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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRS1987

High data rate Reed-Solomon encoding and decoding using VLSI technology

Presented as an implementation of a Reed-Solomon encode and decoder, which is 16-symbol error correcting, each symbol is 8 bits. This Reed-Solomon (RS) code is an efficient error correcting code that the National Aeronautics and Space Administration (NASA) will use in future space communications missions. A Very Large Scale Integration (VLSI) implementation of the encoder and decoder accepts data rates up 80 Mbps. A total of seven chips are needed for the decoder (four of the seven decoding chips are customized using 3-micron Complementary Metal Oxide Semiconduction (CMOS) technology) and one chip is required for the encoder. The decoder operates with the symbol clock being the system clock for the chip set. Approximately 1.65 billion Galois Field (GF) operations per second are achieved with the decoder chip set and 640 MOPS are achieved with the encoder chip.

Miller, Warner↗
NASA NTRS1994

Spectral analysis of ALH 84001, a meteorite from Mars

ALH 84001 has recently been reclassified as a meteorite from Mars (SNC) and contains more than 90% orthopyroxene with minor chromite and accessory phases of augite, maskelynite, and carbonate. This meteorite represents a new class of igneous material from Mars. We have measured reflectance spectra of ALH 84001 as a chip as a powder, dry sieved to less than 125 microns to compare with previous spectral analyses of SNCs and remote observations of Mars. Spectra of the chip and powder in the visible-to-near-infrared region are shown. These spectra are composites of data measured with the RELAB bidirectional spectrometer from 0.3 to 2.55 microns and a Nicolet FTIR for longer wavelengths. As expected, the spectra of the chip have negative slopes and are significantly darker than the spectrum of the particulate sample, which has a positive slope. The strong absorptions near 1 micron and 2 microns are characteristic of low-Ca pyroxene and have band rninima of 0.925 microns and 1.930 microns. The strong absorption near 3 microns is characteristic of water. There is a distinct flattening in the spectrum between 1.0 and 1.5 microns indicating the presence of an additional absorption. This is interpreted to be the result of Fe(2+) in the M1 site of low-Ca pyroxene. Mid-infrared spectra showing the Christiansen feature and the reststrahlen bands are shown for spectra of the powder and of three different locations on the chip. These spectra exhibit several features in this range, some of which are associated with a specific region on the chip. Each of the spectra includes a doublet reststrahlen peak near 1100/cm, and peaks near 880 and 500/cm, which are typical for low-Ca pyroxenes. Weaker features at 940-1000/cm, 600-750/cm, and 530-560/cm are present in spectra from some locations on the chip, but not others, implying compositional and textural variation.

Bishop, J.↗
NASA NTRS1997

A Novel Silicon Micromachined Integrated MCM Thermal Management System

"Micromachining" is a chemical means of etching three-dimensional structures, typically in single- crystalline silicon. These techniques are leading toward what is coming to be referred to as MEMS (Micro Electro Mechanical Systems), where in addition to the ordinary two-dimensional (planar) microelectronics, it is possible to build three-dimensional n-ticromotors, electrically- actuated raicrovalves, hydraulic systems and much more on the same microchip. These techniques become possible because of differential etching rates of various crystallographic planes and materials used for semiconductor n-ticrofabfication. The University of Cincinnati group in collaboration with Karl Baker at NASA Lewis were the first to form micro heat pipes in silicon by the above techniques. Current work now in progress using MEMS technology is now directed towards the development of the next generation in MCM (Multi Chip Module) packaging. Here we propose to develop a complete electronic thermal management system which will allow densifica6on in chip stacking by perhaps two orders of magnitude. Furthermore the proposed technique will allow ordinary conu-nercial integrated chips to be utilized. Basically, the new technique involves etching square holes into a silicon substrate and then inserting and bonding commercially available integrated chips into these holes. For example, over a 100 1/4 in. by 1 /4 in. integrated chips can be placed on a 4 in. by 4 in. silicon substrate to form a Multi-Chip Module (MCM). Placing these MCM's in-line within an integrated rack then allows for three-diniensional stacking. Increased miniaturization of microelectronic circuits will lead to very high local heat fluxes. A high performance thermal management system will be specifically designed to remove the generated energy. More specifically, a compact heat exchanger with milli / microchannels will be developed and tested to remove the heat through the back side of this MCM assembly for moderate and high heat flux applications, respectively. The high heat load application of particular interest in mind is the motor controller developed by Martin Marietta for Nasa to control the thruster's directional actuators on space vechicles. Work is also proposed to develop highly advanced and improved porous wick structures for use in advanced heat loops. The porous wick will be micromachined from silicon using MEMS technology, thus permitting far superior control of pore size and pore distribution (over wicks made from sintered n-ietals), which in turn is expected to led to significantly improved heat loop performance.

Kazmierczak, M. J.↗
NASA NTRS1998

Seal the Deal

AvanTeco Corporation has developed a moisture/contaminant sensor chip. This newly developed chip rapidly responds to the presence of moisture, especially in condensed form and in presence of ionic impurities. It determines whether moisture has permeated a hermetically sealed package or a plastic encapsulated microcircuit. The sensor chip was designed as a "go/no go" chip, which is assembled with other chips in a multi-chip module to assess the risk of failure for the entire module. It has been commercialized and is sold by Revtek, Inc.

Source record↗
NASA NTRS1996

Highly Efficient Amplifier for Ka-Band Communications

An amplifier developed under a Small Business Innovation Research (SBIR) contract will have applications for both satellite and terrestrial communications. This power amplifier uses an innovative series bias arrangement of active devices to achieve over 40-percent efficiency at Ka-band frequencies with an output power of 0.66 W. The amplifier is fabricated on a 2.0- by 3.8-square millimeter chip through the use of Monolithic Microwave Integrated Circuit (MMIC) technology, and it uses state-of-the-art, Pseudomorphic High-Electron-Mobility Transistor (PHEMT) devices. Although the performance of the MMIC chip depends on these high-performance devices, the real innovations here are a unique series bias scheme, which results in a high-voltage chip supply, and careful design of the on-chip planar output stage combiner. This design concept has ramifications beyond the chip itself because it opens up the possibility of operation directly from a satellite power bus (usually 28 V) without a dc-dc converter. This will dramatically increase the overall system efficiency. Conventional microwave power amplifier designs utilize many devices all connected in parallel from the bias supply. This results in a low-bias voltage, typically 5 V, and a high bias current. With this configuration, substantial I(sup 2) R losses (current squared times resistance) may arise in the system bias-distribution network. By placing the devices in a series bias configuration, the total current is reduced, leading to reduced distribution losses. Careful design of the on-chip planar output stage power combiner is also important in minimizing losses. Using these concepts, a two-stage amplifier was designed for operation at 33 GHz and fabricated in a standard MMIC foundry process with 0.20-m PHEMT devices. Using a 20-V bias supply, the amplifier achieved efficiencies of over 40 percent with an output power of 0.66 W and a 16-dB gain over a 2-GHz bandwidth centered at 33 GHz. With a 28-V bias, a power level of 1.1 W was achieved with a 12-dB gain and a 36-percent efficiency. This represents the best reported combination of power and efficiency at this frequency. In addition to delivering excellent power and gain, this Ka-band MMIC power amplifier has an efficiency that is 10 percent greater than existing designs. The unique design offers an excellent match for spacecraft applications since the amplifier supply voltage is closely matched to the typical value of spacecraft bus voltage. These amplifiers may be used alone in applications of 1 W or less, or several may be combined or used in an array to produce moderate power, Ka-band transmitters with minimal power combining and less thermal stress owing to the combination of excellent efficiency and power output. The higher voltage operation of this design may also save mass and power because the dc-dc power converter is replaced with a simpler voltage regulator.

Source record↗
NASA NTRS2003

Advanced Packaging Technology Used in Fabricating a High-Temperature Silicon Carbide Pressure Sensor

The development of new aircraft engines requires the measurement of pressures in hot areas such as the combustor and the final stages of the compressor. The needs of the aircraft engine industry are not fully met by commercially available high-temperature pressure sensors, which are fabricated using silicon. Kulite Semiconductor Products and the NASA Glenn Research Center have been working together to develop silicon carbide (SiC) pressure sensors for use at high temperatures. At temperatures above 850 F, silicon begins to lose its nearly ideal elastic properties, so the output of a silicon pressure sensor will drift. SiC, however, maintains its nearly ideal mechanical properties to extremely high temperatures. Given a suitable sensor material, a key to the development of a practical high-temperature pressure sensor is the package. A SiC pressure sensor capable of operating at 930 F was fabricated using a newly developed package. The durability of this sensor was demonstrated in an on-engine test. The SiC pressure sensor uses a SiC diaphragm, which is fabricated using deep reactive ion etching. SiC strain gauges on the surface of the diaphragm sense the pressure difference across the diaphragm. Conventionally, the SiC chip is mounted to the package with the strain gauges outward, which exposes the sensitive metal contacts on the chip to the hostile measurement environment. In the new Kulite leadless package, the SiC chip is flipped over so that the metal contacts are protected from oxidation by a hermetic seal around the perimeter of the chip. In the leadless package, a conductive glass provides the electrical connection between the pins of the package and the chip, which eliminates the fragile gold wires used previously. The durability of the leadless SiC pressure sensor was demonstrated when two 930 F sensors were tested in the combustor of a Pratt & Whitney PW4000 series engine. Since the gas temperatures in these locations reach 1200 to 1300 F, the sensors were installed in water-cooled jackets, as shown. This was a severe test because the pressure-sensing chips were exposed to the hot combustion gases. Prior to the installation of the SiC pressure sensors, two high-temperature silicon sensors, installed in the same locations, did not survive a single engine run. The durability of the leadless SiC pressure sensor was demonstrated when both SiC sensors operated properly throughout the two runs that were conducted.

Beheim, Glenn M.↗
NASA NTRS2003

Microelectromechanical Systems (MEMS) Broadband Light Source Developed

A miniature, low-power broadband light source has been developed for aerospace applications, including calibrating spectrometers and powering miniature optical sensors. The initial motivation for this research was based on flight tests of a Fabry-Perot fiberoptic temperature sensor system used to detect aircraft engine exhaust gas temperature. Although the feasibility of the sensor system was proven, the commercial light source optically powering the device was identified as a critical component requiring improvement. Problems with the light source included a long stabilization time (approximately 1 hr), a large amount of heat generation, and a large input electrical power (6.5 W). Thus, we developed a new light source to enable the use of broadband optical sensors in aerospace applications. Semiconductor chip-based light sources, such as lasers and light-emitting diodes, have a relatively narrow range of emission wavelengths in comparison to incandescent sources. Incandescent light sources emit broadband radiation from visible to infrared wavelengths; the intensity at each wavelength is determined by the filament temperature and the materials chosen for the filament and the lamp window. However, present commercial incandescent light sources are large in size and inefficient, requiring several watts of electrical power to obtain the desired optical power, and they emit a large percentage of the input power as heat that must be dissipated. The miniature light source, developed jointly by the NASA Glenn Research Center, the Jet Propulsion Laboratory, and the Lighting Innovations Institute, requires one-fifth the electrical input power of some commercial light sources, while providing similar output light power that is easily coupled to an optical fiber. Furthermore, it is small, rugged, and lightweight. Microfabrication technology was used to reduce the size, weight, power consumption, and potential cost-parameters critical to future aerospace applications. This chip-based light source has the potential for monolithic fabrication with on-chip drive electronics. Other uses for these light sources are in systems for vehicle navigation, remote sensing applications such as monitoring bridges for stress, calibration sources for spectrometers, light sources for space sensors, display lighting, addressable arrays, and industrial plant monitoring. Two methods for filament fabrication are being developed: wet-chemical etching and laser ablation. Both yield a 25-mm-thick tungsten spiral filament. The proof-of-concept filament shown was fabricated with the wet etch method. Then it was tested by heating it in a vacuum chamber using about 1.25 W of electrical power; it generated bright, blackbody radiation at approximately 2650 K. The filament was packaged in Glenn's clean-room facilities. This design uses three chips vacuum-sealed with glass tape. The bottom chip consists of a reflective film deposited on silicon, the middle chip contains a tungsten filament bonded to silicon, and the top layer is a transparent window. Lifetime testing on the package will begin shortly. The emitted optical power is expected to be approximately 1.0 W with the spectral peak at 1.1 mm.

Tuma, Margaret L.↗
NASA NTRS1997

Sequence information signal processor for local and global string comparisons

A sequence information signal processing integrated circuit chip designed to perform high speed calculation of a dynamic programming algorithm based upon the algorithm defined by Waterman and Smith. The signal processing chip of the present invention is designed to be a building block of a linear systolic array, the performance of which can be increased by connecting additional sequence information signal processing chips to the array. The chip provides a high speed, low cost linear array processor that can locate highly similar global sequences or segments thereof such as contiguous subsequences from two different DNA or protein sequences. The chip is implemented in a preferred embodiment using CMOS VLSI technology to provide the equivalent of about 400,000 transistors or 100,000 gates. Each chip provides 16 processing elements, and is designed to provide 16 bit, two's compliment operation for maximum score precision of between -32,768 and +32,767. It is designed to provide a comparison between sequences as long as 4,194,304 elements without external software and between sequences of unlimited numbers of elements with the aid of external software. Each sequence can be assigned different deletion and insertion weight functions. Each processor is provided with a similarity measure device which is independently variable. Thus, each processor can contribute to maximum value score calculation using a different similarity measure.

Peterson, John C.↗
NASA NTRS2007

Portable Apparatus for Electrochemical Sensing of Ethylene

A small, lightweight, portable apparatus based on an electrochemical sensing principle has been developed for monitoring low concentrations of ethylene in air. Ethylene has long been known to be produced by plants and to stimulate the growth and other aspects of the development of plants (including, notably, ripening of fruits and vegetables), even at concentrations as low as tens of parts per billion (ppb). The effects are magnified in plant-growth and -storage chambers wherein ethylene can accumulate. There is increasing recognition in agriculture and related industries that it is desirable to monitor and control ethylene concentrations in order to optimize the growth, storage, and ripening of plant products. Hence, there are numerous potential uses for the present apparatus in conjunction with equipment for controlling ethylene concentrations. The ethylene sensor is of a thick-film type with a design optimized for a low detection limit. The sensor includes a noble metal sensing electrode on a chip and a hydrated solid-electrolyte membrane that is held in contact with the chip. Also located on the sensor chip are a counter electrode and a reference electrode. The sensing electrode is held at a fixed potential versus the reference electrode. Detection takes place at active-triple-point areas where the sensing electrode, electrolyte, and sample gas meet. These areas are formed by cutting openings in the electrolyte membrane. The electrode current generated from electrochemical oxidation of ethylene at the active triple points is proportional to the concentration of ethylene. An additional film of the solid-electrolyte membrane material is deposited on the sensing electrode to increase the effective triple-point areas and thereby enhance the detection signal. The sensor chip is placed in a holder that is part of a polycarbonate housing. When fully assembled, the housing holds the solid-electrolyte membrane in contact with the chip (see figure). The housing includes a water reservoir for keeping the solid-electrolyte membrane hydrated. The housing also includes flow channels for circulating a sample stream of air over the chip: ethylene is brought to the sensing surface predominately by convection in this sample stream. The sample stream is generated by a built-in sampling pump. The forced circulation of sample air contributes to the attainment of a low detection limit.

Manoukian, Mourad↗
NASA NTRS2012

The Relation between Coronal Holes and Coronal Mass Ejections during the Rise, Maximum, and Declining Phases of Solar Cycle 23

We study the interaction between coronal holes (CHs) and coronal mass ejections (CMEs) using a resultant force exerted by all the coronal holes present on the disk and is defined as the coronal hole influence parameter (CHIP). The CHIP magnitude for each CH depends on the CH area, the distance between the CH centroid and the eruption region, and the average magnetic field within the CH at the photospheric level. The CHIP direction for each CH points from the CH centroid to the eruption region. We focus on Solar Cycle 23 CMEs originating from the disk center of the Sun (central meridian distance ≤15deg) and resulting in magnetic clouds (MCs) and non-MCs in the solar wind. The CHIP is found to be the smallest during the rise phase for MCs and non-MCs. The maximum phase has the largest CHIP value (2.9 G) for non-MCs. The CHIP is the largest (5.8 G) for driverless (DL) shocks, which are shocks at 1 AU with no discernible MC or non-MC. These results suggest that the behavior of non-MCs is similar to that of the DL shocks and different from that of MCs. In other words, the CHs may deflect the CMEs away from the Sun-Earth line and force them to behave like limb CMEs with DL shocks. This finding supports the idea that all CMEs may be flux ropes if viewed from an appropriate vantage point.

CMEs↗
NASA NTRS2014

Aeroflex Technology as Class-Y Demonstrator

Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

Suh, Jong-ook↗
DOE OSTI2024

Architectural Implications of Neural Network Inference for High Data-Rate, Low-Latency Scientific Applications

With more scientific fields relying on neural networks (NNs) to process data incoming at extreme throughputs and latencies, it is crucial to develop NNs with all their parameters stored on-chip. In many of these applications, there is not enough time to go off-chip and retrieve weights. Even more so, off-chip memory such as DRAM does not have the bandwidth required to process these NNs as fast as the data is being produced (e.g., every 25 ns). As such, these extreme latency and bandwidth requirements have architectural implications for the hardware intended to run these NNs: 1) all NN parameters must fit on-chip, and 2) codesigning custom/reconfigurable logic is often required to meet these latency and bandwidth constraints. In our work, we show that many scientific NN applications must run fully on chip, in the extreme case requiring a custom chip to meet such stringent constraints.

Weng, Olivia↗
NASA NTRS2004

COTS MEMS Flow-Measurement Probes

As an alternative to conventional tubing instrumentation for measuring airflow, designers and technicians at Glenn Research Center have been fabricating packaging components and assembling a set of unique probes that contain commercial off-the-shelf (COTS) microelectromechanical systems (MEMS) sensor chips. MEMS sensor chips offer some compelling advantages over standard macroscopic measurement devices. MEMS sensor technology has matured through mass production and use in the automotive and aircraft industries. At present, MEMS are the devices of choice for sensors in such applications as tire-pressure monitors, altimeters, pneumatic controls, cable leak detectors, and consumer appliances. Compactness, minimality of power demand, rugged construction, and moderate cost all contribute to making MEMS sensors attractive for instrumentation for future research. Conventional macroscopic flow-measurement instrumentation includes tubes buried beneath the aerodynamic surfaces of wind-tunnel models or in wind-tunnel walls. Pressure is introduced at the opening of each such tube. The pressure must then travel along the tube before reaching a transducer that generates an electronic signal. The lengths of such tubes typically range from 20 ft (approx.= 6 m) to hundreds of feet (of the order of 100 m). The propagation of pressure signals in the tubes damps the signals considerably and makes it necessary to delay measurements until after test rigs have reached steady-state operation. In contrast, a MEMS pressure sensor that generates electronic output can take readings continuously under dynamic conditions in nearly real time. In order to use stainless-steel tubing for pressure measurements, it is necessary to clean many tubes, cut them to length, carefully install them, delicately deburr them, and splice them. A cluster of a few hundred 1/16-in.- (approx.=1.6-mm-) diameter tubes (such clusters are common in research testing facilities) can be several inches (of the order of 10 cm) in diameter and could weigh enough that two technicians are needed to handle it. Replacing hard tubing with electronic chips can eliminate much of the bulk. Each sensor would fit on the tip of a 1/16-in. tube with room to spare. The Lucas NovaSensor P592 piezoresistive silicon pressure sensor was chosen for this project because of its cost, availability, and tolerance to extreme ambient conditions. The sensor chip is 1 mm square by 0.6 mm thick (about 0.039 by 0.039 by 0.024 in.) and includes 0.12-mm (approx.=0.005-in.) wire connection tabs. The figure shows a flow-angularity probe that was built by use of three such MEMS chips. It is planned to demonstrate this MEMS probe as an alternative to a standard tube-type "Cobra" probe now used routinely in wind tunnels and aeronautical hardware. This MEMS probe could be translated across a flow field by use of a suitable actuator, so that its accuracy and the shortness of its response time could be exploited to obtain precise dynamic measurements of a sort that cannot be made by use of conventional tubing-based instrumentation.

Redding, Chip↗
NASA NTRS2015

Nonnegative Matrix Factorization for Efficient Hyperspectral Image Projection

Hyperspectral imaging for remote sensing has prompted development of hyperspectral image projectors that can be used to characterize hyperspectral imaging cameras and techniques in the lab. One such emerging astronomical hyperspectral imaging technique is wide-field double-Fourier interferometry. NASA's current, state-of-the-art, Wide-field Imaging Interferometry Testbed (WIIT) uses a Calibrated Hyperspectral Image Projector (CHIP) to generate test scenes and provide a more complete understanding of wide-field double-Fourier interferometry. Given enough time, the CHIP is capable of projecting scenes with astronomically realistic spatial and spectral complexity. However, this would require a very lengthy data collection process. For accurate but time-efficient projection of complicated hyperspectral images with the CHIP, the field must be decomposed both spectrally and spatially in a way that provides a favorable trade-off between accurately projecting the hyperspectral image and the time required for data collection. We apply nonnegative matrix factorization (NMF) to decompose hyperspectral astronomical datacubes into eigenspectra and eigenimages that allow time-efficient projection with the CHIP. Included is a brief analysis of NMF parameters that affect accuracy, including the number of eigenspectra and eigenimages used to approximate the hyperspectral image to be projected. For the chosen field, the normalized mean squared synthesis error is under 0.01 with just 8 eigenspectra. NMF of hyperspectral astronomical fields better utilizes the CHIP's capabilities, providing time-efficient and accurate representations of astronomical scenes to be imaged with the WIIT.

NMF↗
DOE OSTI2025

PSEC5 Physical Verification

Ultra-Fast timing detectors, having a time resolution of 10pSec or less, are becoming increasingly important for many scientific disciplines, including High Energy Physics, Nuclear Physics, Medical Imaging and more. When developing ultra-fast detectors such as MCPs, LAPPDs, LGADs, SNSPDs, it is necessary to have access to a readout system that is low power, can support many channels and is cost effective. The PSEC5 chip was an application specific integrated circuit (ASIC) developed by the pioneering group of Prof. Henry Frisch at University of Chicago and micro electronic engineers at Fermi National Accelerator Laboratory. Three boards were designed, two to implement the readout system for an LAPPD and one to only characterize the PSEC1 chip. The main goal of the project shifted to setting up a testing environment to focus on the characterization of the chip. My student and I tested and characterized this ASIC using the third chip-on-board printed circuit board. Results show the successful fabrication and operation of some of the key building blocks and lead to the suggestions on modification for the second iteration of the chip.

Rico Aniles, H. D. [Unlisted]↗
DOE OSTI2025

Microwave-Mediated Extraction of Critical Metals from LED E-Waste

This study introduces a microwave-assisted technique for extracting critical minerals from LED electronic waste. The process begins with microwave irradiation, which thermally decomposes the LED’s plastic lens into a brittle, charred residue. During this stage, the LED chip undergoes deflagration—being rapidly ejected from the reflective cavity and becoming embedded within the decomposed lens material. Consequently, the chip is encapsulated in the resulting charred residue. This composite, consisting of the charred lens and the LED chip, can be easily separated from the metallic pins (Fe, Ni, Ag), which remain almost undamaged. Subsequent calcination of the charred material in air exposes the materials making up the LED chip, which contain critical metals (e.g., Ga, As, In, Y, Au). These metals are then extracted through a two-step acid leaching process involving aqua regia followed by hot concentrated hydrochloric acid, yielding them in potentially recoverable forms. The synergistic effect of microwave irradiation and acid treatment achieves an average extraction efficiency of 96% for critical metals. Notably, this approach enables complete and loss-free recovery of the LED chip, offering a practical and efficient solution for LED e-waste recycling.

Bourlinos, Athanasios B.↗
NASA NTRS1973

Integrated circuit package with lead structure and method of preparing the same

A beam-lead integrated circuit package assembly including a beam-lead integrated circuit chip, a lead frame array bonded to projecting fingers of the chip, a rubber potting compound disposed around the chip, and an encapsulating molded plastic is described. The lead frame array is prepared by photographically printing a lead pattern on a base metal sheet, selectively etching to remove metal between leads, and plating with gold. Joining of the chip to the lead frame array is carried out by thermocompression bonding of mating goldplated surfaces. A small amount of silicone rubber is then applied to cover the chip and bonded joints, and the package is encapsulated with epoxy resin, applied by molding.

Kennedy, B. W.↗
NASA NTRS1974

Basic memory module

Construction and electrical characterization of the 4096 x 2-bit Basic Memory Module (BMM) are reported for the Space Ultrareliable Modular Computer (SUMC) program. The module uses four 2K x 1-bit N-channel FET, random access memory chips, called array chips, and two sense amplifier chips, mounted and interconnected on a ceramic substrate. Four 5% tolerance power supplies are required. At the Module, the address, chip select, and array select lines require a 0-8.5 V MOS signal level. The data output, read-strobe, and write-enable lines operate at TTl levels. Although the module is organized as 4096 x 2 bits, it can be used in a 8196 x 1-bit application with appropriate external connections. A 4096 x 1-bit organization can be obtained by depopulating chips.

Tietze, F. C.↗