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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 487 records · Page 27
All sourcesNASA NTRSDOE OSTI
NASA NTRS1993

WTEC monograph on instrumentation, control and safety systems of Canadian nuclear facilities

This report updates a 1989-90 survey of advanced instrumentation and controls (I&C) technologies and associated human factors issues in the U.S. and Canadian nuclear industries carried out by a team from Oak Ridge National Laboratory (Carter and Uhrig 1990). The authors found that the most advanced I&C systems are in the Canadian CANDU plants, where the newest plant (Darlington) has digital systems in almost 100 percent of its control systems and in over 70 percent of its plant protection system. Increased emphasis on human factors and cognitive science in modern control rooms has resulted in a reduced workload for the operators and the elimination of many human errors. Automation implemented through digital instrumentation and control is effectively changing the role of the operator to that of a systems manager. The hypothesis that properly introducing digital systems increases safety is supported by the Canadian experience. The performance of these digital systems has been achieved using appropriate quality assurance programs for both hardware and software development. Recent regulatory authority review of the development of safety-critical software has resulted in the creation of isolated software modules with well defined interfaces and more formal structure in the software generation. The ability of digital systems to detect impending failures and initiate a fail-safe action is a significant safety issue that should be of special interest to nuclear utilities and regulatory authorities around the world.

Uhrig, Robert E.↗
NASA NTRS1999

Open-Mode Debonding Analysis of Curved Sandwich Panels Subjected to Heating and Cryogenic Cooling on Opposite Faces

Increasing use of curved sandwich panels as aerospace structure components makes it vital to fully understand their thermostructural behavior and identify key factors affecting the open-mode debonding failure. Open-mode debonding analysis is performed on a family of curved honeycomb-core sandwich panels with different radii of curvature. The curved sandwich panels are either simply supported or clamped, and are subjected to uniform heating on the convex side and uniform cryogenic cooling on the concave side. The finite-element method was used to study the effects of panel curvature and boundary condition on the open-mode stress (radial tensile stress) and displacement fields in the curved sandwich panels. The critical stress point, where potential debonding failure could initiate, was found to be at the midspan (or outer span) of the inner bonding interface between the sandwich core and face sheet on the concave side, depending on the boundary condition and panel curvature. Open-mode stress increases with increasing panel curvature, reaching a maximum value at certain high curvature, and then decreases slightly as the panel curvature continues to increase and approach that of quarter circle. Changing the boundary condition from simply supported to clamped reduces the magnitudes of open-mode stresses and the associated sandwich core depth stretching.

Ko, William L.↗
NASA NTRS2005

Investigation of the Utilization of Modern Industrial Methods, Processes, Ergonomics, and the Internet in the Scientific Environment

On Oct. 1, 2001 Cleveland State University and NASA Glenn Research Center embarked on the above named cooperative agreement. Because NASA's research facilities often exhibit instances where the failure to use state-of-the-art technologies and methods to improve on outmoded systems of interface and control, and this runs contrary to the NASA philosophy of "faster, better, and cheaper", it was deemed an ideal opportunity for this collaboration. The main objectives of the proposed effort were to research and investigate the use of the latest technologies, methods, techniques, etc. which pertain to control and interface with industrial and research systems and facilities. The work was done in large part at NASA Glenn Research Center, using selected research facilities as real-world laboratories; such as certain Microgravity Science Division and Space Station projects. Microgravity Science Division at Glenn Research Center designs and builds experiments to be flown on the Space Shuttle and eventually on the International Space Station. Economy of space, weight, complexity, data storage, ergonomics, and many other factors present problems that also exist in industry. Many of the solutions can come from the same areas of study mentioned above.

Myer, Spencer S., Jr.↗
NASA NTRS2008

Microstructural Evaluation and Comparison of Solder Samples Processed Aboard the International Space Station

Samples from the In-Space Soldering Investigation (ISSI), conducted aboard the International Space Station (ISS), are being examined for post-solidification microstructural development and porosity distribution. In this preliminary study, the internal structures of two ISSI processed samples are compared. In one case 10cm of rosin-core solder was wrapped around a coupon wire and melted by conduction, whereas, in the other a comparable length of solder was melted directly onto the hot wire; in both cases the molten solder formed ellipsoidal blobs, a shape that was maintained during subsequent solidification. In the former case, there is clear evidence of porosity throughout the sample, and an accumulation of larger pores near the hot end that implies thermocapillary induced migration and eventual coalescence of the flux vapor bubbles. In the second context, when solder was fed onto the wire. a part of the flux constituting the solder core is introduced into and remains within the liquid solder ball, becoming entombed upon solidification. In both cases the consequential porosity, particularly at a solder/contact interface, is very undesirable. In addition to compromising the desired electrical and thermal conductivity, it promotes mechanical failure.

Grugel, R. N.↗
NASA NTRS2015

Creep Behavior and Durability of Cracked CMC

To understand failure mechanisms and durability of cracked Ceramic matrix composites (CMCs), Melt Infiltration (MI) SiCSiC composites with Sylramic-iBN fibers and full Chemical vapour infiltration SiCSiC composites with Sylramic-ion bombarded BN (iBN) and Hi-Nicalon -S fibers were pre-cracked between 150 to 200 megapascal and then creep and Sustained Peak Low Cycle Fatigue (SPLCF) tested at 13150 C at stress levels from 35 to 103 megapascal for up to 200 hours under furnace and burner rig conditions. In addition creep testing was also conducted on pre-cracked full Chemical vapour infiltration SiCSiC composites at 14500 C between 35 and 103 megapascal for up to 200 hours under furnace conditions. If the specimens survived the 200 hour durability tests, then they were tensile tested at room temperature to determine their residual tensile properties. The failed specimens were examined by Scanning electron microscope (SEM) to determine the failure modes and mechanisms. The influence of crack healing matrix, fiber types, crack density, testing modes and interface oxidation on durability of cracked Ceramic matrix composites (CMCs) will be discussed.

Creep↗
NASA NTRS2022

Design of Flexures for Deployable Reflectarrays Using High Strain Composites

This paper presents a novel flexure design for small scale refelectarrays, specifically CubeSats, that requires high level of deployment precision. Advantages of using a HSC flexure includes additional thermal stability, lesser part count and passive deployment mechanism using the stored strain energy. The proposed design is to use two flat HSC strips of thickness ℎ, length 2𝐿ℎ, width 𝑊ℎ that attach to the core-reflector panel interface. The flexure satisfies two main requirements: ability to fold to a specific compaction 𝑑 without material failure and sufficient stiffness in the deployed configuration. The elastica analysis was implemented to identify the maximum strains in the flexure when folded and provide relations that combine Δ, ℎ, 𝐿ℎ with the maximum allowable strain. A simplified analysis was performed of the vibration of a panel-flexure combination using a two degree of freedom system. The vibration analysis reveals a dimensionless length parameter 𝛽 = (𝐿ℎ/𝐿𝑃) (Δ/ℎ) that determines the transition between bending and shear modes. A non-dimensional relationship was obtained between the natural frequency and 𝛽 that captures the impact of each parameter on the response of the structure. Our current work involves fabricating and testing of the proposed flexures using High Strain Composite materials, with plans to build a prototype for a deployable reflectarray.

López Jiménez, Francisco↗
DOE OSTI2020

A Mathematical Framework for Representing Cyber-Physical System Interdependencies and Resilience

U.S. critical infrastructure is increasingly composed of integrated cyber-physical systems (CPS) whose components are operationally interdependent. These interdependencies can create additional vulnerabilities beyond those that are typically evaluated through independent physical and cyber risk assessments. These additional vulnerabilities, previously undetected at the sub-system and/or component level, could cause cascading effects across both the physical and cyber domains that could lead to infrastructure disruption or failure. This paper will review an initial mathematical framework developed to help understand the dynamics of these interfacing physical and cyber components at a holistic system level. The resulting framework also provides a method for modeling and assessing the resilience of CPS in complex and adaptive systems. It frames the system in terms of mission performance and the potential effects to performance caused by attacks that are cyber, physical, or blended in nature. The framework utilizes a systems-based, state-space modeling approach to reason about risk, resilience, and interdependencies in CPS. Probabilities are applied to each CPS component regarding a threat (both man-made and natural) and the likelihood of that particular component being impacted, along with indirect impact to other interdependent components. These component-level impacts from threats then translate into mission-level impact and systemic state change.

Brigantic, Robert T.↗
DOE OSTI2021

Quantitative Risk Analysis of High Safety Significant Safety-related Digital Instrumentation and Control Systems in Nuclear Power Plants using IRADIC Technology

This report documents the activities performed by Idaho National Laboratory (INL) during fiscal year (FY) 2021 for the U.S. Department of Energy (DOE) Light Water Reactor Sustainability (LWRS) Program, Risk Informed Systems Analysis (RISA) Pathway, digital instrumentation and control (DI&C) Risk Assessment project. In FY-2019, the RISA Pathway initiated a project to develop a risk assessment strategy for delivering a strong technical basis to support effective, licensable, and secure DI&C technologies for digital upgrades/designs. An integrated risk assessment technology for the DI&C systems (IRADIC technology) was proposed for this strategy, which aims to (1) provide a best-estimate risk-informed capability to quantitatively and accurately estimate the safety margin obtained from plant modernization, especially for the High Safety Significant Safety-related (HSSSR) DI&C systems, (2) develop an advanced risk assessment technology to support transition from analog to DI&C technologies for nuclear industry, (3) assure the long-term safety and reliability of vital HSSSR DI&C systems, (4) reduce uncertainty in costs and support integration of DI&C systems in the plant. To achieve these technical goals and deal with the expensive licensing justifications from regulatory insights, the IRADIC technology is instructive for nuclear vendors and utilities to effectively lower the costs associated with digital compliance and speed industry advances by: (1) defining an integrated risk-informed analysis process for DI&C upgrade, including hazard analysis, reliability analysis, and consequence analysis, (2) applying systematic and risk-informed tools to address common cause failures (CCFs) and quantify responding failure probabilities for DI&C technologies, particularly software CCFs, (3) evaluating the impact of digital failures at the individual level, system level, and plant level, (4) providing insights and suggestions on designs to manage the risks; thus, to support the development, licensing, and deployment of advanced DI&C technologies on nuclear power plant (NPPs). In this report, an approach for performing software CCF analysis, given limited data, is developed and demonstrated using a case study of a highly redundant digital reactor trip system. Consequence analysis is also performed based on different accident scenarios. Results indicate that plant modernization including the improvement of HSSSR DI&C systems will make great benefits to plant safety by providing more safety margins to accident management. In addition, a novel approach is proposed in this report for the quantification of software hazards when sufficient operational and testing data available. The method incorporates software development quality as well as strong analysis techniques to identify and link software defects to potential failure modes. The approach includes both semantic and test-based analysis to detect failures that can exist in different stages of the software development life cycle. This method is applied to an advanced human system interface relevant to reactor trip safety developed from the APR 1400 design.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗
DOE OSTI2015

Reliability of emerging bonded interface materials for large-area attachments

In this study, conventional thermal interface materials (TIMs), such as greases, gels, and phase change materials, pose bottlenecks to heat removal and have long caused reliability issues in automotive power electronics packages. Bonded interface materials (BIMs) with superior thermal performance have the potential to be a replacement to the conventional TIMs. However, due to coefficient of thermal expansion mismatches between different components in a package and resultant thermomechanical stresses, fractures or delamination could occur, causing serious reliability concerns. These defects manifest themselves in increased thermal resistance in the package. In this paper, the results of reliability evaluation of emerging BIMs for large-area attachments in power electronics packaging are reported. Thermoplastic (polyamide) adhesive with embedded near-vertical-aligned carbon fibers, sintered silver, and conventional lead solder (Sn 63 Pb 37 ) materials were bonded between 50.8 mm x 50.8 mm cross-sectional footprint silicon nitride substrates and copper base plate samples, and were subjected to accelerated thermal cycling until failure or 2500 cycles. Damage in the BIMs was monitored every 100 cycles by scanning acoustic microscopy. Thermoplastic with embedded carbon fibers performed the best with no defects, whereas sintered silver and lead solder failed at 2300 and 1400 thermal cycles, respectively. Besides thermal cycling, additional lead solder samples were subjected to thermal shock and thermal cycling with extended dwell periods. A finite element method (FEM)-based model was developed to simulate the behavior of lead solder under thermomechanical loading. Strain energy density per cycle results were calculated from the FEM simulations. A predictive lifetime model was formulated for lead solder by correlating strain energy density results extracted from modeling with cycles-to-failure obtained from experimental accelerated tests. A power-law-based approach was used to formulate the - redictive lifetime model.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2023

A Micro-scale Numerical Investigation of Internal and Interfacial Void Defects in Adhesive on Failure Behavior of Adhesively-Bonded Materials with Rough Surfaces

This paper studied the effects of air void defects on the failure behavior of adhesively-bonded materials under global shear via micro-scale computational modeling. The numerical results indicated that interfacial void defects can largely facilitate interfacial debonding of a weaker adherend/adhesive interface under shear. However, this is not the case for a stronger adherend/adhesive interface, showing the reduction on the nominal shear strength of an adhesive joint is mainly due to internal void defects. The reduced bonding performance due to voids can be improved by leveraging an appropriate surface roughness. This preliminary investigation is a first step to better understand the micro-mechanics of interfacial failure in the adhesion of a roughened/patterned adherend via surface modification(s) and an adhesive, and also shows the importance of minimizing interfacial void defects in particular at a weaker adherend/adhesive interface via different techniques.

Qiao, Yao↗
DOE OSTI2023

Heavy ion irradiation induced failure of gallium nitride high electron mobility transistors: effects of in-situ biasing

Abstract While radiation is known to degrade AlGaN/GaN high-electron-mobility transistors (HEMTs), the question remains on the extent of damage governed by the presence of an electrical field in the device. In this study, we induced displacement damage in HEMTs in both ON and OFF states by irradiating with 2.8 MeV Au 4+ ion to fluence levels ranging from 1.72 × 10 10 to 3.745 × 10 13 ions cm −2 , or 0.001–2 displacement per atom (dpa). Electrical measurement is done in situ , and high-resolution transmission electron microscopy (HRTEM), energy dispersive x-ray (EDX), geometrical phase analysis (GPA), and micro-Raman are performed on the highest fluence of Au 4+ irradiated devices. The selected heavy ion irradiation causes cascade damage in the passivation, AlGaN, and GaN layers and at all associated interfaces. After just 0.1 dpa, the current density in the ON-mode device deteriorates by two orders of magnitude, whereas the OFF-mode device totally ceases to operate. Moreover, six orders of magnitude increase in leakage current and loss of gate control over the 2-dimensional electron gas channel are observed. GPA and Raman analysis reveal strain relaxation after a 2 dpa damage level in devices. Significant defects and intermixing of atoms near AlGaN/GaN interfaces and GaN layer are found from HRTEM and EDX analyses, which can substantially alter device characteristics and result in complete failure.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
NASA NTRS2016

Degradation of Leakage Currents and Reliability Prediction for Tantalum Capacitors

Two types of failures in solid tantalum capacitors, catastrophic and parametric, and their mechanisms are described. Analysis of voltage and temperature reliability acceleration factors reported in literature shows a wide spread of results and requires more investigation. In this work, leakage currents in two types of chip tantalum capacitors were monitored during highly accelerated life testing (HALT) at different temperatures and voltages. Distributions of degradation rates were approximated using a general log-linear Weibull model and yielded voltage acceleration constants B = 9.8 +/- 0.5 and 5.5. The activation energies were Ea = 1.65 eV and 1.42 eV. The model allows for conservative estimations of times to failure and was validated by long-term life test data. Parametric degradation and failures are reversible and can be annealed at high temperatures. The process is attributed to migration of charged oxygen vacancies that reduce the barrier height at the MnO2/Ta2O5 interface and increase injection of electrons from the MnO2 cathode. Analysis showed that the activation energy of the vacancies' migration is ~ 1.1 eV.

acceleration factors↗
NASA NTRS2013

Mission Data System Java Edition Version 7

The Mission Data System framework defines closed-loop control system abstractions from State Analysis including interfaces for state variables, goals, estimators, and controllers that can be adapted to implement a goal-oriented control system. The framework further provides an execution environment that includes a goal scheduler, execution engine, and fault monitor that support the expression of goal network activity plans. Using these frameworks, adapters can build a goal-oriented control system where activity coordination is verified before execution begins (plan time), and continually during execution. Plan failures including violations of safety constraints expressed in the plan can be handled through automatic re-planning. This version optimizes a number of key interfaces and features to minimize dependencies, performance overhead, and improve reliability. Fault diagnosis and real-time projection capabilities are incorporated. This version enhances earlier versions primarily through optimizations and quality improvements that raise the technology readiness level. Goals explicitly constrain system states over explicit time intervals to eliminate ambiguity about intent, as compared to command-oriented control that only implies persistent intent until another command is sent. A goal network scheduling and verification process ensures that all goals in the plan are achievable before starting execution. Goal failures at runtime can be detected (including predicted failures) and handled by adapted response logic. Responses can include plan repairs (try an alternate tactic to achieve the same goal), goal shedding, ignoring the fault, cancelling the plan, or safing the system.

Reinholtz, William K.↗
DOE OSTI2017

Design Guidelines for Predicting Stress in Cemented Doublets Undergoing Temperature Change

This work explores quick predictive methods for calculating potentially risky stresses in cemented doublets underdoing temperature change that agree well with finite element analysis. We also provide guidelines for avoiding stress concentrations. Cemented doublets are ubiquitous in the optics world, but it is not always clear if they will perform as intended in a specific thermal environment due to excessive stress. The stress in the optic can cause debonding or even fracture. Yoder addressed this problem using analytical results from Chen and Nelson but also expressed some skepticism as to the accuracy and usefulness of those results. Closed-form analytical solutions are extremely useful when doing trade-off studies to see if a particular geometry or glass choice will cause stress problems. The problem of bonded materials undergoing temperature change is of great interest in the electronics industry, and improved analytical solutions are now available that address the issues raised by Yoder, and they have been validated using finite element analysis (FEA). But the newer solutions still have limitations. The analytical solutions presented here cannot predict stresses due to stress concentrations or singularities at the edge of the bondline—this still has to be done using FEA—although some advanced methods are available. Also, the existing analytical methods assume a flat interface between adjoining elements; they do not account for the effect of curvature. We find that most doublet failures start at the edges and involve debonding of the glass. Glass fracture is rare for doublets, accounting for less than 10% of the failures. This paper provides the reader with a general introduction to a large and dense body of literature in order to demystify the subject of temperature-induced glass bonding failures.

36 MATERIALS SCIENCE↗
NASA NTRS1975

On development of a sealed bearing for space suits

The work to correct several design deficiencies present in the bearings used in the orbital extravehicular spacesuit is reported. These deficiencies included: difficult stitch-on interface between fabric and outer race; a tendency for the clamping threads to seize; and, most importantly, the failure of the sealing surfaces (Teflon seat, Delrin seal) to maintain integrity with cycling. The first problem was corrected by raising the stitch-on holes so as to be more accessible. The seizing was eliminated by changing to a coarser thread, from 32/inch to 24/inch. The solution to the sealing problem required a materials evaluation, candidate material selection, and adhesive evaluation (for bonding the seat material to the outer race) and bench-cycling of candidate seal/seat combinations. The final configuration, successfully bench-cycled and delivered to NASA, is shown.

Rayfield, J.↗
NASA NTRS1981

Thermal and stress analysis of thermal barrier coatings

An analysis has been performed that predicts the thermomechanical behavior of thermal barrier coated specimens. The analysis predicts the behavior during both plasma spray coating application and burner rig testing conditions simulating engine operation. The analysis was accomplished through utilization of one-dimensional through thickness and two-dimensional finite element calculations. The results of these calculations showed that specimens with a substrate control temperature between 300 F and 600 F would be optimum. Controlling substrate temperature was found to have a more dominant effect on the mechanical strains than the ceramic or substrate thicknesses. The predicted stresses and mechanical strains at the bond-coating interface are large enough to cause cracks in this region where post-test observations have determined coating failures originate.

Cassenti, B. N.↗
NASA NTRS1989

Thermal barrier coating life prediction model development, phase 1

The objective of this program was to establish a methodology to predict thermal barrier coating (TBC) life on gas turbine engine components. The approach involved experimental life measurement coupled with analytical modeling of relevant degradation modes. Evaluation of experimental and flight service components indicate the predominant failure mode to be thermomechanical spallation of the ceramic coating layer resulting from propagation of a dominant near interface crack. Examination of fractionally exposed specimens indicated that dominant crack formation results from progressive structural damage in the form of subcritical microcrack link-up. Tests conducted to isolate important life drivers have shown MCrAlY oxidation to significantly affect the rate of damage accumulation. Mechanical property testing has shown the plasma deposited ceramic to exhibit a non-linear stress-strain response, creep and fatigue. The fatigue based life prediction model developed accounts for the unusual ceramic behavior and also incorporates an experimentally determined oxide rate model. The model predicts the growth of this oxide scale to influence the intensity of the mechanic driving force, resulting from cyclic strains and stresses caused by thermally induced and externally imposed mechanical loads.

Demasi, Jeanine T.↗
NASA NTRS1992

The effect of temperature on the deformation and fracture of SiC/Ti-24Al-11Nb

The effect of temperature on the stress-strain behavior in air and the failure mechanisms of Ti-24Al-11Nb alloy and of a SiC/Ti-24Al-11Nb composite with continuous SiC fibers oriented parallel to the loading direction was investigated over temperature range 23-815 C. It was found that the tensile failure process of SiC/Ti-24Al-11Nb was controlled at all temperatures by fiber fracture. Composite failure occurred at 0.8 percent strain at all temperatures. Debond and frictional stresses at the fiber-matrix interface decreased with increased temperature.

Brindley, P. K.↗