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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 487 records · Page 27
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Simplified interconnection structure based on C 60 /SnO 2-x for all-perovskite tandem solar cells

The efficiencies of all-perovskite tandem devices are improving quickly. However, their complex interconnection layer (ICL) structures – with typically four or more layers deposited by different processes – limit their prospects for applications. Here, we report an ICL in all-perovskite tandem cells consisting merely of a fullerene layer and a SnO 2-x (0 60 layer is unintentionally n-doped by iodine ions from the perovskite and thus acts as an effective electron collecting layer. The SnO 2-x layer, formed by the incomplete oxidization of tin (x=1.76), has ambipolar carrier transport property enabled by the presence of a large density of Sn 2+ . The C 60 /SnO 1.76 ICL forms Ohmic contacts with both wide and narrow bandgap perovskite subcells with low contact resistivity. The ICL boosts the efficiencies of small-area tandem cells (5.9 mm 2 ) and large-area tandem cells (1.15 cm 2 ) to 24.4% and 22.2%, respectively. Lastly, the tandem cells remain 94% of its initial efficiency after continues 1-sun illumination for 1,000 hours.

14 SOLAR ENERGY↗
DOE OSTI2017

Inter‐area oscillation statistical analysis of the U.S. Eastern interconnection

Although extensive studies have been conducted on inter‐area oscillation detection and analysis by using phasor measurement data, few have focused on inter‐area oscillation statistics due to the lack of considerably long‐term and high‐resolution recorded data. A preliminary statistical analysis on the inter‐area oscillations that occurred in the U.S. Eastern interconnection from 2010 to 2015 is presented. These oscillation events were captured and recorded by the wide‐area frequency monitoring network FNET/GridEye. Oscillation occurrence, dominant frequency, damping ratio and oscillation excitation types are investigated to explore the statistical characteristics of the detected inter‐area oscillations. The results from this paper will provide valuable information for system operators and planners regarding network operation and future grid development.

Cui, Yi↗
DOE OSTI2010

Micro-Scale Evaluation Of Interface Strength On The Patterned Structures In LSI Interconnects

Reliability of electronic devices has been an issue of serious importance. One of the potential factors to spoil the reliability is possible local drops of strength on the interface of multilayered structure. A new technique for the evaluation of local interface adhesion energy was applied to the interface between Cu and cap layer in a Cu damascene interconnect structure, in order to elucidate variation in adhesion strength as a function of measurement location.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2011

Triaxial Stress Distributions in Cu / low-k Interconnect Features

The distribution of triaxial stresses within single damascene Cu/organosilicate interconnect structures as a function of linewidth, ranging from 45 to 250 nm, was measured using x-ray diffraction. Least-squares minimization techniques were employed to determine the volume-averaged stress tensors of the Cu features. Longitudinal Cu stress values increased for linewidths below 100 nm, while transverse stresses decreased with decreasing linewidth below 100 nm due to the interplay between the Cu microstructure and the feature geometry. Large tensile out-of-plane stresses were observed in all of the lines demonstrating the constraint imposed by the barrier layers that encapsulate the Cu.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗
DOE OSTI2014

Upgrade of the LHC magnet interconnections thermal shielding

The about 1700 interconnections (ICs) between the Large Hadron Collider (LHC) superconducting magnets include thermal shielding at 50-75 K, providing continuity to the thermal shielding of the magnet cryostats to reduce the overall radiation heat loads to the 1.9 K helium bath of the magnets. The IC shield, made of aluminum, is conduction-cooled via a welded bridge to the thermal shield of the adjacent magnets which is actively cooled. TIG welding of these bridges made in the LHC tunnel at installation of the magnets induced a considerable risk of fire hazard due to the proximity of the multi-layer insulation of the magnet shields. A fire incident occurred in one of the machine sectors during machine installation, but fortunately with limited consequences thanks to prompt intervention of the operators. LHC is now undergoing a 2 years technical stop during which all magnet's ICs will have to be opened to consolidate the magnet electrical connections. The IC thermal shields will therefore have to be removed and re-installed after the work is completed. In order to eliminate the risk of fire hazard when re-welding, it has been decided to review the design of the IC shields, by replacing the welded bridges with a mechanical clamping which also preserves its thermal function. An additional advantage of this new solution is the ease in dismantling for maintenance, and eliminating weld-grinding operations at removal needing radioprotection measures because of material activation after long-term operation of the LHC. This paper describes the new design of the IC shields and in particular the theoretical and experimental validation of its thermal performance. Furthermore a status report of the on-going upgrade work in the LHC is given.

43 PARTICLE ACCELERATORS↗
DOE OSTI2014

Electromigration kinetics and critical current of Pb-free interconnects

Electromigration kinetics of Pb-free solder bump interconnects have been studied using a single bump parameter sweep technique. By removing bump to bump variations in structure, texture, and composition, the single bump sweep technique has provided both activation energy and power exponents that reflect atomic migration and interface reactions with fewer samples, shorter stress time, and better statistics than standard failure testing procedures. Contact metallurgies based on Cu and Ni have been studied. Critical current, which corresponds to the Blech limit, was found to exist in the Ni metallurgy, but not in the Cu metallurgy. A temperature dependence of critical current was also observed.

36 MATERIALS SCIENCE↗
DOE OSTI2014

Effects of fluoride residue on thermal stability in Cu/porous low-k interconnects

We have investigated the effects of fluoride residue on the thermal stability of a Cu/barrier metal (BM)/porous low-k film (k < 2.3) structure. We confirmed that the Cu agglomerated more on a BM/inter layer dielectric (ILD) with a fluoride residue. To consider the effect of fluoride residue on Cu agglomeration, the structural state at the Cu/BM interface was evaluated with a cross-section transmission electron microscope (TEM) and atomic force microscope (AFM). In addition, the chemical bonding state at the Cu/BM interface was evaluated with the interface peeling-off method and X-ray photoelectron spectroscopy (XPS). Moreover, we confirmed the ionization of fluoride residue and oxidation of Cu with fluoride and moisture to clarify the effect of fluoride residue on Cu. Our experimental results indicated that the thermal stability in Cu/porous low-k interconnects was degraded by enhancement of Cu oxidation with fluoride ions diffusion as an oxidizing catalyst.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2014

Electron scattering mechanisms in Cu-Mn films for interconnect applications

Electrical properties and corresponding structural features of Cu-Mn alloy films with potential application as barrier and interconnect layers were studied. Cu-Mn films were deposited by DC magnetron sputtering at room temperature on SiO{sub 2} substrates. Electrical resistivity measurements were made as a function of film composition and temperature. The specific resistivity varies linearly with the Mn content showing a maximum of 205 μΩcm at 80 at. % Mn. The temperature coefficient of resistance (TCR) of all alloy films is low, showing non-metallic conductivity for most compositions. Also a minimum TCR has been observed in the 40–80 at. % Mn range which was attributed to a magnetic transformation around 200–300 K. Electrical resistivity measurements are correlated with the film structure revealed by transmission electron microscopy to clarify the phase regions throughout the composition range. In the 20–40 at. % and 70–80 at. % Mn ranges, two-phase structures were identified, where Cu- or Mn-rich solid solution grains were surrounded by a thin amorphous covering layer. Based on the revealed phase regions and morphologies electron scattering mechanisms in the system were evaluated by combining the Matthiessen's rule and the Mayadas-Schatzkes theory. Grain boundary reflectivity coefficients (r = 0.6–0.8) were calculated from fitting the model to the measurements. The proposed model indicates that, in a binary system, the special arrangement of the two phases results in new scattering mechanisms. The results are of value in optimizing the various parameters needed to produce a suitable barrier layer.

36 MATERIALS SCIENCE↗
DOE OSTI2015

Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route having mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2015

A peripheral component interconnect express-based scalable and highly integrated pulsed spectrometer for solution state dynamic nuclear polarization

High sensitivity, high data rates, fast pulses, and accurate synchronization all represent challenges for modern nuclear magnetic resonance spectrometers, which make any expansion or adaptation of these devices to new techniques and experiments difficult. Here, we present a Peripheral Component Interconnect Express (PCIe)-based highly integrated distributed digital architecture pulsed spectrometer that is implemented with electron and nucleus double resonances and is scalable specifically for broad dynamic nuclear polarization (DNP) enhancement applications, including DNP-magnetic resonance spectroscopy/imaging (DNP-MRS/MRI). The distributed modularized architecture can implement more transceiver channels flexibly to meet a variety of MRS/MRI instrumentation needs. The proposed PCIe bus with high data rates can significantly improve data transmission efficiency and communication reliability and allow precise control of pulse sequences. An external high speed double data rate memory chip is used to store acquired data and pulse sequence elements, which greatly accelerates the execution of the pulse sequence, reduces the TR (time of repetition) interval, and improves the accuracy of TR in imaging sequences. Using clock phase-shift technology, we can produce digital pulses accurately with high timing resolution of 1 ns and narrow widths of 4 ns to control the microwave pulses required by pulsed DNP and ensure overall system synchronization. The proposed spectrometer is proved to be both feasible and reliable by observation of a maximum signal enhancement factor of approximately −170 for {sup 1}H, and a high quality water image was successfully obtained by DNP-enhanced spin-echo {sup 1}H MRI at 0.35 T.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2015

Oxygen assisted interconnection of silver nanoparticles with femtosecond laser radiation

Ablation of silver (Ag) nanoparticles in the direction of laser polarization is achieved by utilizing femtosecond laser irradiation in air at laser fluence ranging from ∼2 mJ/cm{sup 2} to ∼14 mJ/cm{sup 2}. This directional ablation is attributed to localized surface plasmon induced localized electric field enhancement. Scanning electron microscopy observations of the irradiated particles in different gases and at different pressures indicate that the ablation is further enhanced by oxygen in the air. This may be due to the external heating via the reactions of its dissociation product, atomic oxygen, with the surface of Ag particles, while the ablated Ag is not oxidized. Further experimental observations show that the ablated material re-deposits near the irradiated particles and results in the extension of the particles in laser polarization direction, facilitating the interconnection of two well-separated nanoparticles.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2016

Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects

An enhanced copper paste, formulated by copper micro- and nano-particles mixture, is reported to prevent paste cracking and obtain an improved packing density. The particle mixture of two different sizes enables reduction in porosity of the micro-paste and resolves the cracking issue in the nano-paste. In-situ temperature and resistance measurements indicate that the mixed paste has a lower densification temperature. Electrical study also shows a ∼12× lower sheet resistance of 0.27 Ω/sq. In addition, scanning electron microscope image analysis confirms a ∼50% lower porosity, which is consistent with the thermal and electrical results. The 3:1 (micro:nano, wt. %) mixed paste is found to have the strongest synergistic effect. This phenomenon is discussed further. Consequently, the mixed paste is a promising material for potential low temperature 3D interconnects fabrication.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2020

Flexible hose interconnect testing for parabolic troughs with nitrate salt

The use of molten salt as a heat transfer fluid in parabolic trough concentrated solar power plants, in lieu of oil-based heat transfer fluids, presents the possibility to increase the plant's operating temperature and corresponding Rankine cycle efficiency, improve dispatchability, and decrease costs. However, several barriers still exist to commercialization of the technology. This paper discusses meaningful progress toward overcoming two specific barriers to commercialization; 1) the lack of a reliable interconnect solution for molten salt service to connect rotating collectors with stationary header pipes and 2) the limitations of publicly available system modeling tools for a plant using molten salt as both the heat transfer fluid and energy storage medium.

14 SOLAR ENERGY↗
DOE OSTI2021

Propagation of atmospheric pressure plasmas through interconnected pores in dielectric materials

We report the propagation of atmospheric pressure plasmas (APPs) on and through porous dielectric materials is being investigated for plasma-catalysis and functionalizing biomedical materials for tissue scaffolding and bone regeneration. Such plasma functionalization improves wettability and cell attachment, and so uniformity of the treatment of the pore surfaces is important. The method of propagation of APPs through porous media is not well characterized. In this paper, we discuss results from a computational investigation of humid air APPs propagating through short fully interconnected pore-chains in a dielectric substrate. The properties of the dielectric and pores (diameter 150 μm) were chosen to resemble bone scaffolding. We found that photoionization is an important feature in plasma propagation through pore-chains to seed electrons in the following pore in the chain. This seeding of electrons in regions of high electric field allows for the formation of micro-streamers and surface ionization waves. This is particularly important when the openings between pores are small. The orientation of the pore-chain with respect to the applied electric field has a significant impact on plasma generation, mode of propagation, and fluences of short-lived, reactive species to the surfaces of the pores. The uniformity of fluences of charged and short-lived neutral species to the pore surfaces decreases as the angle of the pore chain deviates from being aligned with the applied electric field. Diffusion within pores

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2022

Er-doped anatase TiO 2 thin films on LaAlO 3 (001) for quantum interconnects (QuICs)

Rare-earth ions (REIs) doped into solid-state crystal hosts offer an attractive platform for realizing quantum interconnects that can function as quantum memories and quantum repeaters. The 4f valence electrons of REIs are shielded by 5s and 5p electrons and undergo highly coherent transitions even when embedded in host crystals. In particular, Er 3+ has an optical transition in the telecom band that is suitable for low-loss communication. Recently, REIs in thin film systems have gained interest due to potential advantages in providing a flexible host crystal environment, enabling scalable on-chip integration with other quantum devices. Here, we investigate the structural and optical properties of Er-doped anatase TiO 2 thin films on LaAlO 3 (001) substrates. By choosing a system with minimal lattice mismatch and adjusting Er-dopant concentration, we achieve optical inhomogeneous linewidths of 5 GHz at 4.5 K. Furthermore, we show that 9 nm-thick buffer and capping layers can reduce the linewidth by more than 40%, suggesting a pathway to further narrowing linewidths in this system. We also identify that Er 3+ ions mainly incorporate into substitutional Ti 4+ sites with non-polar D 2d symmetry, which makes Er dopants insensitive to the first order to local electric fields from impurities and is desirable for coherence properties of Er 3+ spins.

42 ENGINEERING↗
DOE OSTI2015

Extreme Weather Events and Interconnected Infrastructures: Toward More Comprehensive Climate Change Planning [Meeting challenges in understanding impacts of extreme weather events on connected infrastructures]

The President s Climate Change Action Plan calls for the development of better science, data, and tools for climate preparedness. Many of the current questions about preparedness for extreme weather events in coming decades are, however, difficult to answer with assets that have been developed by climate science to answer longer-term questions about climate change. Capacities for projecting exposures to climate-related extreme events, along with their implications for interconnected infrastructures, are now emerging.

54 ENVIRONMENTAL SCIENCES↗
DOE OSTI2015

Fermi surface interconnectivity and topology in Weyl fermion semimetals TaAs, TaP, NbAs, and NbP

The family of binary compounds including TaAs, TaP, NbAs, and NbP was recently discovered as the first realization of Weyl semimetals. In order to develop a comprehensive description of the charge carriers in these Weyl semimetals, we performed detailed and systematic electronic band structure calculations which reveal the nature of Fermi surfaces and their complex interconnectivity in TaAs, TaP, NbAs, and NbP. In conclusion, our work reports a comparative and comprehensive study of Fermi surface topology and band structure details of all known members of the Weyl semimetal family and hence provides the fundamental knowledge for realizing the many predicted exotic topological quantum physics of Weyl semimetals based on the TaAs class of materials.

36 MATERIALS SCIENCE↗