in a subsequent out-of-autoclave process. Aromatic diamines were protected by condensation with a ketone or aldehyde to form imines. Properties of the amine-cured epoxy were compared with those of commercially available thermosetting epoxy resins and rheology and thermal analysis were used to demonstrate the efficacy of imine protection. Optimum conditions to reverse the protecting chemistry in the solid state using moisture and acid catalysis were determined. Alternative chemistries were also investigated. For example, chain reaction depolymerization and photoinitiated catalysts would be expected to minimize liberation of volatile organic content upon deprotection and avoid residual reactive species that could damage the resin. Results from the analysis of protected and deprotected resins will be presented.

Palmieri, Frank↗
DOE OSTI2020

A Graphene Enhanced SiC-SiC Ceramic Composite Bonding Solution for Generation IV Nuclear Reactors

The feasibility of an effective bonding methodology for SiC/SiC Ceramic Matrix composites using a graphene base brazing compound was established under pressure less conditions. The feasibility demonstration during this program identified the further need to improve the composition of the brazing compound and the processing conditions to enhance the joint strength.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
NASA NTRS1987

Joining of ceramics for high temperature applications

Summarized is a literature survey of the methods for joining ceramics to ceramics or ceramics to metals for high temperature applications. Also mechanical properties and potential applications of the joints are considered. The joining of ceramics is usually carried out by brazing or diffusion bonding. Especially the latter has been found useful, increasing the application of bonded ceramics. The possibility of using electron beam and laser beam welding for joining ceramics has also recently been investigated. The bonding of ceramics has found numerous applications typical for high operating temperatures, i.e., sensors and thermocouples.

Vilpas, Martti↗
DOE OSTI2026

Laser interference structuring of Cu for adhesive joining of HVAC equipment

Due to potential energy and cost savings benefits, adhesive joining has been recently considered for heating, ventilation, air conditioning, and refrigeration (HVAC&R) systems. HVAC adhesive bonding requires cost-effective and adequate surface preparations of adherents. Here, this article investigates the use of abrasion, traditional single-beam laser, and a laser-interference technique as surface preparations of copper surfaces. Surface morphology is characterized using scanning electron microscopy (SEM) and atomic force microscopy (AFM). Effective submicrometer peak-to-valley structuring with a periodicity of ∼2.7μ⁢m was demonstrated for laser-interference processing. Single-lap shear tests were conducted for 89 joints made with bondline thicknesses of 0.15 and 0.3 mm. Data on process variables and measured variables included open-time, bond length, maximum load, displacement at failure, shear lap strength, and failure mode. A statistical analysis was conducted on each lot to determine the lower limit with 95% confidence intervals for displacements at failure and shear lap strengths. A comparison is presented between the properties of laser-structured joints with respect to those prepared by abrasion, which is considered the baseline surface preparation technique. Based on this comparison, one single-beam laser technique and two laser-interference techniques were shown to exhibit vastly superior performance over the joints made with abraded specimens.

Sabau, Adrian S. [Oak Ridge National Laboratory (O↗
DOE OSTI2021

Pulsed electric current joining of oxide-dispersion-strengthened austenitic steels

The solid-state joining of oxide-dispersion-strengthened (ODS) austenitic steels was achieved using a pulsed electric current joining (PECJ) process. Microstructures of the austenitic grain structures and oxide dispersions in the joint areas were characterized using electron microscopy. Negligible grain growth was observed in austenitic grain structures, while slight coarsening of oxide dispersions occurred at a short holding time. The mechanisms of the PECJ process may involve three steps that occur simultaneously, including the sintering of mechanical alloying powders in the bonding layer, formation of oxide dispersions, and bonding of the mechanical alloying powders with the base alloy. The high hardness and irradiation resistance of ODS alloys were retained in the joint areas. This research revealed the fundamental mechanisms during the PECJ process, which is beneficial for its potential applications during the advanced manufacturing of ODS alloys.

36 MATERIALS SCIENCE↗
NASA NTRS1994

Inspecting for widespread fatigue damage: Is partial debonding the key?

Experimental and analytical results indicate that cracks can initiate, grow, and coalesce more rapidly in fuselage lap joints that have experienced partial or complete debonding. Computational analysis in this paper shows that stress concentrations and stress intensity factors at the rivet holes are far less severe when the bond is intact. Debonding hastens the initiation of widespread fatigue cracks and significantly increases crack growth rate. Thus, debonded regions serve as "breeding grounds" for widespread fatigue damage. Therefore, the effectiveness of lap joint inspection programs may be enhanced if detailed inspections are focused on areas in which debonding has been detected.

Brewer, John↗
DOE OSTI2020

Light Exposure Promotes Degradation of Intermediates and Growth of Phosphine-Ligated Gold Clusters

Subnanometer clusters exhibit unique properties not observed at the bulk or nanometer scale. Many applications, however, require clusters to be monodisperse in size and composition.While substantial progress has been made empirically on producing specific-sized gold clusters using different ligands, the mechanisms of cluster formation remain insufficiently understood. Using high mass-resolution electrospray ionization mass spectrometry (ESI-MS), we characterized the formation of cationic triphenylphosphine-ligated gold clusters [Aux(PPh3)y z+] in solution. Our data provides evidence that small hydrogen-containing intermediate “building blocks” (i.e., Au2(PPh3)2H+, Au4(PPh3)4H+, and Au7(PPh3)7H5 2+) are responsible for the growth of larger gold clusters (i.e., Au6(PPh3)6 2+ and Au8(PPh3)7 2+) over several hours. In addition, intermediate degradation and cluster growth are shown to be dependent on irradiation of the reacting solution with light. Specifically, the rate of growth of large clusters is demonstrated to scale with the intensity of light exposure. Complementary theoretical calculations were also performed that provide molecular-level insight into the nature of the bonding between the hydrogens and gold atoms in the intermediate Au-phosphine clusters. Collectively, our joint experimental and theoretical findings advance the understanding of the factors at play in the size-selective synthesis of ligated gold clusters in solution.

Hewitt, Michael A.↗