Search NASA⌕ Search

SEARCH · Search NASA

Results for “packaging”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 523 records · Page 29

Multichip packaging with thermal insulation

Thermal insulation technique permits low and high power electronic chips to operate in the same package without thermal cross-coupling. An alumina glass shield thermally isolates the low power chip from the high power chip while Kovar substrate acts as a heat sink to remove heat from the high power chip.

Mc Inturff, R. G.↗