Search NASA⌕ Search

SEARCH · Search NASA

Results for “Aerospace electronics”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 55 records · Page 3

Decreasing Proton Single Event Effects in CubeSats with Shielding

Shields-1, NORAD ID 43850,has been operating in polar low earth orbit since December 2018. The shielding has resulted in a lower total ionizing dose over time than typical aluminum thin-walled CubeSat structures. The reduced ionizing dosage caused by Shields-1 increases the reliability of commercial parts and reduces internal charging. Furthermore, the Shields-1 shielding reduces the ionizing particle fluence inside the spacecraft that contributes to the ionizing dose. NOVICE Sigma shielding software, using the (Aerospace Proton) AP8 –(Aerospace Electron) AE8 solar minimum trapped belt environment for a 1-year mission, estimates a 21.3 g/cm2 aluminum effective shielding for the Shields-1 electronics enclosure. This high areal density reduces not only the total number of energetic protons, but also reduces the number of ionizing particles over all modeled energies from the estimated shielded fluence for a 1-year mission. NOVICE Adjoint CAD modeling of the Shields-1 structure, with the detector located within the electronics enclosure, estimates that the total number of particles is reduced from 2.20x 10exp9 protons/cm2 to 1.52x 10exp8 protons/cm2, which represents 6.90% of the remaining particles(figure 1). By slowing down approximations of the integral proton fluence, a minimum proton threshold is estimated at 151 MeV. In comparison, a 0.204-cm aluminum thin-walled 3-unit (U) structure, with a 0.907 g/cm2 effective shielding, has 25.0% remaining particles and a minimum proton threshold of 36.2 MeV(figure 1). Proton energies that contribute to single event effects in radiation tolerant or higher semiconductor hardness are typically 100 MeV and higher. The Shields-1 electronics enclosure is estimated to attenuate energies: 100 MeV by 76.5%, 200 MeV by 61.7%, and 500 MeV by 63.0%(figure 2), when comparing the space environment proton differential fluence with the shielded differential fluence. The aluminum thin-walled structure is estimated to attenuate proton energies: 100 MeV by 13.7%, 200 MeV by 12.4%, and 500 MeV by 12.6%(figure 2), which are lower than for the Shields-1 electronics enclosure. The significant differences in attenuation between the Shields-1 electronics enclosure and aluminum thin-walled 3U structure show the additional utility of increasing shielding effectiveness for reducing the numbers of energetic protons that contribute to single event effects.

Larry Thomsen↗

Cost-Benefit Assessment of Additive Manufacturing for Injection Molds

This report presents an additive-manufacturing (AM) technology, where AM Cyclic Olefin Resin (COR) molds would be used for injection molding. The National Laboratory of the Rockies (NLR) team has focused on the costs and economics of this developing technology. This report presents a cost-benefit analysis of using the polySpectra AM COR molds made of COR, at the start of the project (Present') and the potential lifetime, cost-effectiveness, and performance by the end of the project period (Period 3'). The analysis of the AM COR molds is compared to traditional Computer Numerical Control (CNC) machined aluminum molds across the time periods. A cost-benefit model framework has been developed to evaluate AM COR molds. This model accounts for mold delivery to customers, current and future levels of technology readiness, the type of material injected, and various business cases. AM COR molds offer a major advantage in lead time, reducing production setup from weeks or months (with CNC machining) to as little as two to five days. This enables faster prototyping, quicker design cycles, and accelerated time-to-market, critical in industries like electronics, aerospace, medical devices, and automotive. Even modest improvements in the durability of polySpectra AM COR molds show the potential for these molds to complement traditional tooling. With further development, AM COR mold technology could provide significant time and cost savings while supporting increased domestic manufacturing capacity.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗

Assurance of Electronic Parts for Aerospace System Reliability: Past, Present, and Future

Over the last two to three decades, the balance of influence within the electronics industry has shifted decisively towards the consumer electronics and information technology products, away from the defense or aerospace markets. This shift towards the commercial markets has changed certain ground rules in the electronics industry. Reliance of the aerospace industry, in particular, on components from supply chains dedicated to other products, or cross-vertical product integration, creates a supply web and introduces significant risks that are not necessarily present for volume-driven electronic products. Many of the unique risks in the aerospace industry emanate from the key characteristics of this industry. Although selection and usage of commercial electronics in NASA flight hardware is possible at a comparable (and in many cases lower) level of risk to that of employing parts that are screened to military or NASA specifications, for a large majority of flight projects it is difficult to distinguish the difference in on-orbit performance or reliability for parts screened at any level, or commercial parts that have no additional screening performed by the government. This paper identifies several bases for establishing context and developing unique or alternative approaches for successful parts selection and application within NASA and across the commercial space community.

electronic parts↗

NASA/DoD Aerospace Knowledge Diffusion Research Project. Paper 30: The electronic transfer of information and aerospace knowledge diffusion

Increasing reliance on and investment in information technology and electronic networking systems presupposes that computing and information technology will play a major role in the diffusion of aerospace knowledge. Little is known, however, about actual information technology needs, uses, and problems within the aerospace knowledge diffusion process. The authors state that the potential contributions of information technology to increased productivity and competitiveness will be diminished unless empirically derived knowledge regarding the information-seeking behavior of the members of the social system - those who are producing, transferring, and using scientific and technical information - is incorporated into a new technology policy framework. Research into the use of information technology and electronic networks by U.S. aerospace engineers and scientists, collected as part of a research project designed to study aerospace knowledge diffusion, is presented in support of this assertion.

Pinelli, Thomas E.↗

A Brief Overview of NASA Glenn Research Center Sensor and Electronics Activities

Aerospace applications require a range of sensing technologies. There is a range of sensor and sensor system technologies being developed using microfabrication and micromachining technology to form smart sensor systems and intelligent microsystems. Drive system intelligence to the local (sensor) level -- distributed smart sensor systems. Sensor and sensor system development examples: (1) Thin-film physical sensors (2) High temperature electronics and wireless (3) "lick and stick" technology. NASA GRC is a world leader in aerospace sensor technology with a broad range of development and application experience. Core microsystems technology applicable to a range of application environmentS.

Hunter, Gary W.↗

Electron-radiation effects on the ac and dc electrical properties and unpaired electron densities of three aerospace polymers

The effects of gigarad-level total absorbed doses from 1-MeV electrons on the post-irradiation alternating-current (ac) and direct-current (dc) electrical properties and the unpaired electron densities have been studied for Kapton, Ultem, and Mylar. The unpaired electron densities (determined from electron paramagnetic resonance spectroscopy) and the dc electrical conductivities of the irradiated materials were monitored as functions of time following the exposures to determine their decay characteristics at room temperature. The elevated-temperature ac electrical dissipations of the Ultem and Mylar were affected by the radiation. The dc conductivity of the Kapton increased by five orders of magnitude, while the dc conductivities of the Ultem and Mylar increased by less than an order of magnitude, due to the radiation. The observed radiation-generated changes in the ac electrical dissipations are explained in terms of known radiation-generated changes in the molecular structures of the three materials. A preliminary model relating the dc electrical conductivity and the unpaired electron density in the Kapton is proposed.

Long, Sheila Ann T.↗

Electronic SCAN (Selected Current Aerospace Notices)

The on-line version of the NASA Selected Current Aerospace Notices (SCAN) is described and the three methods for electronic access on the Internet are listed. These are (1) File Transfer Protocol (FTP), (2) Gopher, and (3) LISTSERV. An electronic address and a brief description is given for each of them.

Dunbar, Rick↗

The Effects of Thermal Cycling on Gallium Nitride and Silicon Carbide Semiconductor Devices for Aerospace Use

Electronics designed for use in NASA space missions are required to work efficiently and reliably under harsh environment conditions. These Include radiation, extreme temperatures, thermal cycling, to name a few. Preliminary data obtained on new Gallium Nitride and Silicon Carbide power devices under exposure to radiation followed by long term thermal cycling are presented. This work was done in collaboration with GSFC and JPL in support of the NASA Electronic Parts and Packaging (NEPP) Program

Patterson, Richard L.↗

Electronically controlled mechanical seal for aerospace applications--Part 2: Transient tests

An electronically controlled mechanical seal for use as the purge gas seal in a liquid oxygen turbopump has been fabricated and tested under transient operating conditions. The thickness of the lubricating film is controlled by adjusting the coning of the carbon face. This is accomplished by applying a voltage to a piezoelectric actuator to which the carbon face is bonded. The seal has been operated with a closed-loop control system that utilizes either the leakage rate or seal face temperature as the feedback. Both speed and pressure transients have been imposed on the seal. The transient tests have demonstrated that the seal is capable of maintaing low leakage rates while limiting face temperatures.

Wolff, Paul J.↗

The electronic transfer of information and aerospace knowledge diffusion

Increasing reliance on and investment in information technology and electronic networking systems presupposes that computing and information technology will play a motor role in the diffusion of aerospace knowledge. Little is known, however, about actual information technology needs, uses, and problems within the aerospace knowledge diffusion process. The authors state that the potential contributions of information technology to increased productivity and competitiveness will be diminished unless empirically derived knowledge regarding the information-seeking behavior of the members of the social system - those who are producing, transferring, and using scientific and technical information - is incorporated into a new technology policy framework. Research into the use of information technology and electronic networks by U.S. aerospace engineers and scientists, collected as part of a research project designed to study aerospace knowledge diffusion, is presented in support of this assertion.

Pinelli, Thomas E.↗

Facilitating NASA's Use of GEIA-STD-0005-1, Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder

GEIA-STD-0005-1 defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that AHP electronic systems containing lead-free solder, piece parts, and boards will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certify-ability throughout the specified life of performance. It communicates requirements for a Lead-Free Control Plan (LFCP) to assist suppliers in the development of their own Plans. The Plan documents the Plan Owner's (supplier's) processes, that assure their customer, and all other stakeholders that the Plan owner's products will continue to meet their requirements. The presentation reviews quality assurance requirements traceability and LFCP template instructions.

Plante, Jeannete↗

Electronically Controlled Mechanical Seal for Aerospace Applications -- Part 1: Design, Analysis, and Steady State Tests

An electronically-controlled mechanial seal, for use as the purge gas seal in a liquid oxygen turbopump, has been designed, analyzed, and built. The thickness of the lubricating film between the faces is controlled by adjusting the coning of the carbon face. This is done by applying a voltage across a piezoelectric element to which the carbon face is bound. Steady state tests have shown that the leakage rate (and film thickness) can be adjusted over a substantial range, utilizing the available range of voltage.

Salant, Richard F.↗

The effects of the geosynchronous energetic particle radiation environment on spacecraft charging phenomena

The energetic electron environment at the geosynchronous orbit is responsible for a variety of adverse charging effects on spacecraft components. The most serious of these is the degradation and failure of a complementary-metal-oxide-semiconductor (CMOS) electronic components as a result of internal charge-buildup induced by the energetic electrons. Efforts to accurately determine the expected lifetime of these components in this orbit are hampered by the lack of detailed knowledge of the electron spectrum and intensity, particularly of the more penetrating energies greater than 1.5 MeV. This problem is illustrated through the calculation of the dose received by a CMOS device from the energetic electrons and associated bremsstrahlung as a function of aluminum shielding thickness using the NASA AE-6 and the Aerospace measured electron environments. Two computational codes which were found to be in good agreement were used to perform the calculations. For a given shielding thickness the dose received with the two radiation environments differ by as much as a factor of seven with a corresponding variation in lifetime of the CMOS.

Reagan, J. B.↗

Imaging Electron Spectrometer (IES) Electron Preprocessor (EPP) Design

The Aerospace Corporation developed the Electron PreProcessor (EPP) to support the Imaging Electron Spectrometer (IES) that is part of the RAPID experiment on the ESA/NASA CLUSTER mission. The purpose of the EPP is to collect raw data from the IES and perform processing and data compression on it before transferring it to the RAPID microprocessor system for formatting and transmission to the CLUSTER satellite data system. The report provides a short history of the RAPID and CLUSTER programs and describes the EPP design. Four EPP units were fabricated, tested, and delivered for the original CLUSTER program. These were destroyed during a launch failure. Four more EPP units were delivered for the CLUSTER II program. These were successfully launched and are operating nominally on orbit.

Fennell, J. F.↗

The 2004 NASA Aerospace Battery Workshop

Topics covered include: Super NiCd(TradeMark) Energy Storage for Gravity Probe-B Relativity Mission; Hubble Space Telescope 2004 Battery Update; The Development of Hermetically Sealed Aerospace Nickel-Metal Hydride Cell; Serial Charging Test on High Capacity Li-Ion Cells for the Orbiter Advanced Hydraulic Power System; Cell Equalization of Lithium-Ion Cells; The Long-Term Performance of Small-Cell Batteries Without Cell-Balancing Electronics; Identification and Treatment of Lithium Battery Cell Imbalance under Flight Conditions; Battery Control Boards for Li-Ion Batteries on Mars Exploration Rovers; Cell Over Voltage Protection and Balancing Circuit of the Lithium-Ion Battery; Lithium-Ion Battery Electronics for Aerospace Applications; Lithium-Ion Cell Charge Control Unit; Lithium Ion Battery Cell Bypass Circuit Test Results at the U.S. Naval Research Laboratory; High Capacity Battery Cell By-Pass Switches: High Current Pulse Testing of Lithium-Ion; Battery By-Pass Switches to Verify Their Ability to Withstand Short-Circuits; Incorporation of Physics-Based, Spatially-Resolved Battery Models into System Simulations; A Monte Carlo Model for Li-Ion Battery Life Projections; Thermal Behavior of Large Lithium-Ion Cells; Thermal Imaging of Aerospace Battery Cells; High Rate Designed 50 Ah Li-Ion Cell for LEO Applications; Evaluation of Corrosion Behavior in Aerospace Lithium-Ion Cells; Performance of AEA 80 Ah Battery Under GEO Profile; LEO Li-Ion Battery Testing; A Review of the Feasibility Investigation of Commercial Laminated Lithium-Ion Polymer Cells for Space Applications; Lithium-Ion Verification Test Program; Panasonic Small Cell Testing for AHPS; Lithium-Ion Small Cell Battery Shorting Study; Low-Earth-Orbit and Geosynchronous-Earth-Orbit Testing of 80 Ah Batteries under Real-Time Profiles; Update on Development of Lithium-Ion Cells for Space Applications at JAXA; Foreign Comparative Technology: Launch Vehicle Battery Cell Testing; 20V, 40 Ah Lithium Ion Polymer Battery for the Spacesuit; Low Temperature Life-Cycle Testing of a Lithium-Ion Battery for Low-Earth-Orbiting Spacecraft; and Evaluation of the Effects of DoD and Charge Rate on a LEO Optimized 50 Ah Li-Ion Aerospace Cell.

Source record↗

Development of in-situ polymerized intrinsically conductive resin and low-cost carbon pigments offering high conductivity for sensing, EMI shielding and lighting protection

Electrically conductive composites are emerging across diverse industries such as electronic, automotive, aerospace, advanced air mobility, biomedical, infrastructure, defense and security offering static charge dissipation, electromagnetic interference shielding, lighting protection, sensing, dicing, corrosion monitoring, etc. Conductivity enhanced composites provide several advantages compared to conventional metals including weight reduction, corrosion resistance, energy efficient processability, tunable properties and multifunctionality. Polymers are typically insulating in nature and require conducting filler for electron transport. However, dispersion and polymer-filler interphases are critical and often disrupt conducting pathways. Besides, conductive fillers such as graphene, carbon nanotube, MXene, silver nanowire, etc. are expensive, limiting their wide adoption in composite industry. On the other hand, a limited number of intrinsically conductive polymers are available among which polyaniline (PANI) has been widely studied due to its high conductivity, thermal and chemical stability. However, PANI is difficult to process and exhibits weak mechanical properties. In brief, there is a significant demand for electrically conductive polymer formulation with cost-effective conducting fillers that offer processability in scale to expand the market of conductivity enhanced materials.

Kumar, Vipin [Oak Ridge National Laboratory (ORNL)↗