Results for “Sensor packaging” — Page 28

NASA NTRS2011

Carbon Nanotube-Based Structural Health Monitoring Sensors

Carbon nanotube (CNT)-based sensors for structural health monitoring (SHM) can be embedded in structures of all geometries to monitor conditions both inside and at the surface of the structure to continuously sense changes. These CNTs can be manipulated into specific orientations to create small, powerful, and flexible sensors. One of the sensors is a highly flexible sensor for crack growth detection and strain field mapping that features a very dense and highly ordered array of single-walled CNTs. CNT structural health sensors can be mass-produced, are inexpensive, can be packaged in small sizes (0.5 micron(sup 2)), require less power than electronic or piezoelectric transducers, and produce less waste heat per square centimeter than electronic or piezoelectric transducers. Chemically functionalized lithographic patterns are used to deposit and align the CNTs onto metallic electrodes. This method consistently produces aligned CNTs in the defined locations. Using photo- and electron-beam lithography, simple Cr/Au thin-film circuits are patterned onto oxidized silicon substrates. The samples are then re-patterned with a CNT-attracting, self-assembled monolayer of 3-aminopropyltriethoxysilane (APTES) to delineate the desired CNT locations between electrodes. During the deposition of the solution-suspended single- wall CNTs, the application of an electric field to the metallic contacts causes alignment of the CNTs along the field direction. This innovation is a prime candidate for smart skin technologies with applications ranging from military, to aerospace, to private industry.

Wincheski, Russell↗

NASA NTRS2013

What Can the Curiosity Rover Tell Us About the Climate of Mars?

What Can the Curiosity Rover Tell Us About the Climate of Mars? Assessing the habitability of Gale Crater is the goal of the Curiosity Rover, which has been gathering data since landing on the Red Planet last August. To meet that goal, Curiosity brought with it a suite of instruments to measure the biological potential of the landing site, the geology and chemistry of its surface, and local environmental conditions. Some of these instruments illuminate the nature of the planet fs atmosphere and climate system, both for present day conditions as well as for conditions that existed billions of years ago. For present day conditions, Curiosity has a standard meteorology package that measures pressure, temperature, winds and humidity, plus a sensor the measures the UV flux. These data confirm what we learned from previous missions namely that today Mars is a cold, dry, and barren desert-like planet. For past conditions, however, wetter and probably warmer conditions are indicated. Curiosities cameras reveal gravel beds that must have formed by flowing rivers, and sedimentary deposits of layered sand and mudstones possibly associated with lakes. An ancient aqueous environment is further supported by the presence of sulfate veins coursing through some of the rocks in Yellowknife Bay where Curiosity is planning its first drilling activity. I will discuss these results and their implications in this lecture.

Haberle, Robert M.↗

NASA NTRS2014

Human Engineering Modeling and Performance Lab Study Project

The HEMAP (Human Engineering Modeling and Performance) Lab is a joint effort between the Industrial and Human Engineering group and the KAVE (Kennedy Advanced Visualiations Environment) group. The lab consists of sixteen camera system that is used to capture human motions and operational tasks, through te use of a Velcro suit equipped with sensors, and then simulate these tasks in an ergonomic software package know as Jac, The Jack software is able to identify the potential risk hazards.

Technology Portfolio System↗

NASA NTRS2016

eLISA Telescope In-field Pointing and Scattered Light Study

The orbital motion of the three spacecraft that make up the eLISA Observatory constellation causes long-arm line of sight variations of approximately ± one degree over the course of a year. The baseline solution is to package the telescope, the optical bench, and the gravitational reference sensor (GRS) into an optical assembly at each end of the measurement arm, and then to articulate the assembly. An optical phase reference is exchanged between the moving optical benches with a single mode optical fiber (“backlink” fiber). An alternative solution, referred to as in-field pointing, embeds a steering mirror into the optical design, fixing the optical benches and eliminating the backlink fiber, but requiring the additional complication of a two-stage optical design for the telescope. We examine the impact of an in-field pointing design on the scattered light performance.

Livas, J↗

DOE OSTI2015

Intelligent sensor and controller framework for the power grid

Disclosed below are representative embodiments of methods, apparatus, and systems for monitoring and using data in an electric power grid. For example, one disclosed embodiment comprises a sensor for measuring an electrical characteristic of a power line, electrical generator, or electrical device; a network interface; a processor; and one or more computer-readable storage media storing computer-executable instructions. In this embodiment, the computer-executable instructions include instructions for implementing an authorization and authentication module for validating a software agent received at the network interface; instructions for implementing one or more agent execution environments for executing agent code that is included with the software agent and that causes data from the sensor to be collected; and instructions for implementing an agent packaging and instantiation module for storing the collected data in a data container of the software agent and for transmitting the software agent, along with the stored data, to a next destination.

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DOE OSTI2018

Intelligent sensor and controller framework for the power grid

Disclosed below are representative embodiments of methods, apparatus, and systems for monitoring and using data in an electric power grid. For example, one disclosed embodiment comprises a sensor for measuring an electrical characteristic of a power line, electrical generator, or electrical device; a network interface; a processor; and one or more computer-readable storage media storing computer-executable instructions. In this embodiment, the computer-executable instructions include instructions for implementing an authorization and authentication module for validating a software agent received at the network interface; instructions for implementing one or more agent execution environments for executing agent code that is included with the software agent and that causes data from the sensor to be collected; and instructions for implementing an agent packaging and instantiation module for storing the collected data in a data container of the software agent and for transmitting the software agent, along with the stored data, to a next destination.

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DOE OSTI2019

Active cryogenic electronic envelope

A data acquisition module is disclosed for use with electronic components such as superconductive magnets wherein the electronic components and the data acquisition module may reside inside a cryostat. The data acquisition module allows conventional electronic technologies to work inside cryostats at cryogenic temperatures as low as 4° K. This is achieved by management of heat inside the module to keep the module operating at a temperature above the cryogenic temperature. This approach avoids the difficulties that arise from changes in carrier mobility in semiconductors operating at deep cryogenic temperatures. A cryogenic system comprises a cryostat containing a cryogenic fluid and at least one sensor, and a data acquisition module located within the cryostat, the module in communication with the at least one sensor to acquire data, wherein the module comprises a thermal package, a conditioning and digitizing electronic module, a controller module, a power module, and a thermal management module.

42 ENGINEERING↗

DOE OSTI2019

Intelligent sensor and controller framework for the power grid

Disclosed below are representative embodiments of methods, apparatus, and systems for monitoring and using data in an electric power grid. For example, one disclosed embodiment comprises a sensor for measuring an electrical characteristic of a power line, electrical generator, or electrical device; a network interface; a processor; and one or more computer-readable storage media storing computer-executable instructions. In this embodiment, the computer-executable instructions include instructions for implementing an authorization and authentication module for validating a software agent received at the network interface; instructions for implementing one or more agent execution environments for executing agent code that is included with the software agent and that causes data from the sensor to be collected; and instructions for implementing an agent packaging and instantiation module for storing the collected data in a data container of the software agent and for transmitting the software agent, along with the stored data, to a next destination.

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NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

High temperature↗

NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

electronic packaging↗

NASA NTRS2003

The SEIS Experiment: A Mars Seismic Package

This experiment will integrate a VBB (Very Broad Band) two axis seismometer, a three axis Short Period seismometer and a series of environmental sensors for pressure, infra-sounds and temperature. IPGP (France) has the overall responsibility of the experiment and is responsible for the VBB and environmental sensors. ETHZ (Switzerland) is responsible for the electronics of the experiment and JPL (USA) for the SP (Short Period) sensors. SEIS instrument was first proposed and accepted for NetLander mission (and will also be in charge of data acquisition for SPICE experiment). This seismic package should also be proposed for future missions.

Schibler, P.↗

NASA NTRS2004

AIN-Based Packaging for SiC High-Temperature Electronics

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Savrun, Ender↗

NASA NTRS1978

Shock Prevention

The electrician pictured is installing a General Electric Ground Fault Interrupter (GFI), a device which provides protection against electrical shock in the home or in industrial facilities. Shocks due to defective wiring in home appliances or other electrical equipment can cause severe burns, even death. As a result, the National Electrical Code now requires GFIs in all new homes constructed. This particular type of GFI employs a sensing element which derives from technology acquired in space projects by SCI Systems, Inc., Huntsville, Alabama, producer of sensors for GE and other manufacturers of GFI equipment. The sensor is based on the company's experience in developing miniaturized circuitry for space telemetry and other spacecraft electrical systems; this experience enabled SCI to package interruptor circuitry in the extremely limited space available and to produce sensory devices at practicable cost. The tiny sensor measures the strength of the electrical current and detects current differentials that indicate a fault in the functioning of an electrical system. The sensing element then triggers a signal to a disconnect mechanism in the GFI, which cuts off the current in the faulty circuit.

Source record↗

NASA NTRS1995

Improved, Easier-To-Use Tunneling Infrared Sensors

Designs of electron-tunneling infrared sensors and micromachining processes used to fabricate them modified to increase sensitivity and to simplify operation, adjustment, and associated circuitry. Corrugations, pinholes, and standard packaging incorporated into design. Deflection voltages reduced, and thermal drifts eliminated. Performances exceed those of other commercially available, uncooled infrared sensors. Operation of sensors simplified to such extent, now feasible to ship them to nonexpert users for routine testing and evaluation in their laboratories.

Muller, Richard E.↗

DOE OSTI2024

A Fully Adaptive Electromagnetic Suspension System for Vehicles

Recently, electromagnetic suspension systems have become more popular in passenger vehicles. They are superior alternatives to existing conventional passive hydraulic suspension systems. The objective in this paper is to design a new adaptive, not reactive, electromagnetic suspension system. This is performed through two fixed permanent magnets and one electromagnet system packaged as a bolt solution for vehicles. Once combined with other sensors in the vehicle, the proposed electromagnetic system can provide the first fully adaptive suspension system in vehicles.

Davis, Dakota↗

NASA NTRS1994

Design studies of large aperture, high-resolution Earth science microwave radiometers compatible with small launch vehicles

High-spatial-resolution microwave radiometer sensing from space with reasonable swath widths and revisit times favors large aperture systems. However, with traditional precision antenna design, the size and weight requirements for such systems are in conflict with the need to emphasize small launch vehicles. This paper describes tradeoffs between the science requirements, basic operational parameters, and expected sensor performance for selected satellite radiometer concepts utilizing novel lightweight compactly packaged real apertures. Antenna, feed, and radiometer subsystem design and calibration are presented. Preliminary results show that novel lightweight real aperture coupled with state-of-the-art radiometer designs are compatible with small launch systems, and hold promise for high-resolution earth science measurements of sea ice, precipitation, soil moisture, sea surface temperature, and ocean wind speeds.

Schroeder, Lyle C.↗

NASA NTRS2006

The Primordial Anisotropy Polarization Pathfinder Array (PAPPA): Instrument Overview and Status

PAPPA is a balloon-based experiment designed to measure the polarization of the Cosmic Microwave Background using candidate technology for an eventual Inflation Probe mission. It will survey a 20 x 20 degree patch of sky with 1 degree angular resolution covering 3 passbands centered at 100,200 and 300 GHz. Detection will be accomplished via antenna-coupled transition edge sensors (TESs) with SQUID-based readouts. In the eventual flight package, band defining filters and MEMS-based polarization modulators will be incorporated into the superconducting microstrip transmission lines that terminate in resistors that are thermally coupled to the TESs. The MEMS switches will allow on-chip polarization modulation that is faster than significant detector gain variations. The initial configuration will incorporate a simplified focal plane augmented by quasioptical polarization modulation. We describe the overall instrument design and present a summary of the current progress.

Chuss, David↗

NASA NTRS2016

Advanced Sensor Platform to Evaluate Manloads For Exploration Suit Architectures

Space suit manloads are defined as the outer bounds of force that the human occupant of a suit is able to exert onto the suit during motion. They are defined on a suit-component basis as a unit of maximum force that the suit component in question must withstand without failure. Existing legacy manloads requirements are specific to the suit architecture of the EMU and were developed in an iterative fashion; however, future exploration needs dictate a new suit architecture with bearings, load paths, and entry capability not previously used in any flight suit. No capability currently exists to easily evaluate manloads imparted by a suited occupant, which would be required to develop requirements for a flight-rated design. However, sensor technology has now progressed to the point where an easily-deployable, repeatable and flexible manloads measuring technique could be developed leveraging recent advances in sensor technology. INNOVATION: This development positively impacts schedule, cost and safety risk associated with new suit exploration architectures. For a final flight design, a comprehensive and accurate man loads requirements set must be communicated to the contractor; failing that, a suit design which does not meet necessary manloads limits is prone to failure during testing or worse, during an EVA, which could cause catastrophic failure of the pressure garment posing risk to the crew. This work facilitates a viable means of developing manloads requirements using a range of human sizes & strengths. OUTCOME / RESULTS: Performed sensor market research. Highlighted three viable options (primary, secondary, and flexible packaging option). Designed/fabricated custom bracket to evaluate primary option on a single suit axial. Manned suited manload testing completed and general approach verified.

McFarland, Shane↗