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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 505 records · Page 28
All sourcesNASA NTRSDOE OSTI
NASA NTRS2001

Modular electronics packaging system

A modular electronics packaging system includes multiple packaging slices that are mounted horizontally to a base structure. The slices interlock to provide added structural support. Each packaging slice includes a rigid and thermally conductive housing having four side walls that together form a cavity to house an electronic circuit. The chamber is enclosed on one end by an end wall, or web, that isolates the electronic circuit from a circuit in an adjacent packaging slice. The web also provides a thermal path between the electronic circuit and the base structure. Each slice also includes a mounting bracket that connects the packaging slice to the base structure. Four guide pins protrude from the slice into four corresponding receptacles in an adjacent slice. A locking element, such as a set screw, protrudes into each receptacle and interlocks with the corresponding guide pin. A conduit is formed in the slice to allow electrical connection to the electronic circuit.

Hunter, Don J.↗
NASA NTRS1994

Monolithic Optical-To-Electronic Receiver

Monolithic optoelectronic integrated circuit converts multiplexed digital optical signals into electrical signals, separates, and distributes them to intended destinations. Developed to deliver phase and amplitude commands to monolithic microwave integrated circuits (MMIC's) at elements of millimeter-wave phased-array antenna from single optical fiber driven by external array controller. Also used in distribution of high-data-rate optical communications in local-area networks (LAN's). Notable features include options for optical or electrical clock inputs; outputs for raw data, addresses, and instructions for diagnosis; and optical-signal-detection circuit used to reduce power consumption by 80 percent between data-transmission times. Chip fabricated by processes available at many major semiconductor foundries. Distribution of digital signals in aircraft, automobiles, and ships potential application.

Kunath, Richard↗
NASA NTRS1983

Integral inverter/battery charger for use in electric vehicles

The design and test results of a thyristor based inverter/charger are discussed. A battery charger is included integral to the inverter by using a subset of the inverter power circuit components. The resulting charger provides electrical isolation between the vehicle propulsion battery and ac line and is capable of charging a 25 kWh propulsion battery in 8 hours from a 220 volt ac line. The integral charger employs the inverter commutation components at a resonant ac/dc isolated converter rated at 3.6 kW. Charger efficiency and power factor at an output power of 3.6 kW are 86% and 95% respectively. The inverter, when operated with a matching polyphase ac induction motor and nominal 132 volt propulsion battery, can provide a peak shaft power of 34 kW (45 ph) during motoring operation and 45 kW (60 hp) during regeneration. Thyristors are employed for the inverter power switching devices and are arranged in an input-commutated topology. This configuration requires only two thyristors to commutate the six main inverter thyristors. Inverter efficiency during motoring operation at motor shaft speeds above 450 rad/sec (4300 rpm) is 92-94% for output power levels above 11 KW (15 hp). The combined ac inverter/charger package weighs 47 kg (103 lbs).

Thimmesch, D.↗
NASA NTRS1979

Investigation of reliability attributes and accelerated stress factors on terrestrial solar cells

The results of accelerated stress testing of four different types of silicon terrestrial solar cells are discussed. The accelerated stress tests used included bias-temperature tests, bias-temperature-humidity tests, thermal cycle and thermal shock tests, and power cycle tests. Characterization of the cells was performed before stress testing and at periodic down-times, using electrical measurement, visual inspection, and metal adherence pull tests. Electrical parameters measured included short-circuit current, open circuit voltage, and output power, voltage, and current at the maximum power point. Incorporated in the report are the distributions of the prestress electrical data for all cell types. Data were also obtained on cell series and shunt resistance.

Prince, J. L.↗
NASA NTRS2014

Advances in Current Rating Techniques for Flexible Printed Circuits

Twist Capsule Assemblies are power transfer devices commonly used in spacecraft mechanisms that require electrical signals to be passed across a rotating interface. Flexible printed circuits (flex tapes, see Figure 2) are used to carry the electrical signals in these devices. Determining the current rating for a given trace (conductor) size can be challenging. Because of the thermal conditions present in this environment the most appropriate approach is to assume that the only means by which heat is removed from the trace is thru the conductor itself, so that when the flex tape is long the temperature rise in the trace can be extreme. While this technique represents a worst-case thermal situation that yields conservative current ratings, this conservatism may lead to overly cautious designs when not all traces are used at their full rated capacity. A better understanding of how individual traces behave when they are not all in use is the goal of this research. In the testing done in support of this paper, a representative flex tape used for a flight Solar Array Drive Assembly (SADA) application was tested by energizing individual traces (conductors in the tape) in a vacuum chamber and the temperatures of the tape measured using both fine-gauge thermocouples and infrared thermographic imaging. We find that traditional derating schemes used for bundles of wires do not apply for the configuration tested. We also determine that single active traces located in the center of a flex tape operate at lower temperatures than those on the outside edges.

Hayes, Ron↗
NASA NTRS1972

Improved electrical spot terminals

Improved electrical spot terminal has been developed which can be rigidly attached to terminal mounting board. Mounting board is bonded to epoxy board which in turn is bonded to printed circuit board with high temperature adhesive. Conductive lead is coupled between electrical terminal and circuit trace on circuit board. Shape is usually clover-leaf.

Baker, C. D.↗
NASA NTRS1966

TAG user's manual

Transient Analysis Generator /TAG/ program for automatic circuit analysis of transient and steady state behavior of large class of electrical networks

STEADY STATE↗
NASA NTRS2008

Making Superconducting Welds between Superconducting Wires

A technique for making superconducting joints between wires made of dissimilar superconducting metals has been devised. The technique is especially suitable for fabrication of superconducting circuits needed to support persistent electric currents in electromagnets in diverse cryogenic applications. Examples of such electromagnets include those in nuclear magnetic resonance (NMR) and magnetic resonance imaging (MRI) systems and in superconducting quantum interference devices (SQUIDs). Sometimes, it is desirable to fabricate different parts of a persistent-current-supporting superconducting loop from different metals. For example, a sensory coil in a SQUID might be made of Pb, a Pb/Sn alloy, or a Cu wire plated with Pb/Sn, while the connections to the sensory coil might be made via Nb or Nb/Ti wires. Conventional wire-bonding techniques, including resistance spot welding and pressed contact, are not workable because of large differences between the hardnesses and melting temperatures of the different metals. The present technique is not subject to this limitation. The present technique involves the use (1) of a cheap, miniature, easy-to-operate, capacitor-discharging welding apparatus that has an Nb or Nb/Ti tip and operates with a continuous local flow of gaseous helium and (2) preparation of a joint in a special spark-discharge welding geometry. In a typical application, a piece of Nb foil about 25 m thick is rolled to form a tube, into which is inserted a wire that one seeks to weld to the tube (see figure). The tube can be slightly crimped for mechanical stability. Then a spark weld is made by use of the aforementioned apparatus with energy and time settings chosen to melt a small section of the niobium foil. The energy setting corresponds to the setting of a voltage to which the capacitor is charged. In an experiment, the technique was used to weld an Nb foil to a copper wire coated with a Pb/Sn soft solder, which is superconducting. The joint was evaluated as part of a persistent-current circuit having an inductance of 1 mH. A current was induced in a loop, and no attenuation of the current after a time interval 1,000 s was discernible in a measurement having a fractional accuracy of 10(exp -4): This observation supports the conclusion that the weld had an electrical resistance <10(exp -10) omega.

Penanen, Konstantin I.↗
NASA NTRS1987

Electrodynamic plasma motor/generator experiment

The Plasma Motor/Generator Proof of Function (PMG/POF) experiment, a low-cost payload for flight aboard the Shuttle Orbiter using the Hitchhiker G carrier, is discussed. The primary objective of this experiment is to verify that hollow cathode plasma sources can couple electric currents from either end of a long wire moving through the space plasma in LEO into and through that plasma to produce a PMG circuit. The support structure and the electrical components of the experiment are described. The experimental operation is discussed, including the calibration, experimental measurements, and follow-on missions.

Mccoy, James E.↗
NASA NTRS2011

Wireless tamper detection sensor and sensing system

A wireless tamper detection sensor is defined by a perforated electrical conductor. The conductor is shaped to form a geometric pattern between first and second ends thereof such that the conductor defines an open-circuit that can store and transfer electrical and magnetic energy. The conductor resonates in the presence of a time-varying magnetic field to generate a harmonic response. The harmonic response changes when the conductor experiences a change in its geometric pattern due to severing of the conductor along at least a portion of the perforations. A magnetic field response recorder is used to wirelessly transmit the time-varying magnetic field and wirelessly detecting the conductor's harmonic response.

Woodard, Stanley E.↗
NASA NTRS2003

Development of reliable electronic packaging solutions for spacecraft avionics miniaturization using embedded passice devices

Miniaturization of electronic packages will play a key rule in future space avionics systems. Smaller avionics packages will reduce payloads while providing greater functionality for information processing and mission instrumentation. Current surface mount technology discrete passive devices not only take up significant space but also add weight. To that end, the use of embedded passive devices, such as capacitors, inductors and resistors will be instrumental in allowing electronics to be made smaller and lighter. Embedded passive devices fabricated on silicon or like substrates using thin film technology, promise great savings in circuit volume, as well as potentially improving electrical performance by decreasing parasitic losses. These devices exhibit a low physical profile and allow the circuit footprint to be reduced by stacking passive elements within a substrate. Thin film technologies used to deposit embedded passive devices are improving and costs associated with the process are decreasing.

Schatzel, Don↗
NASA NTRS1983

Photovoltaic stand-alone modular systems, phase 2

The final hardware and system qualification phase of a two part stand-alone photovoltaic (PV) system development is covered. The final design incorporated modular, power blocks capable of expanding incrementally from 320 watts to twenty kilowatts (PK). The basic power unit (PU) was nominally rated 1.28 kWp. The controls units, power collection buses and main lugs, electrical protection subsystems, power switching, and load management circuits are housed in a common control enclosure. Photo-voltaic modules are electrically connected in a horizontal daisy-chain method via Amp Solarlok plugs mating with compatible connectors installed on the back side of each photovoltaic module. A pair of channel rails accommodate the mounting of the modules into a frameless panel support structure. Foundations are of a unique planter (tub-like) configuration to allow for world-wide deployment without restriction as to types of soil. One battery string capable of supplying approximately 240 ampere hours nominal of carryover power is specified for each basic power unit. Load prioritization and shedding circuits are included to protect critical loads and selectively shed and defer lower priority or noncritical power demands. The baseline system, operating at approximately 2 1/2 PUs (3.2 kW pk.) was installed and deployed. Qualification was successfully complete in March 1983; since that time, the demonstration system has logged approximately 3000 hours of continuous operation under load without major incident.

Naff, G. J.↗
NASA NTRS1979

Electrical-ground monitor

Instrument for detecting short circuits monitors ground connections and sounds alarm if out-of-limits condition occurs. Circuit includes electronics that prevent false triggering by high-resistance or capacitive paths and other noise.

Lyons, T. D.↗
NASA NTRS2001

Electrically Isolating Subsystems in SOAC Technologies

Integrated circuit fabrication technology has evolved to the point that it is possible to construct complete systems, including power, data processing, and communications, on a single chip. Such System-on-a-chip (SOAC) technologies can enable drastic reductions in spacecraft size and weight, lowering the cost of missions and presenting new mission opportunities. This paper overviews some key enabling technologies unique to the needs of spacecraft for outer-planet exploration and missions requiring extreme resistance to radiation such as Europa orbiters and Europa Landers. The work is being carried out by Kansas State University (KSU) under direction of the Center for Integrated Space Microsystems (CISM) at NASA's Jet Propulsion Laboratory. Additional information is contained in the original extended abstract.

Boyd, R. M.↗
NASA NTRS2007

Metallic Nanowire Interconnections for Integrated Circuit Fabrication

A method for fabricating an electrical interconnect between two or more electrical components. A conductive layer is provided on a substarte and a thin, patterned catalyst array is deposited on an exposed surface of the conductive layer. A gas or vapor of a metallic precursor of a metal nanowire (MeNW) is provided around the catalyst array, and MeNWs grow between the conductive layer and the catalyst array. The catalyst array and a portion of each of the MeNWs are removed to provide exposed ends of the MeNWs.

Ng, Hou Tee↗
NASA NTRS1980

'GAIM' - Gas-addition, impedance-matched arc driver

A conceptual view for a GAIM energy/driver system to maximize shock-tube performance through efficient interfacing of the energy source with the gas dynamics of the arc driver is presented. Electrical and arc-chamber requirements are evaluated utilizing two new computer codes. One code calculates the shock wave generated for a selected time rate and magnitude of arc-energy input; the other computes the values of external circuit elements required to produce the selected energy input, with the driver represented as the load element of the electrical discharge circuit. Results indicate that the energy-storage capability and the driver arrangement needed to produce the highest shock Mach number can be achieved by means of driver gas addition and by impedance matching (GAIM). Design criteria are presented for arc energy requirements necessary to produce given shock-wave speeds. Shock velocities as high as the 70 km/sec required for simulating Jovian entry now seem possible in shock-tube operation. Practical implementation of a GAIM system is discussed.

Dannenberg, R. E.↗
NASA NTRS2012

Enabling Large Focal Plane Arrays Through Mosaic Hybridization

We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit paths by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabricated parts were hybridized using a flip-chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.

Miller, TImothy M.↗